VOC-FREE, NO-CLEAN, SPRAYABLE FLUX TYPE PACIFIC 2009MLF-E

Transcription

1 INTERFLUX ELECTRONICS NV T E C H N I C A L D A T A VOC-FREE, NO-CLEAN, SPRAYABLE FLUX TYPE PACIFIC 2009MLF-E Description: PacIFic 2009MLF-E is an optimised version of the PacIFic 2009MLF. The flux will leave less residues after soldering but maintains its property to reduce micro solder balling. Conventional VOC -free fluxes can give more solder balling than alcohol based fluxes on some micro-ball sensitive solder masks. PacIFic 2009MLF-E minimises solder balling on these solder masks. PacIFic 2009MLF-E is absolutely halogen free. The flux allows a change over from alcohol based fluxes to water based fluxes with absolutely no disadvantages. PacIFic 2009MLF-E is perfectly suitable for lead-free soldering and can be used in spray applications. Why VOC-free? No more risk of fire caused by flux inflammation; No more Volatile Organic Compounds emission caused by flux evaporation; No more irritating alcohol smell in your productioncaused by flux evaporation; No more use of flux thinner; No checking of flux quality needed; Improvement in solderability and cleanliness; Lower flux transport, storage and insurance costs; A reduction of circa 30% in flux consumption. Physical and chemical properties: Density at 20 C : 1.00 g/ml +/-0.01 Colour : clear Odour : Sweet smell Solid content : 3.6% +/-0.2 Halide content : none Flash point (T.O.C.) : n.a Total Acid Number : 25 mg KOH/g +/- 2 IPC/EN : OR/L0 Spray fluxing More flux will give less solder balls. More flux gives also more residues, so an optimal spray volume has to be determined. Because the main cause of solder balling is the solder mask, this optimal spray volume can vary a bit from solder mask to solder mask. Check the spray pattern by passing a card board through the machine. The card board must equally be wetted by the flux. If not, adapt your lateral spray speed, spray pitch or spray volume until you get an even wetting of the flux. To check good top side wetting of the flux, apply some flux to the through hole components on top of the board with a spray bottle or brush and compare the through hole wetting results with your original results. If there is a difference, your spray fluxer settings will have to be 26/06/2006 PAGE 1 OF 2 PACIFIC 2009MLF-E V.O.C. FREE NO-CLEAN SOLDERING FLUX N.V. INTERFLUX ELECTRONICS S.A. Eddastraat 51 BE-9042 Gent ½ Web :

2 INTERFLUX ELECTRONICS NV T E C H N I C A L D A T A adapted. You can either bring the fluxer closer to the board, give more flux, spray slower, or give more air pressure. If none of the above works, contact Interflux Electronics. Preheating All water should be evaporated before hitting the wave. The recommended preheat temperature measured on the topside of the board is 85 C- 160 C. Avoid hot air preheating settings above 150 C Packaging: 10 litres polyethylene drums. 25 litres polyethylene drums 200 litres polyethylene drums. Because we cannot anticipate or control the many different conditions under which this information and our products may be used, we do not guarantee the applicability or the accuracy of this information or the suitability of our products in any given situation. Users of our products should make their own test to determine the suitability of each such product for their par ticular purposes. The product discussed is sold without such warranty, either express or implied. Copyrights reserved to Interflux Electronics NV 26/06/2006 PAGE 2 OF 2 PACIFIC 2009MLF-E V.O.C. FREE NO-CLEAN SOLDERING FLUX N.V. INTERFLUX ELECTRONICS S.A. Eddastraat 51 BE-9042 Gent ADVANCE TECH SERVICES PVT. LTD , GD-ITL Towers, B-8, Netaji Subhash Place, Pitampura, Ring Road, New Delhi Ph : upto 27, Fax : info@advancetechonline.in web: B.O : Bangalore Pune PRODUCT RANGE: Soldering Desoldering for SMD/PTH, Solder POT, Electric Screw Drivers, Pneumatic Screw Driver, Torque Meter, Screw Torque deciders, Screw Feeders, Balancer, Torque Arm, Air Dispenser, Air Free Dispenser, Syringes and Barrel for dispenser, Flux, Spray Fluxer, Desolder Wick, Static Charge Meter, Ionizers, Ion Gun, Illuminated Magnifiers, Hand tools (Cutter, strippers, Pliers, crimper, Cable cutters etc.. ESD Products, Peelable Mask, Solder Bath Treatment, Rework Pens (Conductive pen, flux pen, green over coat pen, conformal coating remover pen), Imported 2/2 Web :

3 INTERFLUX ELECTRONICS NV MATERIAL SAFETY DATA SHEET Date of publication : 08/05/06 Date of revision : 11/01/07 SAFETY DATA SHEET Version : 2 International Standard ISO PRODUCT AND COMPANY IDENTIFICATION Product name : PacIFic 2009MLF-E V.O.C. Free No-Clean Soldering flux Manufacturer : Interflux Electronics NV Eddastraat 51 BE Gent Tel. Nr. : Fax nr. : Collect call for emergency: (Chemtrec) 2. COMPOSITION AND INFORMATION ON INGREDIENTS The soldering flux PacIFic 2009MLF-E is a preparation. Chemical nature Components contributing to the hazard : Materials CAS N % Range 1. Water / 90-98% 2. Proprietary ingredients / 2-10 % This information is strict confidential and will only be given on request of a doctor or a medical department who is obligated to a total confidentiality. 3. HAZARDS IDENTIFICATION Hazard designation : None. Specific hazards for humans and environment : None. Physical and chemical hazard : - Instability : The product is stable. - Incompatibility : Avoid contact with bases, reducing and oxidising agents. - Decomposition : None. - Polymerisation : Will not occur. 4. FIRST-AID MEASURES Inhalation Skin contact Eye contact Ingestion : Not applicable. : Wash the exposed area with soap and water. : Flush with copious amounts of water for 15 minutes, call physician. : Do not induce vomiting, call physician. 11/01/2007 PAGE 1 OF 4 PACIFIC 2009MLF-E V.O.C. FREE NO-CLEAN SOLDERING FLUX N.V. INTERFLUX ELECTRONICS S.A. Eddastraat 51 BE-9042 Gent Tel.: Fax:

4 INTERFLUX ELECTRONICS NV MATERIAL SAFETY DATA SHEET 5. FIRE-FIGHTING MEASURES Suitable extinguishing media : Not applicable. Protection of fire-fighters : None. Fire & explosion hazards : None. Special protective equipment for a fire : None. Flash point : None. 6. ACCIDENTAL RELEASE MEASURES Personal precautions Environmental precautions Methods for cleaning up : Wash hands after use. Preventive precautions for the skin are recommended. : Do not allow spill to spread to sewer or ground. Wash area thoroughly. Contain spill at source by absorbing with sand or other absorbent material. : Scrape up spill. Wipe with rags. Dispose of waste rags in plastic container. Ensure spills are completely cleaned up since this product will dry by evaporation. 7. HANDLING AND STORAGE Handling Technical measures : A good ventilation in the working area is recommended. Keep the container tightly closed. Store at 5 C - 30 C. Precautions for safe handling : General ventilation should be provided. Storage Technical measures : Keep container tightly closed in a cool, well-ventilated - place. Keep away from direct sunlight. PacIFic 2009MLF-E has a shelf life of 12 months when stored in original containers at ambient temperatures. Storage class : LGK 12 VbF-class : None. Storage conditions : Please refer to the above section Technical Measures. Incompatibility of the product : Not applicable. Safe packaging materials : Recommended by manufacturer. 8. EXPOSURE CONTROLS / PERSONAL PROTECTION Engineering measures : Refer to section 7. Control parameters : Not applicable for this product. 11/01/2007 PAGE 2 OF 4 PACIFIC 2009MLF-E V.O.C. FREE NO-CLEAN SOLDERING FLUX N.V. INTERFLUX ELECTRONICS S.A. Eddastraat 51 BE-9042 Gent Tel.: Fax:

5 INTERFLUX ELECTRONICS NV MATERIAL SAFETY DATA SHEET Personal protective equipment Special instructions for protection and hygiene : Industrial hygiene is always recommended. Wash the hands with water and soap after working. Respiratory protection : None required if adequate ventilation is present. Hand protection : Protective gloves, preferable in rubber. Eye protection : Use safety glasses. Skin and body protection : Additional protection equipment is normally not required. 9. PHYSICAL AND CHEMICAL PROPERTIES Physical state : Liquid Colour : clear Odour : Sweet smell ph (flux as received) : 3 Boiling point/range : 100 C Flash Point : None Autoignition : Not applicable Melting point : Not applicable Explosion Limits in air upper : None lower : None Relative Density : 1.00 g/ml ±0.01 Solubility in water : Completely DynamicViscosity 20 C : Not available Evaporation rate (Ether = 1) : Not available 10. STABILITY AND REACTIVITY Stability : Stable. Hazardous reactions : May react with oxidising and reducing agents. Conditions to avoid : Excessive heat, strong light. Materials to avoid : May react with oxidising & reducing agents. Hazardous decomposition products : None. 11. TOXICOLOGICAL INFORMATION Acute toxicity : Interflux PacIFic 2009MLF-E is a non-corrosive and non-toxic product. Other information on health effects: Proprietary ingredient(s) Risk effects on humans Skin contact : Can give a slight irritation. Eye contact : Can give a slight eye irritation. 11/01/2007 PAGE 3 OF 4 PACIFIC 2009MLF-E V.O.C. FREE NO-CLEAN SOLDERING FLUX N.V. INTERFLUX ELECTRONICS S.A. Eddastraat 51 BE-9042 Gent Tel.: Fax:

6 INTERFLUX ELECTRONICS NV MATERIAL SAFETY DATA SHEET Chronic health effects : Not established. 12. ECOLOGICAL INFORMATION General information : water pollution risk : WGK DISPOSAL CONSIDERATIONS Product : Recommendation : Must be disposed as a chemical disposal. The disposal must be carried out according to the Federal State and Local Regulations. Packaging : Recommendation : Disposal must be done according to official regulations. 14. TRANSPORT INFORMATION International regulations Road & Rail (ADR/RID) - Sea (IMDG) - Air (ICAO-TI/IATA-TI) : Non dangerous goods. Number of statistics : REGULATORY INFORMATION Information on the warning label : None. S - phrases : S24/25 : Avoid contact with the skin and the eyes. Other Legal Regulations German water pollution risk (WGK) : 0 No polluting substance. Substances that affect the ozone layer : Substances that affect the ozone layer are not present in this preparation and are not used for its production. EINECS : All ingredients have been registered. 16. OTHER INFORMATION Product information in other European languages can be obtained at Interflux Electronics NV, 9042 Gent. Because we cannot anticipate or control the many different conditions under which this information and our products may be used, we do not guarantee the applicability or the accuracy of this information or the suitability of our products in any given situation. Users of our products should make their own tests to determine the suitability of each such product for their particular purposes. The products discussed are sold without such warranty, either expressed or implied. Copyrights reserved to Interflux Electronics NV 11/01/2007 PAGE 4 OF 4 PACIFIC 2009MLF-E V.O.C. FREE NO-CLEAN SOLDERING FLUX N.V. INTERFLUX ELECTRONICS S.A. Eddastraat 51 BE-9042 Gent Tel.: Fax:

7 HOW TO IMPLEMENT VOC FREE FLUX INTO YOUR FOAMING PROCESS?

8 VOC FREE FLUX PACIFIC 2010 F for FOAM Applications Be sure that your flux tank and your foam stone are not polluted by your present flux. If necessary replace the foam stone and the tubes. Fill your flux tankto itsmaximumi level. l Adjust your air supply till you get a fine bubble layer of foam on the topside of the foam nozzle, preventing too slow an overflow.

9 THEFOAMFLUXER FLUXER 4-10 mm (¼ inch) foam Flux level 2-3cm (1 inch) flux Air stone 20µ

10 THE FOAM FLUXER Minimal contact with PCB (< 2 cm) ; kiss fluxing! Opening fluxer nozzle : 4-10 mm Air stone : 20µ pores Flux level : 2-3cm above the air stone (must stay constant for stable foam!) Never start up foam fluxer without air knife!

11 Advantages : Cheap, easy FOAM FLUXING Equal spreading Good capillary working Disadvantages : Sensitive to warm carriers Evaporation, open to external contamination (air, PCB,...), accelerated formation of fungus

12 HOW TO PREVENT FUNGUS FORMATION IN YOUR FOAMFLUXER WITHOUT USING POISON IN THE FLUX! Pump Min.3 cm UV-tube tb Overflow tube of flux Drum or reservoir

13 VOC FREE FLUX PACIFIC 2010 F for FOAM Applications To check kif the speed of overflow is sufficient, i you blow into the foam, the foam will break down due to the heat of your breath, and what is important is that the foam building recuperates very quickly. This simulates a hot carrier that enters into your foam. When the foam does not recuperate immediately the first part of your PCB will not be fluxed, creating all sorts of defects. I th fl h b t d tt t l th In case the flux has been stored at temperature lower than room temperature: be aware that the foam formation can change during the heating up period till the flux reaches the room temperature.

14 VOC FREE FLUX PACIFIC 2010 F for FOAM Applications Always use an air knife in No Clean applications! (available at Interflux) Reasons: - to take away the excess of flux, resulting in less need of heat and results in reduction of the consumption; - to secure there is enough flux into the holes. - To reduce the fire risk