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2 Justified and Customized Layers Sàrl 2014 Consulting 1- Diener Electronic GmbH Support Integration of Parylene Technology = Resource for JCL to manufacture coating system. (French manufacturer Alliance Concept) 2 - Consulting for VLPPS (Very Low Pressure Plasma Spray) 2015 Parylene Coatings Services Trials & Small production R&D projects - System manufacturing are possible 2 nd sem. Parylene deposition in Production scale.
PURPOSE Offer a wide range of services based on Performance, Technical, scientific and technological skills, Creativity and openness. Shared values and partnership. MISSION Extending scope of polymer vapor phase deposition applications, Democratize the process, Enhancement of vacuum polymer deposition combining it with related technologies.
Services Parylene coating : type N, C, D, F-VT4 and F-AF4 Other kind of parylenes can be also tested for you. Surface activations dedicated to your part Masking & Unmasking Surface modification (energy, roughness,.) Research & Development Research is an integral part of the corporate culture of JCL. JCL should not only be at the forefront of innovation, but should aim to be an actor.
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VACUUM CHAMBER PARYLENE Synthesis 8 ROOM TEMPERATURE FILM SURFACE TREATMENT PROTECTION
Completely Conformal Ultrathin and Lightweight Free from pinholes and Defects 9 Chemical Insolubility Dry Film Lubricity Moisture and Chemical Barrier Particles Immobilization High Dielectric Strength Hydrophobicity
Chemically pure Free of Catalyser, Plasticizer, Solvent Residues No leachable ingredient No outgassing 10 Biocompatible FDA agreement USP XXII - Class VI No Thermal stress No Cure Forces Environmentally Friendly Optically Clear & Colourless
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Parylene F-VT4 4 F on C aromatic Highly Crystalline Good dielectric properties Good crevice penetration Easy to manufacture High T resistance UV+O 2 weakness Impermeability inf. to Parylene N Chlorinated parylenes Only Carbon and Hydrogen Raw material cost Highly Crystalline Excellent dielectric (low k) FDA Agreement Parylene F AF4 High crevice penetration 4 F on C aliphatic Low Friction Coefficient Highly Crystalline UV+ O 2 weakness UV + O2 Resistance Lowest T resistance Amazing T resistance FDA Agreement Very Low Friction Coef. Highest crevice penetration Excellent dielectric (low k) Low deposition rate Lowest impermeability Prohibitive raw material cost Customized equipment using is advised Parylene C 1 Cl on C aromatic Most widely used Easiest to produce Lowest permeability to moisture & gas Mechanical properties FDA Agreement UV+O 2 weakness Moderate T resistance Parylene D 2 Cl on C aromatic Highest thermal resistance in Chlorinated family Low permeability to moisture & gas Mechanical properties UV+O 2 weakness Low crevice penetration Moderate T resistance compared to F parylenes 18
20 Vacuum capability Low Vapour Pressure to avoid vaporization Room T (max. 40 C ) during vacuum process. Remark: specific substrates can be cooled down to limit this weakness Part size Surfaces Cleanliness Dimensions are limited by the deposition chamber JCL Chamber Height: 800 Ø: 600 mm Remark: very large chamber can be realized Surface contaminants, oil, grease, oxides etc. can reduce coating adhesion to the substrate Surface preparation : necessary initial substrate treatment before coating.
MECHANICAL ADHESION Roughness Porosity Complex Geometry 21 SYNERGIE CHEMICAL ADHESION Surface cleanliness Monomer reactivity Adhesion Promoter(s) Plasma treatment PARYLENE - SUBSTRAT
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Standard process Tumbling process 24 Parts arranged on carrousel Laid out on trays or hanged up on support device Carrousel turns slowly during process. Brittle parts and devices All sizes Contacts points not coated (if masking: contact points are chosen to correspond to masked areas). Parts in bulk in a closed barrel. Barrel turns slowly avoiding parts conjoining with coating Small parts Large quantity Complete encapsulation Low damaging material : ferrites, elastomeric parts, Slight loss of transparency: coating more or less milky. Continuous process According to information currently available: not so far realised. Technical challenge. Limitations: Thickness /Deposition speed.
1 st - With latex, scotch, masking of areas or parts where parylene coating is unwanted. 2 nd - Parylene coating of the partially masked part 3 rd - Physical masking removing parylene film usually has to be cut at the masking border. Sensor Connections 25 1 st - Complete parylene coating of part. 2 nd - With latex, scotch, masking of areas or parts where parylene coating is wanted 3 rd - Removal of unmasked (unprotected) parylene by Plasma etching 4 th - Physical masking removing parylene film usually has to be cut at the masking border.
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CLIC to read ON 27
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Thin Film Interferences Colored film when Thickness < 1 mm N 1.661 C 1.639 D 1.669 F VT4 1.580 REFRACTIVE INDEX Eau: 1.33 PMMA : 1.49 Glass: 1.5 1.6 29 F AF4 1.559 Epoxy: 0.8-1.8 PTFE : 2.0-2.5 Silicone rubber: 1.1-2.3 SEPCIFIC GRAVITY g.cm -3 ASTM D1505 N 1.10 C 1.29 D 1.40 F VT4 1.6 F AF4 1.5 Specific Gravity modifications after thermal treatment Crystallinity level Parylene application: Rubber encapsulation N 0.25 C 0.30 D 0.35 F VT4 0.35 F AF4 0.15 FRICTION COEFFICIENT ASTM D1894 PTFE : 0.05 to 0.2 Silicone Rubber: 0.25-0.75 Steel : 0.8
Elongation to break (%) Tensile modulus and Elongation to break evolution function of thermal treatment duration o Parylene C o Vacuum thermal treatment at 265 C CLIC to read ON 30 400 300 200 100 0 1 2 3 4 Thermal treatment duration (Hours) 4.14 3.45 2.76 2.07 Tensile modulus (GPa)
Property Unit PARYLENE Type N C D F-VT4 F-AF4 31 Tensile Modulus GPa 3.2 2.4 2.8 3.0 2.5 Yield Strength MPa 55 42 60 52 48 Tensile Strength MPa 70 45 75 55 50 Yield Elongation % 2.9 2.5 3 2.5 2 Elongation to Break % 20-250 20-200 10 10-50 10
Time mechanical properties / 2 10 5 11.4 years 350 C 200 C 100 C 80 C 60 C 10 4 1 year 32 10 3 1 month 450 C 250 C 135 C 115 C 95 C 10 2 4 days 10 10-1 1 1.2 1.4 1.6 1.8 Parylene N Parylene C Parylene D Parylene F-VT4 Parylene F-AF4 2 2.2 2.4 2.6 2.8 3 10 3 /T (K) 560 441 352 282 227 181 144 111 84 60 C
Relative weight (%) 100 33 80 60 40 20 0 100 200 300 400 500 600 700 Temperature ( C)
H C H C O 2 34 H H Heating Radiations 120-150 C (Par C, N and D) Readily occurs for l < 300 nm O O C H & C OH
Property Dielectric Constant (er) ASTM D150 Unit PARYLENE Type N C F (VT4) F(AF4) 60 Hz 2.65 3.12 2.20 2.21 1 khz 2.65 2.98 2.25 2.20 1 MHz 2.65 2.91 2.42 2.17 35 Dissipation factor (d) ASTM D150 Dielectric strength 25μm. Short time DC breakdown Resistivity 23 C, 50% RH ASTM D257 60 Hz 0.0002 0.023-0.0002 1 khz 0.0002 0.017 0.0013 0.002 1 MHz 0.0006 0.013 0.008 0.001 MV/m 280 220-250 - 225 10μm V ~ 4000 ~ 3500 - - 25μm V ~ 7000 ~ 5600 - ~ 5400 Vol. Ω cm 1.4 10 17 2.2 10 15 1.1 10 17 2.0 10 17 Surf. Ω 1.0 10 13 6.9 10 16 4.7 10 17 5.0 10 15
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Gas Permeability at 25 C Film Thickness 25.4 mm ASTM D 1434 Ncm 3.mm / (m 2.j.bar) Property Unit PARYLENE Type N C D F-VT4 F-AF4 (1) 37 Water Vapour Transmission at 37 C for 10 mm ASTM E96 g / m 2.day 30 10 12 35 20 * N 2 3 250 420 1 900-5 200 O 2 16 600 3 000 13 500 16 700 25 400 CO 2 90 700 3 300 5 500-103 000 (1) SCS Data H 2 S 336 200 5 500 600 - - SO 2 801 300 4 650 2 000 - - Cl 2 31 300 150 250 - - * Water vapour transmission for F-AF4 is not measured with E96 but ASTM F 1249 values should not be compared with others parylenes
BASE ACID SOLVANT Parylene C N D Temperature Amb. 75 C Amb. 75 C Amb. 75 C Dichlorobenzene C 6 H 4 Cl 2 1.4 3 0.2 0.3 0.8 1.8 38 Trichloroethylene Cl 2 C=CClH 0.8 0.9 0.5 0.7 0.8 0.9 Acetone CH 3 -CH 2 O-CH 3 0.9 0.9 (56 C) 0.3 0.4 (56 C) 0.4 0.4 (56 C) IsoPro. Alcohol CH 3 -CH 2 OH-CH 3 0.1 0.2 0.3 0.3 0.1 0.1 Toluene C 6 H 4 CH 3 1.32-0.3-3.69 - Chloric Acid 37 % - HCl 0 4.1 0.2 2.3 0.5 0.7 Sulphuric Acid 98% - H 2 SO 4 0.4 5.1 0.2 5.3 0.8 7.8 Nitric Acid 71% - H 2 NO 3 0.2 1.85 0.2 0.5 4.9 Fluoric Acid 10% - HF 0.09 0.37 0.27 Sodium Hydroxide - NaOH 0 0.5 0.1 0 0.1 0.4 Ammoniac - NH 4 OH 0.2 0.4 0.3 0.4 0.1 0.9
Contact angle (q ) reversibility Saturated Vapour 100 Solid Liquid q CLIC to read ON 39 90 80 70 60 50 40 30 20 Standard Plasma 1 Plasma 1 + Silanes Plasma 2
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Seals Gaskets O-rings Tubing Keypads Elastomers Stents Cochlear implants Needles Lens Catheters Elastomeric seals Medical Device Stoppers and plunger tips Electrosurgical tools Cardiac assist devices Medical electronics Electronic Printed Circuit Boards Sensors Capacitors Ferrite cores Metal components 41 Elastomeric components PARYLENE Digital displays Wafers MEMS LEDs MEMS Sensors PCB assemblies Motor components Power supplies Military Aerospace Automotive LEDs Electronics Sensors LEDs Fuel Cell Technology Emissions Sensors Gaskets and seals Electronic billboards Video displays Aviation Vehicle lighting Traffic signals Scoreboards Outdoor illumination
Green Process Biocompatibilty Biostability Chemical inertia Excellent Chemical Barrier PARYLENE Excellent Moisture Barrier Dry Lubricity 42 Colour less Transparency & Polymers treatment Ultra thin & Conformal Reduce stickiness Resistance UV O 2 only F-AF4 Adhesion Surface preparation Low Elasticity vs elastomers Expensive Process?
Parylene is considered by many to be the ultimate conformal 43 coating for the protection of devices, components and surfaces in the electronics, instrumentation, aerospace, medical and engineering industries.
Parylene ultra-thin conformal 44 coatings are being used more than ever to protect devices and components and enhance the reliability of today s and tomorrow s innovative technologies.