QUALITEK 381 NO CLEAN FLUX CORPORATE HEADQUARTERS USA: 315 Fairbank St. Addison, IL 63-628-883 FAX 63-628-6543 EUROPE UK: Unit 9 Apex Ct. Bassendale Rd. Bromborough, Wirral CH62 3RE 44 151 334 888 FAX 44 151 346 148 ASIA-PACIFIC HEADQUARTERS SINGAPORE: 6 Tuas South St. 5 Singapore 63779 65 6795 7757 FAX 65 6795 7767 PHILIPPINES: Phase 1 Qualitek Ave. Mariveles, Bataan Philippines C-216 6347 935 4163 FAX 63475613717 CHINA: 3B/F, YiPa Print Bldg. 351 # JiHua Rd., Buji Shenzhen, China 518112 86 755 28522814 FAX 86 755 28522787
Description Qualitek 381 is a No Clean halide-free flux designed for both wave soldering and surface mount board assembly applications. The low solids content of 381 flux results in virtually no residue remaining on the boards after soldering. 381 No Clean flux may be used with both high temperature Lead-Free and Sn-Pb soldering processes. Qualitek 381 flux has been designed to improve soldering performance by minimizing bridging and other solder defects. Main Features Halide-free Low residue Excellent wetting Non-conductive/Non-corrosive residues Compatible with Lead-Free & Leaded Solder Systems Technical Data Specification Test Method Flux Classification ROL IPC-J-STD-4B Color and Appearance Light Straw Liquid Copper Mirror Pass IPC-TM-65 2.3.32 Corrosion Pass IPC-TM-65 2.6.15 SIR 2.36 x 1 13 ohms IPC-TM-65 2.6.3.3 Specific Gravity (g/cm 3 ).8 ±.5 Solids 3.75 ±.75 IPC-TM-65 2.3.34 Acid Number (mgkoh/g) 19. 22. Titration (this portion intentionally left blank) Page 2 of 5
Applications TECHNICAL DATA SHEET Flux Application For mass wave soldering of OSP and plated circuit boards, spray, foam or wave fluxing can be utilized to apply this flux. Flux deposition density and uniformity are critical to successful use of low solids no-clean flux. If foam fluxing, the foam fluxer should be supplied with compressed air, which is free of oil and water. The flux tank should be full at all times. The surface of the flux should be 1-½ inches above the top of the flux aerator, or flux stone. Pressure should then be adjusted to produce the optimum foam height with a fine uniform foam head. After fluxing, an air knife should be used to remove excessive flux from the assembly. Uniformity of the spray flux coating can be visually checked by running a tempered glass plate (usually supplied by machine manufacturer) through the spray and preheat sections, and inspected before going across the wave. OPERATING PARAMETERS Amount of flux TYPICAL LEVEL Foam, Wave: 1-2 µg/in 2 solids Spray: 75-15 µg/in 2 solids Foam Fluxing Parameters Foam Stone Pore Size 2-5 µm Flux Level Above Stone 1-1 ½ inches (25-4mm) Chimney Opening 3/8-1/2 inch (1-13 mm) Air Pressure 1-2 psi Top Side Preheat Temperature 19-23 F (85-11 C) Bottom Side Preheat Temperature 65 F (35 C) higher than topside Conveyor Speed 4-6 feet/minute(1.2-1.8 meters/minute) Contact Time in the Solder (including Chip & Lambda) 2.5-4.5 seconds Solder Pot Temperature Sn96.5/Ag3.5 5-53 F (26-276 C) Sn95/Ag5 536-565 F (28-296 C) Sn99.3/Cu.7 51-53 F (265-276 C) SnAgCu 52-53 F (271-276 C) Sn95/Sb5 536-565 F (28-296 C) TYPICAL Lead Free Wave Solder Profile (SNAGCU) Temp ( C) 3 274 25 2 Bottom Side Preheats: 12-145 C for 6 sec Time in Wave = 2.5 to 5 Sec 15 C Max 15 Top Side Preheats: 85-11 C for 6 sec 1 Preheat Zone 5 Flux Zone Time 15 3 5 4 6 75 9 2 135 14 5 16 165 18 183 84 185 19 15 1 1 17 1 1 Time (Sec) 95 2 21 225 24 Page 3 of 5
TYPICAL Leaded Wave Solder Profile (Sn63/Pb37) T e m p ( C ) 3 2 4 2 5 T i m e i n W a v e = 3. 5-4 S e c B o t t o m S i d e P r e h e a t s : 1 1-1 4 C f o r 6 s e c 1 5 C M a x 2 1 5 T o p S i d e P r e h e a t s : 7 7-9 4 C f o r 6 s e c 1 M a x R a m p U p : 2 C / s e c P r e h e a t Z o n e 5 F l u x Z o n e T im e 1 5 3 4 5 6 7 5 9 1 5 1 2 1 3 5 1 4 1 5 1 6 1 6 5 1 7 1 8 1 8 3 1 8 4 1 8 5 1 9 1 9 5 2 2 1 2 2 5 2 4 T i m e ( S e c ) Process Control Control of flux during use is necessary to assure consistent flux deposition on the circuit board. Due to the very low solids content of no clean fluxes, specific gravity is not an accurate measure for assessing solids content. Monitoring and controlling acid number by titration is recommended for maintaining the proper flux concentration. Control of the flux can be achieved with 3A thinner to maintain fluxing activity. Over time debris and contaminants may accumulate in the flux reservoir. Therefore, periodically replacing the flux and cleaning the reservoir is recommended for consistent performance and minimizing debris build-up. Cleaning 381 is a no clean formulation, therefore, the residues are not required to be removed for typical applications. If residue removal is desired, the use of Everkleen 15 Buffered Saponifier with a 5-15% concentration in hot 6 C (14 F) will aid in residue removal. Storage & Shelf Life 381 Liquid Flux should be stored in a 65-8 F environment away from direct heat and flame. Shelf life is 2 years from date of manufacture. Page 4 of 5
Packaging 381 No Clean Liquid Flux is available in 1 Gallon/1 Liter containers 5 Gallon/5 Liter containers 55 Gallon/2 Liter containers Disposal 381 contains hazardous ingredients therefore the flux should be disposed of in accordance with federal, state and local authority requirements. Qualitek is a brand of Qualitek International, Inc. Page 5 of 5