egula t s R SA R Y tional Tra na R TE ns Inter io in Ar m ffic REGI S -R AS9100 ISO 9001:008 Certified Plasma Ruggedized Solutions Global Provider of Custom Ruggedized Engineering Solutions Across Industry plasma etchback desmear testing services & laboratory services Conformal COating parylene COATING potting AND encapsulating bga underfill Form-In-Place GASKET SOLUTIONS PRIVATE LABEL MATERIAL MPAN CO
Plasma Etchback & Desmear Treatments Plasma Ruggedized Solutions has been providing Plasma Etchback and Desmear services for PCB manufacturers since 1990. These treatments remove residues created during the drilling phase of circuit board manufacture. Plasma Desmear employs controlled chemical reactions to clean epoxy resin from the inside of drilled holes in PCBs as small as 1 mil (0.001") in diameter. Plasma Etchback treatment is similar, also removing substrate from within the bore, exposing additional surfaces of internal printed structures. Subsequent to Plasma Etchback treatment, plating adheres to the newly exposed surfaces of the printed structures in addition to the face produced during drilling, creating a superior electro-mechanical interconnect. Our in-house designed and manufactured plasma processing equipment enables us to provide adapted, accurate and repeatable processes that meet your specifications and requirements. Full functionality verification testing is performed to ensure required performance, before processed material is delivered to you. A complete in-house laboratory supports our Plasma Etchback and Desmear processes, to provide rapid process tailoring, development and quality control. Plasma Etchback and Desmear processes are significantly more accurate and repeatable than traditional wet chemical processing, and are environmentally-friendly. Plasma processing generates no environmentally hazardous waste products, as any bi-products created are safe for general disposal. The inherent environmental friendliness of the services and equipment offered by Plasma Ruggedized Solutions translates to improved personnel safety, compared to the hazards posed by traditional chemical processing. Plasma Ruggedized Solutions offers a broad spectrum of developed and proven plasma treatments that other facilities may not. Cleaning of bare assembly surfaces enhances solderability during manufacture. Post manufacturing organics removal and surface activation of populated circuit boards improves adhesive performance when underfill, bonding, potting or conformal coating is required. Other proven treatments can perform surface removal of fluorine and other challenges from materials such as Teflon in preparation for plating or other material deposition processes. Processes established for Teflon Getek Nelco Kapton Speedboard C Polyimide AUTOMATED PROCESS CONTROL 1
Testing/Screening & Laboratory Services Plasma Ruggedized Solutions tests both finished products and their component materials for superior quality and functionality. We offer laboratory analyses for in-process products, failures and field returns. The suite of tests, screening, and laboratory services we offer, ensures that you receive the highest quality finished products. Laboratory feedback also drives our continuous quality improvement program to consistent conformal coating, potting and encapsulation results. Plasma Ruggedized Solutions performs testing that can reveal a broad range of difficulties, common and potential, which may occur. Testing, Screening, and Laboratory procedures we offer for coated, potted, and encapsulated products include: Environmental Stress Screening Environmental stress screenings expose finished articles to your defined environmental envelope, ensuring the reliability of the coatings and your product. Our in-house climate chamber can also test the effectiveness of your selected coatings under extremes of temperature and humidity. Ionic CLEANLINESS Testing Plasma Ruggedized Solutions ionic testing capability can detect the presence of a wide variety of conductive contaminants, prior to the application of your selected coating materials. The detection of ionic compounds on an assembly may indicate a potential electrical or physical failure, and also a potential loss of coating adhesion. Hi-Pot/Continuity Testing These procedures quantify key properties of a component or circuit, coated or otherwise. Hi- POTential testing determines the voltage at which the maximum allowable leakage current flows between a pair of conductive elements which are normally insulated from each other. Continuity testing probes the conductive quality of selected circuit paths in your assemblies, assuring proper performance upon delivery. Cross Sections To identify and prevent potential points of failure, it is often necessary to check the quality of produced printed circuit board assemblies, parts and components before, during and after manufacture. Plasma Ruggedized Solutions offers microsection analysis to meet your quality assurance requirements. Molded Cross SectionS Cross-section tests are destructive tests, in which we excise a small test coupon from the assembly in question and check multiple attributes to determine product quality. Microsection analysis is applicable at any stage of the manufacturing process, from prototype to final production. Post-assembly sectional analysis may reveal thermally stressed components and can confirm the quality of solder connections. Cross-section analysis of failed components or assemblies probes a number of factors and are often key to determining root-cause. Cross sectional analysis is applicable throughout the industry, and is the second most common manufacturing test method for determining the overall quality of products. Two-Dimensional X-Ray Diffraction This testing method is used to inspect visually inaccessible sections of circuit boards and circuit assemblies. It checks for open and short circuits in your products, and can be used to inspect the construction quality of the inner layer features of your products.
Conformal Coating Conformal coatings are designed to shield finished electronic assemblies from environmental attack, such as humidity, salt fog, thermal shock, fungus, bacteria, dust, particulates and corrosive gases. Coatings insulate exposed interconnects, reduce leakage current and prevent malfunction due to conductive contaminants and foreign objects. AVAILABLE COATINGS Acrylic (AR) Silicone (SR) Polyurethane (UR) Parylene (XY) Epoxy (ER) Selection of coating materials and processes that meet your ruggedization and electrical performance requirements is vital. At Plasma Ruggedized Solutions, we can tailor the application process and coating materials to ensure that your coating meets your specific needs, with first articles through production quantities processed identically and repeatedly. Our engineering, production, quality control and customer service teams work together with you to develop and deploy the best solution for your project. We specialize in delivering in-depth guidance and engineering services to our customers during their product design and development phases; to maximize quality, minimize risk and deliver value. CONFORMAL COATING SELECTION CRITICAL CRITERIA Compatible with all components and materials Applied upon clean and prepared surfaces Reliable and durable assembly protection Appropriate to the environmental envelope Achieve Electrical Performance Requirements Optimize Total Cost of Ownership Plasma Ruggedized Solutions continuously improves and develops new and innovative conformal coating methods and processes to serve you. Our technology advancements improve overall quality in our industry, and provide the foundation for the finest state-of-the-art conformal coating services available. Over 0 years of industry experience and innovation makes Plasma Ruggedized Solutions a recognized leader in conformal coating and other combined ruggedization services. Conformal Coating Protection against Chemicals Mechanical Damage Oxidation Corrosion Dust & Dirt Bacteria Moisture Ultraviolet Fungus Mechanical Wear Electric Arcing EMI / RFI Corrosive Gas Mechanical Abrasion Tin Whiskers Vibration
COATING SELECTION GUIDE Performance Rating Scale is Highest Resistance/Compatibility Acrylic (AR) Polyurethane (UR) Epoxy (ER) Silicone (SR) (XY) C Parylene (XY) (XY) D (XY) N Humidity Resistance Humidity Resistance (Extended Periods) Abrasion Resistance - Mechanical Strength Adhesion - - - - Reworkability 1 1 1 Temperature Resistance Thermal Stability Outgassing 1- Acid Resistance - Alkali Resistance Organic Solvent Resistance 1 Optical Clarity - VOC s -1 - - - Thermal Conductivity - - - Dielectric Constant (1MHz @ C). -.. - 5.. -.0.6 -.0.15.8.65 Electrical Impedance 1 - - - Electrical Insulation - - - Industries ServeD Plasma Ruggedized Solutions offers services which have been successfully deployed across many industries. Our extensive knowledge in the protection of circuit board assemblies allows us to secure circuitry to Federal Information Processing Standards (FIPS). Following are examples of the industries we serve. Electromechanical Systems Telecommunications Reconnaissance Sporting Equipment Aerospace Law Enforcement Alternative Energy Tech-Electronics Automotive Fitness Agriculture Computer Systems Intelligence Medical Embedded Systems Recreational Defense Retail Banking LED Applications
Parylene (Polyparaxylylene) Coating Services Plasma Ruggedized Solutions offers an array of Parylene (polyparaxylylene) coating services. This vacuum deposition process involves heating a solid dimer to a vaporous state, cleavage of the dimer into single molecules that then condense and self-assemble into a polymer layer on the circuit board or target. The molecular gas permeates into complex crevices, protecting interior voids and openings without clogging or blockage a distinct advantage over brush, spray or dip-process conformal coating for key applications in medical, military, electronics, aerospace and automotive industries. Parylene coating delivers a thinner protection layer than other processes, allowing assemblies to be fully protected with a minimal increase in size. Parylene coating offers extremely high chemical resistance and superior electrical properties that make it adaptable for nearly any project. The vapor deposition process allows parylene coatings to be uniform in thickness and completely pinhole free. Plasma Ruggedized Solutions parylene coating services also ensure complete conformity, coating the entire assembly and leaving no areas open to exposure. In medical applications, parylene is ideal because it is the only conformal coating material that can be safely implanted in the human body. Parylene is biocompatible, with a long-tested history and no risk of complications. Parylene is one of few materials approved for FDA Class 6 specifications. Plasma Ruggedized Solutions offers coating services using both parylene C and parylene N, the most common parylene formulations for medical applications. Plasma Ruggedized Solutions utilizes a high efficiency parylene coating system which offers a seamless operator interface designed to optimize product throughput while minimizing process variation. Product quality is paramount. Our systems are of the highest caliber in the industry, with dual redundant safety controls including a power management system, battery backup and power generation capabilities. Technological advancements include a fully integrated vapor-phase adhesionpromotion capability combined with our proprietary process controls, resulting in reduced lead times, increased product reliability and repeatability. Direct operator oversight further ensures the highest quality product. Our process flow is streamlined so that attention to detail and product quality are the priorities while reducing the potential for delay. Cleanroom based parylene coating services further enhance your product quality, yielding results that exceed expectations as we continue to enhance the performance boundaries of parylene coatings. Parylene Process STAGE 1 Vaporization phase Dimer (di-para-xylylene) is heated between 160C - 180C and changed to vapor state. Dimer (di-para-xylylene) STAGE PYROLYSIS phase Dimer molecules are heated at 680C, 0.5 torr. pyrolysis (para-xylene) zone. The high temperature cleaves the dimer into two monomers. Monomer (para-xylylene) STAGE DEPOSITION phase At room temperature the monomer molecules enter the deposition chamber and form the polymer (polypara-xylylene). The coating forms consistently over all available surfaces. Polymer (poly-para-xylylene) 5
Parylene Properties TYPICAL PHYSICAL AND MECHANICAL PROPERTIES Parylene (N) Parylene (C) Parylene (D) Tensile Strength, psi 6,500 10,000 11,000 Tensile Strength, MPa 5 69 76 Yield Strength, psi 6,00 8,000 9,000 Yield Strength, MPa,00,00,800 Elongation at Break, % 0 00 10 Density, g/cm 1.110 1.89 1.18 Coefficient of Friction: Static 0.5 0.9 0. Dynamic 0.5 0.9 0.1 Water Absorption, % ( hr) 0.01 (0.019") 0.06 (0.09") <0.1 Index of Refraction, n D 1.661 1.69 1.669 TYPICAL ELECTRICAL PROPERTIES Dielectic Strength, short time (Volts/mil at 1 mil) 7,000 6,800 5,500 Volume Resistivity, C, 50% RH (Ohm-cm) 1x10 17 6x10 16 x10 16 Surface Resistivity, C, 50% RH (Ohm-cm) 1x10 15 1x10 15 5x10 16 Dielectric Constant: 60 Hz.65.15.8 1,000 Hz.65.10.8 1,000,000 Hz.65.95.80 Dissipation Factor: 60 Hz 0.000 0.00 0.00 1,000 Hz 0.000 0.019 0.00 1,000,000 Hz 0.0006 0.01 0.00 TYPICAL ELECTRICAL PROPERTIES Gas Permeability* Nitrogen 7.7 0.95.5 Oxygen 0 7.1 Carbon Dioxide 1 7.7 1 Hydrogen Sulfide 795 1 1.5 Sulphur Dioxide 1,890 11.75 Chlorine 7 0.5 0.55 Moisture Vapor Transmission** 1.50 0.1 0.5 Typical Thermal Properties 7.7 0.95.5 Melting Temperature ( C) 10 90 80 Linear Coefficient of Expansion (10-5 / C) 6.9.5.8 Thermal Conductivity, W/mK 0.1 0.08 - NOTES * cm-mil/100 in-hr-atm ( C) ** g-mil/100 in-hr, 7 C, 90% RH 1mil - 1/1000 in. = 5. microns 6
Potting/Encapsulation Compared to conformal coating, potting or encapsulation delivers superior protection for your electronic assemblies from harsh environments and tin whisker formation. In addition to preserving long term functionality, potting or encapsulation with specialized materials addresses intellectual property protection and the security concerns of tampering, product integrity, counterfeiting and reverse engineering. Potting/encapsulation and epoxy coatings also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by reducing leakage from high voltage circuits, and protecting against voltage arcs and short circuits by preventing the formation of tin whiskers. We offer a variety of available materials for your electronic encapsulation and potting requirements. We offer epoxy, silicone, urethane, and some acrylic materials. Epoxy coatings are ideal for harsh environments and physical security protection, and are tailored to the specific needs of your application, including high voltage or thermal concerns. Silicone potting and silicone encapsulation offer superior protection against moisture exposure, and are a more forgiving material, protecting assemblies from stress by allowing for movement. Urethane coatings are also useful in extreme environmental conditions, are not as rigid, and protect assemblies with even lower levels of physical stress upon individual components. Plasma Ruggedized Solutions employs a number 7 of unique processes for electronic encapsulation and potting, with many of our techniques becoming standard throughout the industry. Our fence and fill process creates a containment system directly on the circuit board assembly being coated, to enclose only specific areas of the PCB when partial coverage is desired. This provides a high-quality, low-cost solution for our customers. Plasma Ruggedized Solutions continually advances the state of the art of potting and encapsulation technologies and techniques through our continuous engineering and implementation of new and innovative methods, giving you the finest service available. We design and create our own molding systems and fixtures in-house, to offer flexibility and adaptability to your requirements. Since potting/encapsulation can enclose an entire electronic assembly, the process can be employed to make your assembly FIPS compliant. Electronic encapsulation and potting will protect the assembly from unauthorized entry, modification and reverse engineering. Any attempt to remove the protective material will destroy the circuit in the process. Plasma Ruggedized Solutions is one of a few companies that offer FIPS services for a variety of applications. Our continuing innovations help us stay at the forefront of this expanding industry.
Ball Grid Array (BGA) Underfill Process Plasma Ruggedized Solutions can underfill any Ball Grid Array (BGA) component, using a variety of encapsulant materials. Our BGA underfill service protects sensitive electronic assemblies against damage from thermal stress, drops and other impact hazards. Cell phones, digital cameras, and other equipment that may frequently be dropped, knocked around or otherwise unintentionally subjected to severe shock and vibration, benefit greatly from this process. The underfill procedure produces a strong mechanical bond between the BGA substrate and the circuit board, fully encapsulating the soldered balls from physical and thermal stress. The underfill material can also enhance thermal conductivity between the BGA device and the circuit board. In some cases, such enhancement allows the PCB to serve as the primary heat sink for the underfilled component. We offer both manual and automated underfill processes to give our customers the best possible result. We will help to determine which components of your electronic assembly are potentially sensitive and need underfill. We work closely with our material suppliers to deliver the best available options, and help select the ideal materials for your particular requirements. Our underfill application and curing processes are easily adaptable to the needs of your project, and can be adjusted and tuned to produce precise and repeatable results on even the most challenging assemblies. Many underfill materials are re-workable, so it is possible to remove and replace BGA devices for repair or upgrade activities. The ultimate goal of our tuned BGA underfill processes is to control the stresses on your assemblies, optimize required processing time and manufacturing costs, and deliver value. Plasma Ruggedized Solutions underfill processes are also applicable to a number of package styles in addition to BGA components. We offer underfill services for LGA (land grid array) devices, to account for packaging density and chip scale considerations; CSPs (chip scale packages) to prevent damage from operational and environmental thermal stress, thermal solution installation and removal, shock and vibration; as well as underfill for chip-on-chip devices, quad flat packs, no lead chip carriers, and many other packages on the market today or in the future. 8
Form-in-Place Gasket Solutions Form-in-place gaskets are designed to take the place of conventional o-rings and gaskets. The form-in-place gasket material is molded directly onto the housing, circuit board, etc, becoming an integral part of the assembly itself. This eliminates the risk of gasket loss or shift, and any possibility of non-conformity due to environmental conditions. Plasma Ruggedized Solutions offers in-house form-in-place gasket services, with a variety of materials available, to meet or exceed the precise requirements of your application. Today s complex electronic devices are highly susceptible to all manner of environmental contaminants. Every industry in which these devices are used, be it military, medical, aerospace, or other, presents its own unique set of potential hazards. Plasma Ruggedized Solutions form-in-place gasket services are designed to offer better protection for PCBs and other electronic assemblies against contaminants and EMI/RFI interference. We perform a number of unique and highly adaptable form-in-place gasket processes to reduce your overall manufacturing costs as well as the potential for product failure. Nearly all of our form-in-place gasket solutions are applied by automated equipment, in order to repeatedly match the precise requirements of your assemblies. From small quantities to full production runs, Plasma Ruggedized Solutions form-in-place gasket processes will meet or exceed your applications unique specifications. Our engineered gasket services allows you to minimize requirements for additional hardware, saving you time, reduce inventory, and control design and material costs. Plasma Ruggedized Solutions will help select the right material for your project. Our engineering team can address design concerns and optimize your assemblies for form-in-place gasket solutions. We ll aid you in each step of the process to ensure that you can deliver the highest quality product for the lowest reasonable cost. Plasma Ruggedized Solutions remarkably adaptable form-in-place gasket processes and service can help you take a good product into the realm of great products. 9
Material Development DESCRIPTION Plasma Ruggedized Solutions is engineering and developing new materials, in-house, for our conformal coating, potting, encapsulating, and other processes. While certain materials we utilize are well suited to the requirements of our ruggedization services, other materials may require a degree of compromise in performance or availability. Some solutions are produced perfectly with standard materials, where other solutions require more specialization. Our materials development processes give us the capability to create materials that match your criteria. By offering tailor-made coating materials, Plasma Ruggedized Solutions can deliver better quality ruggedized products at comparable prices. Our custom materials give you a better product, with improved reliability, longer life expectancy, and lower total cost of ownership. These qualities will give you a distinct advantage over the competition better products lead to sustained sales and growing brand loyalty. Plasma Ruggedized Solutions American-made potting material is designed to outperform its standard material peers. This epoxy resin casting system yields a finely finished, more reliable product. Plasma Ruggedized Solutions is currently producing a superior potting and encapsulation material for use with products that must meet Federal Information Processing Standards (FIPS) requirements, function under extreme thermal, environmental, mechanical and electrical environments, while satisfying the physical security needs of such specialized applications. The KRYPTOS product line is highly adaptable of which KRYPTOS-17 is a filled, RoHS compliant, medium viscosity, self-extinguishing flame retardant, low stress, thermally conductive epoxy casting resin system. UL 9V0 rated, it passes the vertical burn rating criteria at thicknesses of both mm and 6mm. THIS SYSTEM MEETS THE PHYSICAL SECURTIY REQUIREMENTS OF FIPS 10-, AND FIPS 10- FOR AN ENCAPSULATING MATERIAL. THE INHERENT NATURE OF THE MATERIAL MITIGATES TIN-WHISKER FORMATION. It provides superior resistance to water, salt spray, inorganic acids and bases and most organic solvents. The material meets UL 76 specifications and is intended for use in outdoor environments. Curing at room temperature to a tough, semi-rigid polymer, it also exhibits good wetting and adhesion to most surfaces. Free flowing during application, KRYPTOS-17 penetrates voids and has good air release properties and contains both a flame retardants and thermally conductive fillers, maintains excellent electrical properties and is resistant to hard settling. Depending on poured mass and room-ambient temperature, cure-to-handle is achieved in hours, developing to a fully cured state in 6 to 7 hours in the same environment. Thermal acceleration is possible after reaching the gelled state in 8 to 10 hours at a nominal 5 C ambient temperature. For most castings of less than 100 grams, the cured state is achieved in hours at 60 C, and in as little as 60 minutes at 100 C. Contact our Sales Team at (USA) 800-99-757 for KRYPTOS technical data, MSDS information and your project or material quotation today! 10
Plasma Ruggedized Solutions TOLL FREE: (800) 99-757 Plasma Ruggedized Solutions is the customer centric operation for conformal coating, potting and encapsulation, plasma etchback/desmear, testing and laboratory services. Our Northern and Southern California divisions provide rapid response, technical excellence, and a problem-solving, can-do, professional staff. From concept to installation, we are here to help. Plasma Ruggedized Solutions leads the way, delivering quality results through innovative solutions, expertise and cost-saving processes. At Plasma our Customers do not pay for a service: they pay for a result San Jose Division Huntington Beach Division 8 Ringwood Avenue, Suite A San Jose, CA 9511 T (08) 95-805 F (08) 95-801 W www.plasmarugged.com 55 Business Drive Huntington Beach, CA 969 T (71) 89-606 F (71) 89-808 E sales@plasmarugged.com