Radiation Curing AIPI Milano, 15 May 2014 DELO Stefano Farina. Stand: 10/10

Similar documents
DELO KATIOBOND 4552 Light-activated adhesive, low viscos

DELO DUALBOND OB749 UV-/light-/heat curing adhesive, medium viscosity

DELO PHOTOBOND 4468 UV- and light curing acrylate adhesive, medium viscosity

Adhesive curing with the DELOLUX 80 LED lamp. DELOLUX 80 LED Curing Lamp

DELO-PHOTOBOND PB437 UV- and light curing acrylate adhesive, medium viscosity

DELO PHOTOBOND PB437 UV- and light curing acrylate adhesive, medium viscosity

DELO PHOTOBOND GB422 UV- and light curing acrylate adhesive, low viscosity

The perfect adhesive for any potting or encapsulation. Potting Compounds and Encapsulants Reliable Protection of Components

Potting Compounds and Encapsulants Reliable Protection of Components. The perfect adhesive for any potting or encapsulation

Fast processes are preferred in

DELO -ML DB135 Anaerobic- and light curing adhesive, high-strength

DELO DUALBOND. Instructions for Use & General Information on the Product Group. Application areas. Light- and humidity-curing acrylates

DELO DUALBOND. Instructions for Use & General Information on the Product Group. Application areas. Light- and humidity-curing acrylates

DELO PHOTOBOND. Instructions for Use & General Information on the Product Group. Application areas. UV-curing and light-curing acrylates

Glass Bonding. Requirements, Product Range, and Design Examples. Compression shear specimens according to DELO Standard 5

Compression shear specimens acc. to DELO Standard 5. Glass Bonding Requirements, Adhesives, Applications

0250/14.02 ONSERT. Quick and process-reliable bonding of fastening elements with light-curing adhesives. A joint project between

Smart Card Adhesive Excellence and Process Intelligence. Smart card

Technical Datasheet Vitralit 7090 VHS

Lenses on LED modules. Adhesive and Process Solutions for LED Packaging

White Paper Adhesives Sealants Tapes

Multiple bonds in e-motors. Adhesives for E-Motors

ONSERT. Quick and process-reliable bonding of fastening elements with light-curing adhesives. A joint project between

Light Curing Benefits, Adhesives and Curing Lamps. Curing of microswitch sealing with DELOLUX 202

Curing of microswitch sealing with DELOLUX 202. Light Curing Benefits, Adhesives and Curing Lamps

Deep - blue transparent liquid. Specific Gravity Non - Volatile Ingredient 99 % Tensile Strength (kg/cm²) Hardness (Shore D) 90-95

Light Curing - Bonds that Last

Top tipsfor getting. UV curing. process. the best from your. info 1/11

UV and/or visible light absorbing

Smart Card Adhesive Excellence and Process Intelligence. Smart card

Optimizing an LED-Curing System. Virginia Read, Market Segment Manager Industrial Gary Zubricky, Product Line Manager Equipment

High and Matched Refractive Index Liquid Adhesives for Optical Device Assembly

Smartphone with compact camera. Compact Camera Module Assembly Customized Adhesives

Technical Data December 17, 2003 Three Bond Co., Ltd.

DELO-DUOPOX SJ8665 Multi-purpose 2c epoxy resin, cures at room temperature, medium-viscous, filled

ARON OXETANE OXT-221

Epoxy. Epoxy 90, ,000. Epoxy. Epoxy. low ion content, Encapsulation of electronic

EPIKOTE MGS LR 235 Resin EPIKURE MGS LH Curing Agents

DELO MONOPOX AD286 heat curing, construction adhesive

Liquid Optically Clear Adhesive for Display Applications

UV-LED Curing for Industrial Printing

Impact of Zinc Oxide on the UV Absorbance and Mechanical Properties of UV Cured Films

Spectral output of a medium pressure mercury vapor bulb

Light Curing Acrylic Adhesives

DELO-DUOPOX SJ8665 Multi-purpose 2c epoxy resin, cures at room temperature, medium-viscous, filled

Test item Unit Test results Test method Remarks TS C 2/20 rpm

Joint design is critical to the optimum performance of a bond. Factors to be considered in choosing a joint design include

DELO-DUOPOX SJ8665 Multi-purpose 2c epoxy resin, cures at room temperature, medium-viscous, filled

Choosing a Silicone Encapsulant for Photovoltaic Applications

EFFICIENT UV TECHNOLOGY DESIGNS FOR METAL PACKAGING ASIA CAN TECH CONFERENCE. Kuala Lumpur, November , John Clark

DELO-DUOPOX AD895 Multi-purpose 2c epoxy resin, cures at room temperature, medium-viscous, filled

OXT-101 TOAGOSEI CO., LTD.

DELO-DUOPOX AD840 Multi-purpose 2c epoxy resin, cures at room temperature, medium-viscous, filled

EPIKOTE Resin MGS LR285

Composite Solutions for the Automotive Industry

GUIDE to SELECTING and USING

EPIKOTE Resin MGS LR285

Two-Part Acrylic Elastic Epoxy that Cures at Room Temperature

Exterior Wood Coatings based on New Waterborne One-Component UV-Curable Polyurethane Dispersions

A.D. Alobaidani, * D. Furniss, M.S. Johnson, Faculty of Engineering, University of Nottingham,

Abstract. Introduction

UV LED Curing for Wood Coatings

UV structural Adhesives and Sealants How They Are Unique In The Larger Universe Of Photocuring Resins

Equipment Manual Hand-Held Applicators

Welcome to Today s Webinar

Handling of TEGO RC Silicones. Hardi Döhler Jürgen Pomorin

UV-LED: Beyond the Early Adopters

DELO-DUOPOX AD840 Multi-purpose 2c epoxy resin, cures at room temperature, medium-viscous, filled

Process Solutions for Die Attach

Illuminating Innovations

LOCKING FASTENING SEALING BONDING.

Quartz Glass for Ultra High Pressure and High Intensity Discharge Lamps. Heraeus Quarzglas

Directed Oligomer Structure by Controlled Radical Polymerization For Use In Photocurable Thin Films.

GUIDE to SELECTING and USING

TWO COMPONENT METHACRYLATE

Optically Clear Epoxy Encapsulating & Potting Compound 8322 Technical Data Sheet

HYBRID UV IS IT REALLY ALL UV-LED A C H I M H E R Z O G T H E I J C

URL : http//

TECHNICAL DATA. ThreeBond 3055 & 3055B. Acryl UV Hardening Adhesive. Features. Applications

Process Solutions for Die Attach

Fabrication of Smart Card using UV Curable Anisotropic Conductive Adhesive (ACA) Part I: Optimization of the curing conditions

GVB GmbH Solutions in Glass Nordstern-Park Herzogenrath Germany Fax

Basic Lamp Types for Metal and Ceramic Base Designs

DELO-DUOPOX AD894 Multi-purpose 2c epoxy resin, cures at room temperature, low-viscous, filled

Light-emitting diodes for ultravioletcuring

A Viable Alternative for UV Inkjet Applications

Product Information Adhesive Brands

Performance Characteristics + Benefits. Suitable Materials. Acrylics, PVC, ABS, metals, SMC, polyester/vinylester, epoxy, coated metals.

Excelitas Technologies Utilizing deep-uv LED below 300nm to enhance curing

Better stick with UV-curing

Abstract. Introduction

Coating and impregnating protection

Bonding of SMD components with light-curing adhesives by radiation transmission. Part 1

Technical data sheet Spectral UNDER 325 Two-component acrylic filler RELATED PRODUCTS. acrylic thinners

Thermally Conductive Silicone Adhesive TSE3280-G

NTT-AT Optical Adhesives Lineup. Adhesives / Resins and Sealants for Optical Component Assembly

CATHETER and GUIDEWIRE-BONDING ADHESIVES

Thermally Conductive Epoxy Product No

CREATING TOMORROW S SOLUTIONS MOBILITY. e-novation FOR FUEL CELLS POWERED BY SILICONES

Application Notes: PixClear for OLED Internal Light Extraction Rev /4/17

Transcription:

Radiation Curing AIPI Milano, 15 May 2014 DELO Stefano Farina

Product description - Properties and advantages Properties: one-component curing at room temperature curing with UVA- or visible light PHOTOBOND: radiation curing acrylates KATIOBOND: radiation curing epoxy resins DUALBOND: radiation curing epoxy resins additional heat curing is possible Advantages: fast curing in 1 to 60 s elongation at tear 1 up to 300 % no efflorescence processing time controllable through irradiation

Fields of application Smart Cards Glass furniture Loudspeakers for mobile phones Switches, relays, sensors for plant construction and automotive industry

Electromagnetic spectrum For radiation, curing visible light, UVA and UVB (conditionally) are used

Radiation properties Influence of wavelength on photo energy and penetration depth

Transmission spectrum Transmission of different materials Glass Transmission in % PC with filler Wavelength in nm UV-light Visible light

DELO s lamp range DELOLUX 20 DELOLUX 50 DELOLUX 80 DELOLUX 03 S DELOLUX 04 DELOLUXcontrol

Discharge bulb technology (till yesterday ) DELOLUX 03 S DELOLUX 04 DELOLUX 06

Medium-pressure mercury bulbs Setup of the radiator Base Quartz pipe Electrodes Current passage Gas filling

Medium-pressure mercury bulbs Emission spectrum

Medium-pressure mercury bulbs Influencing of the emission spectrum of lamps by doping e.g. with iron (F) Used in DELOLUX 03, DELOLUX 06, DELOLUX 10

High-pressure mercury bulbs Without doping Used in DELOLUX 04

Aging of bulbs with electrodes Decrease in intensity of an iron-doped medium-pressure mercury bulb UVA-Intensity in % Tolerance band Burning time

Intensity measurement - DELOLUXcontrol The irradiance of curing lamps is influenced by aging of the curing lamp and thus decrease in intensity contamination of the lamp disks Therefore: Intensity measurement in the following possible versions: discontinuous measurement (e. g. every day) continuous measurement combination of both versions

LED lamp technology Lamp optimized for the adhesive Fast curing of all UV- and light-curing adhesives Unchanging intensity of the LEDs for optimum process reliability Low maintenance, spare part and operating expenses (TCO - total cost of ownership) Also ideal for short cycle times

Radiation curing: LED Technology (from today on ) Easy: intensity adjustment from 0 100 % Robust: no moving shutter Energy-saving: power on demand life time = curing time

LED-Technology Wavelength adjusted to the photoinitiator. Light completely usable for adhesive curing Fast processes possible

Discharge lamp UV LED Blue LED 0 mm 2 mm Adhesive layer 4 mm 6 mm 8 mm Substrate 10 mm 350 390 nm 390-480 nm 480 540 nm 540 590 nm 590 800 nm

Comparison of discharge and LED lamps Discharge lamps Radiation exit area Power consumption Intensity Emission spectrum DELOLUX 03 S area lamp 212 x 170 mm 400 W 70 mw/cm² UVA at a distance of 100 mm 325 600 nm UVA + VIS DELOLUX 04 light guide lamp light guide Ø 8 mm, 5 mm, 3 mm double 380 W 8,000 mw/cm² UVA at the light guide outlet 315 500 nm UVA + VIS LED lamps Radiation exit area Power consumption Intensity Emission spectrum DELOLUX 20 LED area lamp 101 x 101 mm max. 200 W 200 mw/cm² with type 400 250 mw/cm² with type 460 400 + 460 nm DELOLUX 22 LED area module 55 x 23.3 mm approx. 20 W > 200 mw/cm² LED 400 + 460 nm DELOLUX 80 LED spot lamp Ø 16.9 mm with type 400 and 460 Ø 23.0 mm with type 365 Max. 200 W > 1,000 mw/cm² LED at the optical outlet 365, 400 + 460 nm DELOLUX 50 LED spot lamp Ø 8.6 mm max. 200 W up to 12,000 mw/cm² LED 365 nm

Overview of photo-initiated adhesives Photoinitiated adhesives Radical-curing acrylates DELO-PHOTOBOND Cationic-curing epoxies DELO-KATIOBOND Cationic-curing epoxies DELO-DUALBOND UVA-curing 320-400 nm Radiation-curing 380-450 nm UVA-curing 320-400 nm Light-activation 400-550 nm Light- and/or heat-curing 320-400 nm

DELO-PHOTOBOND - Radical polymerization Monomers: ester of acrylic acid Photoinitiator: I H H C = C H C = O O R 2 1. Decomposition of the photoinitiator in free radicals by irradiation with UV- and visible light respectively: I light R 2. Opening of the double-bond and formation of monomer radicals: R + C = C R - C - C Irradiation must continue until complete curing is achieved! Thus at least one component must be translucent! 3. Chain growth leads to adhesive curing: R - C - C + nc = C R - [C - C] n - C - C

DELO-PHOTOBOND - Options for processing Light- or UV-curing Dispensing Joining Curing

DELO-PHOTOBOND - Curing process 160000 140000 120000 Viscosity [Pas] 100000 80000 60000 40000 20000 0 0 5 10 15 20 25 30 35 40 45 50 Time t [s] DELO-PHOTOBOND 4302 DELO-PHOTOBOND 4436

DELO-PHOTOBOND - Fundamental product properties Every second cell phone is manufactured using DELO-PHOTOBOND Fast curing in 1 s possible Optically stable in the Xenon test at 10-fold sunlight intensity Wide range of elasticity from 4 to 300 % elongation at tear Great layer thickness possible up to 5 mm Hardly exothermal heat development during curing Humid surfaces through oxygen inhibition with some products Biocompatibility: Licenses for medical engineering according to USP Class VI are existent

DELO-KATIOBOND - Cationic polymerization Monomers: Epoxies Photoinitiator: I 1. Decomposition of the photoinitiator in cation and counterion by irradiation with UV- and visible light respectively: light I R + +Y - 2. Cationic opening of the epoxy ring and formation of monomer radicals: C - C O + R + +Y - R2 R3 R1 C - C O R4 C - C O+ R + Y - 3. Chain growth through cationic opening of further epoxy rings (can be extremely exothermal) Irradiation must not be effected until final curing Opaque components can therefore also be bonded Please notice: The complete adhesive amount needs to be irradiated

DELO-KATIOBOND - Options for processing Light- or UV-curing Dispensing Joining Curing Activated by light Dispensing Activating Joining and curing without further irradiation

DELO-KATIOBOND - Curing process 1200000 1000000 Viscosity [Pas] 800000 600000 400000 200000 0 2 min 3 h 5 h 6 h 24 h Time t [s] Activation: 0,8 s / 200 mw/cm² Activation: 0,4 s / 140 mw/cm²

DELO-KATIOBOND Pre-activation times Dependence of open time from preactivation time Processing times DELO-KATIOBOND 45952 6 5 Test (drops) 4 3 2 1 Preactivation time Open time 0 2 4 6 8 10 12 14 16 Processing time / s Parameter: 10 mg drops on glass object holders Irradiation with 50 mw/cm²

DELO-KATIOBOND - Fundamental product properties Three out of four smart cards are manufactured with the use of DELO-KATIOBOND Low ion content (important for electronic applications) Temperature range of use up to 150 C Preactivation possible (bonding of opaque components possible) Biocompatibility: Licenses for medical engineering according to USP XXIII Class VI are existent Tension-equalizing with an elongation at tear up to 50 % Dry surface Exothermal curing

DELO-KATIOBOND - Climate resistance 9 Compression shear strength [MPa] 8 7 6 5 4 3 2 Compression shear strength PC/Al Compression shear strength PC/Al after 4 w climate 1 0 DELO-KATIOBOND 4557 DELO-KATIOBOND 4571 DELO-KATIOBOND 45952

DELO-KATIOBOND - Temperature resistance 30 7 Tensile strength [MPa] 25 20 15 10 5 Elongation at tear [%] 6 5 4 3 2 1 0 DELO-KATIOBOND 4594 0 DELO-KATIOBOND 4594 Tensile strength [MPa] Tensile strength [MPa] 1000h/160 C Elongation at tear [%] Elongation at tear [%] 1000h/160 C Measurands at room temperature each.

DELO-DUALBOND - Fundamental product properties Curing with heat (minimum 120 C) Fast curing of visible areas with light For components with shadowed areas Dry surface Temperature range of use up to 150 C Tension-equalizing with an elongation at tear up to 50 % Fast heat-curing e.g. 3 min at 130 C