Environmental Friendly PWB & Packaging Materials

Transcription

1 Environmental Friendly PWB & Packaging Materials May Electronic Materials Business Unit

2 Agenda 2 1. Brief Introduction of Panasonic Electric Works (PEW) 1) Corporate and EMBU (Electronic Materials Business Unit) 2) EMBU PWB Materials Business Highlights 2. Environmental Activities on Green Materials Today 1) Global Environmental Concerns, and Why Green? 2) Panasonic Environmental Strategy 3) Green Technologies for PWB Materials 3. Environmental Challenges on Green Technologies for Future 1) Future Direction on Electron Products PWB Materials 2) New Technology Development on Green Materials

3 Panasonic Environmental Strategy 3 Key Initiatives 3 Eco Ideas Strategy contributing to global warming prevention Eco Ideas for Products Communications Increase the number of products with the No.1 energyefficient performance and phase out low energy Products efficient products Services Eco Ideas for Everybody, Everywhere Spread environmental activities Throughout the world from local Communities to the global community Facilities Eco Ideas for Manufacturing Reduce CO2 emissions by improving productivity to bring CO2 emissions down further to the level of fiscal year 2001

4 Green Technologies for PWB Materials 4 1. HalogenFree Materials 2. LeadFree Compatible Assembly 3. ECO Friendly Mfg Process

5 RoHS vs LeadFree & HalogenFree 5 RoHS Pb Mercury Cadmium Hexavalent Chromium PBB PBDE RoHS PWB Assembly Solder Pb Free Solder Rise of Melting Point Rise of Reflow Temp PWB Materials High Heat Resistance Higher Tg Higher Degradation Temp Other Bromine Flame Retardants NonBromine LeadFree Conventional Type HalogenFree

6 Green Technologies for PWB Materials 6 Definition HalogenFree Laminates Bromine (Br) content: 0.09wt% (900ppm) or less Chlorine (Cl) content: 0.09wt% (900ppm) or less Br & Cl contents: 0.15wt% (1500ppm) or less By combustion flask type Ion Chromatography method JPCAES <TESTMETHOD FOR HALOGENFREE MATERIALS>

7 Elemental Technology for Frame Retardants 7 Elemental Technology 1 Advantage Phosphorus Type Flame Retardant (New) Brominate Type Flame Retardant (Old) Restraint decomposition reaction in the solid phase and carbonize the surface of the plastic. Restraint decomposition reaction in the gas phase. Brominated Dioxin might be generated. High Heat Resistance(T288 T288) T288 (IPCTM 650) R1566W 22min Standard FR4 1min Mechanism of Combustion Oxygen Elemental Technology2 Combustion Diffusion Diffusion in the solid Thermal Decomposition Plastic material (Surface) Phosphorus flame retardant is reacted with epoxy resin. To apply reactive phosphorus raw material. Reacted with epoxy resin No unreacted additives No deterioration in cured epoxy characteristics Epoxy resin Reactive phosphorus compound

8 PWB Material Proposal for LED Application 8 Approach LED Temp Simulation Clarify how various parameters affect the rising of LED temperature by using a Model of PWB test coupon with assembled LED and General Software of thermal flow (STARCD) Analyze temperature when it is rising gradually and becoming constant Evaluate Coefficient of Thermal Conductivity (CTC) of PWB test coupons (0.4, 0.6, 0.8, 1.0, 1.2 W/mK) Analysis Model and Boundary Conditions Test Coupon LED 0.05W 3 2mm 340 W/mK PWB( 25 1mm) Resin 1.0mm LED Copper Resin Resin Copper *Copper foil 18μm Analysis Model (calculated by ¼ Model ) Enlarged Enlarged PWB Test coupon LED Boundary Conditions Operate Air at 20 and thermal under CTC of 8W/m2K Wall Boundary Symmetry Boundary * 8W/mK is typical condition of thermal analysis for electronics equipments

9 PWB Material Proposal for LED Application 9 Simulation Result Standard FR4 CEM3 HF FR4 CEM3 R1787 Coefficient of Thermal Conductivity of PWB test coupon(w/mk) Temperature of LED Rate of Change(%) ( K1 K2 / ( W2/mK 1/mK ) ) Temp( ) 25mm LED

10 Panasonic Proposal for Green PWB Materials 10 R1566W Mid Tg, HalogenFree and LeadFree Compatible R1577 High Tg, High Td, HalogenFree and LeadFree Compatible R1515H RF705 R1755V R5775K HalogenFree and LeadFree Compatible, High Tg(270 ), Low CTE, for IC Substrates (CSP, POP, etc) HalogenFree, High Speed, LCP based Flexible CCL High Tg, High Td(350 ), LeadFree Compatible Ultra Low Loss, High Speed, LeadFree Compatible R5725 R1787 Low Loss, High Speed, LeadFree Compatible High Thermal Conductive (1.0W/mK) Composite Epoxy Material for LED application

11 Thank you! 11