INFLUENCE OF ELECTRICALLY CONDUCTIVE ADHESIVE AMOUNT ON SHEAR STRENGTH OF GLUED JOINTS ON FLEXIBLE SUBSTRATES
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1 INFLUENCE OF ELECTRICALLY CONDUCTIVE ADHESIVE AMOUNT ON SHEAR STRENGTH OF GLUED JOINTS ON FLEXIBLE SUBSTRATES ABSTRACT: Martin Hirman and František Steiner Department of Technologies and Measurement Faculty of Electrical Engineering University of West Bohemia Univerzitni 26, Pilsen, Czech Republic This article deals with the influence of electrically conductive adhesive amount on shear strength of joints glue by EPO-TEK H20S and MG 8331S on two types of flexible substrates (MELINEX ST504, DuPont Pyralux AC). These joints were made by gluing of chip resistors 1206, 0805 and 0603 with two curing profiles for each adhesive and with two different curing technologies. The different thickness of stencils and reductions of the hole in stencils were used for the experiment. These differences have an effect on the amount of conductive adhesives on the samples. Samples were measured after curing process by using shear strength test with the device LabTest The article presents effects of different curing profiles, various flexible substrates and different amounts of the adhesives on the mechanical strength of the joint. Keywords: Electrically conductive adhesive, flexible substrate, shear strength, hot plate 1 INTRODUCTION Soldering is the most common used technology for conductive connection of components with substrates in electronic devices. In the past lead solder alloys were almost only used, but currently the lead solder alloys are prohibited by the European Directive RoHS (Restriction of Hazardous Substances) and WEEE (Waste Electrical and Electronic Equipment). Therefore lead free solder alloys or electrically conductive adhesives are used. The using of these materials has some differences. The lead free solder alloys have usually higher melting point than lead solder alloys and the electrically conductive adhesives have usually lower curing temperature than the melting point of the solder alloys but adhesives are hygroscopic and expensive. These properties are big disadvantages of these materials. A lot of experiments on rigid substrates with electrically conductive adhesives as lead solder replacement were already performed, e. g. [1], [2], [3], [4]. The other current trend is to use flexible and textile substrates in practical applications. Especially conductive adhesives can be used for the interconnection of these substrates. Such substrates can change properties of glued joints. The mechanical shear strength of the joint on flexible substrate can be also different in comparison with the shear strength of the joint on rigid substrate. This is the reason for the testing of electrically conductive adhesives on
2 flexible substrates. Due to the high price of electrically conductive adhesives, the research of influence of electrically conductive adhesive amount on shear strength of glued joints is important. Saving a small amount of adhesive on one joint could reduce the production costs significantly. Cost reduction is the reason for conducting the following experiment. 2 MATERIALS AND PROCEDURES Description of the experiment was creates as a process by using methodology BPMN 2.0 (Business Process Model and Notation). This process is shown in Figure 1. Fig. 1: Description of the experiment. 2.1 Flexible PCB The two different types of flexible substrates were used for the experiment. First type was the flexible printed circuit board DuPont Pyralux AC with copper conductive pattern without the surface finish (hereinafter referred to as FPCB Cu ) with size of each sample 28 mm x 53 mm. Second type was the flexible printed circuit boards MELINEX ST504 with silver conductive pattern DuPont 5064H (hereinafter referred to as FPCB Ag ) with size of each sample 35 mm x 60 mm. On both of them, the conductive pattern for gluing of ten SMD chip components was made on one side of printed circuit boards. Three types of samples for mount components with the size 1206, 0805 and 0603 were made for both substrates. Fig. 2: The sample of flexible printed circuit board with copper (left) and silver (right) conductive pattern.
3 2.2 Components For the experiment SMD chip resistors with the resistance 0 Ω and with the sizes 1206, 0805 and 0603 were used. All contacts of chip resistors were surface finished by tin. Fig. 3: The flexible PCB with placed 1206 (left) and 0805 (right) chip resistors. 2.3 Electrically conductive adhesives The two different electrically conductive adhesives with silver flakes were selected for the experiment. The first adhesive brand name is EPO-TEK H20S and it is produced by the Epoxy technology Inc. The particle size of silver flakes in the adhesive is less than 20 μm and the adhesive has the resistivity 0,0005 Ω cm. The price of this adhesive is approximately 4,85 per gram including VAT. That is equal to 11,61 per cubic centimeter. The adhesive has five recommend curing profiles from 80 C per 90 minutes to 175 C per 45 seconds. The second adhesive brand name is 8331S and it is produced by the M.G. Chemicals Ltd. The adhesive has the resistivity 0,0060 Ω cm and the price of the adhesive is approximately 1,67 per gram including VAT. That is equal to 4,06 per cubic centimeter. The adhesive has four recommend curing profiles from 25 C per 96 hours to 100 C per 50 minutes. The both named adhesives are two-component and can be storage in room temperature. The storing in freezer is not recommended and it can be opportunity for reduce the costs for adhesives cooling of product manufacturers. 2.4 Amount of adhesives The stencil printing was used for applying of the electrically conductive adhesives on flexible printed circuit boards. For the experiment three different volumes of the adhesive were used (see Table 2). Reduction of width and length means that holes in the stencils were reduced about 5% and 20% of width and length due to pads in conductive pattern on flexible PCBs. The pads in pattern are standardized (see Table 1). Tab. 1: Size of the pads in pattern for all components. Size of the component Width 1,44 mm 0,71 mm 0,61 mm Length 1,64 mm 1,32 mm 0,86 mm Tab. 2: The parameters of used stencils and volume of the adhesives for 1206 component. Thickness of stencil 120 μm 120 μm 80 μm Reduction of width and length 5% 20% 20% Volume of adhesive 0,256 mm 3 0,181 mm 3 0,121 mm 3
4 The samples were weight by the analytical balances Kern ALJ and by the analytical laboratory balances Radwag XA 52/2X. The weight of one joint was calculated. 2.5 Curing profiles of adhesives The experiment comparing the shear strength of glued joints with using of different curing profiles was performed in past [5]. In mentioned experiment the best curing profiles for adhesives EPO-TEK H20S and MG 8331S were chosen. The profiles from the datasheets (120 C / 15 minutes and 100 C / 50 minutes) were used. Moreover for several reasons the newly defined profiles (135 C / 15 minutes and 130 C / 30 minutes) were used. The first assumption was that the higher curing temperature can improve mechanical strength of the joint and reduce the time for curing. The second assumption was to use of the adhesives on flexible substrates which usually have maximal allowable temperature under 150 C. From these reasons the temperatures were chosen which are higher but the substrates could endure it. All used profiles are stated in Table 3. Tab. 3: The curing profiles of the electrically conductive adhesives. Substrate Type of adhesive Sample Curing temperature Curing time Curing method A 120 C 15 minutes EPO-TEK H20S B 135 C 15 minutes FPCB Ag C 100 C 50 minutes MG 8331S D 130 C 30 minutes Hot air E 120 C 15 minutes EPO-TEK H20S F 135 C 15 minutes G 100 C 50 minutes FPCB Cu H 130 C 30 minutes MG 8331S I 100 C 50 minutes Hot plate J 130 C 30 minutes The laboratory drying oven Heraeus 5050 was used for curing of the adhesives. The temperature inside the drying oven was measured by special device made at the Department of Technologies and Measurement, see Figure 4. The special device for measuring of temperature was connected to the multimeter METRAHIT from the Gossen Metrawatt Company. This multimeter was connected to the computer and the profiles were recorded by software LabVIEW from National Instruments Company. Fig. 4: Device for measuring of temperature in drying oven. For the first part of the experiment standard curing by hot air were used. For the second part of the experiment special curing named snap curing by hot plate were used. The profiles from both methods of curing were tuned and the final profiles are shown in Figure 5.
5 2.6 Shear strength test Fig. 5: The temperature profiles used for curing of adhesives. The mechanical shear strength of glued joint was measured for each sample. The samples were glued to the rigid PCB before testing because the samples were flexible. The principal of mechanical shear strength test can be shown in Figure 6. The thorn pushes by force on the component until the disruption of the joint and shear off the component from PCB. The shear strength of the joint was not measured directly because surface under load is not known. The maximal force during the test was recorded. The device LabTest was used for recording of force acting on the chip resistor. The settings of the device are as follows: feed rate of shear thorn 20 mm/min, jaws return 200 mm/min, criterion of test end when reaching 70 % of maximal force (F max ). Ten components were measured for each sample and ten values of maximal force were statistically analyzed for each sample. Fig. 6: The device LabTest (upper-left side), the thorn with the sample (upper-right side, lower-left side), principle of shear strength test (lower-right side).
6 3 RESULTS AND DISCUSSION The maximal force to shear off the component from the flexible PCB was recorded when the mechanical shear strength test was performed. The recorded values were statistically analyzed and the results of this analyzes can be seen in Figure 7 9. Fig. 7: Boxplot of maximal force when shearing-off 1206 chip resistors glued on flexible PCB. Fig. 8: Boxplot of maximal force when shearing-off 0805 chip resistors glued on flexible PCB.
7 Fig. 9: Boxplot of maximal force when shearing-off 0603 chip resistors glued on flexible PCB. A full factorial analysis and methodology DOE (Design of Experiments) were used for evaluation of the results (for components 1206 and 0805). This methodology is often used for detection of more and less significant factors, e.g. [6]. The results of this analysis and the influence of each factor on the mechanical shear strength are seen in Figure 10. Fig. 10: Influence of factors on the mechanical shear strength from DOE methodology. The most significant factors are size of the component and type of the adhesive. Least significant factor is the type of substrates. Sharp drop of the mechanical shear strength between the samples with biggest amount of adhesive (100% - blue marked results) and less amount of adhesive (71% - red marked results, 47% - green marked results) is also seen in Figure 10. It follows that if the mechanical shear strength with 71% of adhesive is sufficient for our application, so we can reduce the
8 amount of adhesive at least on 47% of adhesive and the mechanical shear strength is still sufficient. As mentioned, the type of adhesive is the most significant factor in this experiment. It follows that option of the adhesive is very important and it is possible reach the better results by good choose of the adhesive. The type of substrate is the least significant factor but despite FPCB Ag has a little bit higher mechanical shear strength. Reasons of the higher mechanical shear strength are caused by the different production procedures and properties of substrates. The curing profile is relatively significant factor and newly designed curing profiles [5] have higher mechanical shear strength than profiles from datasheets. The research of these designed profiles will be continued. Substantial differences are not seen in comparison of the samples G and H (Hot air) and the samples I and J (Hot plate) in Figures 7-9. This is the reason of elimination of Hot plate technology from full factorial analysis. We expect that curing by hot plate is helpful for adhesives with short curing time (seconds or few minutes). Fig. 11: Detail of the joint glued by EPO-TEK H20S (left side) and by MG 8331S (right side) on the FPCB Ag. Fig. 12: Detail of the joint glued by EPO-TEK H20S (left side) and by MG 8331S (right side) on the FPCB Cu. The samples were observed by microscopic observation after the test and the typical results of this observation are seen in Figure 11 and 12. Separation of conductive pattern from substrate is seen in Figure 11. This separation is cause by production procedures and properties of the substrate. The cohesive fracture of the joint by EPO-TEK H20S is seen in Figure 12 on the left side. The adhesive fracture of the joint by MG 8331 is seen in Figure 12 on right side.
9 4 CONCLUSION The experiment proved influence of electrically conductive adhesive amount on shear strength of glued joints on flexible substrates. In general the electrically conductive adhesive MG 8331S seems to be the better choice for using on flexible substrates in terms of mechanical shear strength of joint. The results shows that increase of conductive pattern roughness ensure greater mechanical shear strength. As mentioned, the samples with adhesive 8331S on FPCB Cu show adhesive fracture between the conductive pattern and conductive adhesive. This fact is opportunity for the next experiments and for improving of the mechanical shear strength by roughening the copper conductive pattern. The results also shows that newly designed curing profiles increased mechanical shear strength of joints but the question is whether these profiles will not have worse properties after ageing or worse electrical properties. Therefore the research of the properties of electrically conductive adhesive on flexible substrates will be continued. 5 ACKNOWLEDGMENTS This research has been supported by the European Regional Development Fund and the Ministry of Education, Youth and Sports of the Czech Republic under the Regional Innovation Centre for Electrical Engineering (RICE), project No. CZ.1.05/2.1.00/ and by the Student Grant Agency of the University of West Bohemia in Pilsen, grant No. SGS "Technology and Materials Systems in Electrical Engineering. 6 REFERENCES [1] D. Busek, J. Selepova, and P. Mach, Correlations between mechanical and electrical parameters of modified electrically conductive adhesives, Proc th Int. Spring Semin. Electron. Technol., pp , [2] S. Barto, J. Cinert, and P. Mach, Influence of thermal aging on the reliability of electrically conductive adhesives, 2011 IEEE 17th Int. Symp. Des. Technol. Electron. Packag., pp , [3] R. Zhang, J. C. Agar, and C. P. Wong, Recent Advances on Electrically Conductive Adhesives, 12th Electron. Packag. Technol. Conf., no. c, pp , [4] J. Ocklenburg, E. Rastjagaev, and J. Wilde, Investigation of Modern Electrically Conductive Adhesives for Die-attachment in Power Electronics Applications, Electron. Components Technol. Conf. (ECTC 2013), pp , [5] M. Hirman and F. Steiner, A Comparison of the Shear Strength of Conductive Adhesives and Soldering Alloys, in Proceedings of the th International Spring Seminar on Electronics Technology, [6] Y. Gu and D. Jin, Drop test simulation and DOE analysis for design optimization of microelectronics packages, Proc. - Electron. Components Technol. Conf., vol. 2006, pp , 2006.
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