Why Flex? Innovation Flexible circuits give you a unique tool to bring your innovative packaging ideas to market, and to separate your products from the crowd. Flex gives you the ability to create circuitry that fits your device and its application. Circuit density The dielectrics in flexible circuits are.001 making it a natural for ultra thin, ultra light, packaging. Adhesiveless laminates, HDI and thin copper layers make it ideal for fine line technology, giving you the smallest thinnest lightest solution for your circuit designs. Reliability Flexible circuits are designed for the rigors of aerospace, medical and military applications, for the ultimate reliability. Flex assemblies also eliminate connectors, and the labor, yield, and reliability issues that are inherent in their application. Why PCi? Focused Everything we produce at PCi is a flex or rigid flex construction. We ve been at it for twenty-five years, so we have the focus and experience to engineer your product for success. Certified PCi boards are used in military, aerospace, and medical applications, where there is no option for failure. We are military qualified to Mil-PRF-31032, Mil-P-50884, and Mil-P-55110, and ISO 9001-2000. The reliability of our technology is built right into your product. Friendly At PCi we love a challenge, and would love to work with you to produce your next design. Ask to see some examples of our work, and how we ve given package designers the innovation, circuit density, reliability, focus, certification, and friendly service they B OARD A TTRIBUTE Capabilities Each day new board designs push one or more areas of our technology curve and help us produce tighter tolerances and denser boards. The capabilities that we have listed below are given in general terms because they are interdependent and it is possible that your requirements extend beyond the ranges given below. If your project is outside of those ranges, give us a call. We may have already produced it, and if not we d like to work with you to expand our capabilities. S TANDARD T ECHNOLOGY A DVANCED T ECHNOLOGY Layer Count 4-20 16-30 Board Thickness.009 -.093.006 -.125 Internal Imaging.003 /.003.0025 /.0025 External Imaging.004 /.004.0025 /.0025 Minimum Dielectric.001.0005 Minimum Copper 12µ 5µ Minimum Drilled Hole.006 <.006 Minimum Laser Via.005.003 Aspect Ratio 10:1 > 10:1 PTH Size Tolerance.003.002 Impedance Tolerance + 10% + 5%
This board is for a computer application with controlled impedance on five layers, and with selective gold electro-plate and electroless nickel immersion gold. Computer workstation Size: 12 by 6.5 12 overall, 2 flex Polyimide core Polyimide no-flow prepreg 4.5/4 innerlayers flex 3.2/4 innerlayers hardboard 4/6 outerlayers Minimum hole:.0145 Minimum pad:.025 Thickness:.093 +.008
This is a board for a military avionics application featuring dense outerlayer imaging with small conventional vias. Military Avionics Size: 12 by 5.125 11 overall, 4 flex Polyimide core Polyimide no-flow prepreg 3/3 innerlayers 3/3 outerlayers Minimum hole:.010 Minimum pad:.027 Thickness:.059 +.006 ENIG
This board is also for a military avionics application; it has ten layers with four layers of flex, 4/4 on innerlayers, with 4/5 on outerlayers. Military Avionics Size: 5.125 by 2.25 10 overall, 4 flex Polyimide core Polyimide no-flow prepreg 4/4 innerlayers 4/5 outerlayers Minimum hole:.0145 Minimum pad:.025 Thickness:.062 +.007 Selective ENIG and fused solder
This board was manufactured for a high volume telecommunications device, it features a low cost lay-up with controlled impedance on three layers. High volume telecommunications Size: 1.5 by 0.5 6 overall, 2 flex Epoxy no-flow prepreg 4/6 innerlayers 8/6 outerlayers Minimum hole:.0135 Minimum pad:.027 Thickness:.039 +.005 Controlled impedance on 3 layers Selective ENIG and fused solder
This board illustrates how designers use flex to reduce board thickness as well as package size and weight, and incorporate connectors into the bare board design. Wearable insulin pump Size: 3 by 3 6 overall, 2 flex Polyimide core Polyimide no-flow prepreg 4/4 innerlayers 4/4 outerlayers Minimum hole:.010 Minimum pad:.022 Thickness:.030 ENIG
This is good example of how flex can create very innovative, dense, thin, light packaging. This board is bonded with a no-flow prepreg. Speech processor for hearing implant Size: 3.5 by 2.75 4 overall, 2 flex Epoxy no-flow prepreg 4/4 innerlayers 4/4 outerlayers Minimum hole:.010 Minimum pad:.020 Thickness:.021 Via in pads ENIG
This is a unique board that shows how flex can be used for high density applications; the board is 12 layers and thinner than a credit card. It uses a polyimide cast adhesive so the package is pure flex. Engine control unit for robot Size: 3.75 by 2.875 12 overall, pure flex Fusible polyimide bond ply 4.5/4 innerlayers 5/4 outerlayers Minimum hole:.010 Minimum pad:.018 Thickness:.020 12 micron copper on innerlayers Fusible polyimide adhesive P l i id k
This is an example of flex used in a rigid application; four layer board with.006 controlled depth, laser vias, with each part individually scaled at drilling. Innerlayers have 2/1.5 spacing. Carrier for piezo chip Size: 2.25 by 2.375 4 overall, pure flex Fusible polyimide bond ply 2/1.5 innerlayers 4/4 outerlayers Minimum hole:.006 Minimum pad:.012 Thickness:.016 Controlled depth laser vias Laser clearing of pads in chip cavity Rogers R 8080 Photoimagable Coverlay
This is a six-layer rigid flex board for a micro CCD bar code reader for a PDA, that also doubles as a camera. CCD Camera/bar code reader assembly Size: 1.4 by 1.6 6 overall, all flex Epoxy no-flow prepreg 4/4 innerlayers 4/4 outerlayers Minimum hole:.008 Minimum pad:.018 Thickness:.022 +.002 Flex areas are die cut for lower cost Conventional.008 vias for lower cost ENIG
This is another pure flex package; 14 layers bonded with flexible bond plies; controlled depth laser vias on the outer three layers of each side. Infrared Camera Size: 6.6 by 1.6 14 overall, pure flex Adhesive bond plies and coverlay 4/4 innerlayers 4/4 outerlayers Minimum hole:.006 Minimum pad:.012 Thickness:.060 Controlled depth laser vias 3/8/3 construction 5 Lamination cycles
This is a large board for a medical device that is eighteen layers and presents difficult registration due to the number of layers and board s dimensions. Medical Imaging Size: 4.5 by 22.25 18 overall Four layers flex with four layers of epoxy silver shielding Polyimide core Polyimide no flow prepreg 7/4 innerlayers 7/5 outerlayers Minimum hole:.024 Minimum pad:.040 Thickness:.093 ±.005 Oth Sil hi ldi
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