Optonet Industrial 3D-Printing of Metal Parts on a Micron Scale Jena, 2013/11/06 www.3dmicroprint.com joachim.goebner@3dmicroprint.com +49 (0)172 / 842 5378
Additive Manufacturing Miniaturization Overall view Motivation Technology Business Source: IVAM, EOS 3DMP 2
Motivation: Market Challenges Faster time to market combined with shorter lifecycle Focus on Sustainability Customization of products Additive Technologies address these market challenges Increased flexibility in production ("factories around the corner") Cost and productivity pressure, low costs-per-part Differentiation by customer value add 3DMP 3
Typical Advantages of additive Technologies AM technology key differentiators compared to conventional manufacturing processes Freedom of design Cost advantages Customization Time to market Organization Lightweight Static: weight of parts Dynamic: moving, accelerated parts Lattice structures Integrated functionality Embedded functionality without assembly Minimized stock Minimized QA No assembly Individualized parts Customer specific adaptations Medical implants Prototyping and Serial applications Fast feasibility feedback CAD data to parts Cost efficient small series Lattice structure Grabber Jewelry Just print it Image sources: 3DMP, EOS 3DMP 4
Micro Laser-Sintering (MLS) Additive manufacturing serves global manufacturing trends Markets for miniaturized parts are growing Sustainability Time to market Customization Functional integration & cost advantage Flexibility Differentiation, Unique Selling Points Text Text Micro Laser-Sintering extends Additive Manufacturing to the Micro World Source: IVAM, EOS 3DMP 5
Technology: Roadmap Micro Laser-Sintering 2002 2006 2008 2009 2013 2014 2016 First working R&D system at University of Applied Sciences Mittweida 3D-Micromac presents MicroForm, EOS enters project MLS technology demonstrator MLS application development with Industry New Machine Generation and installation at TU Darmstadt First production facility in place MLS is a recognized manufacturing technology Source: 3DMP, HS Mittweida, 3D-Micromac AG, TCC Chemnitz, EOS GmbH 3DMP 6
Technology: Current status Current status at a glance Fine detail resolution Powder particle size 5µm (D90) Laser spot Ø size 30µm Layer thickness from 1 to 5 µm 32µm wall thickness so far 15µm imaginable High output Low running cost Safety Bi-directional recoating Quick job setup Gas tight design & gas cleaning included Air locks and Rapid Transfer Ports Get the desired surface & density Switch between pulsed and cw laser mode Ra minimum 2µm so far without post processing Create surface pattern, structure Almost any metal proccessible So far stainless steel & Molybdenum Next Titanium & Aluminum Research level: Cu, Silver, Tungsten and more, even ceramics Machine and workstation details Build envelope Ø 57 x 30 mm height Argon atmosphere: < 1ppm H 2 0 & O 2 Stepping resolution platform: < 1µm Travel tolerance recoater < 0,5µm Safe pre- and post processing via workstation 64 bit operating system Comprehensive data logging Remote access 3DMP 7
Technology: Process and operational safety QA This area is secure because of the gas tight Machine, Workstation and Rapid Transfer Port Post processing Part & Tool cleaning MLS machine Powder Platforms Tools Parts Warehouse Workstation Sieving Preparing Cartridges Powder Platforms Tools Source: EOS GmbH 3DMP 8
Flexure hinges for bendable handling or endoscopy applications Micro Grabber Flexure hinge arm design Grabber details Challenge For handling applications, a flexible yet strong arm with a mounted grabber is required Solution Flexure hinge designed for optimal mechanical response Hinges with 300 µm gap width Advantages Functional integration: hinges are integrated in the main body Miniaturization of grabber mechanics Grabber head manufactured in one piece Source: EOS GmbH 3DMP 9
Y stent for artery branches Y stent Challenge For endovascular aneurysm repairs and for preventing aneurysm (e.g. in fistulae used for dialysis) Y shaped stents are required Solution Y stent built with 300 µm wall thickness Subsequent plasma polishing Advantages Anatomic situation of blood vessels can be reproduced in stent design Post processing eliminates sharp edges Source: EOS GmbH 3DMP 10
Square holes & lattice structures 90 µm 45 µm 32µm Square holes & lattice structures Challenge Radiation applications from medical devices to space research need structures to guide or shield radiation Solution Square holes and even changing cross sections just do it Wall thickness down to 15 µm imaginable today Advantages MLS enables certain solutions for the first time Lattice structures, a few micron thick can be manufactured much cheaper with MLS than with e.g. etching Source: 3DMP, EOS GmbH 3DMP 11
Density and Surface Cross section polish of 316 L part Square holes & lattice structures Challenge Many applications require full density and low surface roughness some require porosity & surface structures Examples for smooth and patterned surfaces Solution The combination of pulsed and cw exposure in one part enables a large variety of target properties Advantages MLS enables mold exhaust without bores Get different properties within one part Get smooth surfaces or surface patterns Source: 3DMP, EOS GmbH 3DMP 12
Wettability experiment Wettability experiment Challenge For wettability experiments a large surface with regular microstructure was needed 3 mm Solution Pyramidal design with 50 µm structure size built in a grid Advantages Pitch of microstructure has no effect on part cost Main body can be built in free-form shape Source: 3DMP, EOS GmbH 3DMP 13
Fluid mixing chamber Fluid mixing chamber 3 mm Challenge Mixing solution required for 3 liquid components; applied mechanical load has to be minimized Solution Spiral shaped pipes with 200µm wall thickness and 150µm inner diameter Advantages Applied load is minimized, no moving parts required for mixing mixing ratio can be easily modified by pipe diameter, flow ratio and design of the mixing chamber Source: 3DMP, EOS GmbH 3DMP 14
Personalized Jewelry Ring & bracelet Personalized rings Situation Increasing costs for precious metals motivate material savings for jewelry without compromising its appearance Hollow structure as design element Solution Hollow structures save material Plasma polishing enhances surface finish Different ring designs Advantages Jewelry can be personalized without extra cost Structures are a unique design feature Source: 3DMP, EOS GmbH 3DMP 15
Business: Application development together with partners is the key to success MLS Application development since 2009 Medical devices Automotive Molds Jewelry Watchmakers Space research Manufacturing challenges Application development Manufacturing solutions Source: 3DMP, EOS GmbH 3DMP 16
Business: New machine generation, process chains and additional materials will fuel MLS Next steps Installation of 2 new generation machines in 2013 TU Darmstadt DONE EOS DONE Continue application development with industry partners Looking for further R&D partners to form an MLS network Research and engineer process chains with focus on Mechanical properties Surface roughness / structures Target density / porosity Release Aluminum & Titanium and further materials Start MLS part business in 2014 Thank you for your attention! 3D MicroPrint GmbH Technologie-Campus 1 09126 Chemnitz www.3dmicroprint.com info@3dmicroprint.com Source: 3DMP, EOS GmbH 3DMP 17