Title: Sources of Temperature Variance in Dispenser Cathodes

Similar documents
3M Thermal Management Solutions for LED Assembly

3M Electrically Conductive Double-Sided Tape 9711S Series

3M Electrically Conductive Adhesive Transfer Tape 9707

3M Advanced Materials Division 3M TM. Boron Nitride Cooling Fillers Smart Coolness for Excellent Performance

3M Plastic Bonding Adhesive 2665B, Black

3M Pin Strip Header, 1512 Series 2 mm 2 mm Solder Tail Straight & Right Angle, Surface Mount Straight

4411N 4411G 4412N 4412G

Double Coated Urethane Foam Tapes

3M Electrically Conductive Cushion Gasket Tape

Thermal Transfer Polyester Label Material

Adhesive Transfer Tapes with

3M Anisotropic Conductive Film 5363

3 Scotch-Weld TM. Epoxy Adhesive 2158 B/A. Technical Data December, 2009

Scotch-Weld Metal Bonder Acrylic Adhesive DP8407NS Gray

3M Electrically Conductive Gasket Tape MSG6000F Series

Adhesive Transfer Tapes with Adhesive EK

3M Abrasive Systems Division. Sanding made simple.

Trends in Adhesives and Tapes Bonding Dissimilar Materials Using Adhesives and Tapes

3M Contrast Enhancement Film

PRELIMINARY. HTHA (Z1-Foil)

HTHA (Z1-Foil) Vishay Foil Resistors

VHB Adhesive Transfer Tapes with High Performance Acrylic Adhesive 100MP F9460PC F9469PC F9473PC

Adhesive Transfer Tapes with Adhesive EK PC

3M Cold Shrink Silicone Rubber Connector Insulators 8440 Series

3 Adhesive Transfer Tapes with Adhesive PC

Scotch-Weld TM. Epoxy Adhesive/Coating Technical Data July, 2011

Extreme Sealing Tape

Tapes. Reliable. Solar Industry. for the. 3M Tapes for Solar Panel Fabrication

Scotch-Weld Toughened Epoxy Adhesives LSB60 and LSB60NS

Adhesion Promoter/Primer 3M Adhesion Promoter AP596

Destructible Vinyl Label Material 7613T / 7930T

Acrylic Structural Adhesives. Features and Recent Advancements

3 700-Series Hybrid Products:

3 Water Contact Indicator Tape 5557 Condensation Test

Fire Protection Products

Frequently Asked Questions. 3M Liquid-Filled Transformer Insulation

More. with 3M Glass Bubbles. High-strength additives for reduced part weight, improved dimensional stability, enhanced processing and much more.

3 Scotch-Weld TM. Epoxy Adhesive EC Technical Data November, 2010

3 Screen Printable Sheet Vinyl Label Material

3 Scotch-Weld TM Flexible Epoxy Adhesive LSB90

BROADCAST: M BLOCKS, PLUGS, PLANKS NEW PRODUCT LAUNCH Date: June 16, 2016 Issued by: George Yoshida, Ted Colwell

3M Industrial Masking Tapes

Epoxy Adhesive 2648 EG

3 Scotch-Weld TM. Instant Wood Adhesives and Surface Activator. Technical Data April, 2007

Metal Film Resistors, Industrial, Precision

3M Scotchkote Fusion-Bonded Epoxy Coating 6233P

Thermal Transfer Polyimide Label Material

Thermal Transfer Polyester with TT3 Matte Topcoating Label Material

Laser Toner Printable Polyester Label Material TL

3 Screen Printable Sheet Vinyl Label Material

Low VOC Tapes 98010LVC 99015LVC. Technical Data September 2017

3 Scotch-Weld TM. Epoxy Adhesive DP100 FR. Technical Data July, 2011

RTD Simulator. Handy Resistor Simulates RTD Temperature Outputs, such as PT-100 and PT Vishay Foil Resistors FEATURES AND BENEFITS

3M Fast Tack Water Based Adhesive 1000NF

Next Generation Structural Acrylic Adhesives. Enhance Productivity and Performance

3M CS-195+ Composite Sheet Product Description

3M Scotchcast Electrical Resin 281 Two-Part, Semi-Flexible, Filled, Epoxy Liquid Resin

3M D Sub Socket 50 Position 8350 Series

Advanced technologies for enhancing the building envelope. 3M Building and Construction Market

1.4 kg/l (11.4 lb/us gal) Maximum 272 g/kg (Directive 1999/13/EC, SED) Maximum 420 g/l (3.5 lb/gal) To 650 C (1200 F) To 538 C (1000 F)

3M Decorative Polyester Glass Film

Enhancing the Performance & Reliability of Your Electronics Designs. Innovative Thermally Conductive Silicone Solutions IMAGINE

Installation Guide April 2017

3M Scotch-Weld Structural Void Filling Compound

3M Pin Strip Header 2 mm and 2 mm x 2 mm Straight, Surface Mount 951 Series

3M Thermal Bonding Film 588

Endotherme Mat ES-5A-12

PRELIMINARY. FRSH Series (0603, 0805, 1206, 1506, 2010, 2512) (Z1-Foil) Vishay Foil Resistors

3M Card Connector SD Normal Polarization, Push-Push, Surfacemount SD Series

1.4 kg/l (11.4 lb/us gal) Maximum 295 g/kg (Directive 1999/13/EC, SED) Maximum 420 g/l (3.5 lb/gal) 50 to 63 μm (2.0 to 2.

Adhesive Transfer Tapes with Adhesive , 941N, 965, 966, 9461P, 9461PC, 9462P

Double Coated Urethane Foam Tapes

3M Round, Shielded/Jacketed, Flat Cable.050" 28 AWG Stranded, Mass Terminatable, PVC/PVC 3659 Series

Optimizing Strain Gage Excitation Levels

ELECTRICAL RESISTIVITY AS A FUNCTION OF TEMPERATURE

General Information on the Assembly and Solder Pad Design of the DRAGON Family Application Note

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor) RN2110, RN2111

Performance and productivity.

Package Mounting Guide BGA

PS-31 (SUS304, 300 mm) PS-31 (SUS304, 1,000 mm)

3M PCB Connector.100 Four Row 3400 Series

3M Electrically Conductive Cushioning Gasket Tape ECG-8035 / ECG-8055 / ECG-8075

3 Automotive Structural Adhesives Two-Part Induction-Cure Epoxy Adhesive 5045

Destructible Vinyl Label Material

20 W Power Resistor, Thick Film Technology, TO-220

Power Resistor for Mounting onto a Heatsink Thick Film Technology

PCB Technologies for LED Applications Application note

3M XYZ / Isotropic Electrically Conductive Adhesive Transfer Tape 9709

Scotch-Weld TM Polyurethane Reactive Adhesives

Structural Performance Tests of VHB Structural Glazing Tapes

3M Electromagnetic Compatible Products

3M Floor Protection Systems The shine that goes on and on.

Agilent 16047D Test Fixture

3M Ground Plane Cable.050" 28 AWG Stranded, One Drain, PVC 3476 Series

Recommended Hole Pattern: [mm]

High Stability Resistor Chips (< 0.25 % at Pn at 70 C during 1000 h) Thick Film Technology

3M Purification Inc. Technical and Scientific Services Global Support for the Life Science Industry. Global Expertise delivered locally

FRSM Series (Z1 Foil Technology)

3M Floor Protection Systems The shine that goes on and on.

Wirewound Resistors, Industrial Power, Aluminum Housed, Chassis Mount

Transcription:

This technical paper was written and developed when the author(s) was an employee of Semicon Associates, a Ceradyne, Inc. company. Ceradyne, Inc. was acquired by 3M Company on November 28, 2012. Title: Sources of Temperature Variance in Dispenser Cathodes

Sources of Temperature Variance in Dispenser Cathodes Scott Roberts, sroberts@semiconassociates.com Semicon Associates, 695 Laco Dr. Lexington, Ky Ph.(859)255-3664, Fax (859)255-6829 ABSTRACT Typical temperature specifications for dispenser cathodes range from 950Cb to 1100Cb with 1 to 2 percent tolerance. With current techniques tolerance and repeatability of measurements are impacted by variables in construction materials, material surface conditions, test equipment and arrangements, and temperature measurement when dispenser cathodes are vacuum thermal tested. Dispenser cathodes are constructed from various refractory metals and oxide materials which present certain unique properties and associated unique uncertainties. This paper discusses the manufacturing processes and materials contributing to these temperature variables, including emitter surface conditions, surface finish variability on the cathode body and heat shields, heater wire resistance, potting density, and temperature measurement deviation. The data includes sample sets of cathode test data demonstrating the cumulative effects of the variables, error factors, and specific parameters evaluated in the paper. HEATER The major component of determining the temperature of a dispenser cathode is the heater. Tungsten-3% rhenium wire is the material most prevalent in the industry, and the amount of rhenium content is typically held to 3.1 to 3.4 % tolerance. The alloy will perform differently among suppliers, with heaters manufactured having somewhat different wire cold resistance. For example, Nippon wire has approximately 3% lower resistance than Osram wire, requiring an increase in heater length to compensate. This is generally not a problem, since the heater cavity can usually accommodate this adjustment to meet the cold resistance specification. The resistance measurement is made at room temperature with a 4-wire technique to within 5% tolerance of specification 1. For accurate correlation to cathode test conditions, the cold resistance measurement is taken at the same length and leg locations as the hot test will be performed. Other materials used to manufacture heaters include pure tungsten, tungsten-25%rhenium, and pure molybdenum. Consistent wire resistance and dimensions are critical parameters to heater performance. Recent improvements 2 in supplier processes by eddy current testing the wire have reduced the opportunity for splits, inclusions, and other mechanical defects in the final product. POTTING During cathode operation the energy supplied by the heater conducts throughout the potted heater cavity and into the cathode body and emitter. Aluminum oxide is the primary material used in potting the heater into the cathode body and various formula mixes of grit size are used, depending upon the application. The potting compound may also be doped with other oxides to reduce shrinkage and potential crack formations.

Temperature differences due to variances in the potting density effect the thermal energy conduction from the heater to the cathode body. A tightly packed heater with dense potting offers more conduction to the cathode surface. A less dense arrangement will conduct less heat, operate at a higher wire temperature, and perform with less efficiency. The potting density is manually controlled by the assembler during manufacturing, and a rigid qualification matrix must be completed and maintained to address consistency. In Table 1 data samples gathered over a period of one year demonstrate from 1.2% to 2.4% temperature capability, based on a simple six sigma calculation. The data are cumulative of the variances discussed and represent the sum of all the error factors in a practical end result. The cold resistance ranges from 1.8% to 2.8% which is a factor in contributing to the temperature variance. The largest cold resistance capability in data set D of 2.78% does not correspond to the largest Tk3 capability of data set A. The smallest cold resistance capability of 1.85% in data set B also does not correspond to the smallest temperature capability of 1.23% in data set D. Additional sources of variance are involved other than cold resistance. The average capability across all data sets is 1.67% for temperature, which represents the final average variance, and 2.29% for Rc. Table 1 - Cathode Data Sample Set Dataset: A B C D E F Tk3 mean, ºCb 1083 1086 1084 1087 1089 1083 Tk3 stdev 8.686 5.109 6.376 4.442 5.228 6.333 Tk3 stdev X 3 26.06 15.33 19.13 13.33 15.68 19 capability (3s/mean)X100 2.405 1.411 1.765 1.226 1.44 1.755 est. variance 75.45 26.1 40.66 19.73 27.33 40.1 Rc mean, ohms 0.313 0.31 0.308 0.305 0.307 0.305 Rc stdev 0.002 0.002 0.003 0.003 0.002 0.002 Rc stdev X 3 0.006 0.006 0.008 0.008 0.007 0.006 capability (3s/mean)X100 2.075 1.851 2.724 2.779 2.19 2.095 est. variance 5E-06 4E-06 8E-06 8E-06 5E-06 5E-06 COMPONENTS The cathode emitter surface and body components will radiate the energy provided by the heater. Sources of variance include the emitter surface condition, coatings, radiation effectiveness of the body and shielding, and changing conditions of emissivity on all surfaces. During operation the barium compounds will migrate to the emission surface. This will cause a change in the surface emissivity and corresponding change in the temperature measurement. In Figure 1 tests have shown after 500 hours of cycling operation, the temperature measurement may drop 20Cb to 30Cb. To confirm this effect, SRLV cleaning and re-testing the cathodes was performed, resulting in the rise of 10Cb

to 15Cb toward the original temperatures. The remaining percentage is due to the normal drop in initial temperature, where the cathode potting structure will have an initial burn-in phase that establishes stable heat conduction and then performs with minimal change over the design life of the part. Estimated variance due to surface emissivity is 1%. Fig. 1-Sample data for two cathodes showing temperatue effects of tungsten surface conditions. 1050 1045 1040 1035 1030 1025 1020 1015 1010 1005 1000 Initial After 100 After 200 After 300 After 400 SRLV After 500 An emitter surface coating of osmium-ruthenium alloy is typically applied to lower surface work function. This can also cause a temperature measurement shift of 30Cb lower than a non-coated surface. The radiation losses from the cathode body surface can dramatically affect the energy intended for the cathode emitter. In Figure 2 temperature data from a surface study shows the machining finish and the overall shiny-ness or dull-ness conditions will radiate with different efficiencies. A polished molybdenum body may cause the emitter surface to run 10Cb to 15Cb hotter than normal, with similar results from a lightly grit blasted surface on the cathode radius. Drastic effects are demonstrated when the molybdenum body is grit blasted, with 100Cb lower temperature at the cathode surface. The change in emissivity of the body causes more energy to be radiated from the body and less energy from the cathode emissive surface. In Figure 3 data shows the corresponding effects of current during the same test. The higher current demonstrates that more power is required for the grit blasted surface. Total estimated variance could be up to 10%, but typically around 1%. Surface conditions and thickness of any shields and their ability to re-radiate or insulate can also have an effect on the temperature measurement. Thicker shields tend to run

cooler, but also they conduct more heat from their braze joints. The quality and consistency of shield attachment methods are crucial to stable temperature performance. 1180 1160 Fig. 2 - Effects of Modified Surface Conditions on Temperature Polish OD Grit Blast OD Grit Blast Radius Normal Brightness Temperature 1140 1120 1100 1080 1060 1040 1020 1000 1 2 3 4 Fig. 3 - Effects of Modified Surface Conditions on Current Polish OD Grit Blast OD Grit Blast Radius Normal 1.04 1.02 Amps 1 0.98 0.96 0.94 0.92 0.9 1 2 3 4

TEST CONDITIONS The typical manufacturing test environment for dispenser cathodes is in a vacuum bell jar (<2X10-6 Torr) and performed with a power supply and instrumentation in a 3-wire or 4- wire configuration mode (see Fig. 4). Voltage and current measurements are typically 4 significant digits and are taken at the heater connection points. Sources of variance include the current meter shunt resisters (1% tolerance, typical) and the cathode connections. Resistance loss in poor connections will dramatically affect the data and must be avoided. A standard test setup is used for repeatability and accuracy of the measurements across multiple test positions. Tolerance is typically maintained within 2%. For example, a 2 ohm 1% tolerance calibration resistor is measured for cold resistance. The resistor is then tested at 5 volts and the current recorded. The theoretical current value is calculated based on the cold resistance measurement, and then compared to the actual current measurement. Across all test positions the data is held within.050 amps of the theoretical value for this test setup. This may have up to 1.5% effect on the wire temperature of a cathode with similar characteristics and correspondingly affect the surface temperature of the cathode. Fig. 4 Schematic of Test Setup Most cathodes are designed non-inductive with bifilar or toroid configurations, allowing AC or DC operation. Proper polarity must be considered for DC testing, to avoid electrochemical effects of the heater to potting interface. History has shown unstable

performance when the heater is made positive and the body is negative. All cathodes with grounded heater leads are tested with the heater negative and the body positive, or tested in AC mode. Additional precautions are taken when testing large cathodes. A proper warm up schedule must be followed to avoid excessive heating of the internal potted heater. Wire temperature calculations are used to avoid separating the heater from the potting and causing unstable performance or damage. TEMPERATURE MEASUREMENT The temperature measurements are generally measured with optical pyrometers. Testing conditions are not 100% accurate, since black body conditions do not exist on the emitter surface. The temperature measured is called the brightness temperature, usually designated Tb by the industry. The accuracy of an L&N Optical Pyrometer is plus or minus 4ºC in the range of cathode operation 3. This is equivalent to ±.4% uncertainty of a cathode at 1000Cb temperature. The operator s ability to use the instrument is also a source of variance. Correlation of temperature tests between Semicon and two customers are shown in Tables 2 and 3. In Table 2 the worst case of 4ºC std. dev X 3=±12ºC capability. Therefore measurement is about 1% uncertainty. Table 3 shows correlation between operators using the same pyrometer with about 2ºC std. dev. Table 2 Correlation of Test Data Semicon vs. Customer A Part # Semicon Pyro - A Customer A Pyro - B Semicon Pyro - B Customer B Pyro - A std. Dev 1 1082 1082 1078 1082 2.00 2 1083 1089 1084 1086 2.65 3 1083 1088 1085 1082 2.65 4 1085 1089 1088 1088 1.73 5 1084 1089 1087 1086 2.08 6 1075 1078 1073 1076 2.08 7 1079 1086 1077 1082 3.92 11 1080 1080 1080 1082 1.00 12 1065 1069 1060 1068 4.04 13 1072 1080 1074 1072 3.79 14 1085 1082 1088 1079 3.87 15 1086 1090 1084 1086 2.52 16 1084 1080 1081 1082 1.71 17 1086 1085 1082 1085 1.73

Table 3 Correlation of Test Data Semicon vs. Customer B Part # Semicon Pyro - A Semicon Pyro - B Semicon Pyro - C std_dev 1 1120 1124 1120 2.309 2 1119 1123 1120 2.082 3 1112 1111 1115 2.082 4 1123 1121 1124 1.528 5 1119 1118 1118 0.577 6 1125 1123 1126 1.528 7 1125 1126 1124 1.000 8 1124 1123 1121 1.528 9 1126 1123 1124 1.528 10 1124 1121 1125 2.082 11 1126 1124 1127 1.528 12 1115 1119 1118 2.082 13 1131 1128 1126 2.517 14 1120 1125 1124 2.646 15 1110 1109 1112 1.528 16 1104 1105 1106 1.000 17 1116 1116 1116 0.000 18 1125 1126 1124 1.000 Uniformity of the cathode surface can also be affected by the thickness of the cathode pellet. In Figure 5, the line profile of a cathode surface shows the pellet is approximately 10ºC hotter in the center than on the edge. This is about 1% of temperature uncertainty. Fig. 5 Line profile of cathode surface temperature

CONCLUSION For a simple calculation of the total percentage uncertainty from sources discussed the following method was used: % heater wire variance =5% + % potting density variance (operator controlled) =2.4% + % surface conditions variance(emissivity error) =1% + % test equipment error =.4% + % temperature measurement error (gage rr) =1% = total % of uncertainty 9.8% The actual temperature results from Table 1 of 1.67% average variance demonstrate on this specific cathode the target temperature is achieved well beyond worst case. However, typical target specifications are ±25ºC or more and many cathode designs cannot achieve this. Further investigations are necessary to explain the convergence of variance from sources identified. Additional mathematical treatment is necessary to arrive at a proper statistical model. References 1. EIA-940 Engineering Specification for Cathode Heaters,para.7.4.2 2. Title III of the Defense Production Act (50 U.S.C. App. 2061) 3. Leeds and Northrup Directions for 8634 Optical Pyrometer, #177483, Issue 2

Product is manufactured and sold by Ceradyne, Inc., a 3M company. Warranty, Limited Remedy, and Disclaimer: Many factors beyond Ceradyne s control and uniquely within user s knowledge and control can affect the use and performance of a Ceradyne product in a particular application. User is solely responsible for evaluating the Ceradyne product and determining whether it is fit for a particular purpose and suitable for user s method of application. User is solely responsible for evaluating third party intellectual property rights and for ensuring that user s use of Ceradyne product in user s product or process does not violate any third party intellectual property rights. Unless a different warranty is specifically stated in the applicable product literature or packaging insert, Ceradyne warrants that each Ceradyne product meets the applicable Ceradyne product specification at the time Ceradyne ships the product. CERADYNE MAKES NO OTHER WARRANTIES OR CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OR CONDITION OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY OF NON- INFRINGEMENT OR ANY IMPLIED WARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF TRADE. If the Ceradyne product does not conform to this warranty, then the sole and exclusive remedy is, at Ceradyne s option, replacement of the Ceradyne product or refund of the purchase price. Limitation of Liability: Except where prohibited by law, Ceradyne will not be liable for any loss or damages arising from the Ceradyne product, whether direct, indirect, special, incidental or consequential, regardless of the legal theory asserted, including warranty, contract, negligence or strict liability. Technical Information: Technical information, recommendations, and other statements contained in this document or provided by Ceradyne personnel are based on tests or experience that Ceradyne believes are reliable, but the accuracy or completeness of such information is not guaranteed. Such information is intended for persons with knowledge and technical skills sufficient to assess and apply their own informed judgment to the information. No license under any Ceradyne or third party intellectual property rights is granted or implied with this information. 3 Ceradyne, Inc., a 3M company 695 Laco Drive Lexington, Kentucky 40510 895-255-3664 www.3m.com Please recycle. Printed in USA. 3M 2013. All rights reserved. 3M is a trademark of 3M company. Used under license by 3M subsidiaries and affiliates.