Introduction to Electron Backscattered Diffraction. TEQIP Workshop HREXRD Feb 1 st to Feb 5 th 2016

Similar documents
EBSD Basics EBSD. Marco Cantoni 021/ Centre Interdisciplinaire de Microscopie Electronique CIME. Phosphor Screen. Pole piece.

EBSD Electron BackScatter Diffraction Principle and Applications

Crystallographic orientation

Carnegie Mellon MRSEC

Strain. Two types of stresses: Usually:

AN INTRODUCTION TO OIM ANALYSIS

ELECTRON BACKSCATTER DIFFRACTION (EBSD) THE METHOD AND ITS APPLICATIONS IN MATERIALS SCIENCE AND ENGINEERING

ORIENTATION DETERMINATION BY EBSP IN AN ENVIRONMENTAL SCANNING ELECTRON MICROSCOPE

3D-EBSD an CrossBeam-Systemen

A Quantitative Evaluation of Microstructure by Electron Back-Scattered Diffraction Pattern Quality Variations

Application of ASTAR/precession electron diffraction technique to quantitatively study defects in nanocrystalline metallic materials

In-situ Heating Characterisation Using EBSD

Appendix 1 TEXTURE A1.1 REPRESENTATION OF TEXTURE

COMPARISON OF TEXTURE IN COPPER AND ALUMINUM THIN FILMS DETERMINED BY XRD AND EBSD *

The effect of different step-size on the visualization of crystallographic defects using SEM/EBSD technique

Mambo is the perfect tool for viewing EBSD data in pole and inverse pole figures.

Stuart I. Wright EDAX-TSL, Draper, Utah

NEMI Sn Whisker Modeling Group Part 2:Future Work

Microstructural Controls on Trace Element Variability in Ore Minerals

In-situ Observation of Microstructure Change in Steel by EBSD

Electron channelling contrast imaging (ECCI) an amazing tool for observations of crystal lattice defects in bulk samples

QUANTITATIVE MICROSTRUCTURE ANALYSIS OF DISPERSION STRENGTHENED Al-Al 4 C 3 MATERIAL BY EBSD TECHNIQUE


Three stages: Annealing Textures. 1. Recovery 2. Recrystallisation most significant texture changes 3. Grain Growth

Crystallographic Textures Measurement

Observation in the GB (Gentle Beam) Capabilities

Liverpool, UK, L69 3GP

TEM and Electron Diffraction Keith Leonard, PhD (1999) U. Cincinnati

3. Anisotropic blurring by dislocations

Diffraction Going further

Study of the Initial Stage and an Anisotropic Growth of Oxide Layers Formed on Zircaloy-4

Advances in EBSD Analysis Using Novel Dynamical Pattern Simulation Software

11.3 The analysis of electron diffraction patterns

Microstructure Evolution of Polycrystalline Pure Nickel during Static Recrystallization 1

Single crystal X-ray diffraction. Zsolt Kovács

Grain Contrast Imaging in UHV SLEEM

Microstructure and texture of asymmetrically rolled aluminium and titanium after deformation and recrystallization

Practical 2P8 Transmission Electron Microscopy

Electron backscatter diffraction (EBSD) in the SEM: applications to microstructures in minerals and rocks and recent technological advancements

On-axis Transmission Kikuchi Diffraction in the SEM. Performances and Applications

EFFECT OF CRYSTALLOGRAPHIC ORIENTATION ON MECHANICAL PROPERTIES OF STEEL SHEETS BY DEPTH SENSING INDENTATION

Determining the Dependence of Grain Boundary Mobility on Misorientation in High Purity Aluminum with Zirconium Additions. A Thesis

Finding Grain and Antigrains. Matt Nowell May 2016

Electron Microscopy Studies of Niobium Thin Films on Copper

TEM imaging and diffraction examples

Characterization of Al-8090 superplastic materials using orientation imaging microscopy

LECTURE 7. Dr. Teresa D. Golden University of North Texas Department of Chemistry

Crystallographic Distribution of Low Angle Grain Boundary Planes in Magnesium Oxide

Symmetry and Anisotropy Structure, Properties, Sample and Material, Texture and Anisotropy, Symmetry

Investigating the crystal orientation of SiC CVD using orientation imaging microscopy (OIM) & X-ray diffraction (XRD) by Deepak Ravindra

Changes in Microstructure of Al/AlN Interface during Thermal Cycling

Applications of EBSD

Practical 2P8 Transmission Electron Microscopy

Empirical constraints of shock features in monazite using shocked zircon inclusions

TEM imaging and diffraction examples

Electron Microscopy. Dynamical scattering

Imaging with Diffraction Contrast

MICROSTRUCTURAL STABILITY OF ULTRAFINE GRAINED COPPER AT ELEVATED TEMPERATURE

Influence of Crystal Orientations on the Bendability of an Al-Mg-Si Alloy

Evolution of Microstructure and Texture Associated with Ridging in Ferritic Stainless Steels

STUDIES ON THE ACCURACY OF ELECTRON BACKSCATTER DIFFRACTION MEASUREMENTS

EMSE Weak-Beam Dark-Field Technique

Kinematical theory of contrast

MICROSTRUCTURE CHARACTERIZATION OF GOES AFTER HOT ROLLING AND COLD ROLLING + DECARBURIZATION ANNEALING

Analyses on Compression Twins in Magnesium

LSPM CNRS, Université Paris 13, 99 av. J.B. Clément, Villetaneuse, France

EBSD Introduction 1. Electron BackScatter Diffraction - basics and applications - René de Kloe EDAX BV, Tilburg, The Netherlands.

Risks of Cleaning Electron Backscatter Diffraction Data

MTEX. an open source texture analysis toolbox. Ralf Hielscher. Belo Horizonte, TU Chemnitz, Germany

University of Groningen. Dynamics of tempering processes in stainless steel De Jeer, Leo T.H.; Ocelik, Vaclav; De Hosson, J.T.M.

ARTICLE IN PRESS. Ultramicroscopy

Structural change during cold rolling of electrodeposited copper

Diffraction Contrast Tomography. Unlocking Crystallographic Information from Laboratory X-ray Microscopy. Technical Note

Application of Scanning Electron Microscope to Dislocation Imaging in Steel

Electron microscopy II

Microstructure of Friction Stir Welded 6061 Aluminum Alloy

LaboTex Version 3.0. Texture Analysis Software for Windows. Texture Analysis on the Basis of EBSD Data

Development of bimodal grain structures in microalloyed steels:

STUDY & ANALYSIS OF ALUMINIUM FOIL AND ANATASE TITANIUM OXIDE (TiO2) USING TRANSMISSION ELECTRON MICROSCOPY

The object of this experiment is to test the de Broglie relationship for matter waves,

Texture Analysis using OIM

SI GUIDE. File Name: Supplementary Information Description: Supplementary Figures, Supplementary Notes and Supplementary References.

Effects of Grain Size and Orientation on Mechanical Response of Lead Free Solders. Jing Zou

ORIENTATION DEPENDENCE OF DISLOCATION STRUCTURE EVOLUTION OF ALUMINUM ALLOYS IN 2-D AND 3-D COLIN CLARKE MERRIMAN

MICROSTRUCTURE AND MECHANICAL PROPERTIES OF POWDER ALUMINIUM PREPARED BY SEVERE PLASTIC DEFORMATION

Deformation Microstructure and Texture in a Cold-Rolled Austenitic Steel with Low Stacking-Fault Energy

Diffraction Basics. The qualitative basics:

INFLUENCE OF MICROSTRUCTURE ON THE PROPAGATION OF FATIGUE CRACKS IN INCONEL 617. Benjiman Michael Albiston. A thesis. submitted in partial fulfillment

Characteristics of an Aluminum Alloy after Generation of Fine Grains Using Equal Channel Angular Extrusion Process

Thin Film Scattering: Epitaxial Layers

Investigation of SIBM driven recrystallization in alpha Zirconium based on EBSD data and Monte Carlo modeling

Effects of Wavy Roll-Forming on Textures in AZ31B Magnesium Alloy

Arch. Metall. Mater. 62 (2017), 2B,

Representation of Orientation

Homework 6: Calculation of Misorientation; A.D. Rollett, , Texture, Microstructure and Anisotropy

Analysis of EBSD Data

Recrystallization Theoretical & Practical Aspects

Microstructural Characterization of Materials

{001} Texture Map of AA5182 Aluminum Alloy for High Temperature Uniaxial Compression

Transmission Kikuchi Diffraction in the Scanning Electron Microscope

Transcription:

Introduction to Electron Backscattered Diffraction 1 TEQIP Workshop HREXRD Feb 1 st to Feb 5 th 2016

SE vs BSE 2

Ranges and interaction volumes 3 (1-2 m) http://www4.nau.edu/microanalysis/microprobe/interact-effects.html

Backscattered Electrons 4

Topographic Contrast 5 Image from Characterization Facility Manual, University of Minnesota

Secondary and backscattered Electrons 6 Backscattered electrons can also produce secondary electrons. Secondary electrons are generated throughout the interaction volume, but only secondary electrons produced near the surface are able to escape (~5 nm in metals). For this reason, secondary electron imaging (SEI) yields high resolution images of surface features. By definition, secondary electrons have energy <50 ev, with most <10 ev.

EBSD: Theory to Technique 7 Some slides borrowed from Prof. Sudhanshu Shekhar Singh and TSL OIM Training Program

Electron backscattered Diffraction (EBSD) 8

EBSD Setup 9 SEM vacuum chamber Diffracting plane Cone of intense electrons Diffraction Cones Electron beam EBSD detector Cone of deficient electrons Sample at 70 tilt Kikuchi pattern Kikuchi lines

Interaction of electrons with materials Kikuchi pattern (map) 10

Setup for EBSD in SEM 11 Principal system components Sample tilted at 70 from the horizontal phosphor screen (interaction of electrons) Sensitive CCD video camera (capture the image on phosphor screen) T. Maitland et. al., 2007 V. Randle et. al, 2000

Bragg s Law 12 d n = 2d sin B

Formation of Kikuchi lines 13

Conic Sections to Kikuchi Bands 14 The cones of diffracted electrons form hyperbolae on the phosphor screen

Properties of Kikuchi pattern 15 Each band : diffraction of a family of planes Intersections of bands : intersections of planes = zone axes Angles between bands : angles between planes Band widths : proportional to d(hkl) related to lattice parameters Middle line of a kikuchi band represents plane Excess line Zone axis Deficient line Kikuchi lines Kikuchi/EBSP pattern at a point

Indexing: Identifying various planes 16 Look Up Table (LUT) The angles between these bands formed by planes are measured from the Kikuchi pattern These values are compared against theoretical values of all angles formed by various planes for a given crystal system When the h-k-l values of a pair of lines are identified, it gives information about the pair of planes, but this does not distinguish between the two planes and hence this alone cannot be used to identify the orientation of the sample At least 3 sets of lines are required to completely identify the individual planes and hence find the orientation of the sample, as shown in Figure Angle (hkl) 1 (hkl) 2 25.2 200 311 29.5 111 311 31.5 220 311 35.1 311 311 35.3 111 220 45.0 200 220 50.5 311 311 54.7 111 200 58.5 111 311 60.0 220 202 63.0 311 131 64.8 220 311 70.5 111 111 72.5 200 131 80.0 111 311 84.8 311 131 90.0 111 220 90.0 200 020 90.0 200 022 90.0 220 113 90.0 220 220

Band Identification: Image processing 17

Hough Transform 18

Hough Transform 19

Hough Transform 20

Hough Transform 21

EBSD Analysis 22

In order to specify an orientation, it is necessary to set up terms of reference, each of which is known as a coordinate system There are two coordinate systems: Sample (specimen) coordinate system Crystal coordinate system Coordinate systems 23 Specimen coordinate system: Coordinate system chosen as the geometry of the sample Crystal coordinate system: Coordinate system based on crystal orientation. In general [100], [010], [001] are adopted V. Randle et. al., 2000

24 orientation is then defined as 'the position of the crystal coordinate system with respect to the specimen coordinate system', i.e. where Cc and CS are the crystal and specimen coordinate systems respectively and g is the orientation matrix The fundamental means for expressing g is the rotation or orientation matrix The first row of the matrix is given by the cosines of the angles between the first crystal axis, [l00], and each of the three specimen axes, X, Y, Z, in turn In general sample coordinate system is the reference system

Orientation Maps 25 =100 µm; IPF; Step=1 µm; Grid300x200 =100 µm; BC; Step=1 µm; Grid300x200 Inverse Pole Figure Image Quality Map

Phase Maps 26 Titanium Aluminate Alumina Erbium Oxide Zirconium Oxide

Various kinds of boundaries 27

Charts: Misorientation Angle Distribution 28

Charts: Misorientation Profile 29

Charts: Grain Size 30 The area (A) of a grain is the number (N) of points in the grain multiplied by a factor of the step size (s). For square grids: A = Ns 2 For hexagonal grids: A = N 3/2s 2 The diameter (D) is calculated from the area (A) assuming the grain is a circle: D = (4A/p) 1/2.

Pole Figures Consider a cubic crystal in a rolled sheet sample with "laboratory" or "sample" axes as shown below. 31 The Pole Figure plots the orientation of a given plane normal (pole) with respect to the sample reference frame. The example below is a (001) pole figure. Note the three points shown in the pole figure are for three symmetrically equivalent planes in the crystal.

Pole Figure: Texture Analysis 32

Orientation Distribution Function (ODF) 33 Although an orientation can be uniquely defined by a single point in Euler space, 3D graphs are hard to interpret Therefore ODF is a 2D representation of Euler Space Euler Space is divided into slices with interval of 5 o aluminum.matter.org.uk Slices arranged in gird called ODF

t-ebsd 34

SEM EBSD analysis of the microstructure in 316L chips formed with both the 0 and 20o raking angle 20 o tool angle: g = 1.5 not indexable a=+20 0 o tool angle: g = 1.9 a=0 tool indexable Large areas where the orientation cannot be determined (by indexing of Kikuchi patterns) 1. Due to refinement of the microstructure beyond the resolution limit of the SEM 2. Introduction of large amounts of colddeformation strain => decreasing the quality of the Kikuchi pattern Nothing could be indexed G. Facco; S. Shashank; M.R. Shankar; A.K. Kulovits; J.M.K. Wiezorek, MRS2010 Boston

G. Facco; S. Shashank; M.R. Shankar; A.K. Kulovits; J.M.K. Wiezorek, MRS2010 Boston TEM based OIM Analysis (+20 rake) 0.4 m 0.4 m 0.4 m 0.4 m Orientation spread 0.2 m 1. BF images show the formation of dislocation walls sub cell structure typical of large amounts of plastic deformation facilitated by conventional plastic deformation 2. OIM imaging shows large grains that contain low angle mis-orientations 3. OIM observations are consistent with BF image contrast of the dislocation wall sub cell structure

G. Facco; S. Shashank; M.R. Shankar; A.K. Kulovits; J.M.K. Wiezorek, MRS2010 Boston TEM based OIM Analysis (0 rake) 0.4 m 0.4 m 0.4 m 0.4 m 1. OIM imaging shows much smaller grains separated by High Angle Grain Boundaries HAGB s => grain refinement took place 2. 0 raking constitutes a severe plastic deformation process

Cross-correlation technique to determine elastic strain 38

In-situ Recrystallization 39 (a) 26R (b) 500 C (c) 15min (d) 30min (e) 90min (f) 120min N. Sharma, S. Shashank; submitted to J. Microscopy

Band Contrast Intensity as userindependent parameter 40 N. Sharma, S. Shashank; submitted to J. Microscopy

Recovery Parameter 41 (a) 26R, (b) 200 C and (c) 450 C. N. Sharma, S. Shashank; submitted to J. Microscopy

MAD as user-independent parameter 42 N. Sharma, S. Shashank; submitted to J. Microscopy

Summary EBSD is a very powerful technique for quantitative microscopy It is based on diffraction and hence can be used for any crystalline materials This method provides trove of data related to orientation, misorientation and can be extrapolated to represent strains, extent of recovery, recrystallization and may more things 43