LIGHT EMITTING DIODE SPECIFICATION DESCRIPTION: XT1-2835BXXY-CN

Transcription

1 LIGHT EMITTING DIODE SPECIFICATION DESCRIPTION: XT1-2835BXXY-CN REVISION: V1.2 ISSUE DATE: 2014/04/18 1 / 15

2 Revision Note Date Revision Page Vision 2013/11/21 Initiate Document 1~12 Preliminary 2013/12/30 Specification updated 1~15 V /01/07 Change VF BIN Code 1~15 V /04/18 Change VF BIN Code 1~15 V1.2 2 / 15

3 Lighting LED Specification XT1-2835BXXY-CN White LED Specification Features Feature of the device: Small package with high efficiency Typical view angle: 120 Typical light flux output: 20 60mA. Soldering methods: SMT Grouping parameter: Brightness, Forward Voltage and Chromaticity. The product itself will remain within RoHS compliant version. Applications LED Bulb application Plate lighting source Panel Light luminaire Indicator & in-direct lighting Retrofit applications Materials Items Description Housing Encapsulating Resin Electrodes Die attach Chip Heat resistant polymer Silicone resin Ag plating copper alloy Thermal conductive paste InGaN 3 / 15

4 Product Nomenclature XT BXXY - CN Where: Group 1 (XT1) : LumenMax PLCC 2835 family Group 2 (2835) : Package size 3.5 mm x 2.8 mm Group 3 (B X X Y) : CR Cool white / CRI 80 up NR Natural white / CRI 80 up WR Warm white / CRI 80 up Group 4 (CN) : Operating current 60mA, NO Zener chip 4 / 15

5 Absolute Maximum Ratings (T A =25 ) Parameter Symbol Rating Unit DC Forward Current (1) I FD 75 ma Peak Pulse Current (tp 10ms,Duty cycle=1/10) I FP 180 ma Reverse Voltage V R (2) V Reverse Current I R 10 ua ESD Sensitivity (HBM) VB 2,000 V LED Junction Temperature T j 125 Operation Temperature T opr -40~80 Storage Temperature T stg -40~80 Peak Soldering Temperature T sol 260 Note. 1. The solder pad temperature must be lower 80 C. (Ts<80 C) 2. LEDs are not designed to be driven in reverse bias. Electrical-Optical Characteristics For Individual LED (T A =25 ) Parameter Symbol Color Bin Min Max Unit Condition Cool White Brightness(1) Ф v Natural white lm I F =60mA Warm white Color rendering Index(2) CRI ALL R % Note. 1. Brightness is measured with an accuracy of ± 10%. 2. CRI measurement tolerance is ± 3. 5 / 15

6 Parameter Symbol Bin Min Max Unit Condition VA VB VC Forward Voltage V F VA V I F =60mA VB VC VA Note. Forward Voltage measurement tolerance is ± 0.1V. Dimensions 6 / 15

7 Chromaticity Coordinate Groups Cool White Note Macadam ellipse 3step,tolerance: ± 0.5 step 2. 65/STUV 57/STUV 50/STUV Macadam ellipse 5step,tolerance: ± 0.5 step Item Central CIE(X,Y) (0.3123,0.3282) (0.3287,0.3417) (0.3447,0.3553) g g g / 15

8 Cool White 7050K 70Y C 70D 70Z K 65X 65Y B 65A 65W C 65D 65Z K 57X 57Y B 57A 57W C D Z / 15

9 5000K 50X 50Y B 50A 50W C 50D 50Z Note. 1. CIE-X Y measure tolerance: ± 0.01 Neutral White 9 / 15

10 Note Macadam ellipse 3step,tolerance: ± 0.5 step 2. 40/STUV Macadam ellipse 5step,tolerance: ± 0.5 step Item 403 Central CIE(X,Y) (0.3818,0.3797) g g g Neutral White 4500K 45X 45Y B 45A 45W C 45D 45Z K 40X 40Y B 40A 40W C 40D 40Z Note. 1. CIE-X Y measure tolerance: ± / 15

11 Warm White Note Macadam ellipse 3step,tolerance: ± 0.5 step 2. 35/STUV 30/STUV 27/STUV Macadam ellipse 5step,tolerance: ± 0.5 step Item Central CIE(X,Y) (0.4073,0.3917) (0.4338,0.4030) (0.4578,0.4101) g g g / 15

12 Warm White 3500K 35A B 35C 35D K 30A B 30C 30D K 27A B 27C 27D Note. 1. CIE-X Y measure tolerance: ± / 15

13 Carrier Tape Dimensions: Standard loaded quantity 3000pcs per reel Reel Specification 13 / 15

14 Storage (1) Do not open moisture proof bag before the products are ready to use. (2) Before open the package. The LEDs should kept at 30 and 90%RH or less (3) After open the package, the SMD LED should be kept at 28, 60%RH or less. (4) If the moisture absorbent material has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 60 for 24 hours Soldering Manual Soldering (We do not recommend this method strongly) Soldering tin material: tin 6/4 alloy or contained Ag. To prevent cracking, please bake before manual soldering. Keep the temperature on the edge of iron at 300 Max.(25W)and apply for 3 seconds. If the temperature becomes higher, apply in a shorter time (1sec). In manual soldering, take care not to damage the package especially terminal or resin.(do not give stress to the product when soldering) Do not use again if you remove the soldered product. It is recommended using an iron with a temperature control. 14 / 15

15 Reflow Soldering Recommend tin glue specifications: Melting temperature: 150~260 Contains: Sn96.5%,Ag3.0%,Cu 0.5% JIS Z 3282 TEST Never take next process until the component is cooled down to room temperature after reflow The recommended reflow soldering profile (measuring on the surface of the LED resin) is following Cleaning The conditions of cleaning after soldering: An alcohol-based solvent such as Isopropyl Alcohol (IPA) is recommended. Temperature Time :< 50 30sec, or <30 3min Ultra sonic cleaning :< 15W/bath volume: 1 liter max Curing: 100 max,<3min Cautions of Pick and Place It should be avoided to load stress on the resin during high temperature. Avoid rubbing or scraping the resin by any object. Electric-static may cause damage to the component. Please confirm that the equipment is grounding well. Using an ionizer fan is recommended. Cautions of Design and Applications It should be done to connect with a current-limiting serial resistor. Avoid to drive reverse voltage over the specifications on LED when ON/OFF Any application should refer to the specifications of absolute maximum ratings. The dimensions of the recommended soldering pattern may not meet every user. Please confirm and study first before designing the soldering pattern in order to obtain the best performance of soldering. Do not contact with any component on the assembly board. 15 / 15