FINGERPRINT SENSORS
CONTENTS Introduction... 2 Product Portfolio... 5 Adhesives in Action... 6 Glass to IC Attach... 8 Electrically Conductive Adhesives... 9 Sensor Die Attach Materials...10 Underfills... 11 WireBond Sealing / Encapsulants... 12 Reinforcement of FPC... 13 Ring Attach Materials...14 Hard Coating Materials... 15 INTRODUCTION As confidential transaction capabilities become integrated into mobile devices, security and reliability play an even more critical role in device development. The rollout of point-of-sale payment options on smartphones has accelerated the need for unique customer identification via fingerprint recognition. To facilitate this functionality, fingerprint sensors are now an integral part of the latestgeneration mobile devices, and the market for these sensors is growing exponentially. As a market leader in conductive and non-conductive adhesives and inks, Henkel is the ideal partner for fingerprint sensor manufacturers, delivering a full portfolio of material solutions for robust sensor development and production. 2 Fingerprint Sensors
Fingerprint Sensors 3
4 Compact Fingerprint Camera Sensors Modules
PRODUCT PORTFOLIO 3220 GLASS TO IC ATTACH ABLESTIK ABP 6892 ABLESTIK QMI536NB ABLESTIK ATB 120U ELECTRICALLY CONDUCTIVE ADHESIVES ABLESTIK 2030SC ABLESTIK ABP 2032S ABLESTIK CE 3103WLV ADHESIVES FOR FINGERPRINT SENSORS SENSOR DIE ATTACH MATERIALS UNDERFILLS ABLESTIK 2025J PASTE ABLESTIK 2035SC FILM ABLESTIK ATB F125E ECCOBOND FP4547 ECCOBOND UF 3808 ECCOBOND UF 8830 WIREBOND SEALING / ENCAPSULANTS ABLESTIK QMI536NB ECCOBOND FP4654 ECCOBOND UF 3811 REINFORCEMENT OF FPC 3217 3703 ECCOBOND XE 1218 RING ATTACH MATERIALS ECCOBOND DS 3318LVT PC 40-UMF HARD COATING MATERIALS ABLESTIK 8006NSB ECCOBOND LM 8895 Fingerprint Sensors 5
ADHESIVES IN ACTION SUBSTRATE CONTROLLER DIE 6 Materials Fingerprint Solutions Sensors for Fingerprint Sensors
SENSOR DIE METAL RING FLEXIBLE PCB GLASS Materials Solutions for Fingerprint Sensors 7
GLASS TO IC ATTACH ADHESIVE TO ATTACH GLASS TO SENSOR DIE Key Material Properties High adhesion Low-temperature cure Low-moisture absorption Thin bond line control Glass to IC Attach Glass to IC Attach 3220 ABLESTIK ABP 6892 ABLESTIK QMI536NB ABLESTIK ATB 120U Properties Units 3220 ABLESTIK ABP 6892 ABLESTIK QMI536NB ABLESTIK ATB 120U Appearance Black Clear White Transparent Cure Type Heat Heat Heat Heat Viscosity mpa.s 2,500 4,100 10,000 - Glass Transition Temperature (T g ) C 26-24.6-30 75 Modulus @ 25 C N / mm 2 550 176 300 875 CTE below 61 111 80 62 ppm / C above 171 191 150 238 Recommended Cure 10 min. @ 80 C 60 min. @ 80 c 30 min. @ 150 C 30 min. @ 120 C Alternative Cure - 30 min. @ 130 C 60 min. @ 80 C 30 min. @ 90 C 8 Fingerprint Sensors
ELECTRICALLY CONDUCTIVE ADHESIVES SOLDER ALTERNATIVE TO ATTACH METAL RING TO METAL PLATE Key Material Properties Good electrical connection Low-temperature cure Fast cure High adhesion Electrically Conductive Adhesives Electrically Conductive Adhesives ABLESTIK 2030SC ABLESTIK ABP 2032S ECCOBOND CE 3103WLV Properties Units ABLESTIK 2030SC ABLESTIK ABP 2032S ECCOBOND CE 3103WLV Appearance Silver Silver Silver Viscosity (Brookfield CP51 / 5 rpm) Glass Transition Temperature (T g ) mpa.s 11,600 11,000 15,000 C 29 110 114 Modulus @ 25 C N / mm 2 3,300 4,600 4,500 CTE below 45 54 45 ppm / C above 130 162 225 Recommended Cure 90 sec. @ 110 C 60 min. @ 80 C 10 min. @ 120 C Aternative Cure 30 min. @ 80 C - 110 min. @ 80 C Fingerprint Sensors 9
SENSOR DIE ATTACH MATERIALS SENSOR DIE ATTACH TO FR4, CERAMIC OR PCB Key Material Properties High adhesion Low-temperature cure Low warpage Sensor Die Attach Materials Sensor Die Attach Materials Paste Film ABLESTIK 2025J ABLESTIK 2035SC ABLESTIK ATB F125E Properties Units ABLESTIK 2025J ABLESTIK 2035SC ABLESTIK ATB F125E Type Paste Paste Film Viscosity (Brookfield CP51 / 5 rpm) mpa.s 12,900 11,000 - Thickness μm - - 25 Glass Transition Temperature (T g ) C 22 120 215 Modulus @ 25 C N / mm 2 320 2,500 5,256 CTE Recommended Cure below 45 54 37 ppm / C above 135 128 83 30 min. ramp to 175 C + 15 min. @ 175 C 90 sec. @ 110 C 30 min. ramp + 1 hr. @ 130 C Alternative Cure - 30 min. @ 80 C - 10 Fingerprint Sensors
UNDERFILLS REINFORCEMENT OF FLIP-CHIP DIE BONDING AND RIGID SUBSTRATE CONNECTION Key Material Properties Good flow ability Flexible product to accommodate stress High adhesion High reliability Underfills Underfills ECCOBOND FP4547 ECCOBOND UF 3808 ECCOBOND UF 8830 Properties Units ECCOBOND FP4547 ECCOBOND UF 3808 ECCOBOND UF 8830 Viscosity mpa.s 18,000 360 12,000 Glass Transition Temperature (T g ) C 135 113 92 Modulus @ 25 C N / mm 2 11,000 2,610 5,800 CTE below 21 55 31 ppm / C above 80 171 120 Recommended Cure 30 min. @ 165 C 8 min. @ 130 C 2 hr. @ 150 C Fingerprint Sensors 11
WIRE BOND SEALING / ENCAPSULANTS PROTECTIVE ADHESIVE FOR WIRE BONDING Key Material Properties Low-temperature cure Suitable modulus Pass reliability Wire Bond Sealing / Encapsulants Wire Bond Sealing / Encapsulants ABLESTIK QM1536NB ECCOBOND FP4654 ECCOBOND UF 3811 Properties Viscosity (Brookfield CP51 / 5 rpm) Glass Transition Temperature (T g ) Units ABLESTIK QM1536NB ECCOBOND FP4654 ECCOBOND UF 3811 mpa.s 10,000 32,000 354 C -30 146 124 Modulus @ 25 C N / mm 2 300 16,900 2,445 CTE below 80 13 61 ppm / C above 150 53 190 Recommended Cure 30 min. @ 150 C 90 min. @ 165 C 60 min. @ 100 C 12 Fingerprint Sensors
REINFORCEMENT OF FPC REINFORCEMENT OF FLEXIBLE PCB AND RIGID SUBSTRATE CONNECTION Key Material Properties Flexible product to accommodate stress High adhesion Reinforcment of FPC Reinforcement of FPC 3217 3703 ECCOBOND XE 1218 Properties Units 3217 3703 ECCOBOND XE 1218 Appearance Amber White Black Cure Type Dual Cure UV Heat Cure Chemical Type Acrylate Epoxy Acrylate Urethane Epoxy Viscosity mpa.s 37,600 18,000 Cone PK @ 20 S -1 Brookfield @ 20 rpm 1,118 Casson vis @ 25 C Modulus @ RT N / mm 2 330 490 400 Recommended Cure 1 sec. @ 100 mw / cm 2 + 30 min. @ 60 C or 20 min. @ 80 C 80 sec. @ 30 mw / cm 2 35 min. @ 90 C Fingerprint Sensors 13
RING ATTACH MATERIALS RING ATTACH TO GLASS Key Material Properties Good adhesion UV or low-temperature cure Good gap fill capability Low bleed Ring Attach Materials Ring Attach Materials ECCOBOND DS 3318LVT PC 40-UMF Properties Units ECCOBOND DS 3318LVT PC 40-UMF Appearance Clear Clear Viscosity mpa.s 142 250 Glass Transition Temperature (T g ) C 96 94 Modulus @ RT N / mm 2 408 1,493 Recommended Cure 15 sec. @ 100 mw / cm 2 10 sec. @ 600 mw / cm 2 + RT cure 14 Fingerprint Sensors
HARD COATING MATERIALS REPLACE GLASS / HARD FILM Key Material Properties Hard hardness > 5H Water-resistant Passes sweat or salt test Gloss finish Void-free Scratch-resistant Chemical-resistant UV-light resistant Hard Coating Materials Hard Coating Materials ABLESTIK 8006NSB ECCOBOND LM 8895 Properties Units ABLESTIK 8006NSB ECCOBOND LM 8895 Viscosity Brookfield @ 20 rpm cp 52,000 12,000 Glass Transition Temperature (T g ) C 158 29 CTE below 45 26 ppm / C above 134 231 Modulus @ RT N / mm 2 4,376 4,194 Recommended Cure 2 hr. @ 160 C / 30 min. @ 175 C 60 min. @ 150 C Fingerprint Sensors 15
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