Presentation Outline. Plasma Surface Modification Plasmas for Fabricating PV Cells PV Cell Fabrication Trend. Modification Effects

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Reducing Solar Module Cost with Atmospheric Plasma Surface Modification A Green Technology Presented by Rory A. Wolf, V.P. Enercon Industries Corporation

Presentation Outline Plasma Surface Modification Plasmas for Fabricating PV Cells PV Cell Fabrication Trend Atmospheric (Dry) Plasma Surface (APT) Modification Effects PV Cell Surface Preparation & Cleaning APT Prescriptions for PV Materials Conclusions

Plasma Surface Modification Plasma surface modification technology in PV cell manufacturing: o Deposition of amorphous SiN layers o Utilize vacuum PECVD process Create anti-reflection and surface passivation on thin-film solar cells V l hi i b l Vacuum plasma etching in barrel-type reactors for edge isolation

Plasma Surface Modification Increasing chemical waste disposal issues New interest in plasma systems o dry etching o surface cleaning o adhesion promotion Warrants fresh investigation of efficiencies

Plasmas for Fabricating PV Cells Use of plasmas dependent upon PV materials and cycle time Vacuum plasmas not a bridge to high volume continuous process SiNx deposition typically batch processes Can work in semi-continuous mode by exchanging materials after treatment and return to one atmosphere Not economical for high throughput etching cleaning and Not economical for high throughput etching, cleaning and functionalizing

PV Cell Fabrication Trends

PV Cell Fabrication Trends Organic Thin-Film Solar Cells on Plastic Organic semiconductive materials are dissolved in solvents or inks and printed or coated onto a plastic substrate in a continuous roll-to-roll process. Less expensive than silicon, cadmium or tellurium Prototypes in production now. Example 1: clear plastic top layer, a coating of prepolymer adhesive, then ink containing fullerene conductive nano-carbon clusters, and another liquid polymer coating, applied to PET film with an SiOx coating. Example 2: Use of organic inks for solar sells. The ink lets electrons pass to an electrically conductive polymer layer on a plastic substrate.

PV Cell Fabrication Trends Wide range of materials being examined to maximize solar efficiencies. Opportunity integrate continuous in-line processes for rigid/flexible PV cells Utilize atmospheric (gas phase) variable chemistry surface modification technology for dissimilar materials to improve fabrication efficiency.

Atmospheric Plasma Surface Modification

Atmospheric Plasma Surface Modification plasma : n ; Fourth state of matter, (Solid, Liquid, Gas, Plasma.) Mixture of charged ions & energetic electrons generally in equilibrium.

Atmospheric Plasma Surface Modification

Atmospheric Plasma Surface Modification Recipe 1) Take one photon, and allow it to randomly liberate one bound electron from a gas molecule. 2) Accelerate this free electron in an electrical field, forcing it to collide with other gas molecules with enough kinetic energy to separate the atoms, or free more electrons. 3) Increase power in the electric field to create an avalanche of electron collisions.

Atmospheric Plasma Surface Modification

Atmospheric Plasma Surface Modification Plasma Activation Changes free radicals on the surface by substituting chemical groups on the polymer chain being modified. Plasma Deposition Hydroxyl, carbonyl, carboxyl, carboxylic, amino-carboxyl, and amine chemical groups on surface Plasma-Induced Grafting Free radicals are created along the polymer backbone.

Atmospheric Plasma Surface Modification Animation demonstrates only one of the possible reaction pathways during plasma chemical oxidation of polyolefins. Reaction initiated with atomic oxygen, which abstracts an hydrogen atom from the surface. Results in a free radical on the surface, which can react with an oxygen molecule to produce a hydroperoxide group, which can decay into a keton group. Source: Fraunhofer IGB

Atmospheric Plasma Surface Modification Besides keton groups, also formed aldehyd, carboxyl, hydroperoxide, hydroxide, and ester groups (above). Plasma oxidation results in breaking the polymer chains and material removal (ablation) Specific surface functionalization possible under precise control of the reaction conditions.

Atmospheric Plasma Surface Modification XPS spectrum results of untreated PTFE sample XPS spectrum results of treated PTFE sample

Atmospheric Plasma Surface Modification

Atmospheric Plasma Surface Modification Plasma Treatment Micro-Etching Effect Polyethylene (30,000 SEM magnification) Original Polymer Plasma-Treated

Roll-to-Roll PV Surface Cleaning Prior to Si Deposition Base Materials Lightweight, Flexible Will not shatter or be damaged during manufacture, handling, and subsequent operation in the field Thin stainless steel substrates, for example, have thermal time constant <10 ms - can be quickly heated and cooled to eliminate waiting for temperature stabilization Typically carry rolling oil deposits which must be removed Transport in deposition chambers is simple and reliable with little component wear, resulting in very low machine maintenance costs. Polymer Encapsulation Materials Polymer Encapsulation Materials Polymers such as EVA and Tefzel are flexible and lightweight Contaminated with residual organic polymer fragments, water, adsorbed gases

Roll-to-Roll PV Surface Cleaning Prior to Si Deposition Existing Base Material Wet Cleaning Roll material washed to produce clean, dry, particle-free substrate material suitable for Si deposition Web transported though detergent cleaning station, de-ionized water rinsing, IR drying Advantages of APT Cleaning/Functionalizing li i of Base, Encapsulation Films Base material contaminates volatilized/vaporized, increasing cleaning process efficiency. Encapsulant functionalization increases surface-to-reactive adhesive and surface-to-primer bond strength to flexible structures, and glass.

Crystalline Silicon (csi) PV Module Anti-reflective layer SiO2 layer Screen-printed Ag grid Pd layer Ti layer n-type silicon layer p-type silicon layer Metal/alloy back contact layer Atmospheric Plasma cleaning/functionalization Monolithic PV Module Glass / polymer encapsulation layer Atmospheric Plasma cleaning/functionalization PV cell layer Roll to roll fabricated backsheet layer with patterned circuitry i

Triple Junction Roll to Roll Amorphous Silicon (asi) PV Module Screen-printed Ag grid layer Anti-reflective ITO layer p-type layer a-si alloy layer n-type layer p-type layer a-sige alloy layer p-type layer a-sige alloy layer n-type silicon layer Silver & ZnO layer Metal/alloy back contact layer Atmospheric Plasma cleaning/functionalization Roll to Roll R llorganic PV Module Transparent top package / coating Transparent electrode Printed active material Primary electrode Metallized Polymer Film

APT Prescriptions for Flexible PV - Base 140 Minimum APT Power Density - Base W/m2/min. 120 100 80 60 Min. Power Density 40 20 0 Stainless/Copper Alloy Copper/Nickel Alloy Stainless Steel Note: Inert/Reactive gas proportions influence minimum power densities.

APT Prescriptions for Flexible PV Thin Films 30 Minimum Power Density Thin Films W/ft2/min. 25 20 15 Minimum Power Density 10 5 0 BOPET BOPVF ECTFE EPDM ETFE EVA PET PVF THV Note: Inert/Reactive gas proportions influence minimum power densities.

APT Prescriptions for Flexible PV Thin Films Substrate Corona Corona Plasma Plasma Watt Surface Watt Surface Density Tension Density Tension (W/ft 2 /min.) (Dynes/cm) (W/ft 2 /min.) (Dynes/cm) Polyimide 16.6 60 PLA 20 2.0 46 Tyvek 2.0 54 5.3 6.0 60 72 1.0 46 3.0 50 1.0 2.0 46 60

APT Prescriptions for Flexible PV Thin Films

APT Prescriptions for Flexible PV Corona Issues 2x2 micron images of PET film Topographical Image Phase Image (Height 10nm) (Range 60º) A. No Treatment B. WD = 1.16W/ft 2 /min (12.5W/m 2 /min) C. WD = 1.93W/ft 2 /min (20.8W/m 2 /min) D. WD = 2.71W/ft 2 /min (29.2W/m 2 /min)

APT Prescriptions for Flexible PV Emissions Wet Vs. Dry Metal/Metal Alloy Cleaning Metal Cleaning Process Chemical Wet Cleaning Atmospheric Plasma Dry Cleaning Active Cleaning Agent(s) Water-base Sulphuric Acid Ion/Electron/Photon Bombardment Alkaline Solutions Inert + Oxygen Gas Alcohol Solutions Detergent Solutions Dissolved within Chemical Agent(s) Rolling Oils Metal Oxides Water-Soluble Metal Derivatives n/a Entrained in Process Exhaust n/a Volatilized hydrocarbon particles Aluminum oxide particles Water-Soluble Aluminum Derivatives Emissions Water Laden w/ Chemical Wastes 15 ppm Ozone 2,336 ppm Inert gas (98%) 185 ppm Reactive O2 (70%) <10 ppm CO2 <10 ppm Water Vapor Volatized surface particulates Recurring Process Costs Fresh Water, Additional Chemicals Process Gases Handling, Disposal Costs

Conclusions Vacuum Plasma Surface Modification Anti-reflection Surface passivation Surface etching Layer deposition Process Evolutions Increasing chemical waste disposal issues Module per unit process cost reductions Thin Film PV Cell Fabrication CAGR expected to be 74.8% to 2015.

Conclusions Atmospheric (Dry) Plasma surface modification parameters (power density, gas chemistry) established for all flexible module components. Suitable for rigid module component surface preparation, such as frame and junction box sealing. In-line, continuous process No surface morphology effects Green technology, with no hazardous byproducts

Thank you for attending Reducing Solar Module Cost with Atmospheric Plasma Surface Modification Rory A. Wolf, Enercon Industries rwolf@enerconmail.com