A Component Supplier s Green Approach Texas Instruments

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1 A Component Supplier s Green Approach Texas Instruments IPC/JEDEC Pb-free Conference Dallas, TX Dec 9, 2008 Mark Frimann 1

Texas Instruments & RoHS Nickel-Palladium-Gold RoHS Compliant Solutions (no Tin Whiskering ) Nickel-Palladium-Gold RoHS Compliant Solutions (no Tin Whiskering ) Unique Part Numbers in addition to

2 Texas Instruments & RoHS Nickel-Palladium-Gold RoHS Compliant Solutions (no Tin Whiskering ) Nickel-Palladium-Gold RoHS Compliant Solutions (no Tin Whiskering ) Unique Part Numbers in addition to Standard Part Numbers Unique Part Numbers in addition to Standard Part Numbers Easy Access to Material Content Information ti.com/leadfree Easy Access to Material Content Information ti.com/leadfree Awareness Pilot/Ramp Production RoHS Jan04 Jan05 Jan06 Jan07 2

3 Lead-Free Trivia ~1 mg of Lead eliminated TI Ships X ~1 B-UnitsB = per month? Lead eliminated ~100 Car Batteries of Lead no longer used each month 3

4 RoHS Directive Substances Lead (Pb) RoHS Substance main issue for semiconductor suppliers Mercury (Hg) Threshold (homogeneous material) <1000 ppm <1000 ppm None TI Use Lead frame Finish, BGA Solder Balls, Also in lead frames (<300ppm), flip-chip solder bumps (exempt), and solder die attach* (exempt) Hex. Chromium (Cr6+) <1000 ppm None PBBs (RoHS defined Polybrominated Biphenyls) PBDEs (RoHS defined Polybrominated Diphenyl Ethers) Cadmium (Cd) <1000 ppm <1000 ppm < 100 ppm None None BGA Solder Balls (trace impurity) * solder die attach used in high-power type parts such as power amplifiers 4

5 Pb-Free & Green TI Definitions Pb-Free = RoHS & High Temp compatible Pb-Free : TI defines "Pb-Free" or RoHS Compliant to mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials unless exempt. Where designed to be soldered at high temperatures, TI Pb-Free and RoHS Compliant products are suitable for use in specified lead-free processes. Green = Pb-Free & no Bromine or or Antimony Green : TI defines "Green" to mean Pb-Free/RoHS Compliant and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). 5

6 Why go Green? Removes additional substances of of concern Saves time time & effort by by combining 2 conversions into into 1 qual qual Improves the the Moisture Sensitive Level (MSL) of of the the Package Example High-Temp Reclassification (i.e. 235 C 260 C) JEDEC MSL Rating Floor Life Time (J-STD-020C) (before rebake reqd) 1 Unlimited 2 1 year 2A After 4 weeks 3 Mold Compound 168 hours Upgrade 4 72 hours 5 48 hours 5a 24 hours 6 Time on Label (TOL) Floor Life Condition <30 C / 85% RH <30 C / 60% RH <30 C / 60% RH <30 C / 60% RH <30 C / 60% RH <30 C / 60% RH <30 C / 60% RH <30 C / 60% RH 6

Getting the Lead (Pb) Out Ball Grid Array (BGA) Parts Leadframe Based Parts Industry Standard Pb-Free Solution 1) Tin-Silver-Copper Alloy Solder Balls Common Pb-Free

for Components Components Used Used in in High-Reliability High-Reliability Products Products (May2005) (May2005) Recommendation Recommendation #1 #1 Use Use a a Non-Tin

7 Getting the Lead (Pb) Out Ball Grid Array (BGA) Parts Leadframe Based Parts Industry Standard Pb-Free Solution 1) Tin-Silver-Copper Alloy Solder Balls Common Pb-Free Solutions 1) Nickel-Palladium-Gold Plating 2) Tin Plating (risk of Tin Whiskers ) inemi inemi Recommendations Recommendations on on Lead-Free Lead-Free Finishes Finishes for for Components Components Used Used in in High-Reliability High-Reliability Products Products (May2005) (May2005) Recommendation Recommendation #1 #1 Use Use a a Non-Tin Non-Tin plating: plating: Nickel-Palladium-Gold Nickel-Palladium-Gold should should be be strongly strongly considered considered for for lead-frame lead-frame applications. applications. 7

8 Tin Whiskering Example Photos courtesy of NASA Electronic Parts and Packaging (NEPP) Program - 8

9 Conversion Progress Almost all all planned conversions have been completed. (( >96% >96% based based on on P/Ns, P/Ns, >98% >98% based based on on 4Q05 4Q05 shipped shipped units units )) >98% of of the the converted leadframe-based components use use the the Nickel-Palladium-Gold (NiPdAu) finish. 9

10 TI Pb-Free Part Numbers For BGA based parts YES. For Leadframe based parts YES. ( Pb-Free PN added after TI leaded inventory is depleted ) 10

11 Part Numbering, BGAs SnPb Solder Balls Lead-based Board Process (Low-Temp) ADS5121IGHK OPA2347YEDR Bad Solder Joints SnAgCu Solder Balls Lead-Free Board Process (High-Temp) ADS5121IZHK OPA2347YZDR * not actual color BGA BGA Parts Parts are are not not interchangeable, interchangeable, so so two two part part numbers numbers are are required. required. Support Support for for both both versions versions will will be be driven driven by by customer/market customer/market demand. demand. New New part part numbers numbers substitute substitute a Z Z into into the the package package suffix (Gxx Zxx, YEx YZx). suffix (Gxx Zxx, YEx YZx). For For Flip-Chip Flip-Chip BGAs, BGAs, RoHS-Exempt RoHS-Exempt PN PN = Zxx Zxx and and 100% 100% RoHS RoHS PN PN = Cxx Cxx.. 11

12 Part Numbering, Leadframe Parts SnPb Leadframe Lead-based Board Process (Low-Temp) TLC556CDR Converted NiPdAu Leadframe Lead-Free Board Process (High-Temp) TLC556CDR TLC556CDRG4 G4 TI s TI s primary primary Pb-Free Pb-Free solution solution is is Nickel-Palladium-Gold (NiPdAu). (NiPdAu). TI s TI s Pb-Free Pb-Free leadframe leadframe products products are are backward backward compatible compatiblewith with SnPb SnPb processes. processes. A Pb-Free Pb-Free PN PN will will be be added added using using JEDEC/IPC JEDEC/IPC based based Pb-Free Pb-Free codes. codes. Both Both the the Standard Standard PN PN & the the Pb-Free Pb-Free PN PN will will be be orderable orderable part part numbers. numbers. 12

TI Box Labeling Outer Outer Box Box Shipping Shipping Labels Labels will will display display the the ordered

Low-Temp MSL Ratings Assembly Site & Assembly Date Code (YYWW) Comparing the Assembly Site & Date Code to the Search

13 TI Box Labeling Outer Outer Box Box Shipping Shipping Labels Labels will will display display the the ordered ordered part part number number (Pb-Free (Pb-Free PN PN or or Std Std PN) PN) and and will will also also contain contain the the PB-Free PB-Free logo logo and and Pb-Free/Green Pb-Free/Green Finish Finish Code. Code. Inner Box/Reel Labels Customer Ordered PN E4 MSL Caution Label JEDEC Pb-Free Logo & Finish Code High-Temp & Low-Temp MSL Ratings Assembly Site & Assembly Date Code (YYWW) Comparing the Assembly Site & Date Code to the Search Tool info will always identify Pb-Free parts. Comparing the Assembly Site & Date Code to the Search Tool info will always identify Pb-Free parts. 13

Symbolization Strategy Parts will be marked with the following 2-character codes, space permitting. (~98% of devices are OK, pkg size must be > 3.5mm X 3.

14 Symbolization Strategy Parts will be marked with the following 2-character codes, space permitting. (~98% of devices are OK, pkg size must be > 3.5mm X 3.5mm ) This added symbolization may lag the Conversion Date Code by 1-2 months due to WIP issues. JEDEC/IPC Finish Categories (JESD97, IPC-1066) SnAgCu (BGA solder balls) Precious Metals (No Tin) - Ag, Au, NiPd, NiPdAu JEDEC/IPC Pb-Free* Marking Standard E1 E4 TI-Green* Marking Standard G1 G4 *JESD97 only requires Pb < 1000ppm, TI will only use these markings when parts meet our Pb-Free & Green definitions. (TI Pb-Free = RoHS & High-Temp compatible, TI Green = TI Pb-Free and no Sb/Br) Some TI parts (<3%) will use E3 (Matte Tin) or E6 (Tin-Bismuth). 14

15 ti.com Product Folder Example 15

16 ti.com Pb-Free Search Tool Li-Ion Charge Mgmt IC 16

17 Pb-Free Search Tool Results Primary Summary Information >> RoHS & JIG Level A Substances Green & JIG Level B Substances >> Recyclable Metals & Last Update Info ( click for the rest of the columns ) 17

18 Pb-Free Search Tool Product Content Details ( click for more ) 18

19 Material Declaration Certificate ti.com/leadfree 19

20 TI Pb-Free & Green Summary TI s TI s primary Pb-Free Solution is is Whisker-Free We We have >15 >15 years experience with with NiPd based leadframes We re doing 4 conversions (Pb-Free (Pb-Free& Whisker-Free, Whisker-Free, High-Temp High-Temp & Green) Green) at at the the same time time for for most parts = fewer changes for for customers We re adding Pb-Free PNs PNs for for BGA & Leadframe based parts (Z, (Z, G4) G4) We re providing easy access to to key key Pb-Free info info (Search (Search Tool, Tool, etc) etc) Bottom line - We re trying to do our part to make this industry transition easier for you. 20

21 Additional TI Pb-Free Info Self-Serve General Info Info ti.com/ecoinfo App App Notes ti.com/leadfree Product Folders ti.com Product Content/Sch ti.com/productcontent Pb-Free Certificate ti.com/leadfree TI TI Help TI TI Tech Support support.ti.com Questionnaires TI-authorized Sales Representative 21

Pulse White Paper Regarding RoHS Compliance

Pulse White Paper Regarding RoHS Compliance Table of Contents Executive Summary... 2 Background/History... 3 Materials Selection... 3 Testing/Validation... 4 Implementation/Conclusion... 5 References...