Flex Mitigation Technology. April 2009
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1 Flex Mitigation Technology April 2009
2 Topics to cover Today Mechanical Cracking of MLCC s Background Causes Prevention Current Flex Mitigation Technologies Features, benefits, and capabilities Markets & Applications Potential customers Competitors Questions you need to ask. Upcoming Technologies Q&A
3 What is a Mechanical crack? #1 MLCC Failure Mode
4 What is a Mechanical crack? Mechanical damage that occurs when handling and/or mounting Multilayer Ceramic Capacitors. Two Main Causes Impact Cracking Occurs during placement onto a PCB. Improper setup of pick and place machine. Flex Cracking Occurs during board flexure or bending.. Excessive bending of PCB post soldering.
5 What is a "Flex Crack?" Terminations Ceramic Chip Solder Crack SMT Pads
6 When/where do flex cracks occur? ANY post-mount handling that creates excessive bending of the board Depanelization Hardware application Mounting in assembly Unsupported IO edge connectors Stacked in process Pushed "to fit" Unsupported Pick & Place Mismatch in TCE (IR soldered then Wave) Manufacturing defects of MLCC s have been systematically eliminated These failures are now at a PPM level
7 Prevention Board Flex cannot be eliminated at KEMET or any other capacitor manufacturer. 2 Convergent Paths: Education: Change board assembly and handling techniques. Engineering: Mitigate effects of board flex cracks KEMET offers one of the most comprehensive Flex-Mitigation Portfolios available in the Industry.
8 Flex Mitigation Portfolio
9 Current Flex Portfolio Technologies Floating Electrode FE CAP Open Mode Flexible Termination FT CAP Floating Electrode + Flexible Termination FF CAP AEC Q200 Qualified
10 Flex Mitigation Technology: Select the right level of protection for your application Level III: High Level of Crack Protection Level II: Intermediate Level of Crack Protection Flexible Termination Floating Electrode plus Flexible Termination Open Mode plus Flexible Termination Level I: Basic Level of Crack Protection Critical Safety Critical Level 0: NO Crack Protection Standard MLCC Non-Critical Fail-Short Condition Floating Electrode or Open- Mode Semi - Critical Fail-Open Condition Up to 2mm flex bend capability Flexible termination provides for a high level of protection from thermal stress cracks, pick-and-place damage, and board flex stress Fail-short Condition Up to 5mm flex bend capability. Combines Fail -Safe electrode designs with tearaway, termination technology. Provides for a high level of protection from thermal stress cracks, pickand-place damage, and board flex stress Fail-Open Condition Up to 2mm flex bend capability Up to 5mm flex bend capability.
11 Flex Mitigation Technology: Level 0 Standard MLCC Design Level III: High Level of Crack Protection Level II: Intermediate Level of Crack Protection Flexible Termination Floating Electrode plus Flexible Termination Safety Critical Level 0: NO Crack Protection Standard MLCC Non-Critical Fail-Short Condition Level I: Basic Level of Crack Protection Floating Electrode or Open- Mode Semi - Critical Fail-Open Condition Up to 2mm flex bend capability Critical Flexible termination provides for a high level of protection from thermal stress cracks, pick-and-place damage, and board flex stress Fail-short Condition Up to 5mm flex bend capability. Combines cascading electrode design with tearaway, termination technology. Provides for a high level of protection from thermal stress cracks, pickand-place damage, and board flex stress Fail-Open Condition Up to 5mm flex bend capability. Up to 2mm flex bend capability
12 Flex Mitigation Technology: Level 0 Standard MLCC Design Standard MLCC design. No crack protection. Allows for up to 2mm Flex bend capability (Industry Standard) Recommended for non-critical applications Flex crack could result in a fail-short condition ( Catastrophic Failure)
13 Flex Mitigation Technology: Level I Floating Electrode / Open Mode Level III: High Level of Crack Protection Level II: Intermediate Level of Crack Protection Flexible Termination Floating Electrode plus Flexible Termination Safety Critical Level 0: NO Crack Protection Standard MLCC Non-Critical Fail-Short Condition Level I: Basic Level of Crack Protection Floating Electrode or Open- Mode Semi - Critical Fail-Open Condition Up to 2mm flex bend capability Critical Flexible termination provides for a high level of protection from thermal stress cracks, pick-and-place damage, and board flex stress Fail-short Condition Up to 5mm flex bend capability. Combines cascading electrode design with tearaway, termination technology. Provides for a high level of protection from thermal stress cracks, pickand-place damage, and board flex stress Fail-Open Condition Up to 5mm flex bend capability. Up to 2mm flex bend capability
14 Flex Mitigation Technology: Level I Basic Level of Crack Protection Floating Electrode FE CAP Open Mode
15 Flex Mitigation Technology: Level I Open Mode Crack Effective (Active) Area The margin area between the end termination and the effective (active) area is increased in order to prevent cracks from propagating through opposing electrodes. May experience a drop in capacitance but a short is unlikely. Design reduces likelihood of a low-ir or short circuit condition in a board flex situation. Reduces chance for a catastrophic and potentially costly failure event. Available in mid to high capacitance values up to 1µF
16 Flex Mitigation Technology: Level I Floating Electrode FE CAP Effective (Active) Areas Crack Serial design commonly seen in High Voltage MLCC s. May experience a drop in capacitance but a short is unlikely. Design reduces likelihood of a low-ir or short circuit condition in a board flex situation. Reduces chance for a catastrophic and potentially costly failure event. Available in low to mid capacitance values less than 1µF.
17 Flex Mitigation Technology: Level II Flexible Termination Level III: High Level of Crack Protection Level II: Intermediate Level of Crack Protection Flexible Termination Floating Electrode plus Flexible Termination Safety Critical Level 0: NO Crack Protection Standard MLCC Non-Critical Fail-Short Condition Level I: Basic Level of Crack Protection Floating Electrode or Open- Mode Semi - Critical Fail-Open Condition Up to 2mm flex bend capability Critical Flexible termination provides for a high level of protection from thermal stress cracks, pick-and-place damage, and board flex stress Fail-short Condition Up to 5mm flex bend capability. Combines cascading electrode design with tearaway, termination technology. Provides for a high level of protection from thermal stress cracks, pickand-place damage, and board flex stress Fail-Open Condition Up to 5mm flex bend capability. Up to 2mm flex bend capability
18 Flex Mitigation Technology: Level II Flexible Termination Standard Termination Sn Ni Cu Flexible Terminations Ceramic Body Conductive Epoxy Sn Ni Cu Ceramic Body
19 Flex Mitigation Technology: Level II Flexible Termination Termination Tear Reduces stresses transmitted to the brittle ceramic body. Stresses are transferred to the end terminations. Maintains circuit Integrity in extreme flex environments. Reduces chance for a catastrophic and potentially costly failure event. Up to 5mm of bend flex capability. Fail short failure mode if overstressed..improved temperature cycling performance over standard termination system.
20 Flex Mitigation Technology: Level III Hybrid Technology Level III: High Level of Crack Protection Level II: Intermediate Level of Crack Protection Flexible Termination Floating Electrode plus Flexible Termination Open Mode plus Flexible Termination Level I: Basic Level of Crack Protection Critical Safety Critical Level 0: NO Crack Protection Standard MLCC Non-Critical Fail-Short Condition Floating Electrode or Open- Mode Semi - Critical Fail-Open Condition Up to 2mm flex bend capability Flexible termination provides for a high level of protection from thermal stress cracks, pick-and-place damage, and board flex stress Fail-short Condition Up to 5mm flex bend capability. Combines Fail -Safe electrode designs with tearaway, termination technology. Provides for a high level of protection from thermal stress cracks, pickand-place damage, and board flex stress Fail-Open Condition Up to 2mm flex bend capability Up to 5mm flex bend capability.
21 Flex Mitigation Technology: Level III Flexible Termination plus Floating Electrode. KEMET FF-CAP is built to give designers one of the best possible choices for safety critical applications: Flexible Termination Tear away technology. High mechanical performance able to withstand up to 5mm bend flex. Floating Electrode Design Open failure mode when products are overstressed. Available in low to mid capacitance values. Termination Tear Crack
22 Flex Mitigation Technology: Level III Flexible Termination plus Open Mode. KEMET FO-CAP is built to give designers one of the best possible choices for safety critical applications: Flexible Termination Tear away technology. High mechanical performance able to withstand up to 5mm bend flex. Open Mode Design Open failure mode when products are overstressed. Available in Mid to High capacitance values. Crack Termination Tear Effective (Active) Area
23 Portfolio Summary
24 Current Flex Crack Mitigation Technologies Technology Target Values Failure Mode Flex Capability Example Floating Electrode FE CAP Low to Mid Capacitance Open 2mm Open Mode Mid to High Capacitance Open 2mm Flexible Termination FT CAP High Capacitance Short Up to 5 mm Floating Electrode + Flexible Termination FF CAP Low to Mid Capacitance Open Up to 5mm
25 Flex Solutions AEC Q200 Qualified Flexible Termination V 25V 50V 100V 200V Flexible Termination Capacitance Open Mode NEW! Open Mode V 25V 50V 100V 200V Floating Electrode and Floating Electrode with Flexible Termination Floating Electrode (also available with Flexible Termination*) Voltage V 25V 50V 100V 200V 0402* *0402 s are not currently offered with Flexible Termination
26 Applications & Markets
27 Flex Mitigation Technology: Applications & Markets Applications: Circuits with a direct battery or power source connection. Critical and safety relevant circuits without (integrated) current limitation. Any application that is subject to high levels of board flexure or temperature cycling. Examples Raw Power Input side filtering (power plane/bus) High current applications (automobile battery line) Circuits that cannot be fused to open. Markets: Consumer Medical Industrial (Power supply) Automotive Aerospace Telecom
28 Flex Mitigation Technology: Potential Customers Automotive: Bose Delphi Lear Continental Bosch Temic TRW Valeo Visteon Power Supplies: Artesyn Aztec Delta Lambda Power One ITT Power Solutions TRC Electronics Lineage Power Kaga Electronics
29 Questions You Need To Ask
30 Flex Mitigation Technology: Questions you need to ask.. FE CAP Open Mode FT CAP FF CAP Does your application have a direct battery or power source connection? Is your application a critical and safety relevant circuit? Is there any integrated current limitation in your circuit? Is your circuit board subject to high levels of board flexure during assembly, mounting or depanelization? In case of component failure (flex crack) do you prefer an open or short circuit condition? Are you placing MLCC s close to the edges or corners of your board? Are MLCCs being placed near or around connectors or heavy components?
31 Ordering Information
32 Flex Portfolio Part Numbers AEC Q200 Qualified Floating Electrode FE CAP Example: C0805S563K4RAC Open Mode Example: C0805F474K3RAC Flexible Termination FT CAP Now available up to 2225 case size! Example: C0805X105K3RAC Floating Electrode + Flexible Termination FF CAP Example: C0805Y223K1RAC Open Mode + Flexible Termination FO CAP Example: C0805J223K1RAC
33 Upcoming Flex Mitigation Technology LEVEL IV
34 Upcoming Flex Mitigation Technology: Level IV Commercial Stacks Commercial Stacks Target Application: Mission Critical
35 Question & Answer
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