Trace and Track Components Using SAP ME

Transcription

1 xmii Trace and Track Components Using SAP ME Endicott Interconnect Technologies David Kennedy SAP ME/MII Analyst

2 Endicott Interconnect Technologies Heritage The company / The Products The Challenge Goals Challenges Before The Solution Project Path Current Component flow Batch consumption Results Future Questions Overview

3 Endicott Interconnect Heritage 1911 Companies combine to form CTR 1924 CTR changes name to International Business Machines 1972 SAP started by 5 former IBM employees IBM sells Endicott manufacturing operations EI is formed

4 Endicott Interconnect Technologies The company / The Products Privately held local corporation Broad range of products and services, including printed circuit board fabrication, semiconductor packaging and complex assembly solutions. Vertical integration differentiates EI from any supplier in the electronic packaging industry. ISO 9001,14001, and 9100 Aerospace Certification Operates in 1.39 million square feet of manufacturing space in Endicott, NY and has operations for high volume production capacity in Shenzhen, China. Customers include IBM, Sun, Hutchinson, Cadence, Juniper, Cisco, Verigy, Boeing, Northrop Grumman, Raytheon and the U.S. Defense Department. Department of Defense Trusted Foundry Accreditation

5 Endicott Interconnect Technologies The company / The Products EI Detection & Imaging Systems China Complex Assembly Huron Tool Model Shop Integrated Circuit Assembly SureScan Treater Tower Panels Semiconductor Packaging

6 Goals Effective component traceability / data collection Simple / easy to use One point of contact Real time inventory / WIP control Consumption of SAP batch controlled components.

7 Challenges Limited resources Reporting Large BOMs Rework, Rework, Rework The old way worked

8 Before SAP CCIS Common Collection Information System Ztrace Production orders Serial numbers Customer/ Eng data Documents CAIS Complex Assembly Information System Defect / repair Defect data / repair and Component data Trace SDI Reports and Data packages CIS Visiprise

9 Project Path CIS Visiprise Initial implementation ECC 6 Utilization Expansion Future

10 Customer/ Eng data Current Materials Items BOM, Routing, PV BOM ZTrace BOM, Routing, PV Production orders Shop orders ERP Confirmations MII Confirmations ME MRP data Inv. ID Kronos Reports and Data packages Documents

11 Component Flow Components received Incoming inspection Ztrace info entered Ztrace info sent to xmii Visiprise inventory ID created Assembly data back to receipt available Assembly data collected Ztrace label put on box Components assembled manually Child Ztrace created as needed Barcodes scanned into placement tools Assembly run through placement tool Data picked up by Visiprise

12 Batch consumption flow Data field SAP_BATCH collected in Visiprise Complete collaboration calls XMII transaction Record confirmations transaction Confirmation recorded in confirmation table Consumption of anything with data field SAP_BATCH recorded in separate table XMII scheduled confirmation dispatcher transaction Selects confirmation, pulls batch consumptions with matching ID Batch consumptions processed through SAP cleared from table when successful When all batch consumptions are clear confirmation processed with normal backflushing

13 Results Speed approximately 3 components per second BOMs of over 6000 components successfully processed Actual batch consumption in SAP Easy to use Everybody happy

14 Future Actual labor Archiving / ODS Scaling / performance Other business areas MII upgrade Additional MII functions Bigger, Faster, more accurate

15 Questions