Effects of SAC Alloy Copper Dissolution Rates on PTH Processes: Cost and performance justify use of certain alternatives to SAC305/405 1 Craig Hamilton, Polina Snugovsky (Celestica) & Matthew Kelly (IBM)
Based on technical paper Have high CU dissolution rates of SAC305/405 alloys forced a change in the lead-free alloy used during PTH processes? Presented at International Conference on Soldering and Reliability, April 18 th, 2007 Presented at SMTAi, PanPacific Microelectronics Symposium, January 31st, 2007 2
Historical Pb-free Alloy Selection The majority of the electronics manufacturing industry is using SAC305 or 405 alloy to assemble and rework their Pb-free PCBs - For both SMT and PTH processes This choice dates back to 1999 - Based on research into the metallurgy of a number of Pb-free alloy compositions - Considerations: Low melting temp, close to eutectic point, good properties Large focus on SMT reliability to validate SAC alloys Less focus on PTH solder joint reliability due to their construction SAC SAC SAC SAC SAC 3
Is a Change in Alloy Required? Yes, due to: High Cu dissolution rates of SAC305/405 Higher cost of Sn-Ag-Cu alloys Prompting a change away from using these alloys during: 1. PTH rework process 2. PTH primary attach process Trends in wave solder alloys Alternative Pb-free alloy Source: 2007 European Lead-Free Soldering Network Report SAC SAC SAC 4 Alternative Pb-free alloy
Presentation Agenda Background development of SAC305/405 alloys - Summary of key findings to date - Cu dissolution rates - PTH process window Study of Alternative Pb-free alloys - Design of experiment - Cu dissolution rates - PTH process window Preliminary reliability analysis of a Sn-Cu-Ni alloy vs. SAC405 Discuss the impact to manufacturing if an alloy change is made within the: - PTH rework process (solder fountain) - PTH primary attach process (wave) 5
Process Development Flow Define the Problem What is Cu dissolution? Where does it occur? Why is it a problem? Quantify the Impact What factors impact the rates of Cu dissolution? What are the Cu dissolution rates of SAC305/405 alloys? How does high Cu dissolution rates impact the PTH processes? Identify & Verify Solutions What solutions can control or mitigate Cu dissolution? What solutions are viable options? Prioritize solutions Implementation What impact will the solution/s have on manufacturing? Implement the preferred solution 6
Process Development Flow Define the Problem What is Cu Dissolution? Where does it occur? Why is it a problem? Quantify the Impact What factors impact the rates of Cu dissolution? What are the Cu dissolution rates of SAC305/405 alloys? How does high Cu dissolution rates impact the PTH processes? Identify & Verify Solutions What solutions can control Cu dissolution? What solutions are viable options? Prioritize solutions Implementation What impact will the solution/s have on manufacturing? Implement the preferred solution 7
What is Cu Dissolution? Mechanics of Cu Dissolution: 1. Occurs when molten solder alloy comes into contact with copper (Cu) plating Therefore, the primary processes effected are: - Primary attach wave solder - PTH rework solder fountain PTH Connectors Primary Attach PTH Rework 2. Portions of the Cu plating will dissolve into the molten alloy over time. 8 Annular Ring Barrel Knee and Wall
Where does it occur? Primary vs. Rework: Largest impact occurs during the PTH rework process The reasons for this are: Higher contact times at solder fountain Higher flow rates at solder fountain Therefore, a lot of the development work to date has been focused on the PTH rework process 3-10 seconds 15-120+ seconds Courtesy of Air-Vac Courtesy of Speedline Primary Attach Wave Solder PTH Rework Solder Fountain 9
Why is it a problem? Potentially no 1X/2X PTH rework process window available with SAC305/405 alloys Various portions of the Cu plating will dissolve during the rework - The knee will dissolve at the fastest rate - 100% Cu dissolution can occur at the knee - HIDDEN DEFECT Potential quality, reliability concern No current industry IPC specifications for remaining Cu plating post rework Hidden Defect! 10
Process Development Flow Define the Problem What is Cu Dissolution? Where does it occur? Why is it a problem? Quantify the Impact What factors impact the rates of Cu dissolution? What are the Cu dissolution rates of SAC305/405 alloys? How does high Cu dissolution rates impact the PTH processes? Identify & Verify Solutions What solutions can control Cu dissolution? What solutions are viable options? Prioritize solutions Implementation What impact will the solution/s have on manufacturing? Implement the preferred solution 11
SAC405 Development Summary Significant factors influencing Cu dissolution : 1. Contact Time 2. Preheat Temperature 3. Flow Rate 4. Alloy Composition SAC405 Cu dissolution rates calculated and correlated to a PTH rework process window - 1X PTH rework process window is narrow - 2X PTH rework not possible Alternative solution is required Time Pot Preheat TV#1 TV#2 TV#1: 30 secs TV#2: 55 secs 12
Process Development Flow Define the Problem What is Cu Dissolution? Where does it occur? Why is it a problem? Quantify the Impact What factors impact the rates of Cu dissolution? What are the Cu dissolution rates of SAC305/405 alloys? How does high Cu dissolution rates impact the PTH processes? Identify & Verify Solutions What solutions can control Cu dissolution? What solutions are viable options? Prioritize solutions Implementation What impact will the solution/s have on manufacturing? Implement the preferred solution 13
Project Objectives 1. Determine Cu dissolution rates Study and compare the Cu dissolution rates of four Alternative Pb-free Alloys vs. SAC305 & 405 vs. Sn-Pb 2. Establish the PTH rework process windows Calculate the PTH rework process window of each alloy using their respective Cu dissolution rates 3. Select and implement an alternative Pb-free alloy Pick an alloy which delivers a 2X rework process Implement alloy into the PTH rework process suitable for high-volume manufacturing 14
Alternative Pb-free Alloys ALLOYS MELTING RANGE 99.1Sn-0.7Cu-0.05Ni-(<0.01)Ge 1 (Sn-Cu + Ni) 227 C 98.6Sn-0.3Ag-0.7Cu-Bi-X-Y 2 (Sn-Ag-Cu + Bi) 217 to 228 C 96.0Sn-2.5Ag-0.8Cu-0.5Sb 99.1Sn-0.7Cu-X-Y (Sn-Ag-Cu + Sb) 217 to 219 C (Sn-Cu + X) 227 C 1. U.S. Patent # 6180055 2. Patent # PCT/GB2005/004609 2 x Sn-Ag-Cu based alloys + controlled levels of additives 2 x Sn-Cu based alloys + controlled levels of additives Typical additives are: Nickel (Ni), Bismuth (Bi), Antimony (Sb), Germanium (Ge) Additives help to: Other potential effects include: 15 - Control the final grain structure - Improve final joint appearance - Reduce Cu dissolution - Improved wetting - Improved flow characteristics - Improved barrel fill
Test Vehicle IBM Server Product 0.096 thick 8.9 x 19.4 24 layers with 0.5oz and 1oz Cu 12S12P construction OSP surface finish FR4 High Tg laminate 32 in-line DIMM connectors (200 I/O) 16
Design of Experiment Constants: 17 - Equipment, Flow Well, Flux Type, Preheat Temp/Type, Flow Rate, Superheat = Melting Temp Pot Temp = 50 C
Experimental Procedure Bare board used Actual DIMM locations used as the samples Solder fountain was used to represent real-life manufacturing scenario - One sized flow well was used for each run; constant flow rate Each sample was fluxed, preheated and exposed to a continuous solder flow based on the DOE Contamination controlled; tin rinse performed 18
Response and Pass/Fail Criteria Response (Output): Cu plating thickness at the knee - Reason: knee has been determined to be the most susceptible location to Cu dissolution Each sample x-sectioned and measurements were taken Every knee of each barrel per sample was measured Baseline Cu thickness measurements were taken KNEE Pass/Fail Criteria: 0.5 mils of remaining copper used IBM Pb-free specification 19
20 Statistical Results And process window
Statistical Results 1X REWORK 21
Process Window 2X Rework 1X Rework 22
23 Early Reliability Example Sn-Cu + Ni
Early Reliability Studies Example: Sn-Cu + Ni vs. SAC405 Study Earlier reliability work performed on another test vehicle Sample of (OSP) boards were wave soldered (in air) using both alloys Each board was subjected to ATC, 0-100 C, 6000 cycles Waved components were not in-situ monitored Time zero and post 6,000 cycle joint analysis performed 24
Reliability: 6000 cycles Summary: For both Sn-Cu + Ni and SAC405 alloys, there were no failures due to completely open joints found after 6000 cycles Cracks on surface visible, did not result in an open joint SAC405 Sn-Cu + Ni 25
Reliability: 6000 cycles (PTH) Stress relaxation corner cracks and cracks along the pins formed in both SAC405 and Sn-Cu + Ni connectors Evidence that the Sn-Cu + Ni alloy is more prone to crack formation under thermal fatigue Did not result in an open joint! SAC405 Sn-Cu + Ni 26
Reliability: 6000 cycles (Leaded) SOIC components did not fail after 6000 cycles Minor deformations and crack nucleation were visible at the heel and toe areas The damage is more significant in the Sn-Cu + Ni joints Did not result in an open joint! SAC405 Sn-Cu + Ni 27
Process Development Flow Define the Problem What is Cu Dissolution? Where does it occur? Why is it a problem? Quantify the Impact What factors impact the rates of Cu dissolution? What are the Cu dissolution rates of SAC305/405 alloys? How does high Cu dissolution rates impact the PTH processes? Identify & Verify Solutions What solutions can control Cu dissolution? What solutions are viable options? Prioritize solutions Implementation What impact will the solution/s have on manufacturing? Implement the preferred solution 28
Is a Change in Alloy Required? Have high Cu dissolution rates of SAC305/405 alloys forced a change in the lead-free alloy used during PTH processes? Based on the technical development results obtained to date - PTH Rework Process YES - PTH Primary Attach Process POTENTIALLY There are numerous manufacturing and business impacts which need to be considered before making an alloy change in either process SAC 305/405 Alternative Pb-free alloy 29
Impact to Manufacturing Making a change in the alloy used within the PTH processes will have an impact to: - Quality and reliability - Supply chain and cost - Manufacturing process Each of these impacts will need to be addressed before making a change 30
Impact to Manufacturing Option 1: SAC Wave / SAC Rework Pros Process and reliability data available. Cons High Cu dissolution rates Investments already made in qualifications. Tight 1X PTH rework process window Capital investments made in tools, equipment and process. No 2X PTH rework process window Investments already made in procurement and supply channels. Higher dross accumulation rate Already in production. Higher alloy cost Manufacturing yield data available. Pb-free machine upgrade required Increased reliability risks 31
Impact to Manufacturing Option 2: SAC Wave / Alt. Alloy Rework Pros Lower Cu dissolution rates. Cons Pot contamination increases. - Process controls required 2X PTH rework process capable. Effects of mixing alloy not completely understood Reduction in alloy cost Multiple alloys used within the PTH processes - Process controls required - Risk of mixing Reduction in dross accumulation Higher alloy cost at wave. Potential improvements in fluidity & hole fill 32 Pb-free machine upgrade required at wave
Impact to Manufacturing Option 3: Alt. Alloy Wave / Alt. Alloy Rework Cu dissolution benefits 33 Pros Reduce pot contamination Reduction in alloy cost at wave and rework (up to 50%) Reduction in dross accumulation at wave and rework No Pb-free machine upgrade required at wave and rework Limited reliability data Cons - ATC and mechanical testing required Limited yield data Many machines are currently loaded with SAC305/405 alloy - Switching costs Many Pb-free products have been qualified using SAC305/405 alloy - Re-qualification of products Supply chain and distribution links CM / OEM alignments required - Demand / implementation
Conclusions Alloy change is required within the solder fountain process - To deliver a 2X rework process Alloy change is recommended within the wave process Benefits of changing wave alloy: - Cost savings - Process simplification - homogeneous alloy - Reduce contamination risk - Process improvements anticipated Further work is required before changing wave alloy: - Reliability (thermal and mechanical) - Yield analysis - Implementation assessments 34
Acknowledgements Jim Bielick, IBM Jim Wilcox, IBM Irene Sterian, Celestica Linda Scala, Celestica Thilo Sack, Celestica John McMahon, Celestica Jeffrey Kennedy, Celestica Marianne Romansky, Celestica Heather McCormick, Celestica 35
36 Thank you