D-Pak RoHS Compliance Document Contents: 1. 2. Solder Reflow 3. Tin Whisker Report
D-pak BOM 1 Chip Silicon.713 Si 744-21-3.713 1% 1.9% Encapsulant Epoxy Resin.11419 Lead Frame Copper.244 Die Attach Soft Solder.27 SiO 2 7631-86-9.9136 8% 24.8% Epoxy 9598-46-2.1142 1% 3.1% Cu 744--8.23992 99.8% 62.4% Pb 7439-92-1.242 9%.7% In 744-74-6.14 5%.% Ag 744-22-4.14 5%.% Wire Bond Aluminum.8 Al 7429-9-5.8 1%.2% Lead Finish Matte Tin Ni 744-2-. 16%.1%.32 Over Nickel* Sn 744-31-5.27 84%.7% Total *Tin whisker mitigation strategy is nickel under-plate..36842 26 DEGREE REFLOW PROFILE 3 2 6 to 1 s e c 2 1 1 6 to 18 s e c 1 C to 2 C 1 to 3 This part is compliant with EU Directive 211/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (.1%), hexavalent chromium, PBB or PBDE in concentrations greater than.1%, except as 1
D-pak BOM 2 Chip Silicon.713 Si 744-21-3.713 1% 1.9% Encapsulant Epoxy Resin.11419 Lead Frame Copper.244 Die Attach Soft Soldier.27 SiO 2 7631-86-9.9136 8% 24.8% Epoxy 9598-46-2.1142 1% 3.1% Cu 744--8.23992 99.8% 65.2% Pb 7439-92-1.242 9%.7% In 744-74-6.14 5%.% Ag 744-22-4.14 5%.% Wire Bond Aluminum.8 Al 7429-9-5.8 1%.2% Lead Finish Matte Tin*.32 Sn 744-31-5.32 1%.9% Total.36842 *Tin whisker mitigation strategy is 1 C, 1 hour anneal within 24 hours of tin plating. 26 DEGREE REFLOW PROFILE 3 2 6 to 1 s e c 2 1 1 6 to 18 s e c 1 C to 2 C 1 to 3 This part is compliant with EU Directive 22/95/EC (RoHS) and does not contain lead, mercury, cadmium (.1%), hexavalent chromium, PBB or PBDE in concentrations greater than.1%, except as 2
D-pak BOM 3 Chip Silicon.713 Si 744-21-3.713 1% 1.9% Encapsulant Epoxy Resin.11419 Lead Frame Copper.244 SiO 2 7631-86-9.9136 8% 24.8% Epoxy 9598-46-2.1142 1% 3.1% Cu 744--8.23992 99.8% 65.1% Die Attach Pb 7439-92-1.258 95.5%.7% Soft.27 Sn 744-31-5.5 2%.% Solder Ag 744-22-4.7 2.5%.% Wire Bond Aluminum.8 Al 7429-9-5.8 1%.2% Lead Finish Matte Tin*.32 Sn 744-31-5.32 1%.7% Total.36842 *Tin whisker mitigation strategy is 1 C, 1 hour anneal within 24 hours of tin plating. 26 DEGREE REFLOW PROFILE 3 2 6 to 1 s e c 2 1 1 6 to 18 s e c 1 C to 2 C 1 to 3 This part is compliant with EU Directive 22/95/EC (RoHS) and does not contain lead, mercury, cadmium (.1%), hexavalent chromium, PBB or PBDE in concentrations greater than.1%, except as 3
D-pak BOM 4 Chip Silicon.713 Si 744-21-3.713 1% 1.9% Encapsulant Epoxy Resin.11419 Lead Frame Copper.244 SiO 2 7631-86-9.9136 8% 24.8% Epoxy 9598-46-2.1142 1% 3.1% Cu 744--8.23992 99.8% 65.1% Pb 7439-92-1.262 97%.7% Die Attach Soft Solder.27 Ag 744-22-4.8 3%.% Wire Bond Aluminum.8 Al 7429-9-5.8 1%.2% Matte Tin Ni 744-2-. 16%.1% Lead Finish.32 Over Nickel* Sn 744-31-5.27 84%.7% Total.36842 *Tin whisker mitigation strategy is nickel under-plate. 26 DEGREE REFLOW PROFILE 3 2 6 to 1 s e c 2 1 1 6 to 18 s e c 1 C to 2 C 1 to 3 This part is compliant with EU Directive 22/95/EC (RoHS) and does not contain lead, mercury, cadmium (.1%), hexavalent chromium, PBB or PBDE in concentrations greater than.1%, except as 4
D-pak BOM 5 Chip Silicon.713 Si 744-21-3.713 1% 1.9% Encapsulant Epoxy Resin.11419 Lead Frame Copper.244 SiO 2 7631-86-9.9136 8% 24.8% Epoxy 9598-46-2.1142 1% 3.1% Cu 744--8.23992 99.8% 65.1% Die Attach Pb 7439-92-1.2 92.5%.7% Soft.27 In 744-74-6.13 5%.% Solder Ag 744-22-4.7 2.5%.% Wire Bond Aluminum.8 Al 7429-9-5.8 1%.2% Lead Finish Matte Tin*.32 Sn 744-31-5.32 1%.7% Total.36842 *Tin whisker mitigation strategy is 1 C, 1 hour anneal within 24 hours of tin plating. 26 DEGREE REFLOW PROFILE 3 2 6 to 1 s e c 2 1 1 6 to 18 s e c 1 C to 2 C 1 to 3 This part is compliant with EU Directive 22/95/EC (RoHS) and does not contain lead, mercury, cadmium (.1%), hexavalent chromium, PBB or PBDE in concentrations greater than.1%, except as 5
D-pak BOM 6 Chip Silicon.713 Si 744-21-3.713 1% 1.9% Encapsulant Epoxy Resin.11419 Lead Frame Copper.244 Die Attach Soft Solder.27 SiO 2 7631-86-9.9136 8% 24.8% Epoxy 9598-46-2.1142 1% 3.1% Cu 744--8.23992 99.8% 62.4% Pb 7439-92-1.258 95.5%.7% Sn 744-31-5.5 2%.% Ag 744-22-4.7 2.5%.% Wire Bond Aluminum.8 Al 7429-9-5.8 1%.2% Lead Finish Matte Tin Over Nickel*.32 Ni 744-2-. 16%.1% Sn 744-31-5.27 84%.7% Total.36842 *Tin whisker mitigation strategy is 1 C, 1 hour anneal within 24 hours of tin plating. 26 DEGREE REFLOW PROFILE 3 6 to 1 s e c 2 2 1 1 6 to 18 s e c 1 C to 2 C 1 to 3 This part is compliant with EU Directive 22/95/EC (RoHS) and does not contain lead, mercury, cadmium (.1%), hexavalent chromium, PBB or PBDE in concentrations greater than.1%, except as 6
D-pak Test Definition Room Temperature Humidity Temperature Storage Humidity Unbiased Temperature Cycling Test Conditions Inspection Interval Class 1 and 2 Products Total Duration Class 1 and 2 Products Maximum Whisker Length (µm) 3± 2 C/6± 3% RH 1 hours 4 hours 2 55± 3 C/85± 3% RH 1 hours 4 hours 2-4 to 55 C to 8 to 95 C, air to air, 1 min soak, approx 3 cycles cycles 1 cycles 45 Tin Whisker testing per JESD21, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finish Tin Whisker Results (number of failing whiskers) Test 1 Hours 2 Hours 3 Hours 4 Hours Room Temperature /6 /6 /6 /6 Temperature Humidity Humidity /6 /6 /6 /6 Unbiase Test Cycles 1 Cycles 1 Cycles Temperature Cycling /6 /6 /6 7