Material Declaration Data Sheet - v002
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1 Schema Database Version* IEC X3.00 Substance Database Version* IEC D7.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Michael D Harrigan Response Document ID 9307 Contact Title* Intel Product Ecology Company Unique ID Contact Phone* Unique ID Authority Dun and Bradstreet Contact * productecology@intel.com Response Date* 3/23/2015 Supplier Comments - Intel certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Intel completes this form. Intel acknowledges that Customer will rely on this certification in determining the compliance of its products. Customer acknowledges that Intel may have relied on information provided by others in completing this form, and that Intel may not have independently verified such information. However, in situations where Intel has not independently verified information provided by others, Intel agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Customer and the Intel enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Intel's liability and the Customer's remedies for issues that arise regarding information the Intel provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Intel's Standard Terms and Conditions of Sale applicable to such part shall apply. Product(s) Product Family Name: None Requester Item Mfr Item Number* Mfr Item Number Description WGI219-LM; WGI219V Declaration WGI219-LM; WGI2119V Intel Ethernet Connection I219- LM QFN48; I219V QFN48 Effective Date* Mass* UOM* Comment 3/23/ g
2 This product does not contain PVC This product is Low Halogen (Components): Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. Intel components as well as purchased components on the finished assembly meet the joint JEDEC/ECA JS-709A requirement. This product is Low Halogen (PCB): Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) in the PCB laminate. The replacement of halogenated flame retardants may not be better for the environment. The PCB / substrate meet IEC requirements. This product is EU RoHS 2 (Directive 2011/65/EU) compliant. Signature True True True True RoHS Homogeneous Material Name Material Class ID HM Mass % Substance Group Cadmium/Cadmium Chromium (VI) Lead/Lead Mercury/Mercury Polybrominated Biphenyls (PBBs) Polybrominated Diphenylethers (PBDEs) Reportable Application, except batteries, except for batteries, cables and children s /toys, except batteries Reporting Threshold 0.01 mass% of total Cd in 0.1 mass% of total Cr+6 in 0.1 mass% of total Pb in Intentionally Added or 0.1 mass% of total Hg in 0.1 mass% in 0.1 mass% in Above Threshold? (T/F) Substance Mass % Exemption Comments Low Halogen Homogeneous Material Material Substance Group Reportable Reporting Above Substance Comments
3 Material Name Class ID Mass% Application Threshold Threshold? (T/F) Brominated flame retardants (other than Plastic s 0.1 mass% of PBBs, PBDEs, or HBCDD) except printed bromine wiring board laminates PVC M Other Declarable Substances Brominated flame retardants (other than PBBs, PBDEs, or HBCDD) Chlorinated Flame Retardants (CFR) Chlorinated Flame Retardants (CFR) Printed wiring board laminate Plastic s except printed wiring board laminates Printed Wiring Board (PWB) Laminates 0.09 mass% total bromine content in laminate 0.1 mass% chlorine 0.09 mass% total chlorine content in laminate Mass% of Material Substance Group Substance CAS # Reportable Application Reporting Threshold Above Threshold? (T/F) Substance Mass (% of Product) 4-Nonylphenol, 0.1 mass% branched and linear, ethoxylated [substances with a linear and/or branched alkyl chain with a carbon number of 9 covalently bound in position 4 to phenol, ethoxylated covering UVCB- and welldefined substances, polymers and homologues, which include any of the individual isomers and/or combinations thereof] Asbestos Intentionally added Azocolourants and Textiles and Leather 0.003% by weight of azodyes which form the finished certain aromatic textile/leather product amines Cadmium/Cadmium Batteries 0.001% by weight of battery Comments
4 Cadmium/Cadmium Dibutyltin (DBT) Dibutyltin (DBT) Dioctyltin (DOT) Cadmium sulphide mass% Dibutyltin dichloride (DBTC) 0.1 mass% of tin in the part mass% (a) textile and leather 0.1 mass% of tin in intended to the part come into contact with the skin, (b) childcare, (c) twocomponent room temperature vulcanisation moulding kits (RTV-2 moulding kits) Disodium tetraborates 0.1 mass% Fluorinated Intentionally Added Greenhouse Gases (PFC, SF6, HFC) Hexabromocyclodode cane (HBCDD) and all major diastereoisomers Intentionally added or 0.1 mass% Hexahydromethylphth alic anhydride Lead/Lead Lead/Lead Lead/Lead Hexahydromethylphth alic anhydride [1], Hexahydro-4- methylphthalic anhydride [2], Hexahydro-1- methylphthalic anhydride [3], Hexahydro-3- methylphthalic anhydride [4] mass% Consumer products designed or intended primarily for children 12 years of age or younger Paint and similar surface coatings of toys and other intended for use by children Cables/cords with thermoset or thermoplastic coatings 0.01 mass% mass% of surface coating 0.03 mass% of surface coating
5 Lead/Lead Mercury/Mercury Ozone Depleting Substances (CFC, Halon, HBFC, HCFC & others) Batteries mass% of battery Batteries Intentionally added or mass% of battery Intentionally Added Perchlorates 6 x 10 ^-7 mass% of battery or product part Perfluorooctane sulfonates (PFOS) Textiles or other coated s. Intentionally added or 1 microgram/m2 of coated Perfluorooctane sulfonates (PFOS) Perfluorooctanoic acid (PFOA) and individual salts and esters of PFOA Perfluorooctanoic acid (PFOA) and individual salts and esters of PFOA Phthalates, Selected Group 1 (BBP, DBP, DEHP) Phthalates, Selected Group 2 (DIDP, DINP, DNOP) Polychlorinated Biphenyls (PCBs) and specific substitutes Polychlorinated Naphthalenes (PCNs) Polychlorinated Terphenyls (PCTs) Radioactive substances except textiles or other coated s. Intentionally added or 0.1 mass% of the part (as the sum of PFOS) Textiles, photographic 1 microgram/m2 (as coatings applied to the sum of PFOA) films, paper or printing plates and other coated consumer products. except textiles, 0.1 mass% of the part photographic coatings (as the sum of PFOA) applied to films, paper or printing plates and other coated consumer products. Children's toy or child care article Children's toy or child care article that can be placed in a child's mouth 0.1 mass% as the sum of the phthalate concentrations in plasticized 0.1 mass% as the sum of the phthalate concentrations in plasticized Intentionally added Intentionally added mass% in Intentionally added
6 Refractory Ceramic Fibres (RCF), Aluminosilicate Refractory Ceramic Fibres (RCF), Zirconia Aluminosilicate Shortchain Chlorinated Paraffins (C10 C13) Tri-substituted organostannic [Phthalato(2- )]dioxotrilead 1,2- Benzenedicarboxylic acid, di-c6-8- branched alkyl esters, C7-rich (DIHP) 1,2- Benzenedicarboxylic acid, di-c7-11- branched and linear alkyl esters (DHNUP) 1,2- Benzenedicarboxylic acid, dihexyl ester, branched and linear 1,2- Benzenedicarboxylic acid, dipentylester, branched and linear 0.1 mass % 0.1 mass % Intentionally added or 0.1 mass% Intentionally added or 0.1 mass% of tin in the part mass% mass% mass% mass% mass% 1,2-bis( mass% methoxyethoxy)ethane (TEGDME; triglyme) 1,2-Diethoxyethane mass% 1,2-dimethoxyethane; mass% ethylene glycol dimethyl ether (EGDME) 4-(1,1,3, mass% tetramethylbutyl)phen ol, (4-tert- Octylphenol) 4-Aminoazobenzene mass%
7 Ammonium mass% pentadecafluorooctano ate (APFO) Benzo[a]anthracene Rubber or plastic parts mass% of the Benzo[a]anthracene Rubber or plastic parts that come into Benzo[a]pyrene Rubber or plastic parts that come into Benzo[a]pyrene Rubber or plastic parts mass% of the Benzo[b]fluoranthene Rubber or plastic parts mass% of the Benzo[b]fluoranthene Rubber or plastic parts that come into Benzo[e]pyrene Rubber or plastic parts mass% of the
8 Benzo[e]pyrene Rubber or plastic parts that come into Benzo[j]fluoranthene Rubber or plastic parts mass% of the Benzo[j]fluoranthene Rubber or plastic parts that come into Benzo[k]fluoranthene Rubber or plastic parts mass% of the Benzo[k]fluoranthene Rubber or plastic parts that come into Benzylbutylphthalate (BBP) mass% Beryllium Oxide mass% Bis(2-methoxyethyl) mass% ether Bis(2-methoxyethyl) mass% phthalate Boric acid 0.1 mass% Cadmium mass% Cadmium oxide mass%
9 Chrysen Rubber or plastic parts mass% of the Chrysen Rubber or plastic parts that come into Cobalt Dichloride mass% Decabromodiphenyl mass% ether Di( mass% ethylhexyl)phthalate (DEHP) Diarsenic pentoxide mass% Diarsenic trioxide mass% Dibenzo[a,h]anthracen Rubber or plastic parts mass% of the e Dibenzo[a,h]anthracen e Rubber or plastic parts that come into Diboron trioxide mass% Dibutylphthalate mass% (DBP) Diisobutyl phthalate mass% (DIBP) Di-isodecyl phthalate Intentionally added (DIDP) Diisononyl phthalate Intentionally added (DINP) Diisopentylphthalate (DIPP) mass%
10 Dimethyl Fumarate mass% of the (DMF) part Di-n-hexyl Phthalate Intentionally added or (DnHP) 0.1 mass% Dioxobis(stearato)trile mass% ad Dipentyl phthalate mass% (DPP) Disodium 3,3-[[1, mass% biphenyl]-4,4- diylbis(azo)]bis(4- aminonaphthalene-1- sulphonate) (C.I. Direct Red 28) Disodium 4-amino mass% [[4-[(2,4- diaminophenyl)azo][1, 1-biphenyl]-4-yl]azo]- 5-hydroxy-6- (phenylazo)naphthalen e-2,7-disulphonate (C.I. Direct Black 38) Fatty acids, C16-18, mass% lead salts Formaldehyde Textiles mass % of textile Imidazolidine mass% thione; (2- imidazoline-2-thiol) Lead (II) chromate mass% Lead chromate mass% molybdate sulphate red Lead cynamidate mass% Lead dinitrate mass% Lead oxide sulfate mass% Lead sulfochromate yellow mass% Lead titanium trioxide mass% Lead titanium mass% zirconium oxide N,Ndimethylformamide mass%
11 Nickel , where prolonged Intentionally Added skin contact is expected N-pentylisopentylphthalate mass% Orange lead (lead tetroxide) mass% Pentadecafluorooctano mass% ic Acid (PFOA) Pentalead tetraoxide mass% sulphate Pentazinc chromate mass% octahydroxide Phenol, 2-(2H Intentionally added benzotriazol-2-yl)-4,6- bis(1,1-dimethlethyl)- Potassium mass% hydroxyoctaoxodizinc ate dichromate Pyrochlore, antimony mass% lead yellow Silicic acid mass% (H2Si2O5), barium salt (1:1), lead-doped Strontium chromate mass% Sulfurous acid, lead mass% salt, dibasic Tetralead trioxide mass% sulfate Tributyl Tin Oxide Intentionally added or (TBTO) 0.1 mass% Trilead dioxide mass% phosphonate Tris (2-chloroethyl) mass% phosphate (TCEP) Trixylyl phosphate mass%
Material Declaration Data Sheet - v002
Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D7.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Alisha Peterson
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D7.00 Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Timothy R McWilliams
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D7.00 Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* John P Gustavson Response
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D5.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Robert Soderberg
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D5.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Robert Soderberg
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D5.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* John P Gustavson
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D9.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Alisha Peterson
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D9.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Alisha Peterson
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D9.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Nima Khalily
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D11.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Christopher
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D11.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Chris Woodbury
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D11.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Evelyn L
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D11.00 Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Dennis Michael Harrigan
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Schema Database Version* IEC 62474 X3.00 Database Version* IEC 62474 D9.00 Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Syeda J Ahmed Response Document
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D11.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Jeff Pasternak
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D11.00 Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* James P Butler Response
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Schema Database Version* IEC 62474 X3.00 Database Version* IEC 62474 D11.00 Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* ison Managlia Response Document
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D11.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Jeff Pasternak
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D11.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Jeff Pasternak
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D11.00 Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* James P Butler Response
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Schema Database Version* IEC 62474 X3.00 Substance Database Version* IEC 62474 D11.00 Material Declaration Data Sheet - v002 Supplier Information Company Name* Intel Corporation Contact Name* Jeff Pasternak
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D14.00 Supplier Information Material Data Declaration Sheet - v003 Company Name * Intel Corporation Contact Name * Brand,
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D14.00 Supplier Information Material Data Declaration Sheet - v003 Company Name * Intel Corporation Contact Name * Brand,
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D14.00 Supplier Information Material Data Declaration Sheet - v003 Company Name * Intel Corporation Contact Name * Muehlen,
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D14.00 Supplier Information Material Data Declaration Sheet - v003 Company Name * Intel Corporation Contact Name * Muehlen,
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D15.00 Supplier Information Material Data Declaration Sheet - v003 Company Name * Intel Corporation Contact Name * Larson,
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D15.00 Supplier Information Material Data Declaration Sheet - v003 Company Name * Intel Corporation Contact Name * Larson,
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Schema Database Version: IEC 62474 X6.01 Database Version: IEC 62474 D12.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Managlia, Allison
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Schema Database Version: IEC 62474 X6.01 Database Version: IEC 62474 D12.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Butler, James P Response
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Schema Database Version: IEC 62474 X6.01 Database Version: IEC 62474 D12.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Butler, James P Response
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Schema Database Version: IEC 62474 X6.01 Database Version: IEC 62474 D12.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Woodbury, Christopher
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Schema Database Version: IEC 62474 X6.01 Database Version: IEC 62474 D12.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Marquez, David M
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Schema Database Version: IEC 62474 X6.01 Database Version: IEC 62474 D12.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Marquez, David M
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D12.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Larson,
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D12.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Ochoa,
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D14.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Managlia,
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D14.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Managlia,
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Schema Database Version: IEC 62474 X6.01 Substance Database Version: IEC 62474 D14.00 Material Data Declaration Sheet - v003 Supplier Information Company Name * Intel Corporation Contact Name * Larson,
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