LPKF LDS Prototyping. Technology, Process Steps and Systems

Transcription

1 LPKF LDS Prototyping Technology, Process Steps and Systems 1

2 Basics About LPKF LDS MID Molded Interconnected Devices: circuitry on three-dimensional carriers Basic part is a single-shot molded or 3D-printed plastic part MIDs are often called Mechatronic Interconnected Devices to show the combination of electrical and mechanical functions MID technology is not the substitution of standard 2D circuit boards 2

3 Basics About LPKF LDS LDS Laser Direct Structuring is the LPKF patented technology to structure layouts direcly on a plastic part The part can be made by LDS-doped plastic material, or the part can be coated with LPKF ProtoPaint LDS spray lacquer 3

4 LDS Process Laser Ablation Catalyzer Laser beam Laser Modified polymer Polymer + catalyzer Activated additive by laser ablation laser worked surface unworked surface 4

5 LPKF LDS in Production LDS is the most used technology for production of 3D MID devices LDS is predominant in high-volume production for telecommunication equipment (>50% of all smartphones) LPKF LDS laser systems for mass production: Fusion 3D 1500 or Fusion 3D 6300 with automated handling and multiple processing units Quelle: Samsung Quelle: LPKF 5

6 LPKF LDS in Production Further industrial applications for 3D MID technology Automotive industry Medical technology Consumer electronics Computer technology Aircraft and space industry Household appliances Industry automatization All areas have projects in mass production but no pure prototyping solution! 6

7 LDS Equipment Portfolio LDS Prototyping to high-volume production equipment ProtoLaser3D Fusion3D 1100 MicroLine3D 160i Fusion3D 1500 Fusion3D 6300 New! Prototyping Entry level Mid volume High volume Single PU Multiple PU (1 3) Multiple PU (1 4) 7

8 Why 3D MID Prototyping? Prototypes are usually used for: Material qualification Optical and destructive inspection Layout and function check Verification of the dimension Production optimisation Special tests like temperature variation or vibration stress Analysis of new product ideas or new functions Substitution of expensive injection moldings 8

9 Why Separate 3D MID Prototyping Equipment? Often Companys development labatories are not at the same location as the mass production Higher time and travel expenditure for development engineers Production process has to be interrupted to produce prototypes. System or production line has to be converted for new part Production breakdown and additional converting costs 9

10 LPKF LDS Prototyping Perfect set for all electronic designers! LPKF ProtoPaint LPKF ProtoLaser 3D LPKF ProtoPlate Distribution to: Educational institutions Technology scouts Inhouse development

11 LPKF LDS Prototyping LPKF ProtoPaint LPKF ProtoLaser 3D LPKF ProtoPlate

12 3D Base Part 3D base part produced in any material without additive possible production technologies: Stereo lithography (STL) Laser sintering (SLS) Fused deposition modelling (FDM) Surface roughness has to be smaller than 20 µm Micro milling without activation of the base part e.g. LPKF ProtoMat Quelle: 12

13 LPKF ProtoPaint The spray lacquer has to cover the complete 3D base part The lacquer has to be activated by pulling a ring on the bottom of the can The starter kit contains 6 spray cans for approximately 20 parts 13

14 LPKF ProtoPaint LPKF ProtoPaint has to be sprayed in cross coating on the 3D part Distance of 15 to 20 cm between spray nozzle and part Minimum curing time is 180 min at 70 C in a convection oven 14

15 LPKF ProtoPaint Qualified standard materials are (e.g): Polyamide (PA) Polycarbonate (PC) Polycarbonate/acrylonitrile butadiene styrene (PC/ABS) Acrylonitrile butadiene styrene (ABS) Polybutylene terephthalate (PBT) Qualified rapid prototyping materials are: Accura Bluestone (SLA) Accura 48HTR (SLA) Fine polyamide PA2200 (SLS) Vero FullCure 8x0 (Objet) ABS M-30 (FDM smoothed) 15

16 LPKF ProtoLaser 3D Activation on the LDS additive on the ProtoPaint material like on the LDS dopped standard material with LPKF ProtoLaser 3D Laser 16

17 LPKF ProtoLaser 3D Technical details: 3D MID part size 300x300x50 mm Manual part handling, table with mounting support Mechanical lifting table controlled by software Housing from LPKF ProtoLaser S/U3 PC included Software CircuitPro 3D, one license with USB dongle 17

18 LPKF ProtoLaser 3D Infrared laser with 1070 nm Max laser power 5 watts Frequency khz Scanning speed 3D 1 m/s Vision system with fiducial recognition Working distance 160 mm Focus diameter 50 µm with Fine Focus PU Calibrated field size 100x100x25 mm Newson XYZ scanner 18

19 CircuitPro 3D for LPKF ProtoLaser 3D Schematic display of the working table in CircuitPro 3D 19

20 CircuitPro 3D for LPKF ProtoLaser 3D Toolpath generation The difference between CircuitPro for ProtoMat and ProtoLaser S/U3 to CircuitPro 3D is just the method of operation to create a sample ProtoMat and ProtoLaser S/U3 Negative method ProtoLaser 3D Positive method 20

21 CircuitPro 3D for LPKF ProtoLaser 3D Toolpath generation 3D body surface Hatch / structure

22 CircuitPro 3D for LPKF ProtoLaser 3D Placement of the base part Position recognition via vision system Mounting the 3D base part on the table by customer fixture or by non-shrinking paste 22

23 CircuitPro 3D for LPKF ProtoLaser 3D Placement of the base part and position recognition via vision system. Real display of the Fiducial (corner, hole, structured line) in LPKF CircuitPro 3D 23

24 Circuit Pro3D for LPKF ProtoLaser 3D Placement of the base part and position recognition via vision system. Result after position recognition and laser process 24

25 LPKF ProtoLaser 3D Actual reproducible process slot with line/space is 75 µm/75 µm with the LPKF ProtoLaser 3D Comparable with Fusion 3D 1000 platform with CircuitPro 3D V 2.7 and FinePitch PU and the Fusion 3D 6000 series with CircuitPro 3D V 2.8 and FinePitch 25

26 LPKF ProtoPlate LPKF ProtoPlate is an easy-to-use laboratory solution to build up copper layers on laser-activated 3D base parts Current-free chemical process Internal air filtering Internal heating and stirring element Matched set of chemicals for the system (LPKF ProtoPlate CU) 26

27 LPKF ProtoPlate The laser-activated 3D base part has to be attached to an enamelled copper wire to make sure that the part is in the best position in the bath The top of the copper wire is fixed in the cover of the glass beaker When the plating prosess starts, small bubbles appear at the plated surface 27

28 LPKF ProtoPlate To get a good and defined copper surface you find a chart in the manual with the growing thickness dependent on the time in the bath and the temperature of the bath 28

29 LPKF ProtoPlate With the equipment the user will receive some pre-structured parts. These will help him to analyse the different process steps if a problem appears 29

30 Design Rules LDS Vertical-down lines: max. 75 / min. 105 Horizontal lines: max. 70 / min. 110 Laser Pos. 1: 90 Pos. 2: 30

31 Design Rules for LDS MIDs Includes recommendations for all steps of the LDS process chain: Design tips in consideration of manufacturing aspects Tips for LDS materials and injection molding Tips for laser structuring Tips for e-less plating Tips for assembling LDS parts 31

32 General What is the typical bundle of LPKF equipment and recommendation? 1. Substrate Standard rapid prototyping No need for LDS grade! 2. LDS ProtoPaint LDS grade paint Possible to paint selectively 3. Laser direct structuring and plating Activation with Protolaser 3D Plating with ProtoPlate 32

33 Following Process LPKF ProtoPaint lacquer is processable up to 138 C. Because of that LPKF recommend the use of anisotropic conductive film. For the connective fastening of the components on the 3D base part, the thermic hardened polymer is required. Hardening: 120 C for 3 minutes in the LPKF ProtoFlow reflow oven To protect the grown copper against oxidation, a finishing with silver-based organic metal (MOF) is recommended. 33

34 Price and ordercode LPKF ProtoPaint include six spray can Order code List price 450 LPKF ProtoLaser 3D Order code List price LPKF ProtoPlate Order code for 110 V version for 230 V version List price 8500 LDS chemicals for the ProtoPlate System , list price is 800 LDS chemicals for other plating systems , list price is

35 Thank you for your attention! LPKF Laser & Electronics AG Osteriede Garbsen 35