Gas Purification Assemblies Data Sheet MEPGGPENd PG Series Gaskleen Purifier Assemblies and Manifolds Description Pall s Gaskleen PG purifier assemblies have been designed to handle process flow rates up to, slpm. An optional bypass manifold is available complete with isolation valves and backplate for easy mounting. Pall s purification materials are available in every standard configuration. All purifier assemblies contain an integral 3L stainless steel particle filter. % helium leak and pressure tested. No detectable metal contribution above background in HCl gas with HCLP material No detectable metal contribution above background in HBr gas with HBRP material Specifications Assembly Flow Rates PG55: 75 slpm PG: 5 slpm PG:, slpm List of Purifiable Gases Particle Filter Options PG55/PG:. µm or.3 µm PG:. µm Connections in or in gasket seal (VCR or compatible) male/male Inlet/outlet isolation valves (for PG) Assembly Material Electropolished 3L SS <.5 µm/< µin Ra internal surface finish Operating Conditions Maximum operating pressure PG55/PG: 3.5 MPa/5 psig PG:.7 MPa/5 psig Maximum operating temperature: C/ F (INP, SIP, FCP, SFP), C/ F (NH3P, GEHP, OXP, CLXP, HCLP, HBRP, CDAP) EU Pressure Equipment Directive: Assemblies have been evaluated for compliance with the European Union s Pressure Equipment Directive 97/3/EC and are CE-marked. VCR is a trademark of Swagelok Co. Gas Family Material Effluent Specification Nitrogen, argon, helium, xenon, krypton, neon INP < ppb H O, O, CO and CO Silane, hydrogen, methane, cyclopropane, propane, dimethyl ether SIP < ppb H O, O, CO and CO Carbon monoxide SIP < ppb H O, O, CO, Ni(CO), and Fe(CO) 5 Fluoromethane, difluoromethane, trifluorine, tetrafluoroethane, FCP < ppb H O, O, CO and CO pentafluoroethane, heptafluoropropane, carbon tetrafluoride, perfluoropropane, perfluorocyclobutane, hexafluoroethane Ammonia NH3P < ppb H O, O, CO and CO Germane GEHP < ppb H O, O, CO and CO Sulfur hexafluoride SFP < ppb H O, O, CO and CO Air, carbon dioxide, oxygen, nitrous oxide OXP < ppb H O Boron trichloride, chlorine, trichlorosilane, dichlorosilane CLXP < ppb H O Hydrogen chloride HCLP <5 ppb H O Hydrogen bromide HBRP < 5 ppb H O Photolithography clean dry air CDAP < ppb H O, < 3 ppt organics (as C ), < ppt acid gases (as SO ), < 5 ppt basic gases (as NH 3 ), < ppt refractory compounds (as HMDSO) As tested in inert gas.
Pressure Drop vs. Gas Flow Rate..5..5..5 5. 7 5. 3 kpa/5 psig inlet. 35. 3. 5. 5. 3 7 kpa/3 psig inlet 5.. 5.. 55 kpa/ psig inlet.5 5. 37.5 5..5 75. Nitrogen flow rate (in slpm @ C and atm) PG55 with.3 µm filter..5..5..5.. 3 kpa/5 psig inlet.5...75.. 7 kpa/3 psig inlet 55 kpa/ psig inlet.5.5..5 5. 37.5 5..5. 75. Nitrogen flow rate (in slpm @ C and atm) PG55 with. µm filter.......... 3 kpa/5 psig inlet.. 7 kpa/3 psig inlet 55 kpa/ psig inlet... 5 5 5 3 35 5 5 Nitrogen flow rate (in slpm @ C and atm) PG VMM with.3 µm filter.......... 3 kpa/5 psig Inlet 7.. 7 kpa/3 psig Inlet 5.. 3. 55 kpa/ psig Inlet... 5 5 5 3 35 5 5 Nitrogen flow rate (in slpm @ C and atm) PG VMM with.3 µm filter.......... 7.. 5.. 3. 3 kpa/5 psig inlet 7 kpa/3 psig inlet.. 55 kpa/ psig inlet. 5 5 5 3 35 5 5 Nitrogen flow rate (in slpm @ C and atm) PG VMM with. µm filter.......... 7.. 3 kpa/5 psig inlet 5.. 3.. 7 kpa/3 psig inlet. 55 kpa/ psig inlet. 5 5 5 3 35 5 5 Nitrogen flow fate (in slpm @ C and atm) PG VMM with. µm filter. 5.. 5.. 5. 3. 35.. 7. 3 kpa/5 psig Inlet. 5.. 3.... 3 5 7 9 Nitrogen flow rate (in slpm @ C and atm) PG Series assembly 7 kpa/3 psig Inlet 55 kpa/ psig Inlet Note: For pressure drop information for a specific application, please contact Pall Microelectronics.
Lifetime Calculations 75..5 5. 37.5 5..5 ppm ppm ppm.,,,,, Gaskleen PG55 purifier assembly, part # GLP9INPVMM Inlet pressure: 7 kpa (3 psig) contaminant challenge as H O 5 5 35 3 5 5 5 ppm ppm ppm,,,,, Gaskleen PG purifier assembly, part # GLPINPVMM/VMM Inlet pressure: 7 kpa (3 psig) contaminant challenge as H O 9 7 5 3 ppm ppm ppm,,,,, Gaskleen PG purifier assembly, part # GLPINPVFM Inlet pressure: 7 kpa (3 psig) contaminant challenge as H O Note: For lifetime calculations in a specific application, please contact Pall Microelectronics. Nominal Assembly Dimensions. mm. in 99. mm 39. in.7 mm 7.9 in 39. mm 7.3 in ø7. mm ø3. in PG55 Note: For manifold dimensions, please contact Pall Corporation. ø. mm ø. in PG ø5. mm ø. in 5. mm. in PG
Technical Information Impurity Removal as Tested in Specific Gases Specific Gas Inert gases: nitrogen, argon, helium, xenon, krypton, neon Flammable gases: silane, hydrogen, methane, ethane, cyclopropane, propane, dimethyl ether Carbon monoxide Ammonia Fluorocarbons: fluoromethane, difluoromethane, trifluoromethane, tetrafluoroethane, pentafluoroethane, heptafluoropropane, carbon tetrafluoride, perfluoropropane, perfluorocyclobutane, hexafluoroethane Germane Sulfur hexafluoride Oxygenated gases: carbon dioxide, oxygen, nitrous oxide, clean dry air Chlorinated gases: boron trichloride, chlorine, trichlorosilane, dichlorosilane Halogenated gases: hydrogen chloride, hydrogen bromide Photolithography clean dry air Impurity Removal Efficiency < ppb H O, CO, O, and CO, as tested in argon and < ppb H O, CO, O, and CO, as tested in argon, nitrogen and hydrogen using APIMS analyzer < ppb H O, as tested in carbon monoxide using trace moisture analyzer H O and siloxanes removed to trace levels, as tested in silane using APIMS < ppb Ni(CO), and < ppb Fe(CO) 5, as tested in carbon monoxide using GC-ECD analyzer < ppb H O, CO, and O, as tested in argon using APIMS < ppb H O, as tested in ammonia using NIR-TDLAS Removal of O and CO to trace levels, as tested in ammonia using GC-DID < ppb H O, CO, O, and CO, as tested in argon and < ppb O, as tested in trifluoromethane using trace oxygen analyzer < ppb H O, as tested in trifluoromethane using trace moisture analyzer and FTIR < ppb H O, CO, O, and CO, as tested in argon and < ppb H O, CO, and O, as tested in argon using APIMS < ppb H O < ppb H O, and CO, as tested in argon using APIMS analyzer < ppb H O < ppb H O, and CO, as tested in argon using APIMS analyzer < 5 ppb H O as tested in hydrogen chloride using CRDS < 5 ppb H O as tested in hydrogen bromide using CRDS < ppb H O as tested in argon using APIMS analyzer < ppb H O as tested in argon using APIMS analyzer < 3 ppt C H as tested in argon using APIMS Analyzer < ppt SO as tested in nitrogen using ion chromatograph < 5 ppt NH 3 as tested in nitrogen using ion chromatograph < ppt HMDSO as tested in argon using APIMS analyzer and baseline subtraction Unit conversion: bar = kilopascals
Part Numbers / Ordering Information Series Part Number 3 Description PG55 GLP9xxxxFVMM Purifier assembly, 75 slpm,.3 µm filter, in gasket seal (VCR or compatible) male/male GLP9xxxxFMAN GLP9xxxxFVMMGCMAN Bypass manifold with GLP9xxxFVMM assembly Gas cabinet manifold with GLP9xxxFVMM assembly GLP9xxxxVMM Purifier assembly, 75 slpm,. µm filter, in gasket seal (VCR or compatible) male/male GLP9xxxxMAN GLP9xxxxVMMGCMAN Bypass manifold with GLP9xxxVMM assembly Gas cabinet manifold with GLP9xxxVMM assembly PG GLPxxxxFVMM Purifier assembly, 3 slpm,.3 µm filter, in gasket seal (VCR or compatible) male/male GLPxxxxFVMM GLPxxxxFMAN Purifier assembly, 3 slpm,.3 µm filter, in gasket seal (VCR or compatible) male/male Bypass manifold with GLPxxxxFVMM assembly GLPxxxxVMM GLPxxxxVMM Purifier assembly, 5 slpm,. µm filter, in gasket seal (VCR or compatible) male/male Purifier assembly, 5 slpm,. µm filter, in gasket seal (VCR or compatible) male/male GLPxxxxMAN Bypass manifold with GLPxxxxVMM assembly PG GLPxxxxVFM Purifier assembly,, slpm,. µm filter, in gasket seal (VCR or compatible) female inlet/male outlet GLPxxxxMAN Bypass manifold with GLPxxxVMM assembly 3 See list of purifiable gases on page. Example: GLP9INPFVMM. The PG stainless steel assembly (used with all GLP part numbers) is fabricated in accordance with the ASME BPVC Section VIII, Division, and has a U-stamp. If the user determines that an L-stamp is required for a lethal service application, please contact Pall Microelectronics for cost and availability. 5 Harbor Park Drive Port Washington, New York 5 USA +..3.755 toll free (toll free in USA only) +.5..3 phone +.5.5.3 fax microelectronics@pall.com Visit us on the Web at www.pall.com/micro Pall Corporation has offices and plants throughout the world. For Pall representatives in your area, please go to www.pall.com/contact.asp Because of technological developments related to the products, systems, and/or services described herein, the data and procedures are subject to change without notice. Please consult your Pall representative or visit www.pall.com to verify that this information remains valid. Products in this document may be covered by the following patent number: US 7,5,9 Copyright 7,, Pall Corporation. Pall,, and Gaskleen are trademarks of Pall Corporation. Indicates a Pall trademark registered in the USA. Filtration. Separation. Solution.SM is a service mark of Pall Corporation. MEPGGPENd December