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Transcription:

Finish Specification 100-337-00 Owner Joe Otto Approvals: Department Approved. Date Engineering Joe Otto 3/10/17 Manufacturing Chad Loughman 3/10/17 Quality Drew Ware 3/10/17 Material Control Brandon Bailey 3/10/17 Purchasing Karen Dusenbury 3/10/17 1 of 11

Change History Rev Description By Date - Initial Release DHR 10/02/81 A ECO #1732 JCO 01/14/91 B Added 08 JCO 07/02/93 C Added 09 JCO 07/20/93 D Redrawn and Revised JCO 09/20/97 E Redrawn and Revised JCO 01/12/98 F Redrawn and Revised JCO 07/15/98 G ECO 1965 JCO 09/25/98 H ECO 2277 JCO 01/26/05 I Paragraph 3.12.1 was: Electroless nickel plate per SAE-AMS-C-26074, JCO 08/16/06 0.0002 minimum thickness. J See ECN JCO 09/07/07 K See redline document JCO 02/13/08 L Added -14. See redline document. JCO 01/21/09 M Added -15. See outline document. JCO 08/03/09 N See redline document. JCO 01/14/11 P Converted from drawing to process See redline document. JCO 06/27/12 Q Paragraphs 3.15.1 and 3.15.2, step 3: 0.001 was 0.0001 JCO 06/23/14 R Added paragraph 3.16 JCO 8/20/14 S See redline document JCO 3/10/17 2 of 11

1. Scope This document details the plating specifications used by Captor Corporation. 2. Reference Documents The following specifications and standards form a part of this specification to the extent specified herein. Specifications, Military MIL-DTL-5541 Chemical Conversion Coatings on Aluminum and Aluminum Alloys. Standards, Military MIL-STD-202 Test Methods for electronic and electrical component parts. Standards, ASTM ASTM B253 Standard Guide for Preparation of Aluminum Alloy for Electroplating ASTM B 339 Tin, Pig, Grade A ASTM B 545 Standard Specification for Electrodeposited Coating of Tin ASTM B 579 Standard Specification for Electrodeposited coatings of Tin-Lead Alloy Solder Paste ASTM B700 Standard Specification for Electrodeposited Coatings of Silver for Engineering use Standards, SAE AMS-QQ-290 Nickel Plating (Electrodeposited) AMS 2404 Plating, Electroless Nickel AMS 2418 Plating, Copper AMS-C-26074 Coatings, Electroless Nickel, Requirements For AMS-P-81728 Plating, Tin-Lead (Electrodeposited) 3 of 11

3. General Requirements Table 1 provides a listing of the standard plating used by Captor Corporation. 3.1. 100-337-01 CHEMICAL CONVERSION COATING: Aluminum. 1. Chemical conversion coating per MIL-DTL-5541, class 3, Type 1 (Color yellow/gold). 3.2. 100-337-02, ELECTRO TIN REFLOWED (Threaded and Bulk parts): Brass, Copper, Steel. 1. Copper flash per AMS 2418, 0.000020" minimum thickness. 2. Electro tin plate per ASTM B 545, except must contain 3% lead minimum, 0.0001" to 0.0003" thickness. 3. Reflow (fuse) electro tin plating. 5. Parts must meet thread class requirements and dimensional requirements after plating. 3.3. 100-337-03, HOT TIN DIP: Brass, Copper, Steel. 1. Hot tin dip per ASTM B 339, except must contain 3% lead minimum, 0.0003" minimum thickness. 2. Solderability to be per paragraph 4.2 herein. 3.4. 100-337-04, ELECTRO TIN (Threaded parts): Brass, Copper, Steel. 1. Copper flash per AMS 2418, 0.000020" minimum thickness. 2. Electro tin plate per ASTM B 545, except must contain 3% lead minimum, 0.0001" to 0.0003" thickness. 3. Solderability to be per paragraph 4.2 herein. 4. Parts must meet thread class requirements and dimensional requirements after plating. 4 of 11

3.5. 100-337-05, ELECTRO TIN: Stainless Steel. 1. Nickel strike per AMS-QQ-N-290, 0.000020" minimum thickness. 3. Electro tin plate per ASTM B 545, except must contain 3% lead minimum, 0.0003" minimum thickness. 3.6. 100-337-06, ELECTRO TIN: Brass, Copper, Steel. 3.6.1. 100-337-06I, ELECTRO TIN: Brass, Copper, Steel. 1. Copper plate per AMS 2418, 0.0001" minimum thickness. 2. Electro tin plate per ASTM B 545, except must contain 3% lead minimum, 0.0003" minimum thickness. 3. Solderability to be per paragraph 4.2 herein. 3.6.2. 100-337-06II, ELECTRO TIN REFLOWED: Brass, Copper, Steel. 1. Copper plate per AMS 2418, 0.0001" minimum thickness. 2. Electro tin plate per ASTM B 545, except must contain 3% lead minimum, 0.0001 to 0.0003" thickness. 3. Reflow (fuse) electro tin plating. 3.7. 100-337-07, ELECTRO TIN: Aluminum. 1. Electroless nickel flash per AMS-C-26074, 0.0001" nominal thickness. 3. Electro tin plate per ASTM B 545, except must contain 3% lead minimum, 0.0003" minimum thickness. 5 of 11

3.8. 100-337-08, ELECTRO TIN-LEAD: Brass, Copper, Steel. 3.8.1. 100-337-08I, ELECTRO TIN-LEAD: Brass, Copper, Steel. 1. Copper plate per AMS 2418, 0.0001" minimum thickness. 2. Electro tin-lead plate per AMS-P-81728, 0.0001" to 0.0003" thickness. 3. Solderability to be per paragraph 4.2 herein. 3.8.2. 100-337-08II, ELECTRO TIN-LEAD REFLOWED: Brass, Copper, Steel. 1. Copper plate per AMS 2418, 0.0001" minimum thickness. 2. Electro tin-lead plate per AMS-P-81728, 0.0001" to 0.0003" thickness. 3. Reflow (fuse) electro tin-lead plating. 3.9. 100-337-09, ELECTRO TIN-LEAD: Aluminum. 3.9.1. 100-337-09I, ELECTRO TIN-LEAD: Aluminum. 1. Electroless nickel flash per AMS-C-26074, 0.0001" nominal thickness. 3. Electro tin-lead plate per AMS-P-81728, 0.0001" to 0.0003" thickness. 3.9.2. 100-337-09II, ELECTRO TIN-LEAD REFLOWED: Aluminum. 1. Electroless nickel flash per AMS-C-26074, 0.0001" nominal thickness. 3. Electro tin-lead plate per AMS-P-81728, 0.0001" to 0.0003" thickness. 4. Reflow (fuse) electro tin-lead plating. 5. Solderability to be per paragraph 4.2 herein. 6 of 11

3.9.3. 100-337-09IIA, ELECTRO TIN-LEAD REFLOWED: Aluminum. 1. Electroless nickel flash per AMS-C-26074, class 4, 0.0001" nominal thickness. 3. Electro tin-lead plate per AMS-P-81728, 0.0001" to 0.0003" thickness. 4. Reflow (fuse) electro tin-lead plating. 5. Solderability to be per paragraph 4.2 herein. 3.10. 100-337-10, SEE DETAILED DRAWING. This procedure is for special plating requirements, refer to the specified detail drawing. 3.11. 100-337-11 (REMOVED). 3.12. 100-337-12, ELECTROLESS NICKEL, MID PHOSPHORUS: Aluminum, Brass, Steel. 1. Electroless nickel plate per AMS-C-26074, 0.0002" to 0.0004" thickness. 2. Must contain 6% to 9% phosphorous by weight. 3. Solderability to be per paragraph 4.2 herein. 3.13. 100-337-13, ELECTRO TIN-LEAD: Stainless Steel. 3.13.1. 100-337-13I, ELECTRO TIN-LEAD: Stainless Steel. 1. Nickel strike per AMS-QQ-290, 0.000020" minimum thickness. 3. Electro tin-lead plate per AMS-P-81728, 0.0001" to 0.0003" thickness. 7 of 11

3.13.2. 100-337-13II, ELECTRO TIN-LEAD REFLOWED: Stainless Steel. 1. Nickel strike per AMS-QQ-290, 0.000050" nominal thickness. 3. Electro tin-lead plate per AMS-P-81728, 0.0001" to 0.0003" thickness. 4. Reflow (fuse) electro tin-lead plating. 5. Solderability to be per paragraph 4.2 herein. 3.14. 100-337-14, ELECTRODEPOSITED SILVER: Aluminum. 1. Electroless nickel strike per AMS-C-26074, 0.0001 to 0.0003" thickness. 2. Silver plate per ASTM B700, Type III, Grade D, Class S, 0.0001 to 0.0003" thickness. 3. Solderability to be per paragraph 4.2 herein. 3.15. 100-337-15, ELECTRO TIN-LEAD (SOLDER): Aluminum. 3.15.1. 100-337-15I, ELECTRO TIN-LEAD, MATTE (SOLDER): Aluminum. 1. Zincate and copper strike per ASTM B253. (Preparation for electroplating) 3. Electroless nickel plate per AMS 2404 Class 4, 0.001" minimum thickness. 4. Electro tin-lead plate per ASTM B579, 0.0001" to 0.0003" thickness. 5. Solderability to be per paragraph 4.2 herein. 8 of 11

3.15.2. 100-337-15II, ELECTRO TIN-LEAD REFLOWED (SOLDER): Aluminum. 1. Zincate and copper strike per ASTM B253. (Preparation for electroplating) 3. Electroless nickel plate per AMS 2404 Class 4, 0.001" minimum thickness. 4. Electro tin-lead plate per ASTM B579, 0.0001" to 0.0003" thickness. 5. Reflow (fuse) electro tin-lead plating. 6. Solderability to be per paragraph 4.2 herein. 3.16. 100-337-16, ELECTRO TIN-LEAD: Steel, Stainless Steel. 1. Nickel strike per AMS-QQ-N-290, 0.0001 to 0.0003 thickness. 2. Electroless nickel plate per AMS-C-26074 Grade B, 0.001 to 0.0015 thickness. 3. Copper plate per AMS 2418 Class 3, 0.0002 to 0.0005 thickness. 4. Tin-lead plate per AMS-P-81728, 0.0002 to 0.0005 thickness. 5. Within 48 hours of plating completion, bake plated parts at 120 F to 150 F for a minimum of 12 hours. 6. Remove all plating residues. 7. Solderability to be per paragraph 4.2 herein. 4. Quality Assurance Provisions. 4.1. Appearance Unless otherwise specified, the finish shall have a uniform texture and appearance and shall be free of blisters, pinholes, and other defects that may affect the protective value of the coating. 9 of 11

4.2. Solderability When soldering operations will be applied to the finish and the plating specification contains a solderability requirement, the solderability requirement of the specification must be meet. If the plating specification does not contain a solderability requirement, the finish shall be capable of meeting the solderability requirements of MIL-STD-202, Method 208, less steam aging. 5. Packaging 5.1. Shipment to finish facility The items shall be packaged in a manner to prevent damage to the item during routine handling and transport. 5.2. Return shipment from finish facility 6. Notes The items shall be packaged in a manner to prevent damage to the item or the finish during routine handling and transport. 6.1. Order of precedence. In the event of conflicting finish specifications, the following order of precedence shall apply. 1. The finish listed in the computer Bill of Material. 2. The finish listed on the detailed drawing. 3. Industry standards. 10 of 11

6.2. Finish Specifications. Table 1 is a listing of standard finishes for the specific base materials. Table 1, Standard Finishes Dash # Description Base Material -01 Chemical Conversion Coat Aluminum -02 Electro Tin, Reflowed (Threaded and Bulk Parts) Brass, Copper, Steel -03 Hot Tin Dip Brass Copper Steel -04 Electro Tin (Threaded parts) Brass, Copper, Steel -05 Electro Tin Stainless Steel -06 Electro Tin Brass, Copper, Steel -06I Electro Tin, Matte Brass, Copper, Steel -06II Electro Tin, Reflowed Brass, Copper, Steel -07 Electro Tin Aluminum -08 Electro Tin-Lead Brass, Copper, Steel -08I Electro Tin-Lead, Matte Brass, Copper, Steel -08II Electro Tin-Lead, Reflowed Brass, Copper, Steel -09 Electro Tin-Lead Aluminum -09I Electro Tin-Lead, Matte Aluminum -09II Electro Tin-Lead, Reflowed Aluminum -09IIA Electro Tin-Lead, Reflowed Aluminum -10 See detailed drawing Any -11 (Removed) (Removed) -12 Electroless Nickel Aluminum, Brass, Steel -13 Electro Tin-Lead Stainless Steel -13I Electro Tin-Lead Stainless Steel -14 Electrodeposited Silver Aluminum -15 Electro Tin-Lead (Solder) Aluminum -15I Electro Tin-Lead, Matte (Solder) Aluminum -15II Electro Tin-Lead, Reflowed (Solder) Aluminum -16 Electro Tin-Lead Steel, Stainless Steel 11 of 11