Warpage Characteristics of Organic Packages, Phase 4

Transcription

1 Warpage Characteristics of Organic Packages, Phase 4 Chairs: Wei Keat Loh, Intel Ron Kulterman, Flex Call for Sign-up Webinar July 27 th /28 th, 2017 inemi Staff: Haley Fu

2 Agenda Introduction of Project Chairs and Facilitators inemi Project Development Process Project Briefing Companies Involved in Planning Background & Objectives Project Scope Project IS/IS Not Preliminary Measurement Plan Timeline How to Join? Q&A Note: All phones will be on mute until the end of the presentation

3 Introduction: Chairs Wei Keat Loh Intel Senior Technology Development Engineering Manager Assembly and Test Technology Development (ATTD) Focus on package design, solder joint & packaging level reliability, package warpage as well as assembly related mechanical-thermal-fluid flow interaction prediction capability. (PhD in Mechanical Engineering) Ron Kulterman Flex Electrical Engineering of University of Texas Austin Over 36 years in PCBA Mfg and Design at IBM, Solectron, Sun Microsystems, Flex. Incircuit and Functional Test, Dev/Mfg Engineering Liaison, Design Services with DFM/DFT, Thermal Mechanical Lab Manager and Material Characterization and Failure Analysis. 3

4 inemi Project Development Process - 5 Steps 0 1 INPUT SELECTION DEFINITION PLANNING EXECUTION / REVIEW CLOSURE Initiative Open for Industry input inemi Technical Committee (TC) Approval Required for Execution Project Limited to committed Members

5 inemi Project Management Policy Two governing documents for projects SOW (statement of work): sets out project scope, background, purpose, benefits, and outlines required resources, materials, processes, project schedule, etc. Project Statement (PS): signed by participating companies to secure commitment on resource and time contributions. inemi Project requires inemi membership Signed membership agreement Commitment to follow inemi By-laws and IP policy 5

6 Project Briefing

7 Motivations Packaging technology is aggressively evolving to meet new user demands and requirements. Thin and cool device Energy efficient & Highly integrated SOC/SIP/SOP High package and board assembly yield Dynamic warpage characteristic of electronic package is critical for seamless board assembly. Hence this effort is to understand the kind of dynamic warpage demonstrated in industry. Board Warpage Characteristic Package Warpage Characteristic Board Assembly Parameters Material selections: solder paste, flux 7

8 inemi: Warpage Characteristics of Organic Packages, Phase 4 inemi Technology Roadmap 2013 Identify package warpage as key challenge Phase 1 ( ) Literature survey Establish metrology correlation between sites and increase awareness Reaching out to industry for component donation (Forming & Storming) Phase 2 ( ) Establish current technology package dynamic warpage (POP, PBGA, FCBGA) Measurement protocol (effect of As Is, Bake and Moisture Exposure Time (MET)) and sample size needed. (Norming) Phase 3 ( ) Continue establishing technology package dynamic warpage (all kind) Dynamic warpage measurement metrology assessment. (Performing) Phase 4 ( ) Continue establishing technology package dynamic warpage of new package technology (all kinds) Leverage previous effort to study the impact of Low Temperature Solder on dynamic warpage requirement Collaborate with FEA software to derive modeling approach in better predict the dynamic warpage

9 Recent Warpage Trends of Electronic Packages Phase 2 & 3 FBGA, SIP & etc Thin FCBGA and MCP Package 9

10 Recent Warpage Trends of Electronic Packages Phase 2 & 3 Integrated Heat Spreader (I-HS) Packages Package Dynamic Warpage Metrology Assessment 10

11 Impact of Low Temperature Solder Socket and FCBGA Component Dynamic Warpage Comparisons Low Temperature Solder (LTS) initiatives has taking shape. However, the impact to package warpage is not trivial as it changes how the solder joints collapse during SMT. 11

12 Package Technology Dynamic Warpage Measurement Generous Donation of Samples from Industry Focusing on new and advance package technologies Pictures are mainly for illustration only 12

13 Project Scopes in Phase 4 SOW Characterization of latest packaging technology Characterize emerging electronic packaging technology dynamic warpage behavior to develop a better understanding of the current development of package construction and material development as listed in Table I. Silicon Interposer and Embedded Silicon Bridge with different package stiffeners and constructions for Heterogeneous Packaging Solution Next generation of POP packages that leverages wafer level process for package construction which include Panel and Wafer level molding. These also include the use of new fiber reinforced mold material for warpage control. System In Package/Multi Chip Package (BGA) with different configuration and layout. Embedded Package (embedded silicon, actives and passives) Assess the impact of Low Temperature Solder (LTS) on package dynamic warpage requirement To assess the impact of lower temperature solder on package warpage for those packages collected in Phase 2 and 3. To establish the risk level based on package technology with respect to warpage only. Assessment the use FEA in optimizing package warpage Establish modeling optimization approach and tools requirement to enable higher accuracy prediction technique Compare modeling with experiment data and identify potential gaps for further development in FEA technique 13

14 Phase 4 SOW High Level Schedule Some pre-work has been completed during the definition phase 4 to obtain commitment from stakeholders. 14

15 Project IS / IS Not This Project IS: This Project IS NOT: Warpage Characteristics of Organic Packages Investigation of organic substrate based packages to Not the development of a specific standard(s) establish dynamic warpage trends Enticing participation by offering real evaluations Not an evaluation of first level interconnects through anonymous reporting (C4 joints) Characterize the existing package available in industry warpage behavior and compare to the 2017 inemi Warpage Allowable roadmap (i.e., the complete mapping of components over a complete temperature range) Not a repeat of prior or existing work Provide data, input, and make recommendations to identified standards for modifications / improvements to the standards Not a Package reliability study Not biased towards specific suppliers, geographies, or market segments (impartial) 15

16 End in mind Business Impact Establish current state of package warpage behavior in industry and project the future roadmap of allowable package warpage Evaluate the impact of lower reflow temperature on dynamic warpage for packages characterized in Phase 2, 3 and 4 Establish the best use of FEA software in optimizing dynamic warpage for any given package technology and identify areas of improvement Based on above, it can lead to refinement of electronic industry standards Outcome of Project Characterize the dynamic warpage behavior of latest and greatest package technology. Provide data, input, and make recommendations to identified standards bodies for modifications / improvements to the standards Establish the impact of lower reflow temperature solder system on package warpage Establish potential areas of FEA development to improve dynamic warpage predictive capability Project report and sharing Project Results: it is expected that a detailed summary of the evaluations will be provided to the full inemi membership at the conclusion of the project 16

17 Components Donation We would like you to provide: ~10 units which have gone through the complete package assembly process. These packages do not need to be functionally or electrically perfect; it can be test vehicle or dummy package. If more than10 units provided, then we can run additional evaluation to look at effect of environment staging and bake. A brief description of package geometry and ball pitch and ball size used. (insert excel here) As many designs, in as many design envelopes/market sectors as you can supply There will be no: Reverse engineering of the design or package construction (the packages provided will on be only used for Dynamic warpage measurements) No mention of your company in relationship to any design or suppliers (blind test) All units will be destroyed once the measurements have been completed unless otherwise instructed. You will receive in return: The Dynamic Warpage Characteristic of your components (including room temperature through assembly temperatures and back down again) A summary of the Dynamic Warpage Characteristic of all package warpage data collected within your design envelope (blind test, no names of companies or products will be provided) 17

18 How to Join

19 Sign-Up Due on August 18, 2017 inemi membership is required to join the project Download SOW and PS from inemi web: Sign the PS Signature of representative of participants Signature of manager approval Send scanned PS to inemi VP of Operations will sign and approve your participation and send you back the completed PS with acceptance Join inemi membership, or questions, contact Haley Fu 19

20 Questions? Project web page:

21 Haley Fu

22 Warpage Characteristic of Organic Package Phase 2 Accomplishments POP Bottom Package POP Top Package FCBGA PBGA Establish a few measurement protocol about sample size and environment pre-condition. Mapping out dynamic warpage characteristic with respect to existing specification. 22