MICRO-ELECTRO-MECHANICAL VARIABLE BLAZE GRATINGS

Similar documents
Proceedings Post Fabrication Processing of Foundry MEMS Structures Exhibiting Large, Out-of-Plane Deflections

Poly-SiGe MEMS actuators for adaptive optics

Lecture 5. SOI Micromachining. SOI MUMPs. SOI Micromachining. Silicon-on-Insulator Microstructures. Agenda:

MEMS II: January 23. Lab 1: Pop-up mirror - PolyMUMPS - Thermal actuators - Mirror CoventorWare

FABRICATION PROCESSES FOR MAGNETIC MICROACTUATORS WITH POLYSILICON FLEXURES. Jack W. Judy and Richard S. Muller

CHARACTERIZATION OF ELECTROTHERMAL ACTUATORS AND ARRAYS FABRICATED IN A FOUR-LEVEL, PLANARIZED SURFACE-MICROMACHINED POLYCRYSTALLINE SILICON PROCESS

Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Y. C. Lee

Surface Micromachining

Surface micromachining and Process flow part 1

Silicon Nitride Biaxial Pointing Mirrors with Stiffening Ribs

Welcome MNT Conference 1 Albuquerque, NM - May 2010

EE C245 ME C218 Introduction to MEMS Design Fall 2011

Cambridge University Press A Guide to Hands-on MEMS Design and Prototyping Joel A. Kubby Excerpt More information.

Dr. Lynn Fuller Webpage:

Lecture 10: MultiUser MEMS Process (MUMPS)

Surface Micromachining

Microstructures using RF sputtered PSG film as a sacrificial layer in surface micromachining

Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

Invited Paper. Berkeley, CA, USA Davis, CA, USA ABSTRACT 1. INTRODUCTION

Microfabrication of Heterogeneous, Optimized Compliant Mechanisms SUNFEST 2001 Luo Chen Advisor: Professor G.K. Ananthasuresh

Surface Micromachining II

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation

GAS TURBINE ENGINE PROGNOSTICS AND EQUIPMENT HEALTH MANAGEMENT

EUV Transmission Lens Design and Manufacturing Method

4/10/2012. Introduction to Microfabrication. Fabrication

Preface Preface to First Edition

EUV Transmission Lens Design and Manufacturing Method

Laser Micromachining of Bulk Substrates and Thin Films Celine Bansal

Sensors and Actuators Designed and Fabricated in a. Micro-Electro-Mechanical-Systems (MEMS) Course. Using Standard MEMS Processes

Mater. Res. Soc. Symp. Proc. Vol Materials Research Society

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation

Co-Evolution of Stress and Structure During Growth of Polycrystalline Thin Films

SOIMUMPs Design Handbook

Fabrication and Layout

MEASUREMENT OF SHEAR STRESS AND TEMPERATURE USING MEMS FABRICATED SENSORS

Shock Testing of MEMS Devices

The object of this experiment is to test the de Broglie relationship for matter waves,

Tutorial on Micro Electro Mechanical Systems (MEMS)

MEMS Packaging Techniques for Silicon Optical Benches

MEASUREMENTS OF MECHANICAL PROPERTIES OF MICROFABRICATED THIN FILMS

Ultrasonic Micromachining in the fabrication of MEMS Micro-sensors

CMOS Manufacturing process. Design rule set

General Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems

Growth and Doping of SiC-Thin Films on Low-Stress, Amorphous Si 3 N 4 /Si Substrates for Robust Microelectromechanical Systems Applications

MANUFACTURING OF AN OPTICAL QUALITY MIRROR SYSTEM FOR ADAPTIVE OPTICS

EE C245 ME C218 Introduction to MEMS Design

ANTI-STICTION COATINGS FOR HIGH RELIABILITY MEMS

Tensile Testing of Polycrystalline Silicon Thin Films Using Electrostatic

Comprehensive Characterization of. Electrostatically-Actuated Beams

Out-of-plane microstructures using stress engineering of thin films

Figure 2.3 (cont., p. 60) (e) Block diagram of Pentium 4 processor with 42 million transistors (2000). [Courtesy Intel Corporation.

Passive TCF Compensation in High Q Silicon Micromechanical Resonators

Regents of the University of California

NANOTUBE MICRO-OPTO-MECHANICAL SYSTEMS

Smarter sensing solutions

Lecture 1A: Manufacturing& Layout

Metrology and Materials Characterization

Anirban Som

Thomas M. Adams Richard A. Layton. Introductory MEMS. Fabrication and Applications. Springer

Figure 6. Rare-gas atom-beam diffraction patterns. These results were obtained by Wieland Schöllkopf and Peter Toennies at the Max-Planck Institute

the surface of a wafer, usually silicone. In this process, an oxidizing agent diffuses into the wafer

Laser Beam Interactions with Solids In absorbing materials photons deposit energy hc

CX Thin Fil s. Resistors Attenuators Thin-Film Products Thin-Film Services. ISO 9001:2008 RoHS/REACH Compliant ITAR Compliant

Fabrication Technology, Part II

Low-cost, deterministic quasi-periodic photonic structures for light trapping in thin film silicon solar cells

6.777J/2.732J Design and Fabrication of Microelectromechanical Devices Spring Term Solution to Problem Set 2 (16 pts)

Laser Processing and Characterisation of 3D Diamond Detectors

Institute of Solid State Physics. Technische Universität Graz. Deposition. Franssila: Chapters 5 & 6. Peter Hadley

SILICON micromachining has been utilized since the early

Today s Class. Materials for MEMS

MICROFABRICATION OF OPTICALLY ACTIVE InO X MICROSTRUCTURES BY ULTRASHORT LASER PULSES

MEMSAND MICROSYSTEMS Design, Manufacture, and Nanoscale Engineering

Probing Interfacial Contact via MEMS-based Microinstrumentation

Measurement of Residual Stress by X-ray Diffraction

Optical Coatings. Photonics 4 Luxury Coatings , Genève. Dr. Andreas Bächli Head of Optical Coatings at RhySearch, Buchs (SG)

GAS-DRIVEN MICROTURBINE INVENTORS. Jeffrey J. Sniegowski San Marino, N.E. Albuquerque, NM 87111

IC-Compatible Technologies for Optical MEMS

HOMEWORK 4 and 5. March 15, Homework is due on Monday March 30, 2009 in Class. Answer the following questions from the Course Textbook:

Lecture 7 CMOS MEMS. CMOS MEMS Processes. CMOS MEMS Processes. Why CMOS-MEMS? Agenda: CMOS MEMS: Fabrication. MEMS structures can be made

EE C245 ME C218 Introduction to MEMS Design Fall 2007

L5: Micromachining processes 1/7 01/22/02

EE 330 Lecture 9. IC Fabrication Technology Part 2

Lecture 19 Microfabrication 4/1/03 Prof. Andy Neureuther

IC/MEMS Fabrication - Outline. Fabrication

FABRICATION ENGINEERING MICRO- NANOSCALE ATTHE AND. Fourth Edition STEPHEN A. CAMPBELL. of Minnesota. University OXFORD UNIVERSITY PRESS

Application of Electronic Devices for Aerosol Deposition Methods

Mostafa Soliman, Ph.D. May 5 th 2014

All fabrication was performed on Si wafers with 285 nm of thermally grown oxide to

A modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS

Supporting Information

Regents of the University of California 1

A Functional Micro-Solid Oxide Fuel Cell with. Nanometer Freestanding Electrolyte

4. Process Integration: Case Studies

Characterisation of Fe-Ni amorphous thin films for possible magnetostrictive sensor applications

SINGLE CRYSTAL SAPPHIRE

Applications of High-Performance MEMS Pressure Sensors Based on Dissolved Wafer Process

Mechanical Engineering and Applied Mechanics University of Pennsylvania. A glimpse of MEMS. Presented to MEAM 550 (Fall 2001) students

Supplementary Materials for

Transcription:

MICRO-ELECTRO-MECHANICAL VARIABLE BLAZE GRATINGS D. M. Burns and V. M. Bright Air Force Institute of Technology Department of Electrical and Computer Engineering Wright-Patterson Air Force Base, OH 45433-7765 ABSTRACT Two types of micro-electro-mechanical variable blaze gratings (VBGs) have been designed, fabricated, and tested. The gratings operate by adjusting the blaze angle of each slat so that the specular reflection of the incident light matches a particular grating diffraction order. The VBG blaze angle is adjustable with either electrostatic or thermal actuators. VBGs direct incident light in discrete directions, and are useful for steering light with beam diameters greater than 1 mm and power intensities greater than one watt. Both electrostatic and thermal VBGs were constructed from gold and polysilicon using a surface micromachining process and tested with a 20 mw continuous wave HeNe laser operating at a wavelength of 632.8 nm. Optical selectivities (the ratio of power in the selected order to power in either of the nonselected adjacent orders) were determined for both electrostatically actuated and thermally actuated VBGs. The drive voltages for both types of gratings were measured for specific blaze angles and selected diffraction orders. INTRODUCTION Many potential applications of micro-electromechanical optical beam steering systems require optical beam diameters that are too large to fit on a single micromirror. Previously reported micromirror arrays have low fill factors (less than 50%), which may render them unsuitable for directing high power optical beams [I]. Some applications, such as digital laser radars, may benefit from an optical beam steering system that directs light in discrete directions. Variable blaze gratings (VBGs) have a high fill factor (up to 100% for non-normally incident light), and direct the majority of the diffracted light in a specific direction. VBGs are also suitable for spectrum analyzers that require multiple diffraction orders. The VBGs described in this paper were designed at the Air Force Institute of Technology and fabricated through the Multi-User MEMS Processes (MUMPS) sponsored by the Defense Advance Research Projects Agency (DARPA) [2]. THEORY A grating diffracts incident light into reflected orders. The direction of a particular order, e, resulting from light incident at an angle 8i is given by equation (1) [31. m is the order number, h is the wavelength of the source, and a is the period of the grating. Variable blaze gratings operate by adjusting the blaze angle of each slat so that the specular reflection of the incident light matches a particular diffraction order. For normally incident light, the blaze angle ym to select a particular order m is half the angle of the order 8, as measured from an axis perpendicular to the face of the grating. A torsion spring under the slat holds each slat parallel to the substrate. The electrostatic VBG is operated by applying a voltage between the slat and the bottom electrode, causing the edge of the slat opposite the torsion spring to be pulled down by electrostatic attraction. This action angles the slat towards the bottom electrode. The torsion spring returns the slat to its starting position when the voltage is removed. The thermally actuated VBG relies on the expansion of a polysilicon bar under the slat to push an edge of the slat off the substrate. This action angles the thermally actuated slat up from the substrate. In general, electrostatic VBGs have a higher operating frequency than thermally actuated VBGs. However, the maximum blaze angle of electrostatic VBGs is limited by contact with the substrate, while thermally actuated VBGs rotate above the substrate and are capable of a higher blaze angle. FABRICATION The gratings are constructed using surface micromachined thin films on a silicon wafer. MUMPs 55 U.S. Government work not protected by U.S. copyright

offers three patternable layers of polysilicon, and two sacrificial layers of phosphosilicate glass on a base layer of silicon nitride. A top layer of gold is used as the reflective surface for each of the grating slats. Table 1 identifies the layer thickness for each of the films used in MUMPS. The order of the entries in Table 1 is consistent with the order in which the films are deposited on the silicon wafer substrate (silicon nitride layer is applied first). The gold is evaporated on to the device after all other layers have been deposited by low pressure chemical vapor deposition. The polysilicon layers and the substrate are highly doped with phosphorus (approximately 1 O2' atoms- ~m-~) to decrease electrical resistance. After fabrication, the device is "released" by removing sacrificial glass layers in a bath of 49% hydrofluoric acid for 2.5 minutes followed by a rinse in deionized water. The last step is an immersion in 2-propanol for 7 minutes to drive out residual water and reduce stiction. TABLE 1. Structural and Sacrificial Layers Used in MUMPS [2]. Layer Name c Nitride (silicon nitride) Poly-0 (bottom polysilicon layer) 1st Oxide (sacrificial layer - phosphosilicate glass) Poly-1 (middle polysilicon layer) Thickness (pm) 2.0 2.0 2nd Oxide (sacrificial layer - phosphosilicate glass) I poly-2 (top polysilicon layer) I 1.5 I Variable blaze gratings were tested with an attenuated 20 mw HeNe (632.8 nm) continuous wave laser in air and at room temperature. The light from the laser was positioned at a 45 degree angle to the face of the VBG, and in the plane of the diffracted orders as shown in Figure 1. A 300 mm lens was used to focus the laser spot on a single grating. The adjustable mirror and video camera were used to position and observe the laser spot on the die. The incident axis is perpendicular to the output axis. Mirror Laser Power attenuator I 1nciden:axis camera \ Target Figure 1. VBG test set-up. ELECTROSTATIC VBGs k Output axis Figure 2 shows a portion of an electrostatically operated VBG with 58 pm wide slats and a gap between adjacent slats of 2 pm. This grating has 40 slats, each 2.4 mm long. After the grating has been released, the slats can be tilted with respect to the substrate by applying a voltage between the slats and the substrate. The tilt angle of the slat can be controlled until its lower edge is approximately onethird lower than its initial starting position. When the lower edge reaches this position, the slat becomes unstable, and is quickly pulled down to the underlying silicon nitride. This phenomenon is called "snapthrough," and it results from countering a non-linear force (electrostatic attraction) with a linear force (the underlying mechanical spring) [4]. The silicon nitride layer is used to insulate the slat from the substrate so the device is not destroyed after snap-through. Figure 3 is a diagram of the electrostatically-operated VBG shown in Figure 1 with a portion of the Poly-2 and gold layers removed to show the underlying structure. A cross-sectional view of the device is shown at the top of Figure 3. When sacrificial layers are removed, internal material stress causes the gold layer and its supporting Poly-2 layer to curl into a concave shape. For a 58 pm wide slat formed only out of Poly-2 and gold, curvature peak-to-valley distances of 200 nm are typical. By "stacking" or adhering the Poly-1 and Poly-2 layers over the majority of the slat, the curvature peak-tovalley can be reduced to a maximum of 127 nm. If a layer of the 2nd oxide is sealed in a cavity formed between the Poly-1 and Poly-2 layers, the curvature peak-to-valley can be further improved [5]. 56

Outline of Poly- 1 flexure and support post under the top Poly-2 layer Electrical bus and flexible connecting wiring Gold layer I A Figure 2. An electrostatic single-sided VBG with 58 pm wide slats. In Figure 2, only the Poly-2 and gold layer are visible; the Poly-1 and Poly-2 are attached together everywhere except over the spring and support post. Poly-2 Nitride insulated substrate ---- Poly-1 support post double-sided VBGs in Figures 2 and 4 can direct light into and the voltage required. All angles in Table 2 are the direction of the selected order measured with respect to the output axis shown in Figure 1. Because the gratings were designed with different slat widths, the diffracted orders are at different angular positions for each grating. The voltage measurements for the double-sided VBG were for the slat and the bottom electrode on one side and in series with a 1 KQ resistor. TABLE 2. Steering Orders and Voltages for Two Types of Electrostatic VBGs. Figure 3. Schematic diagram of the single-sided electrostatic VBG. The single-sided VBG shown in Figure 2 is only capable of steering incident light over three orders. Figure 4 shows a portion of an electrostatic VBG designed to tilt on either side with 42 pm wide slats and a gap between adjacent slats of 2 pm. This grating has 50 slats, each 2.3 mm long. Two underlying Poly- 0 electrodes are used to tilt the top Poly-2 slat on either side of its center torsion spring. Because the grating slat will touch a bottom electrode at snap-through, a current-limiting resistor is required to be in series with the electrodes to prevent destruction of the device. Table 2 lists the orders that the single-sided and Order Single-sided VBG degrees volts -3-2 -1 0 0 0 +1 0.6 13.9 +2 1.2 22.9 +3 Double-sided VBG degrees volts -2.5 61.2-1.6 48.5-0.8 29.6 0 0 0.8 29.9 1.6 48.9 2.5 61.5 The slat tilt angle across the electrostatic grating is uniform. The optical selectivity, or the measure of power in the selected order divided by the highest power in an adjacent order was 13.4 for the singlesided VBG and 19.5 for the double-sided VBG. The optical selectivities were measured with the slats blazed to favor the second diffraction order. 57

Electrical bus with contacts for the top electrode (the grating slat) and two bottom electrodes Outline of underlying Poly-1 flexure and support posts Figure 4. An electrostatic double-sided VBG with 42 pm wide slats. THERMALLY ACTUATED VBGs A VBG driven by thermal actuators is shown in Figure 5. The width of the slats is 82 pm, and the gap between adjacent slats is 2 pm. This thermally actuated grating has 36 slats, each 2.5 mm long. Figure 6 is a diagram of the VBG in Figure 4 with the Poly-2 and gold layers made transparent to show the underlying structure. The slats are tilted by heating underlvinrr 1.5 um wide Polv-1 actuator arms with electric current. The increase in temperature causes each actuator arm to expand, and lift an edge of the slat off the substrate. The fill-factor of the device was improved by using the gold on each slat as the electrical contact to and from the underlying thermal actuators. The slats are wired together in pairs using a Poly-0 connector. Current flows out on one slat, and retums on the adjacent slat after passing through thermal actuators under both slats. The measured electrical resistance of the entire device is 103.4 R. Electrical bus connecting each slat pair Outline of underlying thermal actuator Outline of Poly-0 bus I connecting each slat pair Torsion spring Figure 5. A thermally actuated VBG with 82 pm wide slats. 58

Slat surface (Poly-2 gold) \ Anchor (Poly-I to Poly-0 contact) Via (Poly-1 to Poly-2 contact) i 7 Actuator arm \ i Figure 6. Schematic diagram of the thermally actuated VBG. If the actuator arms are heated close to their melting point, the arms will shrink below their initial length after the current is removed. This phenomenon is called back-bending [6]. Back-bending does not significantly reduce the total controllable range of motion produced by the actuators, but it does change the position of slats when no power is applied. Backbending can be used to allow thermally actuated VBGs to steer over the -1 to +3 orders instead of the original 0 to +4 orders. The devices will be destroyed if excessive current passes through the actuator arms. Table 3 details the steering orders and corresponding voltages for the thermally actuated VBiG shown in Figure 5 before back-bending. Back-bending occurred at 45 volts for this device, and the device was destroyed at 48.0 volts. The slat tilt angle across the thermal grating was also uniform. The optical selectivity for the thermally actuated VEIG driven to select the second order was 27.9. impact on optical selectivity. Figure 7 presents the measured optical selectivities for the electrostatic and thermally actuated VBGs set with a blaze angle favoring the second order. Maximum incident optical power ratings for the devices have been estimated to be over one watt (at a wavelength of 632.8 nm), but have not been tested at present time. Also, frequency measurements have not yet been performed, however, other electrostaticallydriven devices have been operated at frequencies above 10 KHz [7]. Thermally-driven devices have been operated at frequencies up to 300 Hz [SI. Future work on VBGs is directed toward increasing the number of selectable orders by improving actuator mechanisms. On-going Fourier finite element analysis is being conducted to model the slat surface. The goal of this analysis is to develop new slat designs with improved optical selectivities. 30 0 Number of Usable Orders 1- Single-sided Double-sided Thermally- VBG VBG actuated VBG Figure 7. Measured selectivities of electrostatic and thermally actuated VBGs. Order 0 +1 +2 +3 +4 Thermally actuated VBG degrees volts 0.0 0.0 0.43 6.1 0.86 17.8 1.30 30.2 1.73 42.0 ACKNOWLEDGMENTS This work was sponsored by USAF Wright Laboratory, WLIARD, Eglin AFB, Florida, and WLIAAD, Wright-Patterson AFB, Ohio. REFERENCES CONCLUSION Tilt angle error and surface topo1og:y deviations resulting from the top Poly-2 and gold layers conforming to Poly-0 and Poly-1 structures had little J. H. Comtois, V. M. Bright, S. Gustafson, and M. A. Michalicek, Implementation of hexagonal micromirror arrays as phase-mostly spatial light modulators, Proc. SPIE, vol. 2641, pp. 76-87, October 1995. 59

[2] D. Koester, R. Majedevan, A. Shishkoff, and K. Marcus, Multi-User MEMS Processes (MUMPS) Introduction and Design Rules, Rev. 4, July 15, 1996, MCNC MEMS Technology Applications Center, 302 1 Cornwallis Road, Research Triangle Park, NC, 27709. [3] E. Hecht, Optics, Second Edition, Reading, MA, Addison-Wesley Publishing, 1990. [4] P. M. Osterberg, R. K. Gupta, J. R. Gilbert, and S. D. Senturia, Quantitative models for the measurement of residual stress, Poisson ratio and Young s modulus using electrostatic pull-in of beams and diaphragms, Proc. Solid-state Sensor and Actuator Workshop, Hilton Head Island, SC, pp. 184-188, June 13-16,1994. [5] D. M. Burns and V. M. Bright, Designs to improve surface micromachined micromirror surface topology, to be published in Proc. SPIE, vol. 3008, 1997. [6] J. H. Comtois and V. M. Bright, Surface micromachined polysilicon thermal actuator arrays and applications, Proc. Solid-state Sensor and Actuator Workshop, Hilton Head Island, SC, pp. 174-177, June 3-6, 1996. [7] M. A. Michalicek, D. E. Sene, and V. M. Bright, Advanced modeling of micromirror devices, Proc. International Conference on Integrated MicroNanotechnologv for Space Applications, NASA & Aerospace Corp. Publications, pp. 214-229, 1995. [SI J. H. Comtois, V. M. Bright, and M. W. Phipps, Thermal microactuators for surfacemicromachining processes, Proc. SPIE, vol. 2642, pp. 10-21, 1995. 60