Embossed Tape lapplication Reel size (mm) 180 Switching Type Tape width (mm) 8 Basic ordering unit (pcs) 8000

Similar documents
Embossed Tape Reel size (mm) 180 lapplication Type Tape width (mm) 8 Switching Basic ordering unit (pcs) 3000

RK7002BM. V DSS 60V SOT-23 R DS(on) (Max.) 2.4Ω SST3 I D ±250mA P D 350mW. Nch 60V 250mA Small Signal MOSFET Datasheet.

EMD59. Datasheet. Complex Digital Transistors (Bias Resistor Built-in Transistors)

SST2222A V CEO I C. 40V 600mA. Datasheet. NPN Medium Power Transistor (Switching) lfeatures 1)BV CEO >40V(I C =10mA) 2)Complements the SST2907A

Embossed Tape Reel size (mm) 180 lapplication Type Tape width (mm) 8 DC/DC converters Basic ordering unit (pcs) 3000

EMZ51. Power management (dual transistors) Datasheet. Parameter Value SOT-563 V CEO 20V SC-107C I C 200mA. Parameter Value V CEO -20V I C.

2SD1980 V CEO 100V I C 2A R 1 R kΩ 300Ω. Datasheet. Power Transistor (100V, 2A)

DTC143XCA. Datasheet. NPN 100mA 50V Digital Transistor (Bias Resistor Built-in Transistor)

New Designs. Not Recommended for 2SCR293P V CEO 30V I C. Datasheet. Middle Power Transistors (30V / 1A) lfeatures. linner circuit

RN142S PIN Diodes Outline V R 60 V SOD-523 EMD2 SC-79

UDZVFH18B Zener Diode (AEC-Q101 qualified) Outline

CDZV3.3B Zener Diode. Data sheet. Outline. P D 100 mw. Feature High reliability Small mold type. Inner Circuit. Application

New Designs. Not Recommended for. GDZ5.6 Zener Diode. Data sheet. Outline. P D 100 mw. Inner Circuit. Feature High reliability Super small mold type

RB060LAM-40 Schottky Barrier Diode

Schottky Barrier Diode RBQ10BM65A

EMA4 / UMA4N / FMA4A. Datasheet. Emitter common(dual digital transistor) Parameter DTr1 and DTr2 SOT-553 SOT-353 V CEO -50V I C

New Designs. Not Recommended for DTC143ZKA FRA. AEC-Q101 Qualified. NPN 100mA 50V Digital Transistors (Bias Resistor Built-in Transistors) Datasheet

New Designs. Not Recommended for. ESD Protection Device (TVS) RSA12M. RSA12M Diodes 1/2

RESD1CANFH Transient Voltage Suppressor (AEC-Q101 qualified) Data sheet

2.6± ±0.1. Taping specifications (Unit : mm) 4.0± ±0.05 φ1.55± ± ±0.1 φ1.0± Duty 0.5

Schottky Barrier Diode RBQ30TB45BHZ

BZX84B5V1L Zener Diode

SOT-723 SC-105AA. linner circuit. Reel size (mm) Taping code

DTC143Z series NPN 100mA 50V Digital Transistors (Bias Resistor Built-in Transistors)

Super Fast Recovery Diode RF601BM2D

MMBZ18VAL. Data sheet. Transient Voltage suppressor. Outline. P pp

Transient Voltage suppressor (AEC-Q101 qualified) Outline

BZX84C12VL. Data sheet. Zener Diode Outline. Inner Circuit. Feature High reliability Small mold type. Application Voltage regulation

Sulfur tolerant chip resistors

New Designs. Not Recommended for. KDZ6.8B Zener Diode Data sheet Outline P D 1000 mw PMDU SOD-123 SC-109B

G M R H T B F A

Schottky Barrier Diode RBR5L30B

High power chip resistors < Wide terminal type > LTR series

Anti-surge chip resistors

New Designs. Not Recommended for. ESD Protection diode. 1/ Rev.A RSB6.8CS. Land size figure (Unit : mm)

Ultra-low ohmic jumper chip resistors PMR series - jumper type -

Ultra-low ohmic chip resistors for current detection

2SD2656FRA V CEO I C 30V 1A. Datasheet. NPN 1A 30V Low Frequency Amplifier Transistors. Outline

1.25± ± ±0.05. Taping specifications (Unit : mm) 4.0± ± ± ±0.1 φf1.05. V F

Low ohmic thick film chip resistors

Bi direction ESD Protection Diode

Low Capacitance Protection Device

Data Sheet RSB36F2. 2/ Rev.A ROHM Co., Ltd. All rights reserved. apply voltage. ZENER CURRENT:Iz(mA) 1

UMZ6.8N Diodes. 1.3 (Anode common twin type) 2.0± ± 0.1. 各リードとも Each lead has same dimension 同寸法 0.15±0.05 (3) 1.25± ±0.

New Designs. Not Recommended for. ESD Protection diode. Data Sheet STZC6.8N. 1/ Rev.A

Outline. Reel size (mm) Tape width (mm) Taping TL ,000 B1644

2.0± ± 0.1 各リードとも 同寸法 (5) (4) 1.25± ± ± ± Taping dimensions (Unit : mm) 4.0± ± ±0.

New Designs. Not Recommended for. Schottky barrier diode RB162M-40. Data Sheet C C. 1/ Rev.B

Schottky Barrier Diode RB080L-30

0.8± ± ± ±0.05. ROHM : EMD2 JEDEC : SOD-523 JEITA : SC-79 dot(year week factory) Taping specifications (Unit : mm)

Zener Diode KDZV series

2.9±0.2 各リードとも (3) (2) (1) 0.8± ±0.2. ROHM : SMD3 JEDEC :S0T-346 JEITA : SC-59 week code

1.6± ± ± ±0.1 JEDEC :SOD-123 Manufacture Date ROHM : PMDU. Taping dimensions (Unit : mm) 4.0± ±0.05 φ 1.55±0.

Super Fast Recovery Diode

4V Drive Pch MOSFET RSL020P03FRA RSL020P03FRA. Transistors. AEC-Q101 Qualified. Rev.B 1/4. Structure Silicon P-channel MOSFET. Dimensions (Unit : mm)

RF1501 NS3S. ROHM : LPDS JEITA : TO263S 1 Manufacture Year, Week and Day. Taping dimensions (Unit : mm) 350 V Reverse voltage. V R Direct voltage

4V Drive Nch MOS FET RSR025N03FRA RSR025N03FRA. Transistors. AEC-Q101 Qualified. Rev.C 1/3. External dimensions (Unit : mm)

1.25± ± ± ±0.05. ROHM : UMD2 JEDEC : S0D-323 JEITA : SC-90/A dot (year week factory) EX. UDZS3.6B

1.5V Drive Nch MOSFET

Ta=150 C Ta=125 C. Ta=75 C. Ta=-25 C REVERSE VOLTAGE:V R (V) V R -I R CHARACTERISTICS. I F =10A n=30pcs. AVE:29.

Chip tantalum capacitors (Bottom surface electrode type : Large capacitance) Anode mark (Unit : mm) Dimensions L 1.6 ± 0.1 W ± 0.

Schottky barrier diode

0.1± ± ± ± ± ±0.1 ROHM : PMDU. JEDEC :SOD-123 Manufacture Date. Taping specifications (Unit : mm)

1.6± ± ± ±0.1 ROHM : PMDU. JEDEC :SOD-123 Manufacture Date. Taping specifications (Unit : mm) 4.0± ±0.05 φ1.55±0.

Dimensions (Unit : mm) 2.6± ± ± ±0.2. ROHM : PMDS JEDEC : SOD Manufacture date. Taping dimensions (Unit : mm)

4V Drive Nch+Nch MOSFET

< Specifications (Precautions and Prohibitions) >

SPR-54 Series. Data Sheet. Outline. Features. Viewing angle 2θ 1/2 : 45. Recommended Solder Pattern. Dimensions. Specifications. 1/ Rev.

SML-S13RT. Datasheet. Outline. Features. Surface mount Lens LEDs. Narrow directivity and high brightness. Availability of reverse mounting

TOSHIBA LED Lamp TLCBD1060(T18) Storage Temperature T stg ( C) TLCBD to to 100. Power Dissipation P D (mw)

TO-2013BC-MYE. Surface Mount Device LED. Features. Dimensions MOLDING BODY(LENS) 0.40 PCB 0.40 CATHODE MARK SOLDERING TERMINAL

V D Y. Recommended Solder Pattern. Tolerance : ±0.2 (unit : mm) Absolute Maximum Ratings (Ta=25ºC) Reverse Operating Temp. Storage Temp.

V D Y. Recommended Solder Pattern. Tolerance : ±0.2 (unit : mm) Absolute Maximum Ratings (Ta=25ºC) Reverse Operating Temp. Storage Temp.

Package Information : HRP7

Diode JEDEC code SOD-123FL Package PMDU TR

SYGT/S530-E2 LAMP. Features. Description. Applications. Device Selection Guide. Choice of various viewing angles

Package Information : WSOF5

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor) RN2110, RN2111

2.9 (3) (2) (1) 0.4 Φ1.1± ±0.08. Note) Feed holes might be cover with the adhesive tape, but nothing will affect for using by that.

7343M/BAC3-ATVA/C5. Lamp

Sidelooker Infrared LED IR928-6C-F

SML-P11 Series PICOLED TM -eco

D Y M. Recommended Solder Pattern. Tolerance : ±0.1 (unit : mm)

RF Transformer (Stabilized Matching Device) SMST18 series

Through Hole Lamp Product Data Sheet LTL-307G Spec No.: DS Effective Date: 05/28/2008 LITE-ON DCC RELEASE

Recommended Land Pattern: [mm]

Topview 5630 Red SMD LED

Recommended Solder Pattern. Operating Temp. Storage Temp. Typ. I F Max. V R Min.*2 Typ. Max.*2 I F Min. Typ. I F Green

SMD Technical Data Sheet High Power Green LED LH5070GCZ1.LW01

Recommended Solder Pattern R G B. Operating Temp. Storage Temp. Typ. I F Max. V R Min.*2 Typ. Max.*2 I F Min. Typ.

Through Hole Lamp Product Data Sheet LTL2P3TBK5 Spec No.: DS Effective Date: 05/11/2012 LITE-ON DCC RELEASE

Tolerance : ±0.1 (unit : mm)

SML-S13RT. Data Sheet. 3216(1206) size mm (t=1.85mm)

B Recommended land pattern: [mm] SSt SSt SSt. HOe. SSt SSt SSt. HOe DATE CHECKED

Through Hole Lamp Product Data Sheet LTL307GA6DP Spec No.: DS Effective Date: 08/27/2014 LITE-ON DCC RELEASE

Through Hole Lamp Product Data Sheet LTL-1BEWJ Spec No.: DS Effective Date: 07/10/2012 LITE-ON DCC RELEASE

No. STSE-CM6126B <Cat.No > SPECIFICATIONS FOR NICHIA CHIP TYPE FULL COLOR LED MODEL : NSSM016DT NICHIA CORPORATION -0-

Transcription:

EM6K6 Nch+Nch 20V 300mA Small Signal MOSFET Datasheet loutline V DSS 20V SOT-563 R DS(on) (Max.) 1.0Ω SC-107C I D ±300mA EMT6 P D 150mW lfeatures 1) The MOSFET elements are independent, eliminating mutual interference. 2) Mounting cost and area can be cut in half. 3) Low on-resistance. 4) Low voltage drive (1.8V) makes this device ideal for portable equipment. 5) Pb-free lead plating ; RoHS compliant. linner circuit lpackaging specifications Packing Embossed Tape lapplication Reel size (mm) 180 Switching Type Tape width (mm) 8 Basic ordering unit (pcs) 8000 Taping code Marking labsolute maximum ratings (T a = 25 C,unless otherwise specified) <Tr1 and Tr2> T2R Parameter Symbol Value Unit Drain - Source voltage V DSS 20 V Continuous drain current I D ±300 ma Pulsed drain current I DP *1 ±600 ma Gate - Source voltage V GSS ±8 V Power dissipation total P D *2 150 element 120 Junction temperature T j 150 Operating junction and storage temperature range T stg -55 to +150 K06 mw 2016 ROHM Co., Ltd. All rights reserved. 1/10 20160630 - Rev.002

lthermal resistance Parameter Thermal resistance, junction - ambient total Values Symbol Min. Typ. Max. R thja *2 - - 833 element - - 1042 Unit /W lelectrical characteristics (T a = 25 C) <Tr1 and Tr2> Parameter Symbol Conditions Values Min. Typ. Max. Unit Drain - Source breakdown voltage Breakdown voltage temperature coefficient Zero gate voltage drain current Gate - Source leakage current Gate threshold voltage Gate threshold voltage temperature coefficient Static drain - source on - state resistance Forward Transfer Admittance V (BR)DSS V GS = 0V, I D = 1mA 20 - - V ΔV (BR)DSS I D = 1mA ΔT j referenced to 25-29.0 - mv/ I DSS V DS = 20V, V GS = 0V - - 1 μa I GSS V DS = 0V, V GS = ±8V - - ±10 μa V GS(th) V DS = 10V, I D = 1mA 0.3-1.0 V ΔV GS(th) I D = 1mA ΔT j referenced to 25 - -1.6 - mv/ V GS = 4.0V, I D = 300mA - 0.7 1.0 R DS(on) *3 V GS = 2.5V, I D = 300mA - 0.8 1.2 Ω V GS = 1.8V, I D = 300mA - 1.0 1.4 Y fs *3 V DS = 10V, I D = 300mA 400 - - ms 2016 ROHM Co., Ltd. All rights reserved. 2/10 20160630 - Rev.002

lelectrical characteristics (T a = 25 C) <Tr1 and Tr2> Parameter Symbol Conditions Values Min. Typ. Max. Unit Input capacitance C iss V GS = 0V - 25 - Output capacitance C oss V DS = 10V - 10 - Reverse transfer capacitance C rss f = 1MHz - 10 - Turn - on delay time t *3 d(on) V DD 10V,V GS = 4.0V - 5 - Rise time t *3 r I D = 150mA - 10 - Turn - off delay time t *3 d(off) R L = 67Ω - 15 - Fall time t *3 f R G = 10Ω - 10 - pf ns lbody diode electrical characteristics (Source-Drain) (T a = 25 C) <Tr1 and Tr2> Parameter Symbol Conditions Values Min. Typ. Max. Unit Forward voltage V SD *3 V GS = 0V, I S = 100mA - - 1.2 V *1 Pw 10μs, Duty cycle 1% *2 Each terminal mounted on a reference footprint. *3 Pulsed 2016 ROHM Co., Ltd. All rights reserved. 3/10 20160630 - Rev.002

lelectrical characteristic curves Fig.1 Power Dissipation Derating Curve Fig.2 Drain Current Derating Curve Fig.3 Typical Output Characteristics(I) Fig.4 Typical Output Characteristics(II) 2016 ROHM Co., Ltd. All rights reserved. 4/10 20160630 - Rev.002

lelectrical characteristic curves Fig.5 Breakdown Voltage vs. Junction Temperature Fig.6 Typical Transfer Characteristics Fig.7 Gate Threshold Voltage vs. Junction Temperature Fig.8 Forward Transfer Admittance vs. Drain Current 2016 ROHM Co., Ltd. All rights reserved. 5/10 20160630 - Rev.002

lelectrical characteristic curves Fig.9 Static Drain - Source On - State Resistance vs. Gate Source Voltage Fig.10 Static Drain - Source On - State Resistance vs. Junction Temperature Fig.11 Static Drain - Source On - State Resistance vs. Drain Current (I) 2016 ROHM Co., Ltd. All rights reserved. 6/10 20160630 - Rev.002

lelectrical characteristic curves Fig.12 Static Drain - Source On - State Resistance vs. Drain Current (li) Fig.13 Static Drain - Source On - State Resistance vs. Drain Current (Ill) Fig.14 Static Drain - Source On - State Resistance vs. Drain Current (lv) 2016 ROHM Co., Ltd. All rights reserved. 7/10 20160630 - Rev.002

lelectrical characteristic curves Fig.15 Typical Capacitance vs. Drain - Source Voltage Fig.16 Switching Characteristics Fig.17 Source Current vs. Source Drain Voltage 2016 ROHM Co., Ltd. All rights reserved. 8/10 20160630 - Rev.002

lmeasurement circuits Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms lnotice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit. 2016 ROHM Co., Ltd. All rights reserved. 9/10 20160630 - Rev.002

ldimensions 2016 ROHM Co., Ltd. All rights reserved. 10/10 20160630 - Rev.002

Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( Specific Applications ), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E 2015 ROHM Co., Ltd. All rights reserved. Rev.003

Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E 2015 ROHM Co., Ltd. All rights reserved. Rev.003

Datasheet EM6K6 - Web Page Distribution Inventory Part Number EM6K6 Package EMT6 Unit Quantity 8000 Minimum Package Quantity 8000 Packing Type Taping Constitution Materials List inquiry RoHS Yes