Flex and Rigid flex boards 02/2013 Written by Zreik Anan
Advantages Better Reliability Dynamic flexing Replace cables (Static Flexing) Simplify assembly process Less rework Saves money
Materials Flex clad materials. Cover layer. No flow prepreg. Bond ply material. Rigid clad material.
Flex clad materials 1 No reinforcement. 2 Thin materials. 3 Poor dimension stability. 4 - Dieletric - Kapton. 5 - Adhesive material- copper is bonded to Kapton with acrylic or epoxy adhesive. 6 - Adhesiveless material - Direct bonding of copper to Kapton.
Flex clad materials Adhesive material. copper adhesive Kapton adhesive copper Adhesiveless material copper Kapton copper
Cover layer 1 The cover layer function is to protect the flex part of the board (like solder mask) 1 No reinforcement. 2 Thin flex materials. 3 Poor dimension stability. 4 - Dieletric - Kapton. 5 The adhesive can be acrylic or epoxy based. Kapton Adhesive
Bond ply 1 The bond ply matter is to combine flex areas. 2 No reinforcement. 3 Thin flex materials. 4 Poor dimension stability. 5 The adhesive can be acrylic or epoxy based. Bond Ply Bond Ply Adhesive Kapton Adhesive Adhesive
No flow prepreg 1 No flow prepreg mainly based on epoxy or p i. 2 The reason of using no flow prepreg is to avoid the prepreg flow to the flex area. 3 Usually no prepreg in the flex area because this prepreg is not flex.
2 Layer flex Adhesiveless material Cover layer copper layer(1) Kapton Copper layer(2) Cover layer Bond ply stiffener Adhesive material Cover layer Copper layer(1) adhesive Kapton adhesive Copper Layer(2) Cover layer stiffener Bond ply
Full flex multilayer Adhesiveless material Cover layer Copper layer(1) Kapton Copper layer(2) Bond ply Copper layer(3) Kapton Copper Layer(4) Cover layer Bond ply stiffener
Rigid flex non bikini Copper layer 1 Rigid layer Copper layer 2 No flow prepreg No flow prepreg No flow prepreg Copper layer 7 Rigid layer Cover layer Copper layer(3) Kapton Copper layer(4) Cover layer Cover layer copper layer(5) Kapton Copper layer(6) Cover layer Copper layer 1 Rigid layer Copper layer 2 No flow prepreg No flow prepreg No flow prepreg Copper layer 7 Rigid layer Copper layer 8 Copper layer 8
Rigid flex bikini Copper layer 1 Rigid layer Copper layer 2 No flow prepreg No flow prepreg No flow prepreg Copper layer 7 Rigid layer Cover layer Copper layer(3) Kapton Copper layer(4) Cover layer Cover layer copper layer(5) Kapton Copper layer(6) Cover layer Copper layer 1 Rigid layer Copper layer 2 No flow prepreg No flow prepreg No flow prepreg Copper layer 7 Rigid layer Copper layer 8 Copper layer 8
Important parameters for quotation Item Option 1 Option 2 Layers count 1,2 more Flex clad material Adhesive Adhesivless Flex clad copper Ed Ra Coverlayer Acrylic based Epoxy based No flow prepreg Epoxy based P I based Bikini Yes No Rigid clad material Epoxy based P I based Stiffener Yes No
Fast Print available materials Item Option 1 Option 2 Option 3 Adhesive flex clad material Adhesiveless flex clad material Acrylic based coverlayer Epoxy based coverlayer Epoxy no flow prepreg P I no flow prepreg Taiflex Shengyi Dupont Duopnt Panasonic Taiflex Dupont Taiflex SHengyi 49N ARLON Ventic Isola 406 37N Arlon 38N Arlon Ventic
Supplier CAR
New production 1 Bikini structure. 2 Adhesivless material. 3 Prepreg is used to laminate the layers. 4 High Tg prepregs and rigid layers. 5 it is very important to Dry the boards before assembly 8-12 hours at 120 C. Flex material can easily absorb moisture more that FR4. Drying process can help to avoid delamination problems during the assembly process.
New production
Z expansion
Board drying
Board New drying production
Board Board drying drying
Improving reability
Improving reability
Improving reability
Improving reability
Improving reability
Improving reability
Improving reability
Bending radius
Bending radius