Multilayer Development for Extreme Ultraviolet and Shorter Wavelength Lithography

Similar documents
E-Beam Coating Technology for EUVL Optics

The effect of Mo crystallinity on diffusion through the Si-on-Mo interface in EUV multilayer systems

EUV optics lifetime Radiation damage, contamination, and oxidation

FEL Irradiation Tolerance of Multilayer Optical System

Effects of Thin Film Depositions on the EUV mask Flatness

Corrosion-resistant multilayer coatings for the nm wavelength region

EUV Transmission Lens Design and Manufacturing Method

Introduction to Lithography

Roadmap in Mask Fab for Particles/Component Performance

Corrosion-resistant multilayer coatings for the nm wavelength region

Recovery strategies for mirrors with boron carbide-based coatings for 6.x nm lithography

Interface quality and thermal stability of laser-deposited metal MgO multilayers

Progress in EUV blanks development at HOYA

More on VLSI Fabrication Technologies. Emanuele Baravelli

Ruthenium Oxide Films Prepared by Reactive Biased Target Sputtering

Substrate surface effect on the structure of cubic BN thin films from synchrotron-based X-ray diffraction and reflection

EUV multilayer coatings: potentials and limits

EUV Transmission Lens Design and Manufacturing Method

Low-cost, deterministic quasi-periodic photonic structures for light trapping in thin film silicon solar cells

Silver Diffusion Bonding and Layer Transfer of Lithium Niobate to Silicon

Grazing-Incidence La/B-Based Multilayer Mirrors for 6.x nm Wavelength

EECS130 Integrated Circuit Devices

CLEANING TECHNOLOGY OPTIONS FOR EUV MASK LIFETIME EXTENSION

Development Status of EUVL Blank and Substrate Asahi Glass Co. Ltd. Kazunobu Maeshige

Figure 6. Rare-gas atom-beam diffraction patterns. These results were obtained by Wieland Schöllkopf and Peter Toennies at the Max-Planck Institute

SOLID SOLUTION METAL ALLOYS

Skills and excellence formation on basis of Laboratory of Plasma Physics & Atomic Spectroscopy Institute of Spectroscopy (ISAN) of Russian Academy of

Red luminescence from Si quantum dots embedded in SiO x films grown with controlled stoichiometry

Mo/Si Multilayers with Different Barrier Layers for Applications as Extreme Ultraviolet Mirrors

EUV Technology, Martinez, CA

Simulation Analysis of Defect Repair Methods for EUVL Mask Blanks

In depth study of molybdenum silicon compound formation at buried interfaces

Deposited by Sputtering of Sn and SnO 2

Enhancement of the reflectivity of Al/Zr multilayers by a novel structure

Laser Produced Plasma for Production EUV Lithography

Control technology of EUV Optics Contamination:

scattering study of phase separation at initially mixed HfO 2 -SiO

Simultaneous Reflection and Transmission Measurements of Scandium Oxide Thin Films in the Extreme Ultraviolet

Supporting Information for

Key Technologies for Next Generation EUV Lithography

Copper Interconnect Technology

Activities in Plasma Process Technology at SENTECH Instruments GmbH, Berlin. Dr. Frank Schmidt

Electrical characteristics of Gd 2 O 3 thin film deposited on Si substrate

Next Generation Source Power Requirements. Erik R. Hosler

High Resolution XPS Study of a Thin Cr 2 O Film Grown on Cr 110

Transparent Heat Mirror Using Plasma Polymer Fluorocarbon Fabricated by Continuous Roll-to-Roll Sputtering

Conversion efficiency of 6.X nm Emitted from Nd:YAG and CO 2 Laser Produced Plasma

MATERIALS. Silicon Wafers... J 04 J 01. MATERIALS / Inorganics & thin films guide

Enhancement of extreme ultraviolet emission from laser irradiated targets by surface nanostructures

Roman Chistyakov and Bassam Abraham Zond Inc/Zpulser LLC, Mansfield, MA

Low energy electron bombardment induced surface contamination of Ru mirrors

X-RAY DIFFRACTION ANALYSIS OF Si/SiGe RESONANT TUNNELING STRUCTURES 1. INTRODUCTION

Micro- and Nano-Technology... for Optics

Characterization of Nanoscale Electrolytes for Solid Oxide Fuel Cell Membranes

Supporting Information. for

FIB mask repair technology for EUV mask 1. INTRODUCTION

Properties of TiN thin films grown on SiO 2 by reactive HiPIMS

Grazing-Incidence Metal Mirrors for Laser-IFE

Ultra High Barrier Coatings by PECVD

X-Ray Reflectivity Study of Hafnium Silicate Thin Films Prepared by Thermal Chemical Vapor Deposition

High Power Gas Discharge and Laser Produced Plasma Sources for EUV Lithography

2Dlayer Product Catalog

Development of multilayerbased x-ray optics for FEL and synchrotron applications

ise J. A. Woollam Ellipsometry Solutions

Defense Technical Information Center Compilation Part Notice ADP014314

AMORPHOUS SILICON DIOXIDE LAYER FOR HIGH EFFICIENCY CRYSTALLINE SOLAR CELLS

Fundamentals of X-ray diffraction and scattering

Using Atomic Force Microscopy (AFM) for Engineering Low Scatter Thin Film Optics

Understanding Optical Coatings For Military Applications

Solar Selective Absorber Coating Methods Plasma Processes

U.S. Regional Update IEUVI Optics Lifetime/Contamination TWG October 19 th, 2006

EUV Source Supplier Update, Gigaphoton

PROCEEDINGS OF SPIE. Thin-film polarizer for high power laser system in China

Coatings. Ion Assisted Deposition (IAD) process Advance Plasma Source (APS) plasma-ion assisted Deposition. Coatings on Optical Fibers

Optically thin palladium films on silicon-based substrates and nanostructure formation: effects of hydrogen

Influence of Underlayer on Crystallography and Roughness of Aluminum Nitride Thin Film Reactively Sputtered by Ion-Beam Kaufman Source

Czochralski Crystal Growth

NANOSTRUCTURED TiN THIN FILMS SUITABLE FOR MEDICAL APPLICATIONS

Microstructure, morphology and their annealing behaviors of alumina films synthesized by ion beam assisted deposition

At wavelength characterization of EUV and soft X-ray gratings

FIBRE-COUPLED HIGH-INDEX PECVD SILICON- OXYNITRIDE WAVEGUIDES ON SILICON

Growth and Doping of SiC-Thin Films on Low-Stress, Amorphous Si 3 N 4 /Si Substrates for Robust Microelectromechanical Systems Applications

Heterostructures of Oxides and Semiconductors - Growth and Structural Studies

BN protective coating for high temperature applications

Deposition of TiN/CrN hard superlattices by reactive d.c. magnetron sputtering

Ageing Resistance (12 years) of Hard and Oxidation Resistant SiBCN Coatings

EUVL R&D Program in NewSUBARU. University of Hyogo Hiroo Kinoshita

Highly Reliable Low Temperature Ultrathin Oxides Grown Using N 2 O Plasma

State of the art quality of a GeOx interfacial passivation layer formed on Ge(001)

Adhesion enhancement of DLC hard coatings by HiPIMS metal ion etching pretreatment and its tribological properties José Antonio Santiago Varela

Improved Theoretical Reflectivities of Extreme Ultraviolet Mirrors

High Performance Optical Waveguides based on Boron and Phosphorous doped Silicon Oxynitride

EUV patterning improvement toward high-volume manufacturing

Thin Film Scattering: Epitaxial Layers

Properties of the interaction of europium with Si 111 surface

Application note. Quality control of beam splitters and quarterwave-mirrors using the Agilent Cary 7000 Universal Measurement Spectrophotometer (UMS)

EUV Defect Repair Strategy

CONTROLLING IMAGE PLACEMENT ERRORS DURING THE FABRICATION OF EUVL MASKS

Surface Preparation and Cleaning Conference April 19-20, 2016, Santa Clara, CA, USA. Nano-Bio Electronic Materials and Processing Lab.

DEPOSITION AND CHARACTERISTICS OF TANTALUM NITRIDE FILMS BY PLASMA ASSISTED ATOMIC LAYER DEPOSITION AS CU DIFFUSION BARRIER

Transcription:

Multilayer Development for Extreme Ultraviolet and Shorter Wavelength Lithography Eric Louis 1, Igor Makhotkin 1, Erwin Zoethout 1, Stephan Müllender 2 and Fred Bijkerk 1,3 1 FOM Institute for Plasma Physics Rijnhuizen, The Netherlands 2 Carl Zeiss SMT, GmbH, Germany 3 MESA+ Institute for Nanotechnology, The Netherlands

2 ASML presentation: 2010 International Workshop on EUV Sources, Dublin, Ireland

Outline FOM, who we are 13.5 nm research Need for shorter wavelengths optics 6.x nm multilayer issues relevant for performance and choice of optimum operational wavelength Passivation of La with Nitrogen Roughness reduction B 4 C B Wavelength selection: multilayer reflectivity profile @ 6.5-6.9 nm 3

EUVL: from basic research development labs FOM pilot research on lithographic imaging using 13.5 nm (1992) Two prototype 13.5 nm wafer scanners: ASML Alpha Demo Tools, ADT, including Zeiss and FOM ML-optics 13.5 nm exposures in resist 13.5 nm NA 0.2 # Multilayer optics 10 Max diameter 45 cm Resolution ~ diffraction limited 4

14 year of research on Mo/Si optics! Optical contrast Reflectance Period change (nm) Increased thermal stability 250 C annealing (hours) Mo/Si, no barriers With barriers Bandwidth Stress [MPa] 800 600 400 200 Stress reduction 0 Coating uniformity Periodicity control FOM, Si polish Windt et al M irkarimi et al FOM, Mo+Si polish 0.2 0.4 0.6 0.8-200 Contamination Bandwidth -400-600 Mo fraction/ E. Louis et. al., Prog. Surf. Sci., doi:10.1016/j.progsurf.2011.08.001, 2011 5

Downscaling to next generation EUV: 6.x nm = 13.5 6.X nm Novel ML coatings: New materials: Mo La, Si B (B 4 C) Reduced bi-layer thickness: 6.8 3.4 nm Requirements interlayer quality scale with λ Baseline technology required: Reduction of layers intermixing Roughness mitigation Optimization of optical contrast Search for optimal ML performance Technological aspects: Additionally to coating issues More bi-layers: @13.5 nm N=50 @6.x nm N~200 Bandwidth of the optical column λσ/λ(mo/si)=2% λσ/λ(la/b)=0.6% Reflectance Reflectance 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 REALITY Mo/Si 12.8 13 13.2 13.4 13.6 13.8 14 Wavelength (nm) GOAL La/B 4 C 0.0 6.50 6.55 6.60 6.65 6.70 6.75 6.80 Wavelength (nm) 6

1 st challenge: thermodynamics @ La/B 4 C interfaces The first TEM image blurred interfaces are observed: La-B compound formation? Compound La B 4 C LaC 2 LaB 6 LaN H for (kj/mol) 0-71 -89-130 -303 At interfaces: 7 La + 6 B 4 C 4 LaB 6 + 3 LaC 2 ( H = - 305.4 kj/mole) Solution: nitride formation can prevent La-B and La-C compound formation Introduce stable nitrides by N-ion treatment: LaN can even enhance optical contrast 1 1 T. Tsarfati, E. Louis, F. Bijkerk, et. all., Thin Solid Films 518, 24, 7249-7252 (2010) 7

La distribution, arb. un. 0.12 0.08 0.04 0.00 How does LaN perform in reflectance? Reconstruction of La depth profile in La/B 4 C in LaN/B 4 C 0.0 0.5 1.0 1.5 2.0 Multilayer period Reflectance 0.35 0.30 0.25 0.20 0.15 0.10 0.05 75 period multilayers 0.00 6.4 6.5 6.6 6.7 6.8 6.9 wavelength (nm) LaN/B 4 C La/B 4 C Dramatic difference in maximum reflectance Without any process optimization (Only 75 period multilayers) X ray CBO ω 2Ѳ PSA open Soll er 5⁰ NaI Nitridation of La key to reducing layer intermixing 8

2 nd challenge: roughness reduction Optical contrast 0.020 0.015 0.010 0.005 0.000 Calculations for 200 period LaN/B 4 C multilayer: Roughness reduction from 0.4 to 0.2 nm significant reflectivity gain -0.005 0.0 0.2 0.4 0.6 0.8 1.0 Multilayer period 0.8 0.7 0.6 Roughness control is essential Reflectance 0.5 0.4 0.3 0.2 0.1 0.0 6.50 6.55 6.60 6.65 6.70 6.75 6.80 Wavelength (nm) 9

Scattering from interfaces As deposited Individual interface roughness: 0.3-0.6 nm No severe increase roughness with number of layers First optimization Growth optimization Smoothing mechanisms Kinetic growth manipulation Process optimization smoother interfaces 10

Reflectance 0.8 0.7 0.6 3 rd challenge: optimal optical contrast Replacement B 4 C B: enhancement of the optical contrast 200 period ML's LaN/B LaN/B 4 C 0.5 0.4 0.3 0.2 0.1 0.0 6.50 6.55 6.60 6.65 6.70 6.75 6.80 Wavelength (nm) Reflectance 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 LaN/B LaN/B 4 C 0.00 6.6 6.7 6.8 6.9 7.0 7.1 Wavelength (nm) 50 period ML s AOI=30 o Calculations on ideal multilayers using measured 1,2 optical constants: 10% reflectivity gain Measurements of pilot samples confirm reflectivity gain Deposition pure B to be optimized 1. R. Soufli et. al., Appl. Opt., Vol. 47, 25, 2008 2. M. Fernandez-Perea et. al., J. Opt. Soc. Am. A, Vol. 24, 12, 2007 Replacement of B 4 C with B reflectivity gain expected 11

Outline FOM, who we are 14 years of extensive 13.5 nm research Coating research is essential key to new generation 6.x multilayer issues (a.o. materials) to determine performance and optimum operational wavelength Passivation of La with Nitrogen Roughness reduction B 4 C B Wavelength selection: multilayer reflectivity profile @ 6.5-6.9 nm 12

Calculated multilayer reflectance Optical constants: R. Soufli et. al., Appl. Opt., Vol. 47, 25, 2008 M. Fernandez-Perea et. al., J. Opt. Soc. Am. A, Vol. 24, 12, 2007 0.9 0.20 0.8 Peak reflectance 0.7 0.6 0.5 0.4 0.3 0.2 0.1 LaN/B 4 C (Henke) LaN/B LaN/B 4 C 0.15 0.10 0.05 Bandwidth (nm) 0.0 0.00 6.50 6.55 6.60 6.65 6.70 6.75 6.80 6.85 6.90 Wavelength (nm) Perfect multilayer: LaN/B: maximum reflectance at 6.66 nm LaN/B 4 C: maximum reflectance at 6.63 nm 13

Can optical constants be trusted? R( ) measured at various angles of incidence 1.0 LaN/B 1.0 LaN/B 4 C Normalized reflectance 0.8 0.6 0.4 0.2 experiment calculation 0.0 6.50 6.55 6.60 6.65 6.70 6.75 6.80 6.85 6.90 Wavelength (nm) Normalized reflectance 0.8 0.6 0.4 0.2 experiment calculation 0.0 6.50 6.55 6.60 6.65 6.70 6.75 6.80 6.85 6.90 Wavelength (nm) Calculated maximum confirmed by measured data optical constants reliably predicts optimal wavelength! 14

What about the source? Determination wavelength 6.x nm lithography: Simultaneous optimization required: source multilayer performance optical design Candidate wavelength band: 6.5-7.0 nm S.S. Churilov et al., Phys. Scr. 80 (2009) 15

Throughput of a 10 mirror system Integrated Reflectance 1.0 0.8 0.6 0.4 0.2 Tb LaN/B LaN/B 4 C 0.0 6.50 6.55 6.60 6.65 6.70 6.75 6.80 6.85 6.90 Wavelength (nm) Gd Significantly larger throughput for LaN/B based optics! Optimal wavelength: LaN/B 4 C: =6.64 nm; LaN/B: =6.67 nm Based on 10 ML reflectivity: Tb > 6.63 nm; Gd > 6.78 nm 16

Conclusions La-B interdiffusion strongly suppressed by nitridation: La/B 4 C LaN/B 4 C LaN/B 4 C LaN/B enhanced reflectance experimentally confirmed Preferred multilayer wavelength value: 6.63 nm or higher LaN/B 10 mirror system: highest throughput at 6.67 nm Source: Tb: > 6.63 nm Gd: > 6.78 nm Choice to be made also by source arguments 17

Acknowledgements Coworkers at and and Dutch Technology Foundation The team at Berlin The team at Kurchatov Institute Moscow, Hamburg and Institute of Crystallography RAS Moscow. 18