Nondestructive Internal Inspection The World s Leading Acoustic Micro Imaging Lab
Unmatched Capabilities and Extensive Expertise At Your Service SonoLab, a division of Sonoscan, is the world s largest inspection service specializing in Acoustic Micro Imaging (AMI). Staffed by dedicated applications engineers, SonoLab delivers more experience in AMI applications than any other lab. Through SonoLab, you ll access the superior image quality and extraordinary data accuracy of Sonoscan C-SAM acoustic microscopes, while benefiting from the capabilities and careful analysis of the world s leading AMI experts. You ll receive detailed, illustrated reports as well as verbal consultation regarding your component s internal features, failure mechanism or accept/reject criteria. With Sonoscan-staffed lab locations worldwide and the full resources of Sonoscan, SonoLab brings the capability, flexibility and capacity to meet all your AMI requirements. Market Applications Acoustic Micro Imaging is relied upon for finding defects in a wide range of samples wherever the bonding between layers or the integrity of the materials themselves is of critical importance. A variety of market applications have benefited from SonoLab services: Microelectronics Plastic Encapsulated Microcircuits Ceramic Chip Capacitors Die Attach Chip Scale Packages (CSPs) Flip Chips Stacked Dies Ball Grid Arrays (BGAs/CBGAs) Tape Automated Bond (TAB) Hybrids, MCMs, SIPs Flex Circuits Printed Circuit Boards (PCBs) Smart Cards Bonded Wafers Thermo Electric Coolers (TECs) Power Modules Military, Aerospace and Automotive High-Rel Qualification Upscreening COTS Qualification Lead-free Devices Microelectromechanical Systems (MEMS) Bonded Wafers Fabrication Process Evaluation Zero Level Packaging Seal Level Packaging Packaging Sensors IMEMS MOEMS Lab-on-Chips BioChips Microarrays Composites Fiberglass Polymers Graphite Metal Matrix Hybrid Other Materials Glass Ceramics Plastics Adhesives Metals X-ray Targets Solar Energy Thin Film Polymer-Based Silicon Packaging, Seals Food Medical Pharma Other Hermetic Medical Materials Devices
SonoLab Services Need to analyze a lot of product quickly? Need independent verification? Need a flexible resource for acoustic microscopy? SonoLab has the capabilities to meet your needs. Services include: Component Qualification to Industry Standards SonoLab brings an unmatched combination of experience and technology in component qualification. Ensure your designs meet appropriate standards, such as IPC/JEDEC and various military and aerospace specifications, by putting SonoLab on your development team. Materials Characterization and Evaluation SonoLab will help you determine specific material properties or help you determine if a material has changed significantly compared to the qualified material. The unique nature of this inspection process reveals critical information on a component s construction while leaving the part undisturbed for further investigation. High-Capacity Screening and Lot Reclamation When you need parts quickly screened whether it s 1,000 pieces, 100,000 pieces or even more tap into SonoLab s unmatched capabilities and nearly limitless capacity. SonoLab gives you the ability to verify quality within a large sample size or separate good units from reliability risks as part of a lot reclamation initiative. Failure Analysis and Constructional Analysis SonoLab is the recognized standard for nondestructive analysis. SonoLab personnel will apply the most advanced techniques and technology and provide you with a detailed, illustrated report. You ll gain powerful insights regarding your component s internal features and failure mechanism and understand how you can prevent failures in the future. Inspection and Audit Services SonoLab delivers a comprehensive range of inspection services, including development, failure analysis and industry or military qualifications. In addition, SonoLab can be a valuable independent third-party resource for auditing the quality of purchased components. Custom Training If you currently own Sonoscan equipment, SonoLab s acoustic application engineers can create a customized program to meet your needs. Whether you have new personnel or new applications, wish to improve data and image interpretation skills, or want to learn advanced inspection methods, custom training will provide a lasting benefit. Industry Standards Sonoscan originated Acoustic Micro Imaging (AMI) and continues to work with various organizations to help develop qualification standards that improve component reliability. SonoLab inspection programs will meet all of your qualification needs. IPC/JEDEC J-STD-020 J-STD-035 J-STD-075 MEMS STANDARD SEMI MS8-0309 MILITARY PERFORMANCE SPECIFICATION MIL-PRF-123 MIL-PRF-31033 MIL-PRF-49470 AEROSPACE (NASA & ESA) PEM-INST-001 (NASA/TP 2003 212244) ESA/ESCC Basic Specification No. 25200 MIL/AERO STANDARD GEIA-STD-0006 MILITARY STANDARD MIL-STD-883, METHOD 2030 MIL-STD-883, METHOD 2035 MIL-STD-1580B REQUIREMENT 16.5.1.3 NASA S-311-P-829
Inspection Examples & Results Plastic Encapsulated Microcircuit Hidden defects within an electronic package can often lead to catastrophic failure of the device. Critical delaminations (red and yellow areas) are revealed. Flip Chip Flip chip devices are routinely inspected for underfill, bump and silicon quality. The bright white areas observed in this flip chip image are voids in the underfill, which can lead to electrical failure. Ceramic Chip Capacitor Internal defects such as delaminations, cracks and voids within ceramic chip capacitors can lead to product failure. This inspection revealed delaminations and voids (bright white areas) within the active area. Bonded Wafer Evaluating bond quality in wafer pairs can uncover delaminated and voided regions that can lead to yield loss. Red areas indicate voids and delaminations detected between the wafers. Materials The mechanical strength of a composite can affect its performance. The bright white areas indicate voids and cracks stress points that can lead to mechanical failure, as happened here. MEMS Delaminations and voids can compromise the hermiticity of these devices. The regularly spaced red features are intentional air cavities that contain the actual MEMS devices. The remaining red areas are defects. State-of-the-Art Inspection at SonoLab You can depend on receiving the highest quality Acoustic Micro Imaging (AMI) when you entrust your parts to the professionals who invented the technology. Sonoscan s AMI is unmatched in its ability to find delaminations, voids, cracks and other hidden defects. Working exclusively with Sonoscan systems and technologies, our industryleading engineers use patented technology such as Virtual Rescanning Mode (VRM), an application that allows you to rescan your component even after it s been destroyed, to provide you with the most effective analysis services available.
Foil Seal In medical devices and pharmaceutical packaging, a seal is often used to keep the device or cavity contents sterile and contaminant-free. The bright white areas along the outer perimeter show several leak paths across the width of the seal. Thermo Electric Cooler The ability to actively transfer heat makes thermo electric coolers (TECs) useful devices in a variety of applications. The bright white features within the dark rectangles indicate voids at the direct bond copper (DBC) to ceramic substrate interface. Ball Grid Array This three-dimensional image also includes a crosssectional view through the center of this BGA. Depth information is gained from these views. The red feature near the center is from a void in the die attach. Power Module The ability to transfer heat from the die to the heat sink will often characterize how long a power device will function. The red areas are voids and delaminations between the die and heat sink. Thin Film Solar Cell The thin film cell structure is a multi-layered composite, where each layer must be interconnected and uniformly deposited and bonded. A missing interconnect can be seen in the lower left of the grid, along with delamination of the layers. Solar Concentrator The key reliability issue is the proper transfer of the excess solar thermal energy, requiring a consistent bond between the solar cell and the heat sink. The red areas indicate gaps in the cell-to-solder interface, which could cause loss of efficiency or failure of the structure. Stacked Die These images are from a BGA package containing a two-die stack. The first image indicates good bonding and silicon integrity at the first die. Inspection of the second die reveals a large diagonal crack within the silicon, noted by the red arrow. Additional smaller cracks are highlighted with yellow arrows.
SonoLab Locations Europe Silicon Valley Chicago Phoenix Shanghai SonoLab Silicon Valley 3350 Scott Blvd., Suite 5001 Santa Clara, CA 95054 Phone: 408.213.3900 Fax: 408.213.3901 Email: ssv@sonoscan.com SonoLab Southwest 14301 N. 87th St., Suite 217 Scottsdale, AZ 85260 Phone: 480.342.9400 Fax: 480.342.9402 Email: ssw@sonoscan.com SonoLab Central 2149 E. Pratt Blvd. Elk Grove Village, IL 60007 Phone: 847.437.6400 Fax: 847.437.1550 Email: egv@sonoscan.com SonoLab Europe Unit 2, The Wincombe Business Centre Shaftesbury, Dorset SP7 9QJ England Phone: 44.1.747.855988 Fax: 44.1.747.855938 Email: euro@sonoscan.com SonoLab Shanghai 2875 South Yang-Gao Rd. Building #1, Suite 1009 Pudong Shanghai 200125 PR China Phone: 0086.21.6888.6750 Fax: 0086.21.6888.6752 Email: ssh@sonoscan.com Sonoscan, Inc., Corporate Headquarters: 2149 E. Pratt Blvd., Elk Grove Village, IL 60007 T: 847.437.6400 F: 847.437.1550 www.sonoscan.com Silicon Valley, CA Phoenix, AZ England Philippines Singapore Shanghai REV E