Basic Properties and Application Examples of

Transcription

1 Basic Properties and Application Examples of 1. Basic properties of PGS 2. Functions of PGS 3. Application Examples Presentation [Sales Liaison] Panasonic Electronic Devices Co., Ltd. Capacitor Business Unit PM Group Goods Team PGS Contact Direct Line (0774) [For inquiries of technology issues] Panasonic Electronic Devices Japan Co., Ltd. Ceramic Division Engineering Team4 PGS Contact Direct Line (0123)

2 PGS (Pyrolytic Highly Oriented Graphite Sheet) is made of graphite with a structure that is close to a single crystal, which is achieved by the heat decomposition of polymeric film. PGS is a competitive conductive sheet with high thermal conductivity and high flexibility. :C99.9% or more High heat conductivity: Each material has high heat conductivity. Diamond PGS 17 m PGS 25 m PGS 70 m PGS m 850W/mK 700W/mK 1750W/mK 1600W/mK NEW NEW Pure Copper Aluminum Magnesium alloy [Layered Structure ] 3.354~3.356 x 10-8 cm Stainless steel Heat-Conductive sheet Thermal Conductivity W/(m K) c axis a-b plane Flexibility: PGS is bending-resistant due to its flexibility. PGS can be used for areas such as curved surfaces and corners because its heat conductivity will remain unchanged in the absence of folds in PGS.

3 Flexibility of [Bending Test] [Bending Limitation] The sheet is fixed < 0.98N > Bending Angle 90 degrees Bending Radius( R ) R =2(mm) R =5(mm) 10,000 cycls,000 cycls or more or more Bend Radius: R 180 degrees 3,000 cycls or more 30,000 cycls or more Bending Angle 180 degrees Flexibility: PGS is bending-resistant due to its flexibility. PGS can be used for areas such as curved 90 degrees surfaces and corners because its heat conductivity will remain unchanged in the absence of folds in PGS.

4 Material Characteristics of Graphite Sheets NEW NEW 17 m 25 m 70 m m Thikness (mm) 0.017± ± ± ±0.030 Thermal Conductivity (W/(mK)) X,Ydirection Z direction 1700 to to to to Thermal diffusivity(cm 2 /s) Density (g/cm 3 ) Specific Heat (50 )(J/gK) 9 to 10 ( m 2 /s) 2.17 (2170 kg/m 3 ) 0.85 (850 J/kgK) 9 to 10 ( m 2 /s) 2.10 (2 kg/m 3 ) 0.85 (850 J/kgK) 9 to 10 ( m 2 /s) 1.10 (1 kg/m 3 ) 0.85 (850 J/kgK) 9 to 10 ( m 2 /s) 0.85 (850 kg/m 3 ) 0.85 (850 J/kgK) Heat resistance ( ) Extensional X,Ydirection strength (MPa) Z direction Bending test (times) (R5/180 ) Electric Conductivity (S/cm) 30,000 or more ( S/m) 30,000 or more ( S/m) 30,000 or more 00 ( S/m) 30,000 or more 00 ( S/m)

5 Applications of (two functions) 1)Thermal Transfer PGS Carrying the heat PGS A Diffusing the heat B Heat source (MPUs, PAs, Graphic chips, etc) B B A B B Heat sink Heat source 2)Thermal Interface Decreasing the thermal resistance and diffusing the heat B A Heat sink PGS Package Heat sink PGS Package Heat source Without PGS With PGS The peak temperature drops Surface temperature of the package

6 Application Example of (Transfer) Inspection 1 The heat transfer was monitored with thermograph after the heater was attached to the lower part of PGS, Copper and Aluminum. Size;18x180x0.1mm PGS Cu Al «Heat conductivity when the heater was on.» After 10 seconds «Cooling state when the heater was turned on during the heat balance state» After 20 seconds Resistance heater 10x10mm Applied voltage 8V (appro.12w) PGS Cu Al carries the heat rapidly due to high heat conductivity PGS Cu Al PGS has high cooling effect.

7 Application of (Transfer) Inspection 2 The heat transfer was monitored with thermograph after the heater was attached to the center part of PGS, Copper and Aluminum. [Measuring method] Resistance Heater Electric power 12W Ambient Temperature:25 deg.c Heater size 10 10mm Sample size(heat sink) mm *The surface of the samples and the heater was subjected to black oxide treatment. After 30 minutes Aluminum Copper The temperature of the heater reveals that carried the heat, keeping the heat temperature lowest among the three materials. The low temperature of PGS surface shows that PGS has high heat dissipation.

8 Thermal Resistance of ( ) [Measuring Method] The sample is placed and fixed between the transistor and the fin to measure temperature difference, from which the thermal resistance is calculated. Thermal resistance Rth = (T1-T2) / W (deg.c/w) Transistor 1.5x2cm=3cm 2 P =approx. 7W Transistor 7w Sample 15x 20mm Temperature of the transistor T1 Thermal resistance property Thermal resistance represents the degree of non-conductivity of the heat. Materials with lower thermal resistance are a more efficient conductor of heat (Thermal resistance depends on hardness of, and surface condition of material as well as heat conductivity.) Thermal resistance (deg C, cm 2 /W) Thermal resistance Silicon Sheet 0.3 mm Competitor s Graphite 0.07mm PGS 0.1mm PGS 0.07mm PGS 0.025mm Silicon Grease Temperature of the fin Heat sink fin T2 150x20mm Pressure(kg/cm 2 ) PGS has low thermal resistance due to its high conductivity and flexibility.

9 Shield Effect of Shield Effect (db) Shielding Effectiveness Test (KEC Method) Shield Effect (db)=-20log(vs/v0) Shield Effect for Electric Field Shield Effect for Magnetic Field Frequency (MHz)

10 Application Development ( Standard series) Standard series ( PGS, 70, 25 m ) Type Front face Rear face PGS Only S type A - A type Insulative adhesion type 30 m Adhesive Type A - M type Insulative thin adhesion type 10 m A - PA type Polyester tape standard type 30 m Insulative adhesion type 30 m Laminated type Insulation & Adhesive A - PM type Polyester tape standard type 30 m Insulative thin adhesion type 10 m A SM type Polyester tape thin type 10 m Insulative thin adhesion type 10 m Polyester (PET) tape 30 m Polyester (PET) tape 30 m Polyester (PET) tape 10 m Structure Acrylic Adhesive tape 30 m Acrylic Adhesive tape 10 m Acrylic Adhesive tape 30 m Acrylic Adhesive tape 10 m Acrylic Adhesive tape 10 m Features High Thermal Conductivity High Flexibility Low Thermal Resistance Available up to 400 Conductive Material With insulation material on one side With strong adhesive tape for putting chassis Withstanding Voltage 2 kv With insulation material on one side Low thermal resistance comparison with A-A type Withstanding Voltage 1 kv With insulation material on both side Withstanding Voltage PET tape 4 kv Adhesive Tape 2 kv With insulation material on both side Withstanding Voltage PET tape 4 kv Adhesive Tape 1 kv With insulation material on both side Withstanding Voltage PET Tape 1 kv Adhesive Tape 1kV Withstand temp 400 Standard Size Max. Size mm 25 Part No. EYGS Thickness 70 Part No. EYGS EYGA091207A EYGA091207M EYGA091207PA EYGA091207PM EYGA091207SM Thickness m 110 m 90 m 25 Part No. EYGS EYGA091203A EYGA091203M EYGA091203PA EYGA091203PM EYGA091203SM Thickness m 65 m 45 m

11 Application Development ( High heat resistance series, Special processing series) High heat resistance series ( PGS 70, 25 m ) Special processing (PGS m) Type high heat resistance type Type Adhesive Type Multilayered type A V type A RV type A KV type C C type M SS type M SW type Front face high heat resistance and insulation type 13 m high heat resistance and insulation type 30 m Front face Printing Silicon rubber Rear face High heat resistance and insulation adhesion type 18 m High heat resistance and insulation adhesion type 18 m High heat resistance and insulation adhesion type 18 m Rear face Printing Acrylic adhesive Printing Silicon rubber Printing Silicon rubber Heat-resistance PEEK tape 13µm Polyimide tape m 25 m Structure Features Withstand temp Standard Size Max. Size Part No. Thickness Part No. Thickness Heat-resistance Acrylic adhesive tape 18 µm With high heat resistance and insulation tape on one side Withstanding Voltage Adhesive tape 2 kv 150 EYGA091207V 88 EYGA091203V 43 Heat-resistance Acrylic adhesive tape 18 µm With high heat resistance and insulation tape on both side Withstanding Voltage PEEK tape 2 kv Adhesive tape 2 kv 150 EYGA091207RV 101 m EYGA091203RV 56 Heat-resistance Acrylic adhesive tape 18 µm With high heat resistance and more insulated tape on both side Withstanding Voltage PI tape 5 kv Adhesive tape EYGA091207KV 118 m EYGA091203KV 73 2 kv 150 (Polyimide : 180 ) Structure Features Withstand temp Standard Size Max. Size Part No. Thickness Acrylic adhesive 10 m With pin point adhesive on one side due to the high thermal conductivity Non insulation EYGC091210C 110 Silicon rubber With silicon rubber on one side to increase contact area with heat source and reduce thermal resistance Minute cohesiveness High heat resistance Non insulation 180 EYGM091210SS 200 Silicon rubber With silicon rubber on both side to increase contact area with heat source and reduce thermal resistance Minute cohesiveness High heat resistance Non insulation 180 EYGM091210SW 300 C C, M SS, M SW It becomes a production on orders about each type.

12 Graphite Sheet Application Method 1.Application Example of PGS through simulation 2.General Thermal Design Model

13 1.Application Example of PGS (Simulation with heat) In this simulation test, thermal diffusivity will be measured by analyzing heat spot of a layered sample mainly consisting of PWB, IC (heating element), PGS and a case face (ABS Resin). [Model] 50 mm ABS Resin 35x50x1mm K=0.18 W/m K 35 mm Insulated film 0.03mm K=0.25 W/m K Graphite Sheet 25x40mm, 25x25mm Thickness : 0.07mm Measurement point 9X9 mm at 35 at 1atm Silicon sheet 9x9x0.5mm K=1 W/m K IC 9x9x1.2mm P=1W PWB 25x40x1mm K (xy)=60w/mk,k(z)=1w/mk

14 1.Application Example of PGS (Simulation with heat) Heat distribution of the ABS surface with PGS70µ: Diffused the heat and broke the heat spot. Type A Type A-1 Type A-2 Type B Type B-1 Type B-2 Model PGS size (mm) ABS Silicon IC PWB without PGS Insulated film (Large) (Small) without (Large) (Small) Silicon with with with without without without Result Temp. ( ) Temp. ( ) Surface IC PWB You can choose whichever application you think is suitable for your purposes-whether to lower the temperature of heat source or to lower the surface temperature

15 2 Typical Thermal Design with <Blocking and Sealing of Heat Source> <Heat diffusion to the whole chassis> <Heat transfer to the chassis with larger heat capacity> [Before] Heat spot [After] is attached to heat sources to diffuse heat to the whole chassis. is attached to heat sources in Order to lower the temperatures by heat transfer to larger heat capacity area such as hinge. Heat diffusion to the whole chassis Case Heat dissipation to the hinge with larger heat capacity. Heat dissipation to the intermediate chassis with larger heat capacity. is attached to a case side in order to diffuse heat spots such as PA, resulting in lowered surface temperature. Heat transfer to cooler area Heat spot 8 to 9 reduced PA Isolator PGS is attached to heat sources in order to lower the temperature of the heat source by heat transfer to cooler area. PGS Graphite Sheet Intermediate chassis such as metal frame is placed between heat sources and the intermediate chassis with larger heat capacity In order to reduce the temperatures of heat sources., an excellent heat transfer material, meets thermal design for various devices with various structures.

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