SE2618F with Cu wire at Carsem Package Qualification Plan

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45mm 16L Report No: Qual-QP-12-01106 Qualification Team Product Engineer: Marquis Julien Requester: CG

1 SE2618F with Cu wire at Carsem Package Qualification Plan Part Number: SE2618F with Cu wire Product Type: 2.4GHz b/g/n WLAN FEM Package Type: QFN 2.5 x 2.5 x 0.45mm 16L Report No: Qual-QP Qualification Team Product Engineer: Marquis Julien Requester: CG Yong Product/Package Reliability: Rebecca Luk Prepared by: Jose Salta Skyworks Solutions, Inc. Product & Package Reliability 20 Sylvan Rd. Woburn, MA 01801

2 SE2618F with Cu wire at Carsem, QUAL-QP REVISION HISTORY Rev Description of Change Author Submit Date 1 Initial Release Jose Salta Change lot sampling requirements; qualification parts to come from nominal wire bond assembly splits (Cu-M). Included QBI matrix to justify SE2618F as primary qualification vehicle for SE2603L, SE2605L, SE2597L and SE2574BL. Updated reliability file numbers. Added SE2577L to QBI matrix. Corrected wire bond attributes in QBI matrix. Jose Salta Jose Salta Table of Contents 1 Summary Reference Documents Skyworks Documents Other Supporting Documents Product Description and Information Reliability File Number: , , , Product Information Die Information Assembly and Package Information Material Information and Selected Dimensions HTOL Bias Conditions HAST Bias Conditions Rationale for Qualification by Inference (QBI) Package/Assembly Reliability Testing Requirements Product Level Reliability Requirements for Qualification... 6 Page 2 of 6 Form SQ , rev. 6 Skyworks Solutions, Inc.

3 Product & Package Reliability 1 Summary This document defines the package qualification requirements for the assembly of SE2618F with Palladium-coated copper (Cu) wire at Carsem Ipoh (Malaysia). SE2618F is a qualified product with standard gold (Au) wire in a released 2.5 x 2.5 x 0.45mm maximum height QFN package. The dice are fabricated in qualified 5PAE and CSOI7RF CMOS processes. This qualification is for assembly with palladium-coated Cu wire. SE2618F is being used as a test vehicle for the qualification of Cu wire-bonding on IBM 5PAE and CSOI7RF dies in devices assembled in QFN packaging. It provides Cu wire-related attributes also found in SE2603L, SE2605L, SE2597L, SE2574BL and SE2577L. When reliability testing on SE2618F is complete and passed, the other devices are considered qualified by inference and will meet Skyworks reliability requirements for production. They will be rated at JEDEC MSL1/260 C for moisture sensitivity. 2 Reference Documents 2.1 Skyworks Documents SQ Qualification Standard SQ Wafer Process Qualification Requirements SQ Package and Assembly Qualification Requirements SQ Product Qualification Requirements 2.2 Other Supporting Documents JESD22 JEDEC Standard Test Methods JESD47 Stress-Test-Driven Qualification of Integrated Circuits MIL-STD-883 Department of Defense Test Method Standard, Microcircuits Skyworks Solutions, Inc. Proprietary and Confidential Page 3 of 6

4 SE2618F with Cu wire at Carsem, QUAL-QP Product Description and Information 3.1 Reliability File Number: , , , Product Information Test Vehicle: SE2618F Product Function/Frequency: 2.4GHz b/g/n WLAN FEM 3.3 Die Information Mask Info Wafer Fabrication Information Die Attach Die Qty Mask Company Location Process Material Juniper A12 1 FNW IBM Burlington, VT 5PAE SiGe BiCMOS Blanche 458A01 1 FNW-0400 IBM Burlington, VT CSOI7RF Sumitomo CRM-1076NS Sumitomo CRM-1076NS 3.4 Assembly and Package Information Package Supplier: Carsem Ipoh (Malaysia) Package Family & Name: QFN 2.5 x 2.5 Package Body Dimensions: 2.5 x 2.5mm x 0.45mm max height 16L 0.50mm pitch 3.5 Material Information and Selected Dimensions PCB or Lead Plating Material: NiPdAu Bond Wire Size & Material: 0.9mil palladium-coated Cu Mold Compound: Sumitomo EME-G770HCD (Halogen free) Branding method: Laser 3.6 HTOL Bias Conditions Vcc: 4.35 V (Max Vdd) Vdig: 3.6 V RFin: 2450MHz, CW Pout: 17 dbm 3.7 HAST Bias Conditions Vcc: 4.35 V (Max Vdd) Vdig: 0 V Page 4 of 6 Form SQ , rev. 6 Skyworks Solutions, Inc.

5 Product & Package Reliability 4 Rationale for Qualification by Inference (QBI) Skyworks allows for minor changes within a similar qualified product family to be qualified by inference (reference SQ ). The main drivers for device reliability when migrating from Au wire to Cu wire are the bonding surfaces on the die and the type of wire bonds on the die. Among the five devices in the matrix below, SE2618F requires bonding on both an IBM5PAE die and an IBM CSOI7RF die (both with BOAC-type bond pads), has the most number of stand-off stitch bonds (SSB) and an average number die-to-die bonds. SE2618F s wire bond-related attributes cover those of the other devices. Based on this analysis, reliability test results on SE2618F apply to the other devices. The other devices can then be considered as qualified by inference after SE2618F completes and passes all reliability tests required for qualification. Device Comparison Device Die 1 Die 2 Number of wire bonds BSOB bonds Die to die bonds Die on die bonds Package SE2618F Juniper Blanche (IBM CSOI7RF) QFN SE2603L Heras2 Pandora (IBM CSOI7RF) QFN SE2605L SE2597L SE2574BL Ulrich Heracles Iota N/A QFN N/A QFN N/A QFN SE2577L Cobalt (IBM 5PAE IPD) CalliIsto (IBM CSOI7RF) QFN Skyworks Solutions, Inc. Proprietary and Confidential Page 5 of 6

6 SE2618F with Cu wire at Carsem, QUAL-QP Package/Assembly Reliability Testing Requirements General Information Total sample requirements (#parts x # lots): Part Number: Package: 240 x 3 Cu-M lots plus 90 x 1 Cu-M lot for LTM build SE2618F from Carsem Ipoh (Malaysia) QFN 2.5 x 2.5 x 0.45mm max 5.1 Product Level Reliability Requirements for Qualification Test 1 Qty for Qualification Endpoints (ATE) Accept Criteria Responsible HTOL Tc = 125 +/- 5 ºC, Tj 125 ºC Dynamic stimulus (JESD22-A108) 77 x 1 lot (90 for LTM build) 168 Hours 500 Hours 1000 Hours 0 Fail / 77 Reliability Preconditioning MSL1/260ºC (JESD22-A113) 240 x 3 lots Bake 125C / 24 Hours Moisture Soak 3x Reflow 0 Fail / 240 Assembly Foundry Acoustic Imaging (J-STD-035) 22 x 3 lots Pre- and Post-preconditioning 0 Fail (criteria per SQ ) Assembly Foundry HAST ºC, 85 %RH, 33 PSIA, max Vcc bias (JESD22-A110) 77 x 3 lots 96 hours 0 Fail / 77 Reliability Temperature Cycling -65 ºC to +150 ºC (JESD22-A104) 77 x 3 lots 500 cycles (condition C) 0 Fail / 77 Assembly Foundry High Temp Storage 150 ºC (JESD22-A103) 77 x 3 lots 1000 hours 0 Fail / 77 Assembly Foundry 1 All stress tests are performed by the procedures referenced in SQ Preconditioning is required before TC, HAST, and HTS stresses. The moisture sensitivity level must be documented. Page 6 of 6 Form SQ , rev. 6 Skyworks Solutions, Inc.

Quality and Reliability Report

Quality and Reliability Report Product Qualification MASW-007921 2mm 8-Lead Plastic Package QTR-0148 M/A-COM Technology Solutions Inc. 100 Chelmsford Street Lowell, MA 01851 Tel: (978) 656-2500 Fax: (978)