Benefits Damage-free dicing of thin silicon Capable of producing smallest street widths which in return provides additional space for more parts per wafer Single step process results in reduction of cost and processing time per wafer Capable of producing multiple size die on the same wafer Capable of dicing complex shapes Cuts each die individually, regardless of shape, size or position Capable of cutting wafers on tape frame Dry process eliminates the use of water and additional steps
Wafer Dicing System PTG s basic Wafer Dicing System incorporates Zero Width Laser Dicing Technology, an innovative method of splitting brittle materials without generating a visible seam. It is a basic method of controlled propagation of Micro-Cracks.
Wafer Dicing System PTG s basic system incorporates a Linear Planar Stepper, Laser Head and Control System. Laser Beam Delivery Optics Touch Screen Interface Linear Planar Stepper Material Processing Table Control System Power Supply
Advantages of ZWDT Higher speed 100 times faster than conventional laser dicing 20 times faster than mechanical saw Can process 200mm Wafer in under 30 minutes No loss of material High precision Produces non-dimensional scribe line with no residue
Advantages of ZWDT No micro-cracks, fragmentation or chipping Edges have a high resistance to breakage Edges have an optical quality Eliminates the need for cleaning Entire process can be brought inside the clean room
Advantages of ZWDT Narrow street width Negligible heat affected zone (HAZ) No additional processes involved No polishing No liquids No chemicals No contaminants to the wafer surface
Comparison with Existing Technologies Parameter Technology ZWDT Laser-MicroJet Conventional Laser Dicing Conventional Dicing Speed Up to 1000mm/sec Variable 50x lower Variable 50x lower Variable 50x lower Cycle Time for 1 Wafer 5-10min 8 hours 12 hours 1.5 hours Real Estate 0% Loss 60-100 mkm loss 60-100 mkm loss 60-100 mkm loss Street Width 0 60-100 mkm 60-100 mkm 60-100 mkm HAZ 0 300 mkm 1000 mkm 0 Surface Temperature 100 C 100 C 350 C 80 C # of Passes Required 1 Multiple Multiple Multiple Micro-Cracks None Limited Substantial Substantial Chipping None Limited Limited Substantial Edge Strength Excellent Exceptional < Exceptional Exceptional Most Effective Wafer Thickness Any 80 mkm 80 mkm Any Residue None Cleaning None Cost of Ownership Lowest High Low High Footprint 1m x 1m 2m x 3m 1m x 2m 1m x 1m Typical MTBF (hours) 25000 10000* 15000 20000 Clean Room Compatibility No No No
How Laser Dicing Works Mechanical scribe and break is the classic and most widely used glass separation technology. Laser Cutting Mechanical Scribe PTG s ZWDT uses the controlled propagation of a subsurface micro fracture along the projected separation line with no material loss and extremely high speed and throughput.
How Laser Dicing Works δ mm P = Constant 200 Watt 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 ZWDT incorporates cooling of the surface following controlled heating. With the correct power density profile, this creates the intermolecular separation of the substrate to a certain depth, t. 90 200 350 500 700 800 v mm/sec Depth t has an inverse relation to the speed (v) of cutting, assuming that power (P) is constant. This means that the slower the speed the deeper the micro fracture that is formed will be.
How Laser Dicing Works Both mathematical models and empirical data support these conclusions and field experience has verified these findings.
How Laser Dicing Works