PCB and Systems Assembly Advanced Silicone Materials for Electric Vehicle Applications

PCB and Systems Assembly Advanced Silicone Materials for Electric Vehicle Applications Imagine Improved Thermal Management, Reliability and CostEffectiveness for Electric Vehicle Applications

AC/DC Charger Inverter/Converter Motor/Generator Electric Compressor for Air Conditioner Battery Module DC/DC Converter Designs for the Future... Today The market for plugin hybrid and batterypowered electric vehicles (xev) has the potential to grow exponentially in the coming years. But realizing that potential will depend on a number of factors, including the industry s ability to meet consumer expectations for performance and value. This will challenge battery makers to design for the largevolume production of lithium battery packs that are smaller, lighter and less expensive. These higherenergydensity packs will be capable of delivering more power, longer, through better thermal control. Manufacturers and designers of other xev components including battery management systems, power control units, DC/DC converters and electric motors face many of the same thermal management, assembly and protection challenges. Dow can help, with an extensive portfolio of proven, innovative and emerging silicone technologies for xev applications. Silicone Advantages The properties that have enabled silicone materials from Dow to excel in a wide range of PCB system assembly and automotive applications could prove invaluable in helping you address challenges associated with designing and producing large volumes of lithium battery systems and other components for the electric vehicles of tomorrow: Very low thermal resistance Flow, wetting, adhesion and cure properties that can help speed and simplify processing Excellent thermal stability wide operating temperature range Reliable performance under harsh conditions resistance to thermal shock, oxidation, moisture and chemicals Excellent electrical insulation (dielectric strength) Sheath Heater PTC Heater Battery Management System (BMS) Excellent stress relief pg 2 pg 3

Enabling & ProblemSolving Silicone Materials Silicone is an amazingly versatile material that can be produced in many forms. Dow is a silicone pioneer and a global leader in engineering silicones to meet specific performance and processing requirements. Breakthrough Technologies To meet needs for performance, design flexibility and cost control For Thermal Management Thermally conductive silicone materials from Dow have properties that can help you reduce operating temperatures and extend the life and performance of batteries and other electric vehicle PCB system components. Dow offers a wide range of thermal interface materials with the potential for creating effective, efficient designs and assembly applications. Examples of leading technologies include: Thermally conductive silicone adhesives for coupling the battery pack to the heat sink; also may be appropriate for use within or between cells Noncuring thermally conductive silicone compounds, with a possible applied temperature range of 40 to 150 C, for conducting heat from the battery cells to the heat sink Thermally conductive silicone gels and encapsulants are flowable materials that facilitate highvolume processes in automated production; can be used as an alternative to precured pads to couple cells and modules to heat sinks or as conformable gapfillers For Other Challenges Dow offers proven and innovative materials to help you meet a wide range of electric vehicle application challenges. Silicone gels for potting of PCB circuitry in the battery pack s power management system Adhesives for a variety of bonding applications, including staking large capacitors for vibration control, extra support for large components on circuit boards, and housing sealing Conformal coatings for protecting printed circuit boards in the power management system Engineered elastomers for heatresistant sealing and gasketing DOWSIL EA7100 Adhesive Under UV light A Thermal Radical Cure adhesive for use in the assembly of circuitry housings and for attaching connectors, control units or sensors to substrates. DOWSIL EA7100 Adhesive cures much faster at moderate temperatures than conventional heatcurable silicones, and it may allow you to eliminate some cleaning steps, enabling faster throughput and lower energy costs. Plus, it offers durable adhesion to a broad range of diverse substrates for greater design flexibility. Other quality and performanceenhancing benefits include adhesion in harsh environments, low void formation, superior anticorrosion performance and less sensitivity to contamination. DOWSIL TC4525 Gap Filler A costeffective way to manage the rising heat in nextgeneration PCB system assemblies. DOWSIL TC4525 Gap Filler is a soft and compressible silicone material designed to dissipate heat from PCB system assemblies. This highperforming new silicone technology deliversthermal conductivity of 2.5 W/m.K, greatly improved dispensability and stable performance for more reliablecircuitry in harsh automotive underhood environments. pg 4 pg 5

xev Battery Pack Thermal Management Thermally Conductive Gap Fillers Thermally Conductive Adhesives Thermally Conductive Encapsulants Thermal Conductivity, W/m.K Thermal Resistance, C/W Lap Shear Cure, time/temp. Viscosity, cp DOWSIL TC4515 Gap Filler In development: 1.8 W/m.K silicone gap filler material In development: 1.8 W/m.K silicone gap filler material DOWSIL TC4525 Gap Filler Part B: Blue 2.6 0.42 @ 85 µm 0.73 @ 115 µm 1.23 @ 309 µm 120 min/25 C 20 min/50 C 10 min/80 C Part A: 207,000 Part B: 193,000 Mixed: 217,000 Density, g/cm 3 Durometer CTE, ppm/k Notes 2.9 55 (Shore 00) DOWSIL TC4525 GB Gap Filler Glass bead option (180 micron) for DOWSIL TC4525 Gap Filler Glass bead option (180 micron) for DOWSIL TC4525 Gap Filler DOWSIL TC4525 CV Gap Filler Part B: Blue DOWSIL TC4529 Gap Filler 1 part Gray 3.2 DOWSIL TC2030 Adhesive DOWSIL TC2035 Adhesive 2.6 0.44 @ 78 µm 0.58 @ 100 µm 1.84 @ 400 µm Gray 2.7 Part B: Reddish brown 3.3 0.25 @ 50 µm 0.44 @ 100 µm DOWSIL SE 4485 Thermally Conductive Adhesive 1 part White 2.8 DOWSIL SE 4485 L Adhesive 1 part White 2.2 DOWSIL SE 4486 Adhesive 1 part White 1.6 DOWSIL TC4605 Encapsulant DOWSIL TC4605 HLV Encapsulant Assembly 120 min/25 C 10 min/80 C Part A: 223,000 Part B: 216,000 Mixed: 217,000 Cured: 2.9 40 (Shore 00) 32 (Asker C) 50 to 80 C: 95 50 to 150 C: 123 Noncuring 300,000 3.1 Al: 435 psi, 3 MPa, 300 N/cm 2 60 min/130 C Al: 381 psi, 2.63 MPa, 263 N/cm 2 Cu: 416 psi, 2.87 MPa, 287 N/cm 2 Glass to glass: 168 psi, 30 min/125 C 10 min/150 C Tackfree time @ 1.2 MPa, 120 N/cm 2 25 C: 10 min Glass to glass: 262 psi, Tackfree time @ 1.8 MPa, 180 N/cm 2 25 C: 8 min Glass to glass: 240 psi, Tackfree time @ 1.65 MPa, 165 N/cm 2 25 C: 4 min Gray 1 Al: 110 psi 60 min/120 C Gray 1 Anodized Al: 220 psi 60 min/120 C Part A: 250,000 Part B: 200,000 Mixed: 220,000 Part A: 130,000 Part B: 118,000 Mixed: 125,000 Wet: 3 92 (Shore A) 95 (Shore A [JIS Type A]) 45 (Shore D) 50 to 200 C: 92 Fluidity: 54 mm Cured: 2.9 90 (Shore A [JIS]) UL 94 V0 Fluidity: 47.4 mm Cured: 2.84 90 (Shore A [JIS]) 19,600 Fluidity: 60 mm Part A: 3,100 Part B: 2,500 Mixed: 2,900 Part A: 1,600 Part B: 1,400 Mixed: 1,900 Viscosity, cp Density, g/cm 3 Cure, time/temp. Lap Shear Durometer Adhesives Silicone Foam DOWSIL EA5151 Assembly Adhesive 1 part 60,000 @ 120 C 1.08 DOWSIL 7091 Adhesive Sealant (2) 1 part Black, white, gray 1.4 DOWSIL SE 9168 RTV Adhesive 1 part Gray Cured: 1.32 DOWSIL SE 9185 Clear or White Adhesive DOWSIL EA1236 Base and Catalyst Special Adhesive DOWSIL 38209 Silicone Foam (5) 1 part Clear or white Cured: 1.05 ; (basetocatalyst mix ratio by weight: 100 to 14) Base: White Catalyst: Black Part A: Dark gray Part B: Colorless 180,000 @ 0.5 s 1 160,000 @ 5 s 1 Base: 1.31 Catalyst: 1.05 Cured: 1.28 Part A: 11,00017,000 Part B: 12,00017,000 Part A: 1.07 Part B: 1.01 Density: 200280 (cured @ 23 C and tested after 24 hr) exposed to moisture in the air exposed to moisture in the air; tackfree time (3) : 28 min exposed to moisture in the air; tackfree time (3) @ 25 C: 6.5 min exposed to moisture in the air; tackfree time (3) @ 25 C: 8 min Room temperature cure; tackfree time (3) : 10 min exposed to moisture in the air; tackfree time (3) @ 25 C: max 10 min Polycarbonate lap shear adhesion: 1 day: 0.5 MPa 7 days: 1.7 MPa Cured: 2.6 81 (Shore A [JIS]) Cured: 1.67 30 (Shore A) Cured: 1.67 60 (Shore A) 5557 (Shore A) 32 (Shore A) Glass: 275 psi, 1.9 MPa, 189 N/cm 2 44 (Shore A [JIS]) Glass: 120 N/cm 2 31 (Shore A) Tensile Strength, MPa Elongation, % 4.54.7 > 900 UL flammability @ 1.5 mm: 94 V0 UL flammability @ 1.5 mm: 94 V0 Notes Can be used with standard hotmelt dispensing equipment 2.5 680 FIPG (2) 3.69 363 UL 94 V0 3 515 36 (Shore A) (4) 2.2 300 Fast roomtemperature cure 45 (Shore 00) BATTERY Compression set @ 50% compression, 22 hr @ 70 C: Nonpostcured: 32% Postcured 1 hr @ 100 C: 4% Stressstrain characteristics in compression, 50% compression: 74 KPa Developmental product data. DOWSIL EA5151 Assembly Adhesive. Utilizes silicone technology to achieve instant green strength when dispensed and cures to a strong moisturecured silicone adhesive. (2) Used as formedinplace gasket (FIPG) material. Mechanical properties: cured 7 days in air at 23 C (73 F) and 50% relative humidity. (3) (4) Measured after 7day cure at room temperature. (5) Designed to be dispensed and cured directly on parts to form an integrated compression gasket. pg 6 pg 7

xev Battery Pack (continued) Connector Viscosity, cp Density, g/cm 3 Cure, time/temp. Lap Shear Durometer Tensile Strength, MPa Elongation, % Notes BATTERY Encapsulants SYLGARD 170 Silicone Elastomer SYLGARD 170 Fast Cure Silicone Elastomer Black Black Part A: 3,160 Part B: 1,110 Mixed: 2,135 Part A: 3,436 Part B: 1,287 Mixed: 2,361 Part A, Uncured: 1.37 Part B, Uncured: 1.37 Part A, Uncured: 1.38 Part B, Uncured: 1.38 24 hr/25 C 25 min/70 C 10 min/100 C 47 (Shore A) Thermal conductivity: 0.48 W/m.K 0.2 hr/25 C 41 (Shore A) Thermal conductivity: 0.4 W/m.K SYLGARD 567 Primerless Silicone Encapsulant Black Part A: 2,060 Part B: 570 Uncured: 1.24 180 min/70 C 120 min/100 C 40 (Shore A) Thermal conductivity: 0.29 W/m.K Adhesive DOWSIL SE 9186 Clear or White Sealant 1 part Clear or white 64,000 Cured: 1.03 exposed to moisture in the air; tackfree time @ 25 C: max 10 min Glass: 360 psi, 2.5 MPa, 25 N/cm 2 20 (Shore A) 2.5 550 Silicone Foam DOWSIL 36548 Silicone RTV Foam (2) Black Part A: 40,00060,000 Part B: 50,00075,000 Part A: 1.051.11 Part B: 1.051.11 Cured: 0.220.32 228,000 N/m 2, 33 psi Compression deflection: @ 20% compression: 35,900 N/m 2, 5.2 psi @ 40% compression: 69,600 N/m 2, 10.1 psi @ 60% compression: 146,000 N/m 2, 21.2 psi (2) Silicone RTV foam for fireresistant penetration seals. Battery Management System (BMS) PCB Protection Viscosity, cp Density, g/cm 3 TackFree Time, time/temp. Nonvolatile Content (NVC), % Durometer Notes Conformal Coatings DOWSIL 31953 Conformal Coating 1 part Translucent 350 Cured: 0.98 8 min/25 C 0.5 min/60 C 99.4 34 (Shore A) DOWSIL 31965 Conformal Coating 1 part Translucent 115 Cured: 0.99 6 min/25 C 33 (Shore A) DOWSIL 12577 Low VOC Conformal Coating 1 part Transparent 1,050 Cured: 1.12 6 min/25 C 1.5 min/60 C NVC forced draft volatility: 33.6 85 (Shore A) 25 (Shore D) IPCCC830 with Amendment 1 pg 8 pg 9

Power Control Unit (PCU), Including Inverter, Converter, Etc. Thermal Management Thermally Conductive Compounds Thermal Conductivity, W/m.K DOWSIL TC5026 Thermally Conductive Compound 1 part Gray 2.9 DOWSIL TC5625C Thermally Conductive Compound 1 part Green gray 2.6 Thermal Resistance, C/W 0.03 Ccm 2 /W @ 7 µm (40 psi) 0.1 Ccm 2 /W (20 psi) POWERTRAIN Lap Shear Cure, time/temp. Viscosity, cp Density, g/cm 3 Durometer CTE, ppm/k Notes Noncuring 102,118 Uncured: 3.5 Noncuring 81,757 Uncured: 4.2 DOWSIL SC 4471 CV Thermally Conductive Compound 1 part White 2 Noncuring 116,000 Cured: 2.76 Thermally Conductive Gap Fillers Thermally Conductive Adhesives DOWSIL TC4515 Gap Filler In development: 1.8 W/m.K silicone gap filler material In development: 1.8 W/m.K silicone gap filler material DOWSIL TC4525 Gap Filler Part B: Blue 2.6 0.42 @ 85 µm 0.73 @ 115 µm 1.23 @ 309 µm 120 min/25 C 20 min/50 C 10 min/80 C Part A: 207,000 Part B: 193,000 Mixed: 217,000 2.9 55 (Shore 00) DOWSIL TC4525 GB Gap Filler Glass bead option (180 micron) for DOWSIL TC4525 GB Gap Filler Glass bead option (180 micron) for DOWSIL TC4525 GB Gap Filler DOWSIL TC4525 CV Gap Filler Part B: Blue DOWSIL TC4529 Gap Filler 1 part Gray 3.2 DOWSIL Q19226 Thermally Conductive Adhesive 2.6 0.44 @ 78 µm 1.84 @ 400 µm Gray 0.8 DOWSIL 14174 Thermally Conductive Adhesive 1 part Gray 1.78 DOWSIL TC2030 Adhesive DOWSIL TC2035 Adhesive Gray 2.7 Part B: Reddish brown 3.3 0.25 @ 50 µm 0.44 @ 100 µm 120 min/25 C 10 min/80 C Part A: 223,000 Part B: 216,000 Mixed: 217,000 Cured: 2.9 40 (Shore 00) 32 (Asker C) 50 to 80 C: 95 50 to 150 C: 123 Noncuring 300,000 3.1 Al: 375 psi, 2.6 MPa, 260 N/cm 2 Heat cure (100 C or above) 90 min/100 C Al: 646 psi, 4.5 MPa, 30 min/125 C 445 N/cm 2 20 min/150 C Al: 435 psi, 3 MPa, 300 N/cm 2 60 min/130 C Al: 381 psi, 2.63 MPa, 263 N/cm 2 Cu: 416 psi, 2.87 MPa, 287 N/cm 2 30 min/125 C 10 min/150 C Part A: 48,000 Part B: 43,000 Mixed: 59,000 Cured: 2.14 67 (Shore A) 62,300 Uncured: 2.71 92 (Shore A) 125 ppm/ C UL 94V0 Part A: 250,000 Part B: 200,000 Mixed: 220,000 Part A: 130,000 Part B: 118,000 Mixed: 125,000 Wet: 3 92 (Shore A) 95 (Shore A [JIS Type A]) 45 (Shore D) 50 to 200 C: 92 pg 10 pg 11

Power Control Unit (PCU), Including Inverter, Converter, Etc. (continued) Assembly 260 247 Viscosity, cp Density, g/cm 3 Cure, time/temp. Lap Shear Durometer Tensile Strength, MPa Al: 350 psi, 2.4 MPa, 240 kg/cm 2 DOWSIL EA7100 Adhesive 1 part Gray 360,000 Cured: 1.09 15 min/100 C PBT: 375 pcs, 2.6 MPa, 43 (Shore A) 3.4 260 N/cm 2 Adhesives Silicone Foam DOWSIL EA5151 Assembly Adhesive (2) 1 part 60,000 @ 120 C 1.08 Assembly (continued) PCB Protection Room temperature cure when exposed to moisture in the air Polycarbonate lap shear adhesion: 1 day: 0.5 MPa 7 days: 1.7 MPa 5557 (Shore A) Elongation, % CTE, ppm/ C Notes 4.54.7 >900 POWERTRAIN Durable adhesion to a wide variety of substrates Can be used with standard hotmelt dispensing equipment DOWSIL EA6060 Adhesive In development In development Low shear: DOWSIL 36265 Thixotropic Adhesive 1 part Black 1,020,000 60 min/125 C Cured: 1.34 High shear: 30 min/150 C Al: 611 psi 60 (Shore A) 4.8 165 275 UV indicator for inspection 235,000 240 min/100 C DOWSIL 36265 HP Adhesive 1 part Black 1,070 Pasec Cured: 1.33 25 min/125 C 10 min/150 C Al: 825 psi, 5.7 MPa, 568 N/cm 2 68 (Shore A) 5.8 275 215 High tensile strength DOWSIL 31598 HP Adhesive 1 part Black 82,000 Cured: 1.31 DOWSIL 866 Primerless Silicone Adhesive DOWSIL 7091 Adhesive Sealant (3) 1 part Black, white, gray DOWSIL 744 RTV Sealant 1 part DOWSIL EA1236 Base and Catalyst Special Adhesive DOWSIL 38209 Silicone Foam (6) 1 part Gray 48,000 Cured: 1.29 (basetocatalyst mix ratio by weight: (100 to 14) Base: White Catalyst: Black Part A: Dark gray Part B: Colorless Extrusion rate: 185 g/min Extrusion rate: 184 g/min 1.4 Cured: 1.42 180,000 @ 0.5 s 1 160,000 @ 5 s 1 Base: 131 Catalyst: 1.05 Cured: 1.28 Part A: 11,00017,000 Part B: 12,00017,000 Part A: 1.07 Part B: 1.01 Density: 200280 (cured @ 23 C and tested after 24 hr) Durable adhesion to a wide variety of substrates, including plastics, metals, cured silicones and other substrates (contact Dow for details). (2) Developmental product data. DOWSIL EA5151 Assembly Adhesive. Utilizes silicone technology to achieve instant green strength when dispensed and cures to a strong moisturecured silicone adhesive. (3) Used as formedinplace gasket (FIPG) material. Mechanical properties: cured 7 days in air at 23 C (73 F) and 50% relative humidity. Extrusion rate measured using 3.18 mm diameter nozzle at 0.62 MPa. Extrusion rate: 3.2 mm nozzle at 0.63 MPa. (2) Extrusion rate: 90 psi, 1/8inch orifice. 180 min/100 C 30 min/125 C 15 min/150 C 60 min/125 C 30 min/150 C Room temperature cure when exposed to moisture in the air; tackfree time (4) : 28 min Room temperature cure; tackfree time (4) : 55 min Room temperature cure; tackfree time (4) : 10 min Room temperature cure when exposed to moisture in the air; tackfree time (4) @ 25 C: max 10 min Extrusion Rate, g/min Density, g/cm 3 Cure, time/temp. Durometer Tensile Strength, MPa CIPGs (CuredinPlace Gaskets) SILASTIC RBL969420P A&B Liquid Silicone Rubber SILASTIC RBL969430P A&B Liquid Silicone Rubber SILASTIC RBL969445M A&B Liquid Silicone Rubber Part A: Black Part B: White Part A: Black Part B: White Part A: Black Part B: White Part A: 119 Part B: 282 Part A: 75 Part B: 178 (2) Part A: 77 Part B: 98 Al: 712 psi, 4.97 MPa, 497 N/cm 2 57 (Shore A) 5.4 260 277 Able to flow, fill or selflevel after dispensing Al: 774.5 psi, 5.34 MPa, 534 N/cm 2 57 (Shore A) 6.4 210 350 High tensile strength 32 (Shore A) 2.5 680 FIPG (3) Al: 430 psi, 3 MPa, 296 N/cm 2 37 (Shore A) 2.7 590 Bonding large components to circuit boards 36 (Shore A) (5) 2.2 300 Fast roomtemperature cure 45 (Shore 00) Compression set @ 50% compression, 22 hr @ 70 C: Nonpostcured: 32% Postcured 1 hr @ 100 C: 4% Stressstrain characteristics in compression, 50% compression: 74 KPa (4) (5) Measured after 7day cure at room temperature. (6) Designed to be dispensed and cured directly on parts to form an integrated compression gasket. Elongation @ Break, % Modulus 100%, MPa Tear Strength, kn/m 1.17 165 sec/115 C, T90% 21 (Shore A) Die C, 5.9 925 0.39 Die B, 13 1.2 46 sec/115 C, T90% 32 (Shore A) Die C, 7.2 820 0.8 Die B, 14 1.2 34 sec/115 C, T90% 45 (Shore A) Die C, 7.25 600 1.45 Die B, 45 Compression Set @ 25%, % Compression for 22 hr @ 132 C: 36 Compression for 22 hr @ 177 C: 31 Compression for 22 hr @ 177 C: 29 Viscosity, cp Density, g/cm 3 TackFree Time, time/temp. Nonvolatile Content (NVC), % Durometer Notes Conformal Coatings DOWSIL 31953 Conformal Coating 1 part Translucent 350 Cured: 0.98 8 min/25 C 0.5 min/60 C 99.4 34 (Shore A) DOWSIL 31965 Conformal Coating 1 part Translucent 115 Cured: 0.99 6 min/25 C 33 (Shore A) DOWSIL 12577 Low VOC Conformal Coating 1 part Transparent 1,050 Cured: 1.12 6 min/25 C 1.5 min/60 C NVC forced draft volatility: 33.6 85 (Shore A) 25 (Shore D) Lap Shear Adhesion, MPa Vinyl ester (10 min/150 C): 1.3 Al (10 min/150 C): 1.0 Al (10 min/150 C): 1.64 PA66 GF30 (10 min/150 C): 1.35 IPCCC830 with Amendment 1 pg 12 pg 13

Electric Motor Protection Thermally Conductive Encapsulants DOWSIL CN8760G Encapsulant DOWSIL TC4605 Encapsulant DOWSIL TC4605 HLV Encapsulant Thermal Conductivity, W/m.K Thermal Resistance, C/W Dark gray 0.67 24 hr/25 C Gray 1 Al: 110 psi 60 min/120 C Gray 1 Anodized Al: 220 psi 60 min/120 C POWERTRAIN Lap Shear Cure, time/temp. Viscosity, cp Density, g/cm 3 Durometer CTE, ppm/k Notes Part A: 2,900 Part B: 3,200 Mixed: 3,200 Part A: 3,100 Part B: 2,500 Mixed: 2,900 Part A: 1,600 Part B: 1,400 Mixed: 1,900 Cured: 1.58 45 (Shore A) Cured: 1.67 30 (Shore A) Cured: 1.67 60 (Shore A) UL 94 V0; UL RTI rating: 150 C UL flammability @ 1.5 mm: 94 V0 UL flammability @ 1.5 mm: 94 V0 Protection (continued) Viscosity, cp Density, g/cm 3 TackFree Time, time/temp. Nonvolatile Content (NVC), % Durometer Notes Conformal Coatings DOWSIL 31953 Conformal Coating 1 part Translucent 350 Cured: 0.98 8 min/25 C 0.5 min/60 C 99.4 34 (Shore A) DOWSIL 31965 Conformal Coating 1 part Translucent 115 Cured: 0.99 6 min/25 C 33 (Shore A) DOWSIL 12577 Low VOC Conformal Coating DOWSIL LDC 2577 D Dispersion Coating 1 part Transparent 1,050 Cured: 1.12 1 part Transparent 104 Cured: 1.0 6 min/25 C 1.5 min/60 C 5 min/25 C 2 min/60 C NVC forced draft volatility: 33.6 85 (Shore A) 25 (Shore D) IPCCC830 with Amendment 1 23 (Shore D) Control Unit Thermal Management Thermal Conductivity, W/m.K Thermal Resistance, C/W Lap Shear Cure, time/temp. Viscosity, cp Density, g/cm 3 Durometer CTE, ppm/k Notes Thermally Conductive Encapsulant DOWSIL TC6020 Thermally Conductive Encapsulant Gray 2.7 Al: 40.5 psi 23 min/60 C, T90% 13 min/80 C, T90% 5 min/100 C, T90% Part A: 10,800 Part B: 9,960 Mixed: 10,640 2.926 63 (Shore A) Developmental product data. pg 14 pg 15

OnBoard Charger Thermal Management POWERTRAIN Thermal Conductivity, W/m.K Thermal Resistance, C/W Lap Shear Cure, time/temp. Viscosity, cp Density, g/cm 3 Durometer CTE, ppm/k Notes Thermally Conductive Encapsulants DOWSIL TC4605 Encapsulant DOWSIL TC4605 HLV Encapsulant DOWSIL TC6020 Encapsulant Gray 1 Al: 110 psi 60 min/120 C Gray 1 Anodized Al: 220 psi 60 min/120 C Gray 2.7 Al: 0.5 psi 23 min/60 C, T90% 13 min/80 C, T90% 5 min/100 C, T90% Part A: 3,100 Part B: 2,500 Mixed: 2,900 Part A: 1,600 Part B: 1,400 Mixed: 1,900 Part A: 10,800 Part B: 9,960 Mixed: 10,640 Cured: 1.67 30 (Shore A) Cured: 1.67 60 (Shore A) UL flammability @ 1.5 mm: 94 V0 UL flammability @ 1.5 mm: 94 V0 2.926 63 (Shore A) Developmental product data. Assembly Viscosity, cp Density, g/cm 3 Cure, time/temp. Lap Shear Durometer Tensile Strength, MPa Elongation, % CTE, ppm/ C Notes Adhesive DOWSIL EA9189 H RTV Adhesive 1 part White Cured: 1.68 Room temperature cure when exposed to moisture in the air; tackfree time @ 25 C: 2 min Al: 327 psi, 2.2 MPa, 225 N/cm 2 Cu: 343 psi, 2.3 MPa, 236 N/cm 2 PC: 187 psi, 1.2 MPa, 128 N/cm 2 80 (Shore A) 3.9 32 FR4: 349 psi, 2.4 MPa, 240 N/cm 2 Thermal conductivity: 0.88 W/m.K UL 94 V0 Protection Viscosity, cp Density, g/cm 3 TackFree Time, time/temp. Nonvolatile Content (NVC), % Durometer Notes DOWSIL 31953 Conformal Coating 1 part Translucent 350 Cured: 0.98 8 min/25 C 0.5 min/60 C 99.4 34 (Shore A) Conformal Coatings DOWSIL 31965 Conformal Coating 1 part Translucent 115 Cured: 0.99 6 min/25 C 33 (Shore A) IPCCC830 with Amendment 1 DOWSIL 12577 Low VOC Conformal Coating 1 part Transparent 1,050 Cured: 1.12 6 min/25 C 1.5 min/60 C NVC forced draft volatility: 33.6 85 (Shore A) 25 (Shore D) UL 94 V0; MIL I46058C Amend 7 pg 16 pg 17

PTC Heater Thermal Management and Assembly THERMAL SYSTEM Thermal Conductivity, W/m.K Thermal Resistance, C/W Lap Shear Cure, time/temp. Viscosity, cp Density, g/cm 3 Durometer CTE, ppm/k Notes Thermally Conductive Adhesives DOWSIL Q19226 Thermally Conductive Adhesive Gray 0.8 DOWSIL SE 4402 Adhesive 1 part Gray 0.9 DOWSIL TC2035 Adhesive Part B: Reddish brown 3.3 0.25 @ 50 µm 0.44 @ 100 µm Al: 375 psi, 2.6 MPa, 260 N/cm 2 Heat cure (100 C or above) Part A: 48,000 Part B: 43,000 Mixed: 59,000 Cured: 2.14 67 (Shore A) Al: 530 psi, 3.65 MPa, 365 N/cm 2 30 min/150 C 32,000 Cured: 2.2 75 (Shore A) Al: 381 psi, 2.63 MPa, 263 N/cm 2 Cu: 416 psi, 2.87 MPa, 287 N/cm 2 30 min/125 C 10 min/150 C Part A: 130,000 Part B: 118,000 Mixed: 125,000 Wet: 3 95 (Shore A [JIS Type A]) 45 (Shore D) 50 to 200 C: 92 Electric Compressor Protection Viscosity, cp Density, g/cm 3 TackFree Time, time/temp. Nonvolatile Content (NVC), % Durometer Notes Conformal Coatings DOWSIL 31953 Conformal Coating 1 part Translucent 350 Cured: 0.98 8 min/25 C 0.5 min/60 C 99.4 34 (Shore A) DOWSIL 31965 Conformal Coating 1 part Translucent 115 Cured: 0.99 6 min/25 C 33 (Shore A) DOWSIL 12577 Low VOC Conformal Coating 1 part Transparent 1,050 Cured: 1.12 6 min/25 C 1.5 min/60 C NVC forced draft volatility: 33.6 85 (Shore A) 25 (Shore D) IPCCC830 with Amendment 1 Sheath Heater Protection Viscosity, cp Density, g/cm 3 Cure, time/temp. Durometer Notes Encapsulants SYLGARD 170 Silicone Elastomer Black SYLGARD 170 Fast Cure Silicone Elastomer Black Part A: 3,160 Part B: 1,110 Mixed: 2,135 Part A: 3,436 Part B: 1,287 Mixed: 2,361 Part A, Uncured: 1.37 Part B, Uncured: 1.37 Part A, Uncured: 1.38 Part B, Uncured: 1.38 24 hr/25 C 25 min/70 C 10 min/100 C 47 (Shore A) Thermal conductivity: 0.48 W/m.K 0.2 hr/25 C 41 (Shore A) Thermal conductivity: 0.4 W/m.K pg 18 pg 19

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