Design and Manufacturing of a Flexible Hybrid Electronics (FHE) Biometric Human Performance Monitor (BHPM)

Transcription

1 Design and Manufacturing of a Flexible Hybrid Electronics (FHE) Biometric Human Performance Monitor (BHPM) Presented by Professor Mark Poliks Systems Science and Industrial Engineering Binghamton University i3 contact: Charles G. Woychik, Ph.D. i3 Electronics, Inc. Endicott, NY Charles.Woychik@i3electronics.com

2 Agenda About i3 Electronics Technical challenges for manufacturing FHE Intravascular Ultrasound (IVUS) Catheter High Density Double-Sided Flex Wearable Flexible Substrate Summary Jim Turner BU presentation will include information on the BHPM electronics, software and performance (Session 26) 2

3 i3 Electronics, Inc. Endicott, NY i3 Electronics is a privately held, electronic manufacturing provider of innovative products and solutions with differentiated technology. 3

4 Corporate Profile Technology focused company Investing in R&D supporting next generation materials, products Focus on high performance computing, aerospace and defense, medical, ruggedized industrial Leaders in Printed Circuit Board Manufacturing 1 st & 2 nd Level Assembly Backplane Assembly Semiconductor Packaging Flexible Electronics Advanced Laboratory Services Advanced Electronic Laminates System Integration & Test Design, Prototype & Quick Turn Assembly Advanced R&D Services 4

5 Focused on Key Markets With Enabling Technologies Alternative Energy & Industrial Medical Aerospace & Defense Semiconductor & Test Telecom & Ultra High Comp. Design & Modeling Advanced Reliability & SI Labs Semiconductor Packaging & Microflex Advanced Assembly 2.5 and 3D Assembly Ultra High End PCB High Speed Back Plane & Press Fit Assembly 5

6 Key Technical Challenges for Advanced Flex Fabrication Support of ultra thin (as thin as 12.5 µm) polymer film during substrate fabrication and component assembly Fine line circuitization Avoidance of solder wicking without use of traditional solder mask Die attach with high placement accuracy Support of ultra thin film during flip chip attach, particularly maintaining flatness at solder reflow temperature 6

7 Metal Circuit Trace Formation Wet Chemical Etch Subtractive Process (Isotropic Etching) Not well suited for fine feature definition. Semi-Additive Plating (Pattern Plating) Photoresist Metal Substrate Well suited for fine feature definition. 7

8 Subtractive Process 1. Substrate 4. Apply, expose, and develop photoresist 2. Thin electrically conductive commoning layer, e.g., sputter deposited 5. Etch metal 3. Electroplate Cu. 6. Strip photoresist 8

9 Semi-Additive Plating Process (Pattern Plating) 1. Substrate 4. Plate metal 2. Thin electrically conductive commoning layer, e.g., sputter deposited 5. Strip photoresist 3. Apply, expose, and develop photoresist 6. Etch commoning layer. 9

10 Benefits of Semi-Additive Plating (SAP) Processes for FHE Applications Adhesion of the as-deposited metal film was on the order of 1226 N/m as determined by 90 peel test. Locus of failure was cohesive in the polyimide. Extendibility to finer circuit feature dimensions and higher metal trace aspect ratios than can typically be achieved using subtractive metal patterning processes. The fidelity of feature dimensions precisely replicates that of the photolthographically defined plating resist. A continuous range of metal thickness can be achieved, as opposed to the quantized thickness available when using Cu foil-clad polymer films. 10

11 Support Method for Thin Flexible Substrates Support of 12.5 µm polyimide film during substrate fabrication: use of rigid frame For discussion of frame mounting of flexible films, see, e.g., Durocher, et al., US Patent 6,994,897 (2006). 11

12 Design and Manufacturing of a Flexible Hybrid Electronics (FHE) Biometric Human Performance Monitor (BHPM) Cross-Functional Team Members i3 Electronics: Mark Schadt, Frank Egitto, Paul Hart, William Wilson, Kostas Papathomas, Michael Gaige, Brett Pennington, Mike Shay, Charles Woychik Binghamton University: Madina Zabran, Sandeep Mittal, Yang Gao, Varun Soman, Hussam Alothman, Jack Lombardi, Pravakar Rajbhandari, Kanad Ghose, Mark Poliks, Zhanpeng Jin, Tara Dhkal, Jim Turner UC Berkeley: Yasser Kahn, Donggeon Han, Natasha A.D. Yamamoto, Ana Arias American Semiconductor: Dale Wilson

13 Intravascular Ultrasound (IVUS) Systems Operation Uses a tiny ultrasound transducer mounted on the tip of a catheter to image the interior of blood vessels Uses Assesses vessel/lumen diameter Measures lesion length Helps determine the amount of plaque buildup in a vessel, and its composition Helps check to ensure stents have been properly placed and fully deployed Helps measure the effectiveness of balloon angioplasty or stenting during follow ups From Diagnostic and Invasive Cardiology, January/February 2009 Issue, Reilly Communications Group 13

14 Intravascular Ultrasound (IVUS) Catheter Flexible Electronics Module: Fabricated at i3 Electronics, Inc. Part of Intravascular Ultrasound (IVUS) Catheter System Intravascular Ultrasound (IVUS) is a catheter- based system that allows physicians to acquire images of diseased vessels from inside the artery. IVUS provides detailed and accurate measurements of lumen and vessel size, plaque area and volume, and the location of key anatomical landmarks. 14

15 Intravascular Ultrasound (IVUS) Catheter Lowell Satler, MD 15

16 Miniaturization of the IVUS Catheter Tip Electronics 16

17 Fine Pitch Assembly for IVUS Catheter Underfill ASIC Die Cu Stud ASIC Die Bond Pad Solder Polyimide Film Au Bond Pad on Flex Circuit Trace Circuit Trace on Flex Au Flip Chip Bond Pad Low Surface Energy Metal Solder Dams 17

18 High Density Double-sided Flexible Substrate Component in System for In Vivo Diagnostics Processes Ultrasound Device 11 µm lines and spaces, 25 µm vias Double-Sided Flex Module Semi-Additive Plating Bare Flip Chip Die System in Package Double-Sided Component Placement 18

19 Nano-Bio Manufacturing Consortium (NBMC) Program Sensor for Monitoring Human Biometric Parameters Wireless Electrocardiography Patch 19

20 Human Performance Monitor A wearable flexible substrate sensor system to measure human performance parameters. A broad based electronics platform (Cu on flex) interfaced with printed sensors that measure a variety of parameters (flexible-hybrid). Measurement of biometric parameters such as ECG signals, heart rate, heart rate variation and skin temperature. The electronics platform is configured for signal detection and preprocessing, on-board analysis, and communication of results to a local host.

21 Human Performance Monitor NBMC Phase 1 Flexible-Hybrid Electronics Solution Electronics Side Component Solder Mask Kapton PI Side View Solder Mask Sensor Side Printed Sensors Well for Contact Gel Cu 21

22 Human Performance Monitor Wireless Electrocardiography Patch Human Subject Testing 22

23 Human Performance Monitor Wireless Electrocardiography Patch Via 23 Transition from plated metallurgy to ink jet printed metallurgy

24 Human Performance Monitor Wireless Electrocardiography Patch Human Subject Testing 24

25 Phase II Milestones - Human Performance Monitor Sensor for Monitoring Human Biometric Parameters: Current Research Program With NBMC Phase II Milestones Design modifications to improve robustness in flex testing. Improved electronics design, BOM, and software to extend battery life, including on-board antenna modifications for enhanced blue tooth communications. Feasibility studies for capacitively coupled electrodes to replace more conventional gel based electrodes. 25

26 Phase II Human Performance Monitor with Encapsulation Phase II Human Performance Monitor with electronic component side encased in protective coating. Different configuration of a compliant Encapsulant to protect components and to flatten polyimide substrate. 26

27 Benefits of Polyimide Based Films for FHE Applications Excellent thermal durability, capable of use in applications at temperatures as high as 400 C. This mitigates issues of degradation in polymer properties that might otherwise be induced by sintering of the Au NP ink or during solder reflow for component assembly. The polyimide is laser friendly, i.e., hole quality achieved using UV laser micromachining is excellent. Its relatively low modulus makes the film conducive to dynamic flex applications. Compatible with fine pitch assembly developed at i3 Electronics. Over 30 years of experience in developing flexible packages using polyimide thin films. Future development working with Binghamton University to develop a high volume roll-to-roll flexible substrate manufacturing process. 27

28 Summary Processes, fixtures, and equipment have been devised to provide circuitry and mounting of components on flexible substrates. Using semi-additive plating processes (pattern plating), fine-feature circuitization is achieved. The flex substrates accommodates assembly processes with component placement accuracy of 9 µm (3 sigma). A flexible patch for electrocardiography has been demonstrated to perform as well as conventional, commercially available, clinical grade, disposable Ag/AgCl wired sensor systems. Body temperature measurement using printed thermistors was also incorporated onto the patch. 28

29 Thank You 29