YANTAT PRINTED CIRCUIT (SHENZHEN) CO. LTD.

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2 YANTAT GROUP HK HEAD OFFICE Logistic/Sales YANTAT PRINTED CIRCUIT SHANGHAI SALES OFFICE SHENZHEN SALES OFFICE

3 HONG KONG HEAD OFFICE

4 YANTAT PRINTED CIRCUIT

5 YANTAT PRINTED CIRCUIT

6 YANTAT S MAIN OBJECTIVES TO PROVIDE THE BEST SERVICE AND QUALITY PRODUCT TO OUR CUSTOMERS TO DEVELOP LONG-TERM MUTUALLY BENEFICIAL PARTNERSHIP

7 BACKGROUND Name of Company: YANTAT Printed Circuit (Shen Zhen) Co.,Ltd. President: W.Y.CHAN Established: HongKong ShenZhen 1991-Present PingShan,ShenZhen Capital(2007): USD$ 49,000,000 Plant A Size: 58,000 Square Meters Plant B Size: 7000 Square Meters No. of Employees: 1600 Production Capacity: 45,000 Square meters per month

8 MANAGEMENT 30 MARKETING 40 ENGINEERING 55 OTHERS 65 QUALITY ASSURANCE 120 PRODUCTION 1200

9 INTERNATIONAL CERTIFICATIONS TS Certificate No. CN06/0009 T2 ISO14001 : 2004 Certificate No E R1-M UL-796 Certificate No. E152990

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11 Certificate of International Management System

12 IPC MEMBER SINCE 1999

13 IPC-A-600G PERFAG IPC6011 IPC-6012A IPC-D-300 IPC-SM-840C ANSI/UL-796 Acceptability of Printed Boards 2E, 3C General Performance Specification for Printed Boards Qualification and Performance Specification for Rigid Printed Boards Printed Boards Dimensions and Tolerances. Qualification and Performance of Permanent Solder Mask Standard for Printed Boards

14 YANTAT MARKET SHARE U.S.A. 15% Europe 30% China 22% Japan 10% Hong Kong 13% Australia 10%

15 Major Customers

16 Domestic China OEM Customers

17 CEM Customers

18 ENIGMA

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20 Yantat has been approved as Nokia qualified supplier since 2005

21 8 LAYERS 15% LAYERS 2% MEDICAL 10% 6 LAYERS 15% OTHERS 28% (TEFLON, METAL-BACKED) OTHERS 5% 4 LAYERS 25% DOUBLE SIDED 15% COMMUNICATION 40% INDUSTRIAL AUTOMATION 20% AUTOMOBILE 20% CONSUMER ELECTRONICS 5%

22 SALES TURNOVER USD$ YEAR 2007

23 Mass Production New investment Construction starts in 2008 Q2 Customer Customer Prototype Shop Quick turn R & D Max 1m 2 Small Volume High Mix Max 15m 2 Output Mass Production Shop Medium volume Low mix 50 m 2 Minimum

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25 WATER RECYCLING PLANT Over USD$2 millions Investment Recycling water can be used again in the production Environmental friendly

26 The Water Treatment System The Entrance

27 Waste Water

28 Automatic reagents feeders

29 Mud Processor

30 Settling Tank and Mud Processor

31 Filtration Tanks

32 Micro Filtration

33 RO System

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36 ENVIRONMENTAL PROTECTION Solar System save energy hot water supply environmental friendly

37 Ionic Ionic contamination tester Model Tester Z-100A RELIABILITY TESTS 100% Electrical Test 100% Visual Inspection (including warp & twist check) Dimensional Inspection (finished hole sizes, pcb profiles, etc) Microsection Solderability Test (245±5ºC; 3-5 sec) Thermal Test (288±5ºC; 10 sec. inspect delamination, etc) Tape Test (adhesion test) Peel Test (conductor peel strength) Impedance Test Ionic Contamination Test Microscope (Micro-section) Model GX-FSL Gel Tester Peel Strength Tester Model TA650 Model 030

38 YANTAT Capabilities Conductor width/spacing 4 /4 mils Aspect Ratio 1 : 8 Min Finish hole diameter Multi-layers Board thickness Solder Mask Legend Surface Finishes 0.15mm Up to 20 layers Minimum 0.25mm, Maximum 3.8mm LPI, Peelable ink, Carbon ink Two Part epoxy and UV Electrical Test Voltage : V Profiling Gold finger thickness HASL, Lead Free HASL, Flash Gold, Immersion Silver, Immersion Tin, Immersion Ni/Au, OSP, Selective Hard Gold. Punching, Routing, V-Cut μm (Au) Maximum panel size 610 mm X 508 mm (24 X 20 ) Impedance Control +/- 10%

39 TECHNOLOGY ROADMAP 2001/ / / /2007 Line width / spacing 6/6 MIL 5/5 MIL 4/4 MIL 3.5/3.5MIL Layer count 2,4,6, (prototype & small quantity) > 16 Min. hole size : 0.30mm 0.2mm 0.20mm 0.15 mm Max. board thickness 3.4mm 3.8mm 4.0mm 4.5mm Material FR-4, PTFE, Metal Backed FR-4, PTFE, Metal Backed FR-4, PTFE, Metal Backed Rigid-Flex Hybrid Material Polyimide Impedance control +/- 10% +/- 10% +/-10% +/- 10% Surface Finish HASL, Flash-Au, HASL, OSP, Flash-Au, Hard Gold Quality ISO9002, QS9000 QS9000 ISO Immersion Ni/Au, Immersion-Tin, Immersion Ag OSP-HT, Pb-free HASL ISO14001 TS 16949

40 MATERIAL RANGE Standard FR1, FR2, FR4,CEM1 and CEM3 High performance substrates including Teflon (PTFE), GETEK, Rogers 4003 & 4350 etc Metal-backed PCB s including Aluminum Carrier Plates High Temperature substrates (170 tg) Further product enhancements to include rigid flex board (Up to 6 Layers) and related products Impedance controlled PWB Halogen-free PWB

41 High Frequency Microwave PCB Specifications: Thickness: 0.5mm Finishing: HASL Material: Metal backed Materials : Taconic: TLC-32, TLX-8, TLK-5, Rogers: RO4003, RO4350, Arlon, Metclad, GE: GETEK Specifications: Thickness: 0.76mm Finishing: HASL Material: ROGER R4350 Specifications: Thickness: 0.5mm Finishing: HASL Material: Teflon

42 NEW EQUIPMENT Automatic Immersion Silver Line Plating Line Automatic Immersion Tin Line Pressing Machine Lead-free HAL Machine Brown Oxide Line

43 YanTat Group Development Plan Expansion of YanTat Printed Circuit and Establish a New C Plant will have 60,000 Square Meter / Month capacity. Establish an automated High Volume manufacturing facility will have 80,000 Square Meter / Month capacity in Eastern China.

44 New expansion in south China on the existing location (Nanbu Industrial Estate,Ping Shan,Shen Zhen City) on the basis of present plant (65,000 square mater) and will add another 100,000 square meter YanTat Plant C. Present factory Building Location For New Factory C

45 YanTat Plant C

46 Construction on the 300,000 square meter landscape in Eastern China an Automated & High Volume production plant for our Automotive and Industrial customers

47 LOCATION YANTAT Factory CHINA HONG KONG HONG KONG Head office

48 Leon, Cecilia, Agnes, Evelyn, Allen, Amy, Ted We are always here to support you!