Galvanic Metallisation of CFRP devices

Similar documents
Three-Dimensional Molded Interconnect Devices (3D-MID)

METHODS OF COATING FABRICATION

Overview of Coatings and Surface Treatments

curamik CERAMIC SUBSTRATES AMB technology Design Rules Version #04 (09/2015)

Team Metal Finishing Inc.

Chapter 4 Fabrication Process of Silicon Carrier and. Gold-Gold Thermocompression Bonding

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Determination of pre/post process surface roughness and comparison with copper film adhesion on multiple polymer substrates

Prevention Strategies Design and Coatings

Hard Gold Plating vs Soft Gold Plating Which is Right for My Application? By: Matt Lindstedt, Advanced Plating Technologies

Supporting Information: Model Based Design of a Microfluidic. Mixer Driven by Induced Charge Electroosmosis

Via Filling: Challenges for the Chemistry in the Plating Process

5.8 Diaphragm Uniaxial Optical Accelerometer

Electroplated Copper Filling of Through Holes on Varying Substrate Thickness

ASTM Volume 02.05, May 2017 Metallic and Inorganic Coatings; Metal Powders and Metal Powder Products

Plasma Activated EB-PVD of Titanium and its Compounds by Means of Large Area SAD

DESIGN AND PRODUCTION OF LOW-COST METALLIZED POLYMER MM-WAVE COMPONENTS

Silver Diffusion Bonding and Layer Transfer of Lithium Niobate to Silicon

Anti - Corrosive Finishing

Stroncoat The new generation of zinc-magnesium coatings

3D Structured collector foils Decrease the filling time and improve the cell capacity

CX Thin Fil s. Resistors Attenuators Thin-Film Products Thin-Film Services. ISO 9001:2008 RoHS/REACH Compliant ITAR Compliant

1. Aim This Process Instruction (PI) describes the surface quality guidelines in respect of metal parts supplied to GOTEC.

energy Solar reflective surfaces

Mobile repair of hard coated rolls and machine components. ICE Europe Technical Program, Dr. A. Barth,

SURFACE TEMPERATURE SENSORS

5W, 4527, SL Type Low Resistance Chip Resistor (Lead / Halogen Free)

1/2W, 0805 Low Resistance Chip Resistor (Lead / Halogen free)

Electroplating, Anodizing & Metal Treatment Hand Book

Beam Leads. Spider bonding, a precursor of TAB with all-metal tape

Electroplating, Anodizing & Metal Treatment Hand Book

SUMMARY AND CONCLUSION

Product specification TiNOX energy

OPTIMIZED SEMI-ADDITIVE PROCESS FOR POLYIMIDE AS DIELECTRIC IN BUILD UP PACKAGES

Plasma Heat and Surface Treatment

HBLED packaging is becoming one of the new, high

METALLIC PERMEATION BARRIER FOR CRYOGENIC COMPOSITE PROPELLANT STORAGE AND TRANSFER APPLICATIONS

View of INEGI buildings in the campus of the Faculty of Engineering of the University of Porto

Palladium as diffusion barrier - a way to a multifunctional printed circuit board finish

Solar absorber coatings

Direct Copper Metalization of Aluminum: Elimination of Zincate

Optimizing Immersion Silver Chemistries For Copper

The most efficient way of transforming sunlight into heat

CORROSION & ITS CONTROL -Content. Introduction Classification Galvanic series Factors affecting Protection methods Summary

MULTILAYER CERAMIC BAND PASS FILTER

Optimizing Immersion Silver Chemistries For Copper

Microwave Plasma Processing

Israel Institute of Metals E-MRS Fall 2017

This Appendix discusses the main IC fabrication processes.

High Throw Electroless Copper Enabling new Opportunities for IC Substrates and HDI Manufacturing

General Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems

Chapter 11: Passives: Discrete, Integrated, and Embedded. Johan Liu

Direct nano-crystalline Ni plating on titanium surfaces

Power Electronics Packaging Revolution Module without bond wires, solder and thermal paste

Overview of Material Challenges for Earth Observation missions.

Metallization of MID Dec 2 010

Gasket Material Type - Galvanic compatablity and Voltage differential

EFFECTS OF CURRENT DENSITY ON SIZE AND SURFACE MORPHOLOGY OF HIGH SPEED DIRECT NANO-CRYSTALLINE NICKEL PLATING ON TITANIUM SURFACE

Solar absorber coatings

PROCESS CONTROL OF THERMAL BARRIER COATING SYSTEM BY CURRENT VARIANT CHANGES TO ALTER THE MICROSTRUCTURAL AND MECHANICAL CHARACTERISTICS

Metallization deposition and etching. Material mainly taken from Campbell, UCCS

Optimized Thermal Management. with Advanced Ceramic Materials for Power Electronics, CPV and HCPV

High Speed Titanium Coatings by Supersonic Laser Deposition

Int. CI.*: B 32 B 15/01 B 32 B 15/18, B 32 B 3/00 C 25 D 5/14, H 01 L 21/48 H 01 L 23/02. Morristown, NJ 07960IUS)

PHYS 534 (Fall 2008) Process Integration OUTLINE. Examples of PROCESS FLOW SEQUENCES. >Surface-Micromachined Beam

2.4 GHz ISM Band Working Frequency

NEXTREMA. Glass-ceramics engineered and designed for extreme conditions

Trivalent Black Layers With Cathodic Corrosion Protection

Flexible Printed Circuits Design Guide

Wireless implantable chip with integrated Nitinol-based pump for radio-controlled local drug delivery

By Ron Blankenhorn, Pac Tech USA, Santa Clara, Calif., and Thomas Oppert, Pac Tech GbmH, Nauen, Germany

EECS130 Integrated Circuit Devices

Vacuum deposition of TiN

NEW COPPER ELECTROLYTES FOR BLIND MICROVIA FILLING

Electroplated Gold in Microwave Integrated Circuits

UTILIZATION OF ATMOSPHERIC PLASMA SURFACE PREPARATION TO IMPROVE COPPER PLATING PROCESSES.

Metalworking/Automotive

Platypus Gold Coated Substrates. Bringing Science to the Surface

Innovative PCB Solutions. Win time and flexibility benefit from Swiss quality. THE PCB CHALLENGE Doing it together

Technology Drivers for Plasma Prior to Wire Bonding

Comparison of different electrochemical deposits for contact metallization of silicon solar cells

MULTILAYER CERAMIC BAND PASS FILTER

CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS (polishing compositions C09G; detergents in general C11D)

VLSI Design and Simulation

The Role Of Electroplates In Contact Reliability

NASF SURFACE TECHNOLOGY WHITE PAPERS 83 (1), 7-12 (October 2018) Advances in Decorative PVD Chromium Coatings for Polymer Substrates

INFLUENCE OF HEAT TREATMENT ON TRIBOLOGICAL PROPERTIES OF Ni-P ELECTROLESS COATINGS. Michal Novák a Dalibor Vojt ch a Michala Zelinková a Tomá Vít b

Effects of zincate treatment on adhesion of electroless Ni-P coating onto various aluminum alloys

Intel Pentium Processor W/MMX

A Basic Introduction to Thin-Film Coatings. From the Experts at VaporTech

Reference Only. Spec. No. JENF243E-0003Q-01 P 1 / 8. Chip EMIFIL LC Combined Type for Large Current NFE61PT 1H9 Reference Specification

We manufacture the following Products :

MAXIT CrN PVD High-Performance Coatings. Sulzer Metco

Offshore Wind Turbines Power Electronics Design and Reliability Research

Electro-chemical processing for tungsten fabrication and joining by layer deposition

Chapter 2 Manufacturing Process

High Stability Resistor Chips (< 0.25 % at Pn at 70 C during 1000 h) Thick Film Technology

TIN-BASED LEAD-FREE SOLDER BUMPS FOR FLIP-CHIP APPLICATION. S. Yaakup, H. S. Zakaria, M. A. Hashim and A. Isnin

Transcription:

5th International CFK-Valley Stade Convention 7. 8. June 2011, Stadeum Stade, Germany A. Dietz, G. Klumpp, H.-J- Kramer Fraunhofer IST, Braunschweig C. Haas Astrium GmbH Friedrichshafen

Overview GMES - Sentinel Fundamentals of Plastic Metallisation Metallisation of Waveguides Quality Management Conclusions

Sentinel GMES: Computer simulation of Sentinel 1 in LEO (Low Earth Orbit; 200 2,000 km above earth surface)

ESA-Mission GMES/Sentinel GMES - Global Monitoring for Environment and Security Sea ice & iceberg monitoring Global fire Oil pollution monitoring Active seismic zone and volcano observatory Forest Monitoring for Kyoto implementation Global Biosphere Monitoring

GMES/Sentinel SAR Synthetic Aperture Radar - Waveguide C-Band SAR with centre frequency of 5.405 GHz Waveguides Antennas in the frequency range of > 1000MHz Metallic or metal coated tubes in a round, elliptic or rectangular form The Wave length determines the dimension of the waveguides Scheme of the Sentinel 1 waveguide array

GMES/Sentinel Challenges of the plastic metallisation Hydrophobic surface no wetting Electrically insulating surface no direct metallisation Different atomistic properties between plastic substrate and metallic coating bad adhesion

Comparison: Electrodeposition on metal substrates Benefits Electrical conductivity of the substrate Coating and substrate are quite similar concerning physical and chemical properties Diffusion of coating and substrate improve the adhesion Problems Passivation of very unnoble substrate metals like Titanium, Aluminium

Metal deposition on plastics Wetting theory Push button effect Non-wetted surface Metal Wetted surface Plastic Etched plastic surface

Homogeneous deposition on complex geometries Dog bone effect due to the streamlines of field Homogeneous deposition by means of auxiliary anodes

GMES/Sentinel Dimension: VP: Length: 870mm; Width: 20mm; Height: 20mm HP: Length: 870mm; Width: 40mm; Height: 18mm Challenges of the CFRP metallisation Defect free coating outside and inside Very good adhesion due to the large temperature difference in space and the different CTE of plastic and metal Constant thickness of the coating inside and outside of the WG Roughness: ra < 2µm

Scheme of CFRP metallisation Cleaning and drying Removing dust, form release agents, finger prints from the surface with water and acetone Removing water from the plastics (heat treatment) Etching Removing the outer resin layer in order to roughen the surface Pre-metallisation Electroless deposition of a thin electrically conductive layer Metallisation Electrolytic deposition of Nickel and Copper Passivation and drying Dipping process in order to prevent the oxidation of copper Blow off with air and heat treatment to remove traces of water

Metallisation defects Not allowed: Defect size about 0,4mm Not allowed: Free metallised fibres Not allowed: (Large non-metallised areas

Metallisation defects Most frequently defects: Metallised fibres (electrically conductive); unmetallised resin (electrically insulating)

Critical points Complete metallisation Exact dimensions of wholes and slots Metallised non-metallised area (adhesion problems) Perfect metallisation of inlet and outlet

Cross sections of metallised CFRP wave guides Metallisation of the fibres Metallisation of the pure resin Metallisation of the mixed area fibres - resin

Cross sections Top view with a light microscope on the surface of CFRP Left: without any pre-treatment Right: after etching Cross sections of metallised CFRP Uncovered fibres Pure resin

Quality Management Demanded Quality Actions 100% control the coating quality visually by an endoscope (defects, free fibres) the coating weight (to calculate the coating thickness) the adhesion by an tape test the size of the metallised wholes by a defined wire Periodic control the coating thickness by investigating the cross sections under light microscope the roughness value Ra < 2 µm....

Quality Management Adhesion testing: Thermal shock test by dipping the WG in liquid Nitrogen (b.p. -196 C) and boiling water (b.p. +100 C) (5X) The Scotch tape with very high adherence must not show any metal pieces

Process Equipment Process Equipment: From Etching CFRP to the completely metallised waveguide

Conclusions Conclusions The complete and defect free metallisation of CFRP waveguides for aerospace application is possible and will be performed in an industrial scale The process of the waveguide metallisation is transferable to other devices with a simple or complex 3-D-geometry The usual metals can be deposited like Copper, Nickel, (Hard)-Chromium, noble metals The metallisation is useful for following applications Electrical conductivity (lightning protection) Diffusion barrier against gases and liquids Bonding and soldering of metal parts on CFRP Tribological application like increased wear resistance or low CoF With limitations: decorative effects....

Metal deposition on CFRP Thank you for your attention!