Laser Micromachining - Market Focus Dr. Andrew Kearsley Oxford Lasers Ltd. Moorbrook Park, Didcot OX11 7HP andrew.kearsley@oxfordlasers.com 5th CIR HVM-UK: South East Conference Harwell, 17 November 2005
Overview of Talk Introduction to Oxford Lasers Characteristics of Laser Micromachining Laser micromachining systems High Value Applications of Laser Micromachining Future challenges
Oxford Lasers Founded 1977 as spin off from Oxford University Based in Didcot, Oxfordshire Two divisions: Imaging and Industrial Imaging: integrates laser (strobe light), camera, computer, software, optics and applications knowledge into imaging systems. Industrial: integrates lasers, beam delivery, beam manipulation optics, work handling, control and process knowledge into micromachining systems Main geographic markets: UK, USA and Japan Subsidiary in USA, just north of Boston
Industrial Division - Core Strengths Knowledge of wide range of lasers. Knowledge of work handling, imaging, optics etc required for a system. Knowledge of wide range of laser applications. Knowledge of laser processing techniques. Ability to innovate / develop new processes. Ability to match customer requirements and laser process / system.
Characteristics of Laser Micromachining Very high precision (< 1 micron accuracy). Very little damage or stress on substrate. Relatively slow. Relatively expensive and tends to cost more than traditional techniques. Target markets have to have high value added by the use of laser micromachining.
Services offered Sample production Process development Pilot or low/medium volume production System manufacture Additional production capacity during surges in demand Long term support
Sales Process Marketing Customer Enquiry Laser Micromachining Feasibility Study metals, ceramics, polymers, glass,semiconductors,composite System definition and proposal and / or Pilot Production System Sale System Design, Build & Commissioning
Micromachining Systems Fully automated laser micromachining system Laser Proprietary Optical Trepanning System 5-axis part positioning Material handling systems (options) User-friendly pc interface
Which Laser to use? (Quality) (Proc.Speed) Laser Wavelength Laser Pulse Width Laser Beam Profile Laser Power Laser Rep.Rate Laser Focussability Important Parameters hole size hole aspect ratio feature quality processing speed cost per hole
Examples of Materials Silicon Nitride 90 m Ø, 500 m thick Steel 50-100 m Ø, 100 m thick Silicon 125 m Ø, 350 m thick Upilex Polyimide 500 m thick
Industrial Laser Micromachining Applications Wide variety of markets including: Semi/Microelectronics Inkjet Printer Nozzle PCB via interconnects IC Test Vertical Probe Card Optical Switching Heat management in PCB packaging Automotive Fuel-Injection Nozzle Fuel Filter Car brake sensors Con-rod lubrication Aerospace/Defence Turbine component cooling Engine Silencing Missile guidance Aerofoil laminar flow BioMedical MEMS Catheter Sensors Aerosol Spray Atomisers DNA Sampling Vaccine production Lab-on-a-Chip Environment/Energy Toxic Gas Sensors Solar Cell Technology Fuel Cell Particulate Filters Other Food Packaging Gem Stone drilling Digital Fingerprinting
IC Vertical Test Probe Card Vertical probe heads are used for IC electrical testing prior to packaging. They require microholes to guide the contacting wires. Laser drilling of the guide plates allows high packing density with smaller hole sizes and provides flexibility, high processing speed Guide Plates Probe wires IC test wafer Probe Head Materials silicon ceramics (Al 2 O 3, Si 3 N 4 & others) plastics (PI) Hole Geometry Hole size : 40-100 µm diameter Hole shape : square, circular, elliptical Hole Cylindricity : parallel or tapered Wafer thickness : 300-700 m Technology challenges Hole position accuracy Speed of drilling Taper angle control tolerance Toolpath flexibility, any hole shape
IC Vertical Test Probe Card Si 3 N 4 500 m thick, 511nm entrance m] Exit Diameter [ Hole Size Repeatability 50 49 48 47 46 45 44 1 51 101 151 201 251 Hole Number exit 90 mø Silicon 50 m square
Fuel-Injection Diesel-injection nozzle Gasoline-injection nozzle Fuel feed Injection hole valve
Future Trends in Laser Micromachining Better Resolution (shorter wavelength, shorter pulses) Lower Production Cost (process speed, high rep.rate, high power) Better Quality (shorter pulses, faster motion control) More Complex Materials (multi-wavelength laser systems) Industrial Robustness (compact, fully diode-pumped laser systems)
Future Challenges Getting market to appreciate value of services provided. Protecting intellectual property, often know-how rather than patents. Maintain margins as applications take off and customers require multiple systems. Maintain markets as laser micromachining knowledge becomes widespread and migrates to lower cost economies. Identify new volume applications.