Innovative, Silicone Solutions for LED Lighting Better Performance and Reliability for your Lighting Designs
With Dow Corning, You Have a Powerful Ally for Thermal Management Heat remains the enemy of reliable LED lighting products. Cooling LEDs is necessary not just to enable long life, but to also ensure that LED lamps and luminaires provide stable lumen output and color over the life of the product. Moreover, thermal management is becoming an increasingly important performance metric for the entire LED value chain, as solid-state lighting competes with conventional illumination for high-intensity and high-temperature applications. Dow Corning offers an innovative and growing portfolio of thermally conductive silicone adhesives, greases, encapsulants and dispensable thermal pads. We can help you identify a thermal management solution for most sensitive electronics. Combining materials knowledge, application expertise, collaborative innovation and a global presence, we can help you meet your design goals for heat dissipation, processability and low cost of ownership. Our broad portfolio of thermal interface materials offers versatile heat management options for virtually every LED lamp and luminaire design. Heat is the Enemy of LED Lighting Devices Unlike conventional light sources, an LED module has a unique challenge. Managing its temperature has a direct impact on the reliability, output quality, lifetime and system cost of the device. Additionally, thermal management is becoming an increasingly important performance metric for the entire LED value chain, as solid-state lighting competes with conventional illumination for high-intensity and high-temperature applications.
Thermal s Strong Bonds that Dissipate Heat brand thermal adhesives form strong, thermally stable bonds to most LED printed circuit board substrates (such as ceramic, MCPCB and FR4) and deliver excellent thermal conductivity. Our materials cure at room temperature with accelerated heat-cure options for flexible processing. Their low volatility means no adverse impact to the light output. SE 4485 Thermal is a one-part, tack-free, flowable, moisture cure adhesive. It has excellent thermal stability and low temperature resistance. It also passed UL V0 flammability tests. Temperature Stability of SE 4485 High Temperature (150 C) High Temperature (80 C) and High Humidity (95% relative humidity) Heat Shock (-50 C/150 C) Property Initial 250 hours 1,000 hours 250 hours 1,000 hours 300 cycles 900 cycles Hardness (JIS Type A) 83 87 88 85 85 88 88 Tensile Strength, MPa 3.8 3.0 3.2 2.6 2.3 3.1 3.2 Elongation, % 25 25 10 25 10 25 25 Adhesion Strength (AL), N/cm 2 227 221 222 117 136 217 230 Adhesion Strength (GL), N/cm 2 238 177 222 123 80 158 181 Thermal Greases ExtendingThermal Management to the Smallest Gap brand thermal greases enable very thin bond lines and fill tight gaps to ensure durable thermal management and long-term reliability of LED devices. Our broad and versatile portfolio of solutions encompasses both thermal silicone compounds and greases. TC-5625 Compound remained stable through 20,000 power cycles. Stable thermal resistance indicates negligible pump out. TC-5625 Compound has a very low end-of-life thermal resistance, indicating high reliability and stability. Note: Even lower thermal resistance can be achieved.
Thermal Resistance of TC-5625 Compound and Benchmarks Thermal Resistance ( C-cm 2 /W) 0.30 0.25 0.20 0.15 0.10 0.05 ASTM D5470 0.00 0 20 40 60 80 100 120 Pressure Load (PSI) TC-5625 Compound Competitor 1 Competitor 2 Power Cycle on TTV Tester Thermal Resistance, C-cm 2 /W Dow Corning TC-5625 Compound Thermal Reliability, Power Cycle TTV (Each Cycle: 8 minutes power, 2 minutes cool down, T(lid) ~92 C to r.t.) 0.5 0.45 0.4 0.35.03 0.25 0.2 0.15 0.1 0.05 0 0 5000 10000 15000 20000 25000 Cycles TC-5629 Grease is a one-part, non-curing, thermally conductive, silicone grease. It has good stability in vertical surface and high thermal conductivity at 2.9 W/m k. TC-5629 grease is an excellent thermal conductive solution for LED lighting and other electronics applications. Thermal Resistance of TC-5629 Grease at Various Thicknesses Thermal Resistance, C-cm 2 /W Thermal Resistance at Various Thickness Measured by guarded hot plate. Measured temperature: 50 C 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 200 400 600 800 1000 Effect of Environmental Aging on the Viscosity of TC-5629 Grease Viscosity, Pa-s 500 450 400 350 300 250 200 150 100 50 0 0 500 1000 1500 2000 2500 3000 Time, h HTS (150 C) TCT (-40 C/140 C) THS (85 C/85% RH) Complex Modulus Curve of TC-5629 Grease 1.0E+06 Complex Modulus Curve No impact on modulus in a wide temperature range. Effect of Applied Pressure on Bond Line Thickness of TC-5629 Grease 100 The thickness becomes 50 µm by adding 50 N/cm 2 Complex Modulus, Pa 1.0E+05 1.03+04 1.0E+03 1.0E+02 1.0E+01 Thickness, µm 80 60 40 20 1.0E+00-50 0 50 100 150 200 Condition: 25mm parallel plate Gap: 1mm Frequency: 1Hz Temperature, C Strain: 1% Ramp rate: 3 C/minute 0 0 20 40 60 Applied Pressure, N/cm 2
TC-5080 Thermal Grease is a one-part, non-curing, thermally conductive, silicone grease. The grease has good stability in high temperature and thermal conductivity at 1.0 W/m k. This material can be applied by screen/stencil printing and needle dispensing. Stability and Thermal Resistance of TC-5080 Thermal Grease Thermal Resistivity ( C/W) 0.3 0.25 0.2 0.15 0.1 0.05 0 (0.1 mm BLT) Initial 250 500 hours HT (150 C) TS (-40/+125 C) WT (85 C/85% RH) Dispensable s brand dispensable thermal pads enable quick and precise printing of thermally conductive silicone pads in controllable thicknesses on complex substrate shapes. They can enhance thermal performance, accelerate production and reduce system costs compared with fabricated pads. Plus, they may offer longer reliability compared with conventional thermal greases. Reliability Test of TC-4025 4.5 Thermal Resistance (K-cmˆ2/W) 4.0 3.5 3.0 2.5 2.0 1.5 1.0.50 x x + x ++ + x 0.0 0 200 400 600 800 1000 1200 BLT (µm) Time 0 85 C, 85% RH, 500 hrs. Thermal Shock, 1000 cycles Thermal Shock, 500 cycles TC-4025, 85 C, 85% RH, 2 x 85 C, 85% RH, 1000 hrs. + TC-4025, -40~125 C, 2K cy Samples are cured into thin sheets 0.25-1 mm thick and then brought for reliability tests: 85 C/85%, thermal shock -40~125 C. Thermal resistance after reliability test (500, 1000, 2000 hrs/cycles) obtained based on ASTM 5470 standard and compared with time 0 testing.
Thermal Interface Material Selection Guide for LED Lighting Thermal Conductivity Stable in High Temperature Thin BLT TIM (<100 µm) Fast Track-Free Room Temperature Cure Heat Accelerating Cure Good Stability in Vertical Surface Control Volatility Thermal SE 4485 SE 4486 SE 9184 Compound EA-9189H Compound Thermal Grease TC-5629 Compound TC-5625 Compound TC-5080 Thermal Grease SE 4490CV Compound SC 102 Compound Dispensable TC-4025 Dispensable TC-4026 Dispensable TC-4015 Dispensable TC-4016 Dispensable 2.8 P P P P P P 1.59 P P P P P P 0.84 P P P P P P 0.88 P P P P P 3.2 P P 2.5 P P 1 P P 1.6 P P P 0.8 P P 2.5 P P P P P P (after cure) 2.5 P P P P P (after cure) 1.7 P P P P P P (after cure) 1.7 P P P P P (after cure) This list is not all-inclusive. If you do not see a product that meets your needs, please contact your Dow Corning representative.
Key Properties of s, Greases and s Thermal s Thermal Greases Dispensable s Key Properties Units SE 4485 SE 4485L SE 4486 SE 4420 EA-9189 H White RTV TC-5629 Compound TC-5625 Compound TC-5080 Thermal Grease SE 4490CV Compound TC-4025 Dispensable TC-4026 Dispensable TC-4015 Dispensable TC-4016 Dispensable One- or Two-Part one-part one-part one-part one-part one-part one-part one-part one-part one-part two-part two-part two-part two-part Mix Ratio N/A N/A N/A N/A N/A N/A N/A N/A N/A 1:1 1:1 1:1 1:1 Viscosity cp 230,000 150,0000 20,000 108,000 paste 295,000 102,125 836,000 497,600 A: 73,000 B: 74,000 A: 73,000 B: 74,000 A: 104,000 B: 124,000 A: 104,000 B: 124,000 Mixed Viscosity cp N/A N/A N/A N/A 70,000 70,000 103,000 103,000 Color white white white white white gray gray white white blue blue blue blue Bleed % <0.01 N/A N/A N/A N/A Specific Gravity 2.9 2.85 2.59 2.26 1.6 3.1 4.2 2.16 2.62 2.83 2.83 2.6063 2.6063 Working Time at 25 C Tack-Free Time at 25 C hours N/A N/A N/A N/A N/A N/A N/A N/A N/A >3 >3 4 4 minutes 12 5 4 8 3 N/A N/A N/A N/A N/A N/A N/A N/A Unprimed Adhesion - Lap Shear MPa 2 (glass) 2.7 (glass) 2.4 (glass) 2.7 (AL) 2.5 (AL) 3 (FR4) 1.2 (PC) 1.7 (copper) N/A N/A N/A N/A N/A N/A N/A N/A Tensile Strength MPa 3.7 5.1 4.1 4.4 5.6 N/A N/A N/A N/A N/A N/A N/A N/A Cure Time at 25 C hours N/A N/A N/A N/A 24 24 24 24 Heat Cure Time minutes N/A N/A N/A N/A N/A N/A N/A N/A N/A Durometer Shore 00 Durometer Shore A 40 minutes (75 C) 15 minutes (100 C) 10 minutes (120 C) 40 minutes (75 C) 15 minutes (100 C) 10 minutes (120 C) 48 minutes (75 C) 16 minutes (100 C) 10 minutes (120 C) N/A N/A N/A N/A N/A N/A N/A N/A N/A 50 50 50 50 91 89 80 77 78 N/A N/A N/A N/A N/A N/A N/A N/A Elongation % 20 45 75 40 N/A N/A N/A N/A 209 209 262 262 48 minutes (75 C) 16 minutes (100 C) 10 minutes (120 C) Thermal Conductivity Thermal Resistance @ 40 psi Dielectric Strength Dielectric Constant Dissipation Factor Volume Resistivity Content of Low Molecular Siloxane (D4-D10) W/mK 2.8 2.2 1.59 0.92 0.88 3.2 2.5 1 1.646 2.5 2.5 1.71 1.71 C*cm 2 / W N/A N/A N/A N/A N/A 0.1 0.25 0.77 N/A N/A N/A N/A kv/mm 19 38 20 28 24 6.3 3 9 18 18 18 18 5.6 at 5.00E-03 at 4.4 at 2.00E-03 at 4.8 at 3.00E-03 at 4.1 at 2.00E-03 at 2.91 at 0.0082 at 19.61 (1kHz) N/A 6.4 (100kHz) 6.4 (100kHz) 5.78 5.78 0.0415 (1kHz) 0.001 (100kHz) 0.001 (100kHz) 0.002 (100kHz) 0.002 (100kHz) ohm*cm 8.00E+14 1.00E+14 2.00E+14 1.00E+15 1.93E+16 3.10E+13 1.22E+12 2.89E+15 N/A 3.90E+12 3.90E+12 5.18E+12 5.18E+12 ppm 10 10 10 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A Agency Listing UL94 V-0 N/A N/A N/A UL94 V-0 N/A N/A UL94 V-0 N/A UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0
How can we help you today? Tell us about your performance, design and manufacturing challenges. Let us put our silicon-based materials expertise, application knowledge and processing experience to work for you. For more information about our materials and capabilities, visit dowcorning.com. To discuss how we could work together to meet your specific needs, email electronics@dowcorning.com or go to dowcorning.com/contactus for a contact close to your location. Dow Corning has customer service teams, science and technology centers, application support teams, sales offices and manufacturing sites around the globe Images: AVs to be added when images used are approved. LIMITED WARRANTY INFORMATION PLEASE READ CAREFULLY The information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customer s tests to ensure that our products are safe, effective and fully satisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent. Dow Corning s sole warranty is that our products will meet the sales specifications in effect at the time of shipment. Your exclusive remedy for breach of such warranty is limited to refund of purchase price or replacement of any product shown to be other than as warranted. DOW CORNING SPECIFICALLY DISCLAIMS ANY OTHER EXPRESS OR IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR MERCHANTABILITY. DOW CORNING DISCLAIMS LIABILITY FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES. Dow Corning is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation. 2013 Dow Corning Corporation. All rights reserved. AMPM264-13 Form No. 11-3402-01