Asahi Kasei Microdevices Corporation. Quality & Environment Handbook

Transcription

1 Asahi Kasei Microdevices Corporation Quality & Environment Handbook

2 Index About Us 0.1 Introduction to AKM Company Organization Company Sites Asahi Kasei Microdevices and the Asahi Kasei Group Important Notices Related to Product Safety and Other Issues Social Responsibility 0-6 Chapter 1 "Quality Management System" 1.1 Compliance with International Standards Quality Management System Quality Policy Management Cycle Product Realization Monitoring, Measurement and Improvement Systems Management of Records Resource Management 1-24 Chapter 2 "Reliability Assurance" 2.1 Principle of Reliability Assurance Definitions Failure Distribution Accelerated Testing Model Reliability Test & Certification Reliability Qualification Plan AKM's Standard Test Methods Planning Testing According to the Failure Mode Reliability Qualification Techniques for Eliminating Latent Defects 2-15 Chapter 3 "Failure Analysis & Analysis Technology" 3.1 Failure Analysis Flow Analysis Equipment & Analysis Examples Root Cause Identification & Problem Solving Tools 3-16 Chapter 4 "The Management of Environment-Related Substances" 4.1 Management of Chemical Substances Management of Environmentally Hazardous Substances Green Procurement 4-7 Chapter 5 "Notes on the Use of AKM Products" 5.1 Notes on Mounting Soldering MSL (Moisture Sensitivity Levels) & Dealing with Moisture Absorption Underfill Notes on Board Design Notes on Circuit Design General Precautions About Derating Notes on Absolute Maximum Ratings Noise and Surge Voltage Countermeasures Latch-Up Countermeasures (For LSI / CMOS products) Notes on Handling Static Electricity & Electrostatic Discharge Destruction Packing Storage Methods Transportation Methods Cautions during Evaluation Notes on the Disposal of the Product 5-21 Chapter 6 "Appendices & Figures" 6.1 Reference Information Conflict Minerals Symbiosis with Regions Compliance with International Standards for Each Plant Documents Provided by AKM QC Process Chart Reliability Testing Results Estimated Post-Shipping Failure Rate Packing Specifications Package Thermal Resistance Flame Resistance FMEA (Failure Mode and Effects Analysis) ESD (Electrostatic Discharge) Recommended Land Pattern Package Cross Section Diagrams Package Diagrams & Marking Diagrams Analysis Data Component Tables Certificate of Non-Use Certificate of Compliance with the RoHS Directive Certificate of Non-Use of Substances Subject to the REACH Regulations Certificate of Non-Use of Halogens Reference Standards List of Tables & Figures 6-22

3 About Us About Us 0.1 Introduction to AKM The company name is registered as Asahi Kasei Electronics Kabushiki Kaisha in Japanese and as Asahi Kasei Microdevices Corporation in English. Under the abbreviated company name, AKM is a registered trademark in various countries around the world. With our unique development, design and production technologies, and superior strength in marketing, AKM provides the materials and functions that are essential for our customers production processes and final products. We will continue technological innovation to secure our position as an important partner for our customers and to achieve a high level position in the industry. Our business is primarily focused on advanced analog/digital IC s, as represented by products such as voiceband processing circuits, TCXO control circuits and electronic compasses for mobile information devices, and also on sensing devices, such as magnetic, current and infrared sensors. The products we have developed using our unrivalled advanced technologies have been widely used around the world Company Organization 2015) The organization chart for the company is shown in Figure (Correct as of September 1, Company Sites The latest information of sales office and operating sites of AKM in Japan and overseas are published on AKM-Website, and shown in Figures and (Correct as of September 1, 2015) 0-1

4 About Us Asahi Kasei Microdevices Corporation Corporate Administration & Planning. Risk Management & Coordination. Research & Development Center Quality Assurance Center Sales Division Sales Administration Department Sales Department 1 Sales Department 2 AKM Semiconductor, Inc. Asahi Kasei Microdevices Europe SAS Asahi Kasei Microdevices Korea Corporation Asahi Kasei Microdevices (Shanghai) Co., Ltd. Asahi Kasei Microdevices Taiwan Corporation Mixed Signal Products Division Sensing Products Division Manufacturing Center FAB1 FAB2 FAB3 FAB5 FABFP AKM Technology Corporation Asahi Kasei Technosystem Co., Ltd. Figure Company Organization Chart 0-2

5 About Us Figure Company Sites in Japan Figure Company Sites Overseas 0-3

6 About Us Asahi Kasei Microdevices and the Asahi Kasei Group As a member of the Asahi Kasei Group, Asahi Kasei Microdevices is responsible for business activities in the field of electronics. The business fields of the Asahi Kasei Group and the Group philosophy are shown in Figure Asahi Kasei Corporation Chemical and Fiber Asahi Kasei Chemicals Corporation Asahi Kasei Fibers Corporation Housing and Building material Electronics Healthcare Asahi Kasei Homes Corporation Asahi Kasei Construction Materials Corporation Asahi Kasei Microdevices Corporation (Our Company) Asahi Kasei E-materials Corporation Asahi Kasei Pharma Corporation Asahi Kasei Medical Co., LTD. Zoll Medical Corporation Figure Business Fields and Group Philosophy of the Asahi Kasei Group 0-4

7 About Us 0.2 Important Notices Related to Product Safety and Other Issues The documents related to AKM products, including catalogs and datasheets, contain an IMPORTANT NOTICE as points of caution related to product safety and other issues. These are representative examples of such notices, but it is important to check the actual notices for each individual product. IMPORTANT NOTICE 0. Asahi Kasei Microdevices Corporation ( AKM ) reserves the right to make changes to the information contained in this document without notice. When you consider any use or application of AKM product stipulated in this document ( Product ), please make inquiries the sales office of AKM or authorized distributors as to current status of the Products. 1. All information included in this document are provided only to illustrate the operation and application examples of AKM Products. AKM neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of AKM or any third party with respect to the information in this document. You are fully responsible for use of such information contained in this document in your product design or applications. AKM ASSUMES NO LIABILITY FOR ANY LOSSES INCURRED BY YOU OR THIRD PARTIES ARISING FROM THE USE OF SUCH INFORMATION IN YOUR PRODUCT DESIGN OR APPLICATIONS. 2. The Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact, including but not limited to, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for the above use unless specifically agreed by AKM in writing. 3. Though AKM works continually to improve the Product s quality and reliability, you are responsible for complying with safety standards and for providing adequate designs and safeguards for your hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of the Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. 4. Do not use or otherwise make available the Product or related technology or any information contained in this document for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). When exporting the Products or related technology or any information contained in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. The Products and related technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 5. Please contact AKM sales representative for details as to environmental matters such as the RoHS compatibility of the Product. Please use the Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. AKM assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 6. Resale of the Product with provisions different from the statement and/or technical features set forth in this document shall immediately void any warranty granted by AKM for the Product and shall not create or extend in any manner whatsoever, any liability of AKM. 7. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of AKM. 0-5

8 About Us 0.3 Social Responsibility The practice of corporate social responsibility (CSR) for companies is becoming more and more important each year, as companies conduct their business. In addition to complying with the laws and regulations of Japan and other countries (see 4.1 Chemical Substance Control), AKM also respects international guidelines such as the United Nations Global Compact and the Electronic Industry Citizenship Coalition (EICC) Code of Conduct. Refer to the AKM Environmental and Social Responsibility Section in the Asahi Kasei CSR Report for details on measures against violations of human rights such as child labor and others. Also, refer to section (Conflict Minerals) in this document for information on conflict minerals which are restricted by the financial regulatory reform in the United States (the Dodd-Frank Wall Street Reform and Consumer Protection Act). AKM not only complies with laws, regulations and public guidelines, but we are also promoting activities which aim for symbiosis with the surrounding regions and environments. Refer to section (Symbiosis with Regions) for details about these activities. 0-6

9 Chapter 1 Quality Management System Chapter 1 Quality Management System 1.1 Compliance with International Standards AKM was certified to the ISO 9001 International Standard for Quality Management Systems in June 1995, and to the ISO/TS16949 Standard for automotive-related products in July Certification for the ISO International Standard for Environmental Management Systems has been obtained by each location. (See Figure 1-1-1) Refer to section 6.3 (Status of Compliance with International Standards at Each Plant) for details of the situation of certification and the registration certificates. Figure ISO Registration Certificates 1-1

10 Chapter 1 Quality Management System 1.2 Quality Management System Quality Policy This is an introduction to AKM's Quality Policy, as set out in their QMS (Quality Management System). In this quality policy, we have clarified our commitment and determination to put efforts into activities that are considerate to quality and to the environment Management Cycle In AKM s QMS, the management cycle is operated annually on a company-wide level, as shown in Figure Based on the budget plan for each fiscal year, the quality objectives are set in the QMS. Activities are then implemented and managed to achieve these objectives. In the business plan management review, the quality objectives are set and their performance and achievements are reviewed. This business plan management review is held twice each year. An internal audit plan is set at the beginning of the fiscal year and an internal audit is held. The status of the QMS implementation is monitored through this internal audit and reviewed at the QMS management review which is held once each year. There is also an examination of ISO/TS annually. 1-2

11 Output Input Chapter 1 Quality Management System Business plan Management review [Beginning of FY, March] Customer Business plan QMS Management review [annually, December] Management responsibility Four key process /measure, analysis, improvement status in each department Internal audit [annually] Customer Resource provision and management Measurement, analyse and improvements Requirement Product realization Product Satisfaction Third-party assessment [annually, April] Quality improvement activities QMS improvement activities Business plan Management review [Middle of FY, September] The product realization process consists of four key processes, e.g. customer-related, design and development, manufacturing and quality Figure AKM's Management Cycle Product Realization Management System throughout the Product Life AKM manages every stage of a product s life, from its planning, throughout production, and up to the end of life, as shown in Figure Approval is performed when proceeding to the next stage and we ensure that the product requirements are satisfied and that customers are satisfied. 1-3

12 Chapter 1 Quality Management System Product planning stage Define the provisional specifications for the product and formulate the business plan Development planning stage Approval of business plan Define the detailed specifications for the product and formulate the development plan Development stage Review of development plan Design and develop the product and the manufacturing processes Approval of the start of production Production stage Produce the product Proposal to end production End of production stage End the production Figure AKM s Product Realization System In the product realization system shown in Figure 1-2-3, the Quality Assurance Center is involved in the investigations and approvals at each stage to ensure validation. 1-4

13 Chapter 1 Quality Management System Customer Sales Dept. Quality Assurance Center Design Dept. Technology Development Dept. Manufacturing Dept. Customer requests Market research Product planning stage Product quality planning (Discussion of required specifications, analysis of risks, etc.) APQP Meeting for product planning APQP Meeting when development start Product development plan Process / assembly development plan Development verification meeting Development plan stage Process / assembly development Product design Various design related reviews Characteristics check possible samples: Samples which have had a check performed of whether or not the characteristics satisfy the required specifications Characteristics guarantee possible samples: Samples with the same level of characteristics guaranteed as those on products Reliability guarantee possible samples: Samples with the same level of reliability guaranteed as that on products Production of samples to check characteristics Check of characteristics possible samples Check of characteristics Design approval Production of samples for characteristics Characteristics guarantee possible samples Characteristics guarantee Product qualification Reliability testing Development stage Process reliability qualification Reliability guarantee possible samples Assembly reliability qualification Reliability qualification APQP Meeting for transfer to mass production Quality assurance qualification Mass production Initial flow management / Special monitoring period Production stage APQP Meeting when check stability Figure Quality Assurance System from Design to Mass Production (outline) 1-5

14 Chapter 1 Quality Management System Design for Automobile Application Quality With products for use in automotive applications, AKM takes their application and usage environment into account and considers how to secure safety as we design products and manufacturing processes. We aim for stable supply of zero-defect products over the long-term, and carry out quality control and continual improvements. Products for automotive applications are developed and produced under management which complies with ISO/TS We also consider any additional (AEC-Q100, Q101) requests from customers. (1) AKM s APQP Activities APQP (Advanced Product Quality Planning) is one of the methods required in the automotive industry for product quality planning and management planning. These activities are implemented from the product planning stage so that defective products are not produced. At the time of product development, the Quality Assurance Center judges the quality target level necessary for the APQP activities in accordance with risk management for each project. The proposed projects are followed by the Quality Assurance Center until the desired level of production stability is confirmed. When the stability of production has been confirmed, management using APQP activities is completed. Figure shows examples of APQP activities. (Corresponding to Figures and ) Product planning stage APQP Meeting for product planning Development planning stage APQP Meeting when start development Development stage APQP Meeting for transfer to mass production Production stage Figure Product Development and APQP Activities 1-6

15 Chapter 1 Quality Management System (2) Zero Defects Manufacturing AKM has introduced the following innovative activities, in order to achieve zero defects: - Process control and quality control activities using statistical methods (see section (3) (Statistical Process Control)) - Facility maintenance (see section (2) Production Facility Management) - Inspection methods to remove latent defects (see section 2.3 Technologies to Remove Latent Defects) Change Control Changes which have an effect on quality and reliability require evaluation, verification, and validation. AKM established rules for change control based on JESD46D Customer Notification of Product/Process Changes by Solid-State Suppliers and other standards. For any changes that involve a specification change, and for changes that have an effect on the product reliability, the customer is notified in order to provide an adequate period of time for the customer to evaluate and respond to the change. Table illustrates examples of changes subject to change control at AKM. Firure shows the procedure for change control. Table Examples of Changes Subject to Change Control Classification of change Changes to product specifications Changes to materials Process changes Examples of changes Changes to specification documents - Changes to electrical characteristics - Changes to external dimensions - Changes to labeling and marking Changes to the lead frame materials (from 42 Alloy to copper) Changes to the mold resin materials (from materials with bromine to halogen-free materials) The transfer of the manufacturing process to a different plant A change to the foundry to which wafer manufacturing is contracted 1-7

16 Chapter 1 Quality Management System Supervising Dept. Related Dept. Quality Assurance Center Sales Dept. Customer Occurrence of change case Prior evaluations and investigation Drafting of change plan Either returned to the supervising department or the plan is cancelled Not possible Judgment of whether or not verification plan is possible Possible Requirements related to the change Not necessary Judgment on notification at the drafting stage Necessary Notification to the customer Check by customer Implementation of verification plan Check of contents Receipt of check Check of appropriateness Either returned to the supervising department or the plan is cancelled Not possible Judgment of whether or not application of the change is possible Possible Requirements related to the change Not necessary Judgment on notification at the implementation stage Necessary Notification to the customer Check / approval by customer Check of contents Receipt of check Application of change Initial flow management Check on results of initial flow Figure Procedure for Change Control (outline) 1-8

17 Chapter 1 Quality Management System Purchasing (1) General When the purchasing department procures raw materials, services and others, it evaluates their quality and performance. In order to maintain a consistent supply chain at both AKM and at our customers, AKM recommends the acquisition of ISO 9001 and ISO/TS certification for our suppliers. The evaluations also include consideration of the environment and of the materials contained. When necessary, AKM requires and checks the certificates to prove that particular materials are not contained or are not used. Refer to Chapter 4 for information on the handling of environmentally hazardous substances and green procurement. (2) Management of Subcontractors When subcontracting part of the manufacturing process, AKM establishes a system of conformity based on the specifications agreed between AKM and the subcontractor to promote the maintenance and improvement of the quality of the subcontractor s performance through continuous evaluations and verification. From this perspective of supply chain management, the following three points are considered by management:. 1) Efforts to enhance activities to prevent accidents, rather than just dealing with accidents once they have occurred. 2) Efforts to prepare a system that can also respond to the quality requirements of customers for automotive applications, including the development of a quality and environmental system at the external subcontractor, with the goal of achieving conformity to ISO/TS ) The construction of a management system for subcontractors around the world consistent with the aim of management at a global level. Figure indicates the activities carried out by AKM to manage subcontractors. 1-9

18 Chapter 1 Quality Management System - Subcontractor screening registration Management Department AKM Subcontractor - Requirements related to quality and the environment - Examination of specification documents and control plan - Monitoring of quality (Yield and quality accidents) - Regular vendor evaluations - The correction of quality accidents and efforts to prevent recurrence - Horizontal deployment (extension of examples of problems) and prevention of occurrences - Regular checks of continuous improvement, the prevention of occurrences and the prevention of recurrences. Subcontractor - Quality meetings and recurrence prevention. Figure Subcontractor Registration through Evaluation Through these activities, closer ties are developed along the route from the subcontractor to AKM and on to the customer, so that AKM and the subcontractor can work together to take measures to improve customer satisfaction Production Control System (1) Production Control System AKM performs production control aided by a CIM (Computer Integrated Manufacturing) system to ensure traceability at the lot level. By performing delivery management using this system, we aim to make detailed adjustments to the product processing speed for each product in order to meet the delivery date requirements of each customer. Management systems such as CIM have an online connection not only to an automated warehouse on the plant floor but also to the production control department in the headquarters, so these systems make a large contribution to total delivery management, which includes the product plan, flow management, inventory management and shipping. Our aim is to achieve lean manufacturing (*1) through the use of this production control centering on CIM. Figure shows an outline explanation of the production control system at AKM. (*1) Lean manufacturing (or lean product system): A method of production control which aims to eliminate waste in the manufacturing process and to systematically reduce total costs for the products and the manufacturing processes overall. 1-10

19 Chapter 1 Quality Management System Customer Sales sites Sales Department and Production Control Order management system Sales and outsourcing management system Cost control system Wafer Front-end processing Back-end processing Product warehouse Product shipping Manufacturing Site CIM Design management system Quality management system Test management system Figure Integrated Production Control System (2) Production Facility Management There are two key points for production facility management: [1] To perform daily inspections and maintain normal status, and [2] To perform checks after dealing with short term breakdowns, after repair and after planned maintenance, in order to release the equipment in a normal state. At AKM, planned maintenance is performed to prevent unnecessary equipment stoppages to improve the equipment operating rates, and also to maintain product quality. Figure illustrates an outline of the planned maintenance. Both TBM and CBM (*1) methods are used when the maintenance plans are scheduled and implemented. (*1) TBM and CBM TBM (Time Based Maintenance): Preventive maintenance is performed at a fixed interval which is decided based on past results, etc. CBM (Condition Based Maintenance): The status of the equipment is monitored and predictive maintenance is performed when necessary. 1-11

20 Chapter 1 Quality Management System Maintenance Planning Analisys of maintenance data Analisys of failure cause Maintenance Work Inspection, Diagnosis Repair, Maintenance Repair aging, Replacement Figure Basic Outline of Planned Maintenance (3) Statistical Process Control In order to supply products with consistent quality, AKM performs quality control using statistical methods in accordance with the SPC (Statistical Process Control) manual (*1). The stability of the process is verified by checking control charts and process capability indices (Cp, Cpk) and if an abnormal trend is detected, appropriate action is taken to effect a rapid recovery. (*1) SPC Manual: One of the core tools used in ISO/TS The manual issued by the AIAG (Automotive Industry Action Group) (USA) which gives the concrete criteria, etc., necessary to perform process control using statistical methods. (4) In-process Inspections and Action when Abnormalities are Detected When an abnormality of some kind is detected in the monitoring data during product processing, or when products outside the control values are found in the in-process inspections after product processing, the processing is stopped immediately and a problem report is issued, in order to prevent the outflow of defective product and to minimize the extent of the effects. When a problem report has been issued, the facts are checked, the cause is identified, the related personnel hold discussions to decide the action to take and a record is created. Figure shows an outline of the in-process inspections. 1-12

21 Chapter 1 Quality Management System Incoming Each process Wafer processing, assembly, etc. Inspections at each process (*1) Pass Fail -Stop of flow -Check of facts -Cause identification Flows to next process To inspection process Manufacturing Discussion between related personnel and When necessary: decision on action to take -Corrective action, horizontal deployment -Feedback to the process (*1) Examples of inspections at each process Items: External appearance, film thickness, line width, plating thickness, ball shear strength, Figure In-process Inspections and the Action when Abnormalities are Detected etc. Methods: Visual inspections, film thickness systems, SEM, etc. Frequency: Per lot / batch (5) Product Inspection Processes In our product inspection process, we perform inspection of the electrical characteristics and of the external appearance. The inspections of the electrical characteristics are composed of probe testing at the wafer level, sorting after assembly and final testing. The visual inspections include visual inspections at the wafer level, sorting after assembly and the final test. Figure shows the details of the product inspection process. 1-13

22 Chapter 1 Quality Management System Feedback Manufacturing process Probe test (*1) Wafer external appearance inspection (*2) Assembly process Feedback Sorting (*1) Final test (*3) Electrical characteristics Sorting (*1) Final test (*3) External appearance Packing and shipping (*1) 100% inspections: Managed by Manufacturing (*2) Sampling inspections: Managed by Manufacturing (*3) Sampling inspections: Managed by Quality Assurance Figure Examples of Inspection Processes at AKM Management of Measurement Tools In order to manufacture products that satisfy quality requirements, it is important that measurements are precise. Periodic calibrations and inspections are performed on measurement tools for which a guarantee of the precision of the measured values is necessary. The calibration is performed using measurement tools that have traceability secured to national and international standards. Figure illustrates the traceability system for calibration at AKM. 1-14

23 Chapter 1 Quality Management System National standards and international standards National Institute of Advanced Industrial Science and Technology, etc. Public inspection institutions Japan Electric Meters Inspection Corporation Japan Quality Assurance Organization Etc. General calibration institutions (*1) Measurement tool manufacturer Measurement tools for calibration Measurement tools for the process Asahi Kasei Microdevices Figure Traceability System Diagram for Measurement Tools AKM manages measurement tools in accordance with the MSA (Measuring Systems Analysis) manual (*2) core tool. The introduction of MSA makes it possible to not only understand errors in individual measurement tools, but to also statistically understand variation in a measurement system. (*1) Calibration organizations that conform with ISO/IEC are selected for the calibration of measurement tools that are used for products for automobile applications. (*2) MSA manual core tool: A manual issued by the AIAG which gives the concrete analysis methods and criteria necessary to analyze measurement systems using statistical methods. 1-15

24 Chapter 1 Quality Management System Monitoring, Measurement and Improvement Systems Evaluations of Customer Satisfaction AKM places great importance on feedback from customers, in order to achieve, maintain and improve a level of performance and the provision of products that are trusted by customers all over the world and that create new value for our customers at all times, as is stated in our quality policy. The Marketing and Sales Center periodically collects and summarizes various customer comments obtained through contact with customers with regard to specification exchange, technical information, quality data submission and quality requirements or contracts that have recently been diversified, customer complaints that indicate their dissatisfaction, and quality audits by customers. These customer comments are reflected to the top management and are also shared with related departments including subcontractors, in order to carry out activities to gain the satisfaction and trust of customers. For products affected by TS, we monitor the product quality and process efficiency in accordance with ISO/TS Figure illustrates the flow of evaluations of customer satisfaction levels. Customer Provision of products which will satisfy customers Score card QDC information, etc. Product realization process Do AKM Sales Dept. Reflection in quality targets related to customer satisfaction levels Plan Customer satisfaction evaluation sheet Evaluation meetings by managers Check Related departments (Corrections/ improvements) Management conference Management review Quality Assurance Dept. Act Figure Flow of Evaluations of Customer Satisfaction 1-16

25 Chapter 1 Quality Management System AKM System for Dealing with Customer Quality Problems If there is any quality problem with AKM products, the customer contacts the AKM sales staff, who acts as their contact. After cause identification and measures to prevent recurrence are implemented in accordance with the requirements of the customer, the Quality Assurance Center will summarize them and report to the customer via the sales staff. Returned products will be analyzed at the Quality Assurance Center at AKM. Refer to Chapter 3 for details of the analysis procedures and methods. Based on the results of the analysis, the Quality Assurance Center instructs the related departments to carry out investigations of the root cause and to take measures to prevent recurrence. The related departments include the Design Department, the Manufacturing Department and the Outsourcing Management Department (subcontractors, etc.), roughly categorized. When necessary, an adequate organization is formed based on a multidisciplinary approach including the Quality Assurance Center. The information from customers on defective products is input to a database by the AKM Sales Department. When proceeding with each analysis stage, the Quality Assurance Center quickly adds the obtained information to this database. By accumulating information in this way, it can be used not only for corrective action to prevent recurrences, but also as information for preventive action. Figure shows the system at AKM for dealing with customer quality problems. 1-17

26 Chapter 1 Quality Management System Customer Sales Staff Investigation and analysis Quality Assurance Center Design & Development Dept. Cause identification and countermeasures Manufacturing Dept. External Subcontractor Horizontal deployment AKM Quality Assurance Center Sales Staff Database of complaints per classification of root cause Customer Figure System at AKM for Dealing with Customer Quality Problems Corrective Action AKM implements appropriate corrective action for complaints and problem information received from customers, and for any non-conformity discovered in the process and quality management systems. When problems like these occur, a team based on a multidisciplinary approach is organized to solve the problem. This team clarifies the details of the problem and takes action to contain it, and to prevent the impact from spreading. The action to contain the problem includes measures such as stopping the shipping and flow of products within the scope of the impact of the problem and limiting the use of production equipment. Whilst implementing this containment action to prevent the expansion of the problem, various problem solving methods are used to determine the cause. Once the cause has been identified, methods such as 5 Whys analysis and 8D (Eight Disciplines Problem Solving) (*1) are used to pinpoint the root cause of the problem. Once the root cause has been found, permanent countermeasures are implemented and horizontal deployment and feedback to the system are done to prevent recurrences. 1-18

27 Chapter 1 Quality Management System After the effectiveness of the permanent countermeasures and the measures to prevent recurrence are checked, the corrective action is completed. Figure illustrates an example of the flow of corrective action. (*1) 8D: A method with a series of steps as the method for solving a problem which has occurred. It starts with the organization of a team and includes clarification of the problem, provisional countermeasures (for containment), analysis of factors, verification of countermeasures, the implementation of permanent countermeasures and action to prevent recurrences (horizontal deployment). Start corrective action Drafting of plan for corrective action Containment action (Stopping flow of affected lots, etc.) Identification of root cause Implementation of permanent countermeasures Action to prevent recurrence (Horizontal deployment, feedback to the system, etc.) Check of effectiveness of permanent countermeasures and measures to prevent recurrence Report of corrective action Department / site which was the cause Completion of corrective action Quality Assurance Figure Flow of Corrective Action (example: for a case of quality problems received from the customer or company-internal failures) 1-19

28 Chapter 1 Quality Management System Preventative Action At AKM, various types of information related to management and quality are collected and analyzed at occasions such as management reviews and management representative meetings. In addition, continuous monitoring of quality and other factors is also performed in the day-to-day production activities. If any undesirable trends or latent problems are discovered, preventive action is taken to stop these from becoming actual problems. Preventive action is implemented based on the results of an investigation of the type of countermeasure required. After preventive action has been implemented, its effectiveness is evaluated and feedback is given to related departments where necessary Continuous Organizational Improvements AKM continually approves the effectiveness of our quality management system by using a management process that is guided by the methodology of ISO 9001 (Managing for the sustained success of an organization a quality management approach). Continual improvements are not done through any particular individual or special activities, but tackled on a daily basis by applying the PDCA cycle everywhere in the process, from the quality management system to day-to-day production activities. Examples of AKM s continual improvements: Performance using quality objective management (see Management Cycle); and Management systems through internal audits and improvements by small group activities. (1) Continuous improvements to Management Systems through Internal Audits It is essential to check whether the quality management system conforms with the various requirements and check whether it is being implemented and maintained effectively. AKM performs internal audits periodically and also whenever necessary. The internal audits are classified according to their frequency and the items that are subject to the audit. Regular audits are implemented at least once each year. Also, special audits are implemented at any time, including [1] when follow-up has become necessary after a regular audit, [2] when there is a major change to the quality management system, [3] when a major complaint has occurred, and [4] when any other major quality problem has occurred. 1-20

29 Chapter 1 Quality Management System The competence of the auditors is evaluated after the completion of the internal audit, and guidance is given when necessary. AKM also strives to maintain and improve the competence of the auditors by implementing regular training sessions. Figure shows the flow of the internal audits. Planning of internal audit Inputs Training of auditors Implementation of audit Improvement instructions Corrective action Evaluation of auditors Management review Summary of audit results Outputs Figure Flow Chart for Internal Audits (outline) (2) Small Group Activities Small group activities are implemented as one method to motivate employees and raise their skill levels. Small group activities continue in an annual cycle and play an important role as activities to improve the workplaces. Teams that have carried out excellent activities participate in the Nationwide QC Circle Conference. Two teams received the Most Impressive award in fiscal year 2010 and four teams received it in fiscal year Figure shows a presentation of small group activities within AKM. 1-21

30 Chapter 1 Quality Management System Figure Small Group Activities Presentation (3) Example of Continual improvements (Particle reduction in FAB2 clean room) In wafer processing, particles are one of the factors that adversely affect product quality. AKM implements activities to reduce particles and to perform wafer processing in a cleaner environment. The cleanliness of the manufacturing area in the FAB2 clean room is FED-STD-209D Class 1 / 0.1 μm (roughly ISO Class 3 / 0.1 μm). (Figure shows the appearance of the work area in the FAB2 clean room.) In order to maintain this environment, in addition to the appropriate management of air conditioning equipment, AKM also promotes 5S activities such as regular cleaning activities. We also implement the management of particles in the clean room as shown in Figure Figure Clean Room (left: central aisle, right: working area) 1-22

31 Chapter 1 Quality Management System Particle (*1) measurement Yes Pass No (*2) Examples of action necessary -Wafer disposal -Addition of bad mark Etc. Continuation of normal operations (*1) Particles affected -Airborne particles -Product particles -Particles inside equipment -Fallen particles Issuance of abnormality notification report Emergency measures such as stopping of product flow Notification to related personnel Check on extent of impact Take necessary action (*2) for affected lots Discuss with related departments, investigate cause and decide countermeasures Notification to customers if necessary Implementation of particle countermeasures Figure The Flow of Particle Management Management of Records At AKM, we have set the periods shown in Table for the storage of records to secure traceability. Different storage periods are decided if customers, or laws or regulations require. Table Basic Storage Periods for Records *General records Type of record *Records necessary for product tracing or for the analysis of causes when problems occur (Records related to design and manufacturing) *Records which substantiate conformity with ISO/TS *Records to guarantee the appropriateness of products which are required to conform with ISO/TS Storage period 5 years or longer from production or shipping and, 1 year or longer from the obsolescence of the product 10 years or longer from the obsolescence of the relevant product 15 years or longer from production or shipping and, 5 years or longer from the obsolescence of the product 1-23

32 Chapter 1 Quality Management System Resources Management At AKM, the product realization process is supported by the management of resources: human resources, infrastructure, and the work environment Education and Training The personnel who have an influence on product quality are required to have the necessary competence for their work. AKM has created procedures for the personnel to gain necessary competence, and to evaluate and confirm their competence. We contribute to the achievement of the business plan by securing and educating our personnel. As shown in Figure , the education and training at AKM begins with an understanding of the initial competence of personnel. An additional education and training plan is then implemented, and concluded with a check on the effectiveness of the education and training. This check is then linked back to the evaluation of the competence of the personnel, and by implementing the PDCA cycle in this way, we continually improve or maintain the competence of the personnel. Customer requirements and environmental changes Abilities necessary for the work Compare these two and clarify any gaps Act Evaluation (understanding) of the abilities of personnel Drafting of plan for education and training Plan Check on the effects of education Check Implementation of education and training Do Figure The Flow of Education and Training (outline) 1-24

33 Chapter 1 Quality Management System Contingency Plan AKM has prepared contingency plans related to environmental safety, stable production and product quality. The emergency situations that have been assumed are shown in Table Table Emergency Situations that are Assumed Classification of emergency situation Industrial accidents Environmental safety related Stable production Product quality Natural disasters Supplementary information Fires, explosions, chemical substance leaks, etc. Earthquakes, typhoons, tsunamis, tornadoes Utility interruptions Insufficient electrical power supply, insufficient water supply, etc. Labor shortage - Key equipment failure - Accidents or disasters at the supplier of raw materials Accidents or disasters at processing subcontractor Accidents or disasters at transportation subcontractor A situation when filed return is necessary An urgent claim about quality Start up a project Respond with an emergency project structure Ensuring the Safety of Employees AKM places importance on ensuring the safety of its employees while performing manufacturing operations. In addition to complying with laws and regulations such as the Industrial Safety and Health Act, all the plants have introduced an OHSMS (Occupational Health and Safety Management System) to achieve a higher level of safety and security. Proactive activities are developed to find the points of hidden danger in the workplaces and to prevent accidents before they occur. 1-25

34 Chapter 2 Reliability Assurance Chapter 2 Reliability Assurance 2.1 Principle of Reliability Assurance Definitions Reliability is defined in JIS Z 8115 as the ability of an item to accomplish the required functions for a given period of time under given conditions. The following four items could be given in relation to reliability. [1] Reliability: The probability that required items can be executed under given conditions, for a given time interval. [2] Failure rate: The proportion of the normal, good items which fail in the time units given up to a time t after start of use. This is distinguished from the defect rate by the difference of a function of time. [3] Weibull distribution: A distribution function which expresses the life. A shape parameter (m), scale parameter (η) and location parameter (γ) are defined as indices expressing the distribution of failures. With the distribution of the failures, there is an early failure period, an operation period failure period and a wear-out failure period. These are expressed with the profile parameter m as early failures (m<1), operation period failures (m=1) and wear-out failures (m>1). [4] Normal distribution: The normal distribution is a distribution function conceived to express the distribution of errors. It is the foundation of statistical methods as a basic statistical distribution. There are also functions for the numeric conversion (quantification) of each of these. (a) Reliability Function The reliability function R(t) expresses the probability of not failing until a time t. It is defined by the equation: R( t) n c( t) n n: Total number of samples c(t): Number of failures which occurred up to time t There is also an unreliability function that forms a pair with the reliability function. The unreliability function F(t) expresses the probability of failing up until a time t. It is defined with the equation: 2-1

35 Chapter 2 Reliability Assurance c( t) F( t) n As can be seen from these two equations, the relationship R(t) + F(t) = 1 holds true between the reliability function R(t) and the unreliability function F(t). (b) Failure Rate Function The failure rate function λ(t) expresses the failure rate per unit of time, in time t. It is also called the instantaneous failure rate and is defined with the equation using the failure density function f(t) and the reliability function R(t): ( t) f ( t) R( t) The failure density function f(t) expresses the rate of failure increase at time t and is defined with the equation. f ( t) df t dt (c) Weibull Distribution The Weibull distribution is a life model which applies empirically in cases when the failure rate varies over time. The reliability function for it is expressed with the following equation. At the time when the reliability function R(t) value becomes exp (-1), the scale parameter η becomes a fixed value, which is not dependent on the value of the profile parameter m. R t t exp m m: Profile parameter η: Scale parameter (d) Normal Distribution The normal distribution is a probability distribution where the data gathers around the mean value. It is common to handle the frequency distribution of errors by assuming that it obeys this normal distribution. The probability density function of the normal distribution is defined using the equation. f x 1 exp x μ: Mean value σ: Standard deviation 2 2-2

36 Instantaneous failure rate Chapter 2 Reliability Assurance Failure Distribution The distribution of failures is divided roughly into the three areas of early failures, operation period failures and wear-out failures. It is possible to show the relationship between the instantaneous failure rate and the actual usage time as a bathtub curve, as shown in Figure It is also possible to know the failure distribution from the Weibull distribution profile parameter m. Early failure (m<1), operation period failure (m=1), wear-out failure (m>1) Product life Durable life Screening within the semiconductor manufacturing process Early failure period Operation period failure period Wear-out failure period Failure use time Figure Failure Rate Curve (bathtub curve) Expressing the Distribution of Failures (1) Early Failures (decreasing failure rate type Weibull distribution m<1) These are failures occurring due to design or manufacturing errors, break-in or variation. The failure rate is high immediately after manufacturing, but over time the latent defects are all exhausted and the failure rate falls. It is possible to screen for these early failures with in-process inspections of the electrical characteristics. Frequently, abnormal values are produced when electrical characteristics are measured in products that contain defects that will lead to early failures. In these cases, detection is possible by analyzing the distribution of the electrical characteristics measurement results. Usually units of ppm (parts per million) are used to express the early failure rate. This can be thought of as the number of failed devices per million. For example, if one out of 10,000 devices manufactured is a failure, then the defect rate will be 100 ppm. (2) Operation Period Failure (Constant failure rate type Weibull distribution m=1) This is the period between early failures and wear-out failures. We think of this as the area where the remaining early failures become apparent. The mean failure rate is the ratio of failures occurring in the time between the start of the mean failure period (the end of the defined period for early failures) and the time when the useful life is reached. The units generally used to express the mean failure rate are FIT (Failure In Time). 2-3

37 Chapter 2 Reliability Assurance This is an expression of the number of failures per 109 total operating hours (number of products operated x operating time). Number of failure 1 FIT= ( ) Number of productsoperated Operating time For example, a failure rate of 100 FITs means that the probability of failures occurring is one device in every 10 7 operating hours. It does not mean that the life of each individual device is 10 7 hours. In other words, this is equivalent to the occurrence of 100 ppm failures per 1000 hours. (3) Wear-out Failures (Increasing failure rate type Weibull distribution m>1) This is the period when the products reach the end of their life. The failure rate increases because eventually all the products fail due to causes such as wear, fatigue, corrosion and oxidation. The failures in this period are called wear-out failures. It is not acceptable to allow these failures to occur during the durable period, so it is essential that quality is built-in at the design stage to prevent the occurrence of these wear-out failures during that time. For this reason, the number of years of useful life and the cumulative failure rate up to that number of years are important for product life. Conventionally, MTTF (Mean Time To Failure) was used as one of the indices expressing life. However, this is only a value determined by calculation of the probability and it does not show the real situation. It is therefore important to clarify the life demanded of the product and to perform reliability testing to guarantee that period of time as the useful life. At AKM, with reference to JEITA EDR-4708, we clarify the quality grade and prerequisites for each application of the product and aim to perform appropriate reliability testing with a scientific basis for the useful life that has been set Models of Accelerated Testing Accelerated tests are defined in JIS Z 8115: Tests done at stress levels which exceed the specified values of the standard conditions, to reduce the observation time for the item's reaction to stress or to increase the reaction during a given time. Note: In order to maintain the appropriateness of the testing, the accelerated test must not alter the basic fault modes, the failure mechanism or the relationship between these two. Accelerated testing is a method that focuses on a specific stress in the usage environment. Testing is performed with stricter conditions to accelerate the failure phenomena physically or chemically, so that the failure rate and life under normal conditions can be estimated in a shorter period of time (or with a reduced number of test samples). However, there are limits to the acceleration possible at the product level, so it is not always possible to recreate the targeted failure mode. We also perform highly accelerated tests at the element level using TEG (Test Element Groups). 2-4

38 Energy Chapter 2 Reliability Assurance The four main models of accelerated testing are as follows: (1) Temperature acceleration model (Arrhenius model) (2) Temperature difference acceleration model (Eyring model) (3) Humidity acceleration model (4) Voltage acceleration model (1) Temperature Acceleration Model (Arrhenius Model) This chemical reaction model is the most generally used accelerated life model for semiconductor devices. It is a reaction theory model which states that the destruction and deterioration of items originates from changes at the atomic and molecular level and that failure occurs when these changes progress and exceed a certain limit. Figure shows a model diagram of the activation energy and the progress of the reaction. Activation energy Ea Original state (Normal state) Reaction generation state (Deteriorated state) Figure Reaction and Activation Energy in the Arrhenius Model (model diagram) The mechanisms of change include diffusion, oxidation, dislocation, electrolysis, corrosion and bonding deterioration due to alloy growth, and the acceleration factor common to all of these is temperature. The dependence of reaction speed on temperature is known widely as the Arrhenius model and the reaction speed K is expressed with the equation. Ea K exp k T Λ: Constant Ea: Activation energy k: Boltzmann's constant (= [ev/k]) T: Absolute temperature [K] 2-5

39 Life lnl Chapter 2 Reliability Assurance The reaction speed K is the reciprocal of the time until the device fails (the life), so it is possible to replace it with the relational expression of life and temperature as in this equation: Ea L A exp k T L: Life A: Constant With the natural logarithm of the equation above, is produced. E ln L k temperature is shown. a 1 ln T As shown in Figure 2-1-3, the linearity of the relationship between life and L1 L2 Temperature 1/T [1/K] 1/T2 1/T1 Figure Arrhenius Model Using this relationship, it is possible to predict the life (L1, L2) at differing temperatures and to use the ratio of these to determine the temperature acceleration coefficient. High-temperature operating tests and high-temperature storage tests of semiconductor devices usually use this Arrhenius model. (2) Temperature Difference Acceleration Model (Eyring Model) This model is an extension of the Arrhenius model and also considers the effects of factors other than temperature (such as voltage, humidity and mechanical stress). The general expression of the Eyring model is shown with this equation. It is used for predicting life by applying stress. E K exp k T a S n Λ,n: Constants S: Stress factors other than temperature k: Boltzmann's constant (= [ev/k]) T: Absolute temperature [K] 2-6

40 Life lnl Chapter 2 Reliability Assurance With this equation, if we focus on the stress other than that from temperature and convert the reaction speed K to an equation for life L, as with the Arrhenius model, then the result is the equation: L A S n A: Constant Taking the common logarithm of that equation: lnl = -n lns + lna This equation expresses the linearity of the relationship between life and stress as shown in Figure L1 L2 S1 Stress lns S2 Figure Eyring Model From this equation above, the acceleration coefficient α from stress factors other than temperature is expressed with the following equation, from the ratio of the different stress conditions S1, S2 and the life L1, L2 at that time. (See Figure ) S S 2 1 n (3) Humidity Acceleration Model These two models are humidity acceleration models, with a different model applied for different failure modes. (a) Absolute Vapor Pressure Model This model is the Eyring model when the stress is the absolute vapor pressure. expressed with the equation: It can be 2-7

41 Chapter 2 Reliability Assurance L A V n p Vp : Absolute vapor pressure (b) Relative Humidity Model This model is the Eyring model when the stress is the relative humidity. It can be expressed with the equation: L A exp E k T n a RH exp RH: Relative humidity With both the absolute vapor pressure model and the relative humidity model, the acceleration coefficient can be expressed with the ratio of the life times with differing stress conditions, in the same way as with the Eyring model. (4) Voltage Acceleration Model The voltage acceleration model differs between different failure modes. For any particular failure mode, the model differs depending on the device processes (structures). Here, we introduce the example of the TDDB (Time Dependent Dielectric Breakdown) models. (a) Eox Model This model is generally used when the thickness of the oxide film exceeds 5 nm. The life L is expressed with the equation. Ea L A exp exp k T A: Constant EOX Ea: Activation energy E k: Boltzmann's constant γeox: Field strength acceleration coefficient Eox: Gate oxide field strength ox (b) Vg Model This model is generally used when the thickness of the oxide film is between 2 nm and 5 nm. The life L is expressed with the equation. Ea L A exp exp Vg Vg k T γvg: Voltage acceleration coefficient Vg: Gate voltage 2-8

42 Chapter 2 Reliability Assurance (c) Power-law Model This model is generally used when the thickness of the oxide film is less than 2 nm. The life L is expressed with the equation. Ea L A exp V k T n g n: Field strength acceleration coefficient Vg: Gate voltage 2-9

43 Chapter 2 Reliability Assurance 2.2 Reliability Testing and Qualification Reliability Qualification Plan AKM implements tests to fit the purpose of the verification, with reference to industry standards such as JEITA, JEDEC and AEC-Q100. Also, with reference to JEITA EDR-4708 (Guideline for LSI Reliability Qualification Plan), which was newly established in April 2011, we have added and are placing importance on a test method (Method 2: described later) to suit the failure mode, with the purposes of improving the accuracy of reliability predictions and improving the ability to detect failures for each failure mode. AKM can consider referencing other standards as needed. [Qualification Flow] [1] Investigation of qualification requirements at the development planning stage - Confirmation of application and required reliability level depending upon the application and specific customer requirements - Confirmation of new technologies applied to the emerging product differing from existing products to decide the qualification details - Selection of test method Method 1 Testing using AKM's standard test conditions: Product level tests Method 2 Testing with failure mode: Testing at TEG level and at product level [2] Investigation of qualification requirements at the start of development Method 1 Testing using AKM's standard test conditions: The test conditions and number of samples are selected based on related standards Method 2 Testing with failure mode: The test conditions and number of samples derived from Webull analysis with the failure mode [3] Qualification stage - Verification that all required elements and parameters identified at the planning stage have been satisfied. 2-10

44 Life test Strength tests Referen ce tests Chapter 2 Reliability Assurance AKM's Standard Test Methods AKM implements tests appropriate to the test purpose with the test items shown in Table Table AKM s Standard Test Methods Type Test item Test purpose High-temperature operating test Early failure rate evaluation test (ELFR) (*1) Low-temperature operating test High-temperature storage test High temperature, high humidity bias test High-temperature, high-humidity storage test Temperature cycle test (Gas phase) Thermal shock test (Liquid phase) Moisture soaking and soldering heat stress series test Writing and data storage tests Solderability test Test of resistance to soldering heat (*2) Electrostat ic (ESD) tolerance test Latch-up test Human body model (HBM) Lead tensile strength test Mounting reliability Pressure cooker test Evaluation of durability against electrical stress and thermal stress for an extended period Evaluation of durability against short periods of electrical stress and thermal stress for early defects Evaluation of durability against electrical stress and thermal stress for an extended period Evaluation of durability when the package is stored at a high-temperature for an extended period Evaluation of durability when used in a high temperature, high humidity environment Evaluation of durability when stored in a high temperature, high humidity environment Evaluation of durability against high temperatures and low temperatures and against temperature changes Evaluation of durability against rapid temperature changes Evaluation of durability against temperature changes which assumes the stresses of mounting on a PCB Evaluation of the maximum write/ delete count and storage period Conditions are set separately for each product Evaluation of the solderability of the terminals in soldered joints Evaluation of durability against the heat during soldering Evaluation of the endurance to the human body electrostatic discharge a device receives when being handled Evaluation of latch-up susceptibility of devices with parasitic thyristor structures, such as CMOS Evaluation of bond strength after soldering Evaluation of durability against mechanical and thermal stress after mounting on a PCB Accelerated evaluation of durability when the product is used and stored in a high temperature, high humidity atmosphere Main failure phenomena that can be detected Migration of metal layer interconnects and destruction of oxide film over time due to electric field Destruction of the oxide film, short circuits caused by particles, open circuits Hot carrier deterioration - High temperature corrosion Electric field corrosion of metal layer interconnects, ion migration between metal interconnects, leak current due to moisture Ion migration between metal interconnects, leakage current due to moisture Wire bond integrity, package cracks, chip cracks Wire bond integrity, package cracks, chip cracks Package cracks, delamination in the package Deterioration of data write characteristics and data storage in nonvolatile memory Failure of soldering adherence to the terminal Package cracks, delamination in the package Oxide film destruction, diffusion bonding destruction, sensor destruction Interconnect melting and junction destruction due to overcurrent Destruction at leads Destruction of soldered joints, destruction of terminals Electric field corrosion of metal interconnects, ion migration between metal interconnects, leak current due to moisture Referenced standards JEITA ED-4701/100 Test method 101 AEC-Q100 B1 AEC-Q100 B2 JEITA ED-4701/200 Test method 201 AEC-Q100 A6 JEITA ED-4701/100 Test method 102 AEC-Q100 A2 JEITA ED-4701/100 Test method 103 AEC-Q100 A3 JEITA ED-4701/100 Test method 105 AEC-Q100 A5 JEITA ED-4701/300-1 Test method 307A JEITA ED-4701/100 Test method 104 JEDEC J-STD-020D AEC-Q100 B3 JEITA ED-4701/303 Test method 303A JEITA ED-4701/300-3 Test method 301B AEC-Q100 A1 JEDEC J-STD-020D JEITA ED-4701/300 Test method 304 AEC-Q100 E2 JEITA ED-4701/300-2 Test method 306A AEC-Q100 E4 JEITA ED-4701/300-3 Test method 301B JEITA ED-4702B JEITA ET-7407A AEC-Q100 A3 2-11

45 Instantaneous failure rate Chapter 2 Reliability Assurance Low temperature storage test Electrostat ic (ESD) tolerance test Charged device model (CDM) Machine model (MM) (*1) ELFR: Early Life Failure Rate Evaluation of durability when the product is stored at a low temperature for an extended period Evaluation of the endurance to the electrostatic discharge that occurs when the device is charged during handling Evaluation of the endurance to the machine model electrostatic discharge a device receives when being handled In general semiconductor devices, there are no failure modes which become apparent when the device is left at low temperatures. Oxide film destruction Oxide film destruction, sensor destruction JEITA ED-4701/200 Test method 202 JEITA ED-4701/300-4 Test method 305B AEC-Q100 E3 JEITA ED-4701/300 Test method 304 Reference 1 (*2) Conditions for the testing of resistance to soldering heat (moisture absorption conditions, etc.) are selected according to the thermal resistance capability of the package Planning Testing According to the Failure Mode Using this test method, failure modes from the failure distribution (early, operation period, wear-out) are assumed and then the test items and conditions, time and number of samples are calculated from the Weibull distribution and statistical methods based on the data such as the activation energy for those assumptions. Figure shows the method for checking the durable period. Reliability testing at the TEG level Reliability testing at the product Durable period Screening within the semiconductor manufacturing process Early failure region Operation period failure region Wear-out failure region Field use time Figure Method for Checking Durable Period Test Plan to fit the Failure Distribution An appropriate test plan is established for each of the failure regions of early failures, operation period failures and wear-out failures. 2-12

46 Chapter 2 Reliability Assurance [Early Failures] With the objective of eliminating all early failures using AKM's in-process inspections and product inspection process, we also treat the results from the electrical characteristics inspections within the process (probe tests, sorting) as reliability testing data. The burn-in data and EFR data, etc., are used and checked to estimate the cumulative failure rate (defect rate) and perform checks. For new processes, we check that the level of completion of the process is such that there are no products which fall outside the distribution (no outliers) found in the in-process inspections. [Operation Period Failures] Operation period failures include the residual early failures that become failures at the start of this period in a declining trend. (There are also occurrences of random failures due to external factors.) When the durable period of the product is exceeded, eventually the starting period of the wear-out failures is reached. For the residual early failures, the same test plan used for early failures is applied.. AKM guarantees a sufficient margin between the durable life of the product and the start of wear-out period failures, by applying a test plan for the failures at the start period of wear-out failures. [Wear-out Failures] Wear-out failures occur when the durable period of the elements making up the semiconductor device have been exceeded. Using a TEG (element level) targeted for each failure mode by element, the durable period is derived with highly accelerated test conditions. We check whether the identified failure mode is the same as the failure mode at the product level by testing conditions at the upper level of actual usage, or lowly accelerated conditions. This is equivalent to the normal reliability test of the product, but a product TEG which is more sensitive to the failure mode concerned is sometimes used Reliability Qualification AKM implements the qualification when the necessary requirements decided at the product planning and design start stages are satisfied. - Process reliability qualification: Reliability qualification for the wafer manufacturing process - Assembly reliability qualification: Reliability qualification for the package assembly process - Individual product reliability qualification: Reliability qualification for individual products 2-13

47 Chapter 2 Reliability Assurance - Family qualification: We analyze the differences between the relevant product and existing products for which reliability qualification has already been completed and for which there are sufficient proven results in mass production. This reliability qualification can then be applied if it is possible to view the relevant product as a family device of the existing products. [Examples: Verification of differences] - Quality target level, actual usage environment, actual usage state - Circuit structure, layout pattern, circuit elements used, strictness of the design rule used - Manufacturing process flow, process control methods and equipment - Correlation of chips and packages (electrode materials and structure, top layer passivation, chip size, die size, etc.) The standard test items performed for reliability qualifications are shown in Table (Example for LSI devices, when the sample size is determined by the LTPD (*1) method, confidence level 90%, pass judgment failure count 0.) (*1) LTPD (Lot Tolerance Percent Defective): A method with an OC curve specified so that if a lot with a certain failure rate has a confidence level of β then failures will be judged at a probability of (1-β). Table Standard Test Items and Numbers of Samples for the Reliability Testing of LSI Products ( : Necessary, : Implemented as appropriate, depending on details) Type Life test Environmental test EFR Wafer manufacturing process Assembly Test item Derivation / Derivation / New New change change High temperature operation 77 pcs. 77 pcs Low temperature operation 32 pcs. 32 pcs High temperature, high humidity operation 45 pcs. 45 pcs. 45 pcs. 45 pcs. High temperature storage 32 pcs. 32 pcs. 32 pcs. 32 pcs. Low temperature storage 32 pcs. 32 pcs. 32 pcs. 32 pcs. High temperature, high humidity storage 77 pcs. 77 pcs. 77 pcs. 77 pcs. Pressure cooker 32 pcs. 32 pcs. 32 pcs. 32 pcs. Temperature cycle 77 pcs. 77 pcs. 77 pcs. 77 pcs. Thermal shock pcs. 32 pcs. Reflow pre-treat + high temperature operation (High temperature write) 767 pcs. x 3 lots 767 pcs Pre-treat + individual items 767 pcs. 767 pcs. 767 pcs. x 3 lots Resistance to soldering heat Mounting reliability Reflow processing Pre-treat Pre-treat Temperature cycle Pre-treat (SAT implementation) Applied to non-leaded type packages 2-14

48 Chapter 2 Reliability Assurance 2.3 Technology for the Elimination of Latent Defects AKM eliminates latent defects using the technologies listed here when performing an inspection of the electrical characteristics, with the purpose of improving the reliability level of the products and reducing the failure rate for early failures. - Electrical stress tests - PAT (Part Average Testing): Conforming to AEC-Q001 - SYL (Statistical Yield Limits) and SBL (Statistical Bin Limits): Conforming to AEC-Q002 - IDDQ (IDD Quiescent current) test (1) PAT PAT is a statistical test method that was designed to improve the reliability of devices for automotive applications. It is currently standardized in AEC-Q001 by the AEC (Automotive Electronics Council). It is not possible to exclude outliers (*1) when using just the test limits (pass / fail judgment values) that are usually set. There is a possibility that these outlier devices contain slight defects and there is a risk that they will fail due to stresses exerted later (stresses during mounting, usage, etc.). For this reason, PAT limits are set inside the normal test limits (a guardband), to exclude the outliers. (*1) Outliers: Items that are within the range of specification, but have values that are greatly removed from the center of the population distribution. Figure Concept of PAT In PAT there is Static PAT (SPAT) and Dynamic PAT (DPAT). 2-15

49 Chapter 2 Reliability Assurance i) Static PAT: SPAT limits (robust mean ± 6 robust sigma) are calculated from test data from previous lots, and then these SPAT limits are applied to the lots that follow (with fixed limits until a review). The variation between lots and between wafers is considered here, so the effect on the yield is reduced. (See Figure 2-3-2) Figure Static PAT ii) Dynamic PAT: For each individual wafer, the DPAT limits are calculated from the pass/fail data of the particular wafer under test, and chips outside of the DPAT limits are failed. The limits are stricter than with SPAT, so the exclusion of outliers is more certain. (See Figure 2-3-3) Figure Dynamic PAT 2-16

50 Chapter 2 Reliability Assurance (2) SYL, SBL SYL and SBL are methods for using statistical methods to determine the wafers and lots that have abnormal yields or have failure item bins showing abnormal failure rates. SYL examines the yields and SBL examines the failure item bins. To determine the criteria for judgment, the average values and standard deviation (σ) for the yields and the failure items being managed are calculated from the test results for a fixed number of lots. Then, for the wafers or lots that are worse than 3σ, action is taken. (The criteria are periodically reviewed.) (3) IDDQ Testing IDDQ testing is a method for using power supply current measurements for highly sensitive detection of short circuit related failures within digital circuit blocks. Using conventional test methods, even if there was a short circuit related failure within a digital circuit, it was not always possible to detect it, depending upon the location of the problem. In IDDQ testing, the digital circuits are operated and the power supply current is measured when the CMOS that makes up the circuits is in the quiescent state. A short circuit related failure is identified if an IDDQ is detected, as this should not be detected in the static state (although, a small leakage current may flow). Figure shows a schematic representation of the range of coverage of IDDQ testing. AKM applies this testing for products that have high quality requirement levels, such as those for automotive applications and infrastructure related applications, and for products whose key characteristic is low current consumption (such as battery driven applications). It is also applied to other products when necessary. SIDD (*2) The scope of assumed failures Digital Function (*1) IDDQ DIDD (*3) (*1) Digital Function: Function test for the digital part. (*2) SIDD (Static VDD Power Supply Current): Power supply current in static state. (*3) DIDD (Dynamic VDD Power Supply Current): Power supply current in operation. Figure Representation of IDDQ 2-17

51 Chapter 3 Failure Analysis and Analysis Technology Chapter 3 Failure Analysis and Analysis Technology Failure analysis is a process of investigating and analyzing products that have failed in order to determine the failure mode and the root cause. In addition to performing failure analysis on products with defects that have occurred during customer processes or in the field, we also analyze failures that have occurred during our manufacturing processes, inspection processes and reliability testing. In all of these cases, AKM prevents recurrence of the problem by feeding back the failure analysis results to the source of the failure (design, wafer manufacturing, assembly, inspections, etc.). In this way, the analysis results are used for continuous improvement of the quality and reliability that is built in to each process. 3.1 Failure Analysis Flow Figure illustrates AKM s failure analysis flow. Defective products or intermediate products found in AKM s processes are also analyzed in this flow with coordination with related departments. 3-1

52 Chapter 3 Failure Analysis and Analysis Technology Customer Return Receipt, Registration 1st Judgment * Outside Observation, Lead correction, Re-Ball * Evaluation by Tester (*1) (Pass/Fai Judgment) * Observation by X-ray, SAT Equipment 1st Report (*1) Tester: LSI tester and Hole-IC tester Pass Pass/Fail? No Evaluation by Bench Necessity? Fail Yes Evaluation by Bench (Electrical Evaluation) Evaluation by Bench (Electrical Evaluation) Report of failure un-reappearing OK OK/NG? NG * Verification of the TEST * Examination of measure Chip Chip/Package? Interim Report (Suitable) Chip Failure Analysis * Package Open * Chip Observation Circuit Analysis * Digital Failure Diagnostic * Emission/OBIRCH/SDL Analysis * EB-Tester/Mechanical Probing * Nano-Probing Physical Analysis * Etch-Back Analysis (De-Layer) * FIB/SEM, STEM (Cross-sectional observation) * Ultimate analysis by EDX Package Package Failure Analysis * X-ray CT Analysis * De-capsulation (Polishing, Wet, Laser) * Cross-sectional Observation (Polishing, Ion-Milling) * Specification of the cause of failure * Presumption of the failure mechanism * The measure against Escape prevention /Occurrence prevention * Confirmation of the effect Final Report Figure Failure Analysis Flow 3-2

53 Chapter 3 Failure Analysis and Analysis Technology 3.2 Analysis Equipment and Analysis Examples AKM uses various types of equipment for failure analysis, as shown in Table We also use various measurement tools for electrical evaluations in addition to the equipment listed in the table. AKM makes full use of all these systems to identify the causes of failures. Table Failure Analysis Equipment at AKM Type Equipment name Application Non -destructive Semi -destructive Circuit analysis Physical analysis X-ray transmission system Ultrasonic detection equipment (Scanning Acoustic Tomography) Mold opener Observes the inside of the package (condition of wire bonds, etc.). Observes the inside of the package (possible delamination, etc.). Exposes the chip without electrically destroying it by melting the mold resin. Equipment photograph Example analysis (1) (1) (2) (2) - - Laser opener Uses a laser to remove (open) the package resin. - - Emission microscope EB tester Manual prober OBIRCH analysis equipment Identifies the location of abnormal current leakage, etc., by detecting the faint light emission in the chip. Uses an electron beam to analyze the electrical operation of circuits (non-contact). Can obtain voltage contrast images and operation waveforms. A probe needle is brought into direct contact with the product to analyze the electrical operation of the circuit. Detects changes in the current when the sample is being lit by a laser (with local heating by a laser). Used to identify the location of short circuits. (3) (3) (4) (4) - - (5) (5) Logic tester Uses digital test patterns to evaluate digital function. - - FIB for circuit edit Corrects wiring in the circuits and creates probing pads, etc. (6) - Backside polishing system Nano-probing system Exposes and polishes the backside of the chip. (Done as a preparatory treatment before emission or OBIRCH analysis, etc.) SEM-based probing system. MOS static characteristics measurement and interconnect analysis with the EBAC method. - - (7) (7) Optical microscope Optical observations of chips. - (8) RIE system Performs dry plasma etching for the removal of SiN and SiO2 films. - - Draft chamber Local exhaust system for wet etching processing. - - Scanning electron microscope (SEM) FIB/SEM dual system Detailed observation of the profile of the chip surface. Inspecting chip cross-sections by processing using the FIB and then observation using the SEM. (9) (9) (10) (10) EDX Elemental analysis with characteristic X-ray detection. - (11) Scanning transmission electron microscope (STEM) (*1) Uses transmitted electrons to perform chip cross-section analysis. - (11) Cutter Rough cutting for the observation of package cross-sections. - - Polisher Polishing for the observation of package cross-sections. - - (*1) Equipment at an affiliated company in the AKM Group. Description of equipment used for failure analysis 3-3

54 Chapter 3 Failure Analysis and Analysis Technology (1) X-ray Transmission System X-ray transmission systems use X-ray penetration technology to observe the inside of a product without destroying it. The primary use is for observation of wire bonds and inner lead profiles. This system includes a device that has a microfocus X-ray tube, making observations possible with sharp images from low magnification to high magnification. There are also systems at AKM with CT functions. Figures and are photographs of the X-ray transmission equipment and an image taken by the machine. With CT function Figure X-ray Transmission Systems Gold wire Gold wire breakage failure Lead part Figure Example Observations Using X-ray Transmission Systems 3-4

55 Chapter 3 Failure Analysis and Analysis Technology (2) Scanning Acoustic Tomography (SAT) Scanning acoustic tomography is inspection equipment that uses ultrasonic waves. An ultrasonic pulse is sent from the outside of the package towards the inside, detecting the reflected. This technology makes it possible to observe defects (voids, cracks, delamination, etc.) inside the package. This equipment is also used in the reliability evaluations examining the resistance of the package to moisture and heat. Figures and are photographs of scanning acoustic tomography equipment and images taken using it. Figure Scanning Acoustic Tomography Equipment (SAT) TAB delamination Normal product Figure Examples of Observations Made on Scanning Acoustic Tomography Equipment 3-5

56 Chapter 3 Failure Analysis and Analysis Technology (3) Emission Microscope Emission microscopes detect faint light generation from the chip. When a chip contains a failure, an abnormal electrical field is sometimes generated inside the chip. The carriers (hot carriers) accelerated by this abnormal electrical field generate electron-hole pairs and light is emitted when these electron-hole pairs recombine. By detecting this light generation, abnormalities such as leakage current are detected. This equipment is extremely easy to operate and it enables phenomena to be captured visually. It is a useful technology which is employed very frequently in IC failure analysis. Figures and are photographs of an emission microscope and an inspection image taken using it. Figure Emission Microscope Abnormal light generation can be seen at two points The light generation is caused by interconnect shorting due to particles (The yellow arrows indicate the points of light generation.) Figure Example of Observation Using an Emission Microscope 3-6

57 Chapter 3 Failure Analysis and Analysis Technology (4) EB Tester (EB: Electron Beam) The principle of EB testers is the same as the SEM. The equipment detects secondary electrons during irradiation with an electron beam. The number of secondary electrons detected is dependent upon the electric potential of the interconnects on the chip, making it possible to analyze the electric potential behavior of the interconnects. The types of information that can be obtained are electrical potential images of the interconnects and operation waveforms. This technology is used in the analysis of digital circuits. Although it has the advantage of measuring the electrical potential without contact, there is a disadvantage that it is limited to measuring a repetitive waveform synchronized to a logic tester. Figure is a photograph of EB tester equipment. Inspection images from the equipment are shown in Figures (Difference image analysis) and (Waveform analysis). Figure EB Tester Pass condition Fail condition Difference image *The voltage contrast image at a particular address is obtained for pass and fail conditions. *By obtaining the image differences between pass and fail, it is possible to discover the places with different logic visually. Figure Example of Difference Image Analysis (analysis using voltage contrast images) 3-7

58 Chapter 3 Failure Analysis and Analysis Technology Control Pass condition Node A Node B Fail condition Node A Node B Operation abnormality *It is possible to observe the waveforms at any particular place at the same time. *The logic in the part shaded green is operating abnormally in the fail condition. Figure Example of Waveform Analysis (5) OBIRCH Analysis Equipment (OBIRCH: Optical Beam Induced Resistance Change) In OBIRCH analysis, localized heating is caused at the point irradiated by the laser, and the analysis captures the changes in resistance and current due to this heating. Extremely small variations in current are captured using this method, and location of leakage current is determined. Also, by combining this equipment with a logic tester, analysis of digital function marginal failures is performed. This is called SDL (Soft Defect Localization). Figure is a photograph of OBIRCH analysis equipment. Inspection images are shown in Figures (OBIRCH analysis) and (SDL analysis example). 3-8

59 Chapter 3 Failure Analysis and Analysis Technology Figure OBIRCH Analysis Equipment * The yellow arrows indicate the points showing OBIRCH reactions. * Both examples are of MOS gate oxide film leaks Figure Examples of Analysis on OBIRCH Analysis Equipment (left: surface analysis, right: backside analysis) 3-9

60 Chapter 3 Failure Analysis and Analysis Technology * The yellow arrow indicates the point showing SDL reaction. * The SDL reaction indicates a point where the pass/fail status changes with the laser heating. Figure Example of SDL Analysis (6) FIB for Circuit Edit (FIB: Focused Ion Beam) The FIB uses an ion beam for localized processing. It performs both etching and deposition processes at the microcircuit level. On the FIB process is assisted by gas to further increase the precision of the processing. We use this technology to correct circuits and to produce probe pads. This technology is essential as a preparatory processing before EB tester analysis and mechanical probing analysis. The equipment is also used for circuit debugging at the design and development stage. Figure are photographs of the FIB for circuit. Figure FIB for Circuit Edit 3-10

61 Chapter 3 Failure Analysis and Analysis Technology (7) Nano-probing system The nano-probing system is a SEM-based probing system. Using the SEM, it achieves nanometer-scale probing. A representative example is the measurement of static characteristics for a single MOS structure. Since probing is done directly onto an exposed contact, the static characteristics of a single MOS on a chip are measured. The nano-probing system also performs analysis using the absorbed current method (EBAC: Electron Beam Absorbed Current analysis). EBAC analysis is used to discover shorts and opens in the interconnects. Figure is a photograph of nano-probing system equipment. Examples of analysis are shown in Figures (MOS static characteristics measurement) and (EBAC analysis). Figure Nano-probing System * The chip is polished to expose the contact layer and the contact is probed directly to measure the MOS static characteristics. Figure Example of Analysis of MOS Static Characteristics Measurement (left: probing, right: measurement results) 3-11

62 Chapter 3 Failure Analysis and Analysis Technology Location of discontinuities * Analysis of the location of discontinuities on a via chain TEG * The difference in contrast on the EBAC image is greater at the points of discontinuity Figure Example of EBAC Analysis (8) Optical Microscope An optical microscope uses light in the visible and near-visible wavelengths. Although the use of visible light makes it possible to obtain color information, the resolving power is limited by the wavelength of light. Figure is an image from observations using an optical microscope. Point of * Example of burnout of GaAs Hall element Figure Example Observation Using an Optical Microscope 3-12

63 Chapter 3 Failure Analysis and Analysis Technology (9) Scanning Electron Microscope (SEM) SEM equipment detects the secondary electrons and back-scattered electrons when the sample is irradiated with an electron beam. High magnification high resolution images are obtained from the surface of the chip. Some SEM systems also include EDX (Energy Dispersive X-ray Spectrometers). EDX is equipment for elemental analysis that uses the detection of characteristic X-rays. Figures and are photographs of SEM equipment and images obtained using SEM. Figure SEM Equipment Poly-Si gate exposure After Poly-Si gate removal Pinhole in gate oxide film Different voltage contrast to the surrounding area *Gates with different voltage contrasts to the surrounding areas indicate the presence of gate leaks Figure Example of Analysis Using a SEM 3-13

64 Chapter 3 Failure Analysis and Analysis Technology (10) Dual FIB/SEM system (FIB: Focused Ion Beam, SEM: Scanning Electron Microscope) A FIB/SEM dual system has both an FIB column and a SEM column in a single sample chamber. The sample is processed using the FIB and then observed using the SEM, makings it possible to observe the cross-section of a chip quickly and accurately. We mainly use this equipment for cross-section analysis with SEM, but it is also used for the preparation of samples for a scanning transmission electron microscope (STEM). Figures and are photographs of an FIB/SEM dual system and an image taken using the system. Figure Dual FIB/SEM Equipment Metal interconnect discontinuity failure Metal interconnects Metal interconnects Metal interconnects Metal interconnects Short Particle Poly-Si gate *Left: An abnormality in the interconnect etching has caused shorting between interconnects. *Right: A particle in the Poly-Si gate area has caused an abnormal profile on the metal interconnects, resulting in a discontinuity. Figure Cross-section Analysis Using FIB/SEM 3-14

65 Chapter 3 Failure Analysis and Analysis Technology (11) Scanning Transmission Electron Microscope (STEM) STEM equipment detects the electrons transmitted when a sample is irradiated by an electron beam. Observations are made at extremely high resolution, but it is necessary for the sample to be prepared into a thin slice before the analyzing operation. Observations frequently used include transmitted electron (TE) images and high-angle annular dark-field (HAADF) images. EDX and EELS (Electron Energy-Loss Spectroscopy) analysis is included on STEM systems, enabling highly sensitive elemental analysis at a high resolution. Images from STEM analysis are shown in Figures (cross-section observation) and (elemental analysis). Poly-Si gate Figure Example of Cross-section Observation on a STEM System (observation of cross-section of Poly-Si gate) STEM image O N Si Ti *Results of elemental analysis of the MOS drain part *Displays mapping of the main elements Figure Example of Elemental Analysis Using STEM + EDX 3-15

66 Chapter 3 Failure Analysis and Analysis Technology 3.3 Root Cause Identification and Problem Solving Tools As well as clarifying the failure mechanism of defective products by failure analysis, it is more important to check the correlation with the problem symptoms and identify the cause of the occurrence, based on the results of the analysis, and also to implement countermeasures to prevent occurrences. Figure illustrates the flow of action within AKM from the results of failure analysis to the implementation of measures to prevent reoccurrences. These actions are carried out with consultation between engineers in each section (engineers in design, manufacturing, test, quality control, etc.). The 8D (8 Disciplines) process and other methods are also used as management tools for problem solving. Verification of Reliability * Analysis by Weibull Failure analysis results Confirmation of the correlation with failure symptoms Circuit simulation (Electric operation simulation) Process simulation (Physical structure simulation) Specification of the cause of failure * Specification of the cause process * Presumption of the failure mechanism * TEG trend investigation * Probe test data investigation * Screening test data investigation * The measure against Occurrence prevention * Process quality improvement * Process history investigation - Other lot comparison - Investigation of the used machine etc. * In-process inspection data investigation * FTA (Failure Tree Analysis) Confirmation of the effect Figure Actions for Problem Solving 3-16

67 Chapter 4 The Management of Environment-Related Substances Chapter 4 The Management of Environment-Related ubstances 4.1 The Management of Chemical Substances Substances that have a harmful effect on the environment should not be spread into the environment during manufacturing activities. They must also not be spread into the environment via products. AKM has clarified the substances whose use is prohibited by laws and regulations, the environmentally hazardous substances, the substances that are inappropriate in corporate ethics and the substances which the customer demands be controlled and we manage these substances carefully so that they are not included in products or packaging materials. Also, we quickly collect the information on chemical substances, etc., for which information must be communicated through the supply chain and actively work at information disclosure and communication with our customers. As a global company, AKM complies with the guidelines in each industry around the world. Semiconductor devices use various substances due to their characteristic properties. We avoid the use of environmentally hazardous substances as much as is possible, but when the use of such substances is unavoidable for required device characteristics, we clearly indicate their existence and work to manage them appropriately The Management of Environmentally Hazardous Substances Restrictions on chemical substances in Japan are determined by regulations such as the Law Concerning the Examination and Regulation of Manufacture, etc. of Chemical Substances, the Pollutant Release and Transfer Register, the Industrial Safety and Health Act and the Poisonous and Deleterious Substances Control Act. Recently, there have been international directives and regulations that restrict usage and prohibit inclusion of hazardous substances, within the European Union (EU) by directive of the European Parliament s Council of the European Union. Products that do not comply with the EU restrictions cannot be sold within the EU countries. Strict regulations of the EU such as RoHS and REACH are required by the European Commission. Substances that have an impact on the environment must not be included, not just in products, but also in the raw materials used for manufacturing and in the materials related to distribution. At AKM, we have created guidelines for the management of chemical substances, and carry out that management to ensure that environmentally hazardous substances are not included in products (including samples) or in packaging materials. 4-1

68 Chapter 4 The Management of Environment-Related Substances We have also defined environmentally hazardous substances with standard values for them and we have clarified three categories for the materials that make up products and packaging materials: 1) Substances subject to laws and regulations in Japan and overseas such as RoHS or the Law Concerning the Examination and Regulation of Manufacture, etc. of Chemical Substances. 2) Standards applied to products that are halogen-free 3) SVHC (*1) candidate substances for REACH Of these substance regulations, 1) and 2) are prohibited for intentional use (*2). Also, in 3), substances are monitored if they are intentionally included in the product at more than 0.1 wt%. (*1) SVHC: Substance of Very High Concern (*2) Unintentional use is only applied to impurities that are unavoidably included due to the manufacturing methods. In addition to the internal standards at AKM, when requested to, we also investigate support for standards and regulations at the customer site or in the various countries, regions and industries. We also respond to various inquiries regarding product environments (customer specified forms, JAMP AIS, JGPSSI, JAMA/IMDS, constituent tables, certificates of non-use, etc.), so contact our sales staff with any specific requests. The majority of international regulations at present are the ones enacted by the European Union (EU). These include regulations such as the ones outlined below RoHS Directive The RoHS (Restriction of Hazardous Substances) Directive was enforced in July 2006 by the European Parliament and Council. It regulates the harmful substances used in electrical and electronic equipment in the EU. The regulations include six substances: cadmium, lead, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphenyl ether (PBDEs). It is prohibited to either supply or sell any products to EU countries that exceed the regulated values for the inclusion rate of each of these substances. (See Table for the regulated values for each substance.) (Some exceptions to the regulations exist, for example, for cases when an alternative is technologically difficult.) Reference: Revised RoHS (RoHS II) The RoHS Directive was revised into RoHS 2.0, which came into effect on July 21, In this revision, four new substances have been defined as substances for priority assessment in addition to 4-2

69 Chapter 4 The Management of Environment-Related Substances the original six substances. Also, although the schedule for enactment is undecided, the addition of these four substances to the list of prohibited substances is being investigated. Substances for priority assessment (candidate substances for addition): [1] HBCDD (hexabromocyclododecane) [2] DEHP (Di-2-ethylhexyl phthalate) [3] BBP (Butyl benzyl phthalate) [4] DBP (Dibutyl phthalate) Table Substances Subject to the RoHS Directive and Regulation Values Substance name Cadmium Lead Mercury Hexavalent chromium Polybrominated biphenyls (PBBs) Polybrominated diphenyl ether (PBDEs) Regulation value 100 ppm or less 1,000 ppm or less 1,000 ppm or less 1,000 ppm or less 1,000 ppm or less 1,000 ppm or less REACH Regulation The REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) regulation is a regulation concerning the use of chemical substances which came into force in June If the volume of chemical substances (or the chemical substances included in products) produced within the EU countries or imported into the EU countries equals or exceeds 1 ton per year, then these chemical substances must be registered with the European Chemicals Agency, an evaluation must be done of their danger and the results must be disclosed. Also, for the chemical substances classified as Substances of Very High Concern (SVHC), in addition to the registration, permission must also be obtained from the European Chemicals Agency (ECHA). A comparison of the details of the RoHS Directive and the REACH Regulation is shown in Table

70 Chapter 4 The Management of Environment-Related Substances Table Comparison of RoHS Directive and REACH Regulation RoHS Directive REACH Regulation Substances affected 6 substances (as of July 1, 2006) There are 138 SVHC (Substances of very high concern) (As of September 3, 2012) It is predicted that this will increase to around 1,500 substances in the future Parts affected Homogeneous material Products Regulation 1,000 ppm or less (100 ppm or less 1,000 ppm or less value for Cd only) Check on Analysis possible Analysis check difficult inclusion Regulated details Prohibition of inclusion Obligation to communicate information (B to B) / Obligation to disclose information (B to C) Registration obligation (EU authority: ECA) Penalties Products recalled if violation occurs It is expected that there will be penalties such as fines (in the laws in each country) Management Damage to brand image Damage to brand image risk Industries affected Electrical and electronic equipment All industries Others - Regular update of analysis data annually becoming established in industry - Analysis methods based on the IEC standards - Simple measurements using EDX, etc., are not acceptable - The analysis institutions must obtain ISO certification -Minimization of harmful effects of chemical substances used and manufactured by ELV Directive The ELV Directive (End-of Life Vehicles Directive) is a directive which came into effect in the EU region on October 21, 2000 in order to promote the reuse and recycling of used automobiles. The objective of this directive is as follows. a) To prevent the generation of waste material from vehicles. b) To promote the reuse and recycling of used vehicles and the parts from them. c) To promote the environmental protection by businesses involved in the life cycle of vehicles, such as companies dismantling and processing scrap vehicles. If harmful substances are used in automotive parts then this hinders the reuse and recycling, so use has been restricted for a group of materials called SOC (Substances Of environmental Concern). 4-4

71 Chapter 4 The Management of Environment-Related Substances The substances affected by the ELV Directive and the regulation values for them are shown in Table Table Substances Subject to the ELV Directive and Regulation Values Substance name Regulation value Cadmium 100 ppm or less Lead 1,000 ppm or less Mercury 1,000 ppm or less Hexavalent 1,000 ppm or less chromium WEEE Directive The WEEE (Waste Electrical and Electronic Equipment) Directive was officially announced and enforced in February The producers of electrical and electronic equipment (EEE) to be sold in the countries of the EU are required to take the action below. a) To give consideration so that when the product becomes waste it does not have a harmful effect on the environment b) To take responsibility for collection and recycling EuP Directive The EuP (Energy-using Products) Directive came into effect in It requires that all products (such as refrigerators, washing machines, etc.) which use energy (electricity or fossil fuels, etc.) must be designed with consideration for the environment, requiring the implementation of ecodesign. Products that comply with this directive are given a CE mark. Products without the CE mark may not be sold within the EU countries. In order to comply with the EuP Directive and obtain CE marking, the important environmental aspects must be identified and the burden on the environment is reduced for the entire life of the product, from the gathering of raw materials to the end-of-life stage (the disposal after its use). The EuP has now been expanded to become the ErP (Energy-related Products) Directive, which came into force on November 20, This directive has widened the scope of products affected to those related to energy (windows and insulation materials, water regulating valves, etc.). 4-5

72 Chapter 4 The Management of Environment-Related Substances Standards for Compliance as Halogen-Free Products Regulations and usage restrictions for specific materials (and material groups) are spreading internationally. Of these, halogen materials, antimony trioxide and red phosphorus are materials that are closely connected to semiconductor products. The industry standards for halogen-free products are widely established. AKM's standards for the management of halogen-free products are listed in Table Substances affected Bromine, chlorine and their compounds Antimony and its compounds Table Standards Applied to Halogen-free Products Internal control value Br: Less than 0.09 wt% (900 ppm) Cl: Less than 0.09 wt% (900 ppm) Standard values in JPCA-ES01, etc. (reference) Br: 0.09 wt% (900 ppm) or less Cl: 0.09 wt% (900 ppm) or less Br + Cl: Less than 0.15 wt% (1,500 ppm) Br + Cl: 0.15 wt% (1,500 ppm) or less Sb (as Sb Element): Less than 0.1 wt% (1,000 ppm) Red phosphorus As P: Less than 0.1 wt% (1,000 ppm) - - Of the halogen materials, the harmful effects on the environment of bromine and chlorine (and their compounds) is of particular concern because their bioaccumulation potential is high, and because there are also risks of dioxins being generated during their combustion. For this reason, definitions of halogen-free and test methods are established by groups and institutions such as the Japan Electronics Packaging and Circuits Association (JPCA-ES01: Test Method for Halogen-Free Materials), the International Electrotechnical Commission (IEC : Reinforced base materials, clad and unclad-non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad) and the U.S. Association Connecting Electronics Industries (IPC-4101: Specification for Base Materials for Rigid and Multilayer Printed Boards) (all with common definitions). AKM has applied standards that comply with these definitions. The toxicity of antimony has understood long time and there are risks seen in some of its compounds. For example, even though the toxicity of antimony trioxide (used as a flame retardant promoter) is low, it has been specified as a deleterious substance. Antimony and its compounds are not environmentally hazardous substances (prohibited substances), but they have been defined as a Class I Designated Chemical Substance in the PRTR (Pollutant Release and Transfer Register) law and if they are included in materials at a rate of 0.1 wt% or higher then there is an obligation to specify this on the MSDS (Material Safety Data Sheet). Accordingly, although antimony trioxide 4-6

73 Chapter 4 The Management of Environment-Related Substances has conventionally been used as a flame retardant promoter, we restrict its use in halogen-free products, together with brominated epoxy resin (fire retardant). Red phosphorus also is used as a flame retardant, but when it is left for long periods of time, it reacts with moisture and oxygen in the air and chemical changes occur, causing corrosion and breakage on the wiring in electronic equipment and tracking which may lead to fires. For these reasons, do not include red phosphorus in molding resins Green Procurement In order to provide our customers with products that have a minimal impact on the environment, it is essential that measures are taken not just at AKM, but that they are taken throughout the entire supply chain. For this reason, we are implementing Green Procurement for the purchase of the required materials, and to prioritize the procurement of raw materials and other materials that have a smaller impact on the environment. We investigate and check the danger, toxicity and legal regulations for raw materials and other materials. This is not only for the products that AKM purchases directly, but we also demand that the same consideration is made by external subcontractors. We implement strict management, and strive to comply with legal regulations and to protect the environment. For example, we take measures such as carrying out investigations of suppliers when necessary. We manage the chemical substances that are affected by RoHS, REACH and others throughout the supply chain using the latest versions of the JIG (Joint Industry Guide) tool for information communication in the electrical and electronics industries and the cross-industry MSDSplus/AIS tool for information communication. The JAMP (Joint Article Management Promotion consortium) was established in Japan in September 2006 for cross-industry communication of information on chemical substances. As information communication tools, it has the MSDSplus, which aims to supplement the MSDS for substances and drug compounding, and the AIS (Article Information Sheet) for completed articles. These tools have been highly regarded and are introduced by the European Chemicals Agency (ECHA) as platforms for information exchange in the supply chain. AKM has been a member of JAMP since its establishment, and from an early stage we worked on the JAMP-GP (Global Portal) IT system infrastructure for the JAMP tools, which is a system developed for the more efficient and timely transmission of MSDSplus and AIS. Further details on green procurement at AKM can be relevant section in our web page. 4-7

74 Chapter 5 Notes on the Use of AKM Products Chapter 5 Notes on the Use of AKM Products 5.1 Notes on Mounting To avoid damaging the quality and reliability of semiconductor device products, pay careful attention to the mounting methods used. During mounting, the products will be heated by soldering. While it is obviously important to prevent direct destruction of the chip when heating, avoid damaging the package as well. Causes of damage to the package include not only direct heating, but also stress due to underfill and rapid expansion that occurs when absorbed moisture is turned to steam. Insufficient heat dissipation may also cause deterioration in electrical characteristics or lead to destruction. In order to avoid these problems, the procedures outlined in this chapter should be followed Soldering In general, semiconductor devices should not be left at high temperatures for an extended period of time. However, insufficient heating during the mounting process results in poor solderability. Regardless of the method used, soldering must be done at an appropriate temperature and for an appropriate time. Also, using a strong alkaline or acidic flux during soldering may corrode the leads or have a detrimental effect on electrical characteristics Method for Mounting Surface-Mount Packages (1) General Cautions In recent years, semiconductor device packages used in surface mounting have become smaller and thinner in order to increase mounting density. This has resulted in reduced strength compared with conventional products. For surface-mount package products, pay particular attention to the described methods when establishing soldering and mounting conditions. a) Soldering Method AKM recommends the reflow method as the soldering method for surface-mount packages. We do not recommend the flow soldering method of passing the device through molten. This is because solder bridges are often formed with this method, and large thermal shock to the package. If the flow soldering method is necessary, we suggest that you contact AKM prior to implementation. 5-1

75 Chapter 5 Notes on the Use of AKM Products b) Package Temperature and Stress during Heating In addition to the stress that occurs during assembly due to heat, the thermal expansion coefficient of the resin used in plastic packages increases at high temperatures, and the bending modulus and bending strength decline, so internal stress occurs inside the package. Also, when using the infrared reflow method, a temperature difference is created between the side irradiated by the infrared and the other side, which is also a cause of stress. If the temperature is increased rapidly, then the occurrence of these stresses is more prominent. When stress occurs inside the package, there is a risk that cracks will occur, so perform this mounting in accordance with the temperature profile recommended by AKM. c) The Effects of Package Moisture Absorption The resin used in plastic chip packages for semiconductor devices will absorb moisture if stored in a high-humidity environment. On AKM products with moisture-proof packing, the moisture absorbed can rapidly turn to steam and expand during soldering and mounting, causing separation at the boundary of the resin and the internal chip/ lead frame. In severe cases, this can cause package cracks. Effective methods to prevent moisture absorption include storage in a dry box, and the management of the time between the opening of the moisture-proof packing and soldering. To remove moisture if it has been absorbed, we recommend performing a bake before soldering and mounting. Section contains information on the effects of package moisture absorption and on methods for dealing with it Method for Mounting Through-Hole Mount Packages (1) General Cautions Through-hole packages such as DIP and SIP which are packaged in bulk do not have moisture-proof packing. It is important to be careful with the soldering method to ensure that the body of the package is not exposed to a large amount of heat during mounting. When mixing through-hole together with surface-mount packages, refer to JEITA EDR-4701C Handling Guidance for Semiconductor Devices. (2) Recommended Dip Conditions When using dip or reflow method for soldering, the recommended conditions depend on the AKM product type. 5-2

76 Chapter 5 Notes on the Use of AKM Products (a) LSI Products (mainly power device related products) The recommended conditions for AKM's LSI products are: Bath temperature: 260 C ± 5 C Dip time: 10 s ± 1 s (b) Sensor Products Figure shows the recommended conditions for AKM's sensor products. This graph shows the relationship between the bath temperature and dip time. For example, if the bath temperature is 300 C, then the dip time should be less than 5 seconds. If the bath temperature is 260 C, then the dip time should be less than 15 seconds. 310 Bath temperature ( C) C, 5 s or shorter 260 C, 15 s or shorter Dip time (s) Figure Recommended Dip Conditions for Through-hole Mount Packages Mounting using a Soldering Iron (1) General Cautions When using a soldering iron, AKM recommends that the temperature at the terminal during soldering be up to 260 C for 10 seconds or up to 350 C for 3.5 seconds. When soldering, do not to exceed these conditions. If the temperature of soldering is higher and the time is longer, then the device temperature will be increased excessively, resulting in deterioration or destruction. When using a soldering iron, it is better to use either a 3-wire type or earthed iron tip with a transformer to lower the secondary voltage, and it is also recommended to confirm that there are no leaks at the iron tip. The iron tip should only contact the leads. (2) Recommended Soldering Conditions 5-3

77 Chapter 5 Notes on the Use of AKM Products Recommended hand soldering conditions: 350 C, 3 s (once, on each lead) We do not recommend hand soldering for no-lead type and solder ball type packages such as QFN and BGA. Contact AKM with any special requirements, including repairs, for our recommendations Flux Types and Cleaning Methods (1) Flux We recommend rosin flux (RMA: Mildly Activated Rosin base). Halogen based flux should be avoided as Halogen, especially Chlorine, tends to remain on the package, and this adversely affects the product reliability. Choose a flux whose safety and environmental effect have been sufficiently considered. (2) Cleaning When cleaning the mounting board, clean it thoroughly to remove flux, as residual flux will cause lead corrosion or other problems that may adversely affect the reliability, even if a rosin based one is used. This also applies if the flux is no-clean flux (low residue flux), and removal may still be necessary in applications where high reliability is required. Sufficient evaluations must be done when using the no cleaning process. Cleaning agents and methods should be selected so that the cleanliness of the board after component mounting satisfies the standards shown in Table Table Printed Circuit Board Cleanliness after Component Mounting (from JEITA EDR-4701C) Item Standard Residual amount of Cl 1 μg/cm 3 or less Resistivity of solvent extract 2 x 10 6 Ω cm or less When marking with ink, the marking will disappear if it is kept in the cleaning solution for a prolonged period. Particular caution is necessary when using ultrasonic cleaning. We recommend the use of general cleaning agents such as semi-aqueous or hydrocarbons, or the use of alcohol cleaning agents. Select a cleaning agent where safety and environmental effects have been sufficiently considered. 5-4

78 Chapter 5 Notes on the Use of AKM Products Avoid ultrasonic cleaning for hollow type packages. The resonance in the internal connection wires may lead to breakage. When using ultrasonic cleaning for other types of packages, implement under the appropriate conditions to avoid resonance. Do not allow the device and printed circuit board to come into direct contact with the vibration source MSL (Moisture Sensitivity Levels) and Dealing with Moisture Absorption Packaged products will continually absorb moisture when stored in normal conditions. When products that have absorbed water are heated in the reflow oven, the packaged main body of the device is heated together with the leads and the water that has infiltrated inside the resin expands. This will cause problems such as internal delamination or package cracks. These problems can be avoided by handling the product in a way which is appropriate for its MSL MSL (Moisture Sensitivity Levels) The MSL of a package expresses the potential vulnerability of a component to damage during reflow soldering due to moisture absorption. AKM refers to general standards and performs reflow thermal resistance tests to check the MSL (Moisture Sensitivity Levels). For example, a product with a MSL of Level 3 in JEDEC J-STD-020D can be reflow soldered without baking (drying by heating) if the product is stored less than 168 hours (1 week) in an environment which is at 30 C or less and 60% RH or less after opening the moisture-proof packing. Table illustrates the storage periods and storage conditions for each MSL as defined in JEDEC J-STD-020D Action after Moisture Absorption Once the moisture-proof packing has been opened, baking will be necessary if the storage period is exceeded, or if the product is placed in an area of high humidity and absorbs moisture. Based on JEDEC J-STD-033C (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices), AKM recommends these conditions for processing to remove moisture and for storage after this processing: (1) Products Packed in Trays The trays used by AKM are heat resistant ones, so baking may be done under these conditions: Moisture removal processing conditions: Baking at 125 C for 24 hours 5-5

79 Chapter 5 Notes on the Use of AKM Products However, if the baking is done with the trays bound together, then the trays may deform; remove the binding before baking. (2) Tape Packed Products and Tube Packed Products The embossed tape and reels and the plastic tubes are not heat resistant, so it is not possible to perform baking with the conditions described in (1). To perform baking with the conditions described in (1), remove the products from the embossed tape or tube. If baking is to be done in the packaged state, use these conditions: Moisture removal processing conditions: Baking at 40 C and 5% RH or less for 13 days Or storage for 13 days in a moisture barrier bag containing a desiccant or in a desiccator These conditions are for thin package products (with package thicknesses 1.4 mm or less), which cover majority of AKM products. The products with packages greater than 1.4 mm in thickness require different conditions, so contact us for further direction. (see the product s datasheet for the package thickness.) (3) Pausing and Resetting Floor Life Floor life is the period permitted from the opening of the moisture barrier bag, or else from the completion of processing to remove moisture, up until the mounting. If the period of moisture absorption is 12 hours or less, then storing in a desiccator under the following conditions will make it possible to reset the floor life (cancel the progress so far) or else pause it (temporarily halt its progress). Reset conditions: Storage at room temperature and 10% RH or less for 5 times as long as the period of moisture absorption Pause conditions: Storage within the period of the floor life at room temperature and 10% RH or less (4) Storage After Processing Products should be stored in the conditions below after processing to remove the moisture. Storage conditions: 5-30 C and 70% RH or less for 7 days or less Please mount the product before this storage period is exceeded Underfill AKM does not recommend the use of underfill. The customer should carry out sufficient evaluations before using underfill for packages such as BGA and WL-CSP. 5-6

80 Chapter 5 Notes on the Use of AKM Products If the applied amount is too much, too little, or uneven, then stress on the package may cause cracks. It is therefore important to manage the amount applied appropriately. In order to release the stress, for example, to apply the underfill so that the fillet goes above the boundary between the silicon and the resin on all four sides. Also, depending upon the materials and the condition of the application, confirm that the temperature cycle durability after mounting does not deteriorate Notes on Board Design In order to fully utilize the performance of the product, in addition to the attention necessary to the circuit design for electronic equipment (see Section 5.2), it is also important to pay attention to the design of the board, for example the layout of components and the wiring pattern Thermal Resistance In general, when the junctions of semiconductors are used in high temperature environments for long periods of time, their reliability and life are reduced. The circuit and board are designed so that the junction temperature does not reach an extremely high temperature due to the heat generated during operation. The thermal resistance, which affects the junction temperature, is a parameter expressing how effective heat is transmitted, and it is a guideline for the junction temperature. This shows the temperature increase for the amount of heat generation for a unit of time. A lower thermal resistance means that the heat is more easily dissipated, so the performance is maintained even if the power consumption is large (meaning that more heat is generated). Figure shows a schematic diagram of the thermal resistance and the heat dissipation paths when a device is mounted on a board. What AKM expresses as θjc is a parameter (thermal parameter) that is treated as ΨJT in thermal characteristic specifications, with the heat path through the leads to the mounted board also taken into consideration. Also, for convenience, the channel temperature is expressed as the junction temperature. 5-7

81 Chapter 5 Notes on the Use of AKM Products T a θ ja T c θ jc T j a: Without backside tab T c θ ja T a θ jc T j b: With backside tab exposure The exposed tabs function as a heat spreader Ta: Ambient temperature ( C) Tj: Junction temperature ( C) Tc: Case surface temperature ( C) θja: Thermal resistance from junction to ambient ( C / W) θjc: Thermal resistance from junction to package surface ( C / W) θca: Thermal resistance from package surface to ambient ( C / W) Figure Schematic Diagram of Thermal Resistance As shown in Figure 5-1-4, the heat from the devices mounted on the board dissipates primarily on the path through the leads and the backside to the board side. When a high heat dissipation mechanism (a water cooling jacket, etc.) is used, the dominant heat path is from the package surface to the heat dissipation mechanism. Appropriate design and mounting of heat dissipation mechanisms and printed patterns on the board can reduce the heat resistance. The following equations are used to express the thermal resistances between the junction and the ambient θja and between the junction and the package surface θjc. ja T j T P d a T T j jc P, d c Pd: Electricity consumption (W) 5-8

82 Chapter 5 Notes on the Use of AKM Products The junction temperature can be derived from this equation if the thermal resistance, ambient temperature and device power consumption are known. T j T a P d T T P ja j c d jc, The thermal resistances (θja, θjc) may differ depending upon the environment where the device is used. The main factors affecting the thermal resistance are the air flow around the device (and the capacity of the housing for the device) and the density of the wiring on the board (the remaining copper rate). The thermal resistance is reduced with an increased air flow and with higher wiring densities. The user must determine the conditions for the use of the device and carry out appropriate thermal design so that the junction temperature (Tj) does not exceed the maximum rating for the product Board Stress and the Proximity of Magnetic Material (for sensor products) AKM products using Hall-effect sensors require particular caution about these points when boards are designed: - The stress applied by bending on the board after mounting may cause the magnetic characteristics to vary. Caution is required to prevent excessive bending when mounting and when incorporating the board into a product. - Magnetic material other than that in the application may change the output, so pay attention when deciding the layout Land Pattern The optimum dimensions for the mounting pad will depend upon factors such as the board materials, the solder paste materials, the soldering method and the equipment accuracy. The product s datasheet is a reference for the actual design, but contact our sales staff if anything is unclear. 5-9

83 Chapter 5 Notes on the Use of AKM Products 5.2 Notes on Circuit Design The datasheets for semiconductor devices indicate the functions and electrical characteristics of the device and the scope to which these are guaranteed. It is important that to design circuits such that the specification values and derating indicated in the AKM datasheet are satisfied with an appropriate margin. Derating (See Section 5.2.2) should be used and consideration should be made to allow a slight margin in the circuit design. From the perspective of reliability design, items that should be taken into consideration during design work include countermeasures against external noise and surge voltage, overshoot due to reactive loads, and latch-up in CMOS products, and others General Precautions For a system to achieve the desired level of reliability, consider these effects of the surroundings of the device. (1) Place such that the temperature near the semiconductor device does not become excessively high. (2) Maintain the power supply voltage, input voltage and power consumption within the rated values. (3) Ensure that excessive voltage due to noise is not applied to or induced in the input, output or power supply pins. (4) If plastic molded semiconductor devices are placed in a strong electric field, then polarization of the plastic materials and the passivation layer results, which may cause errors in operation. A shield should be used when placing the devices in environments with strong electric fields. (5) Prevent the occurrence of static electricity during use. (6) To avoid external surges, etc., place a protective circuit in the input and output section. (7) Ensure that the voltage applied is balanced when the power supply is being turned on/off. For example, excessive stress will result if a voltage is applied to the input or power supply pins while the grounding pin of the circuit is floating. (8) For products that use multiple power supplies, the start-up and shut-down should be done in the power supply sequence specified in the AKM datasheet. Contact our technical representative with any questions about this sequence or other matters. 5-10

84 Chapter 5 Notes on the Use of AKM Products About Derating According to JIS Z 8115, derating is defined as being The reduction of the stress ratio for a product. The act of systematically reducing the stress below the rated value in order to improve reliability. In other words, it is the use of conditions that have a sufficient margin to the rated values in order to reduce the failure rate of a device. The question of what level of derating to use compared with the maximum rating is an important issue in reliability design. The derating items to consider at the system design stage will depend slightly upon the semiconductor types. There is electrical stress derating for the voltage, current, power and load, etc., and also derating for environmental conditions such as the temperature and humidity, etc., and for mechanical stress from vibrations or impacts. Table shows the items that should be considered in derating the design for reliability design. It is desirable for reliability design that these derating standards are considered at the application design stage. If the derating is difficult, then it may be necessary to take different measures, for example, the selection of devices with higher maximum ratings, so contact our sales staff for direction. Table Items to be Considered in Derating the Design Derating factor Derating standard Temperature Junction temperature Follow the recommended operating conditions Ambient temperature Topr (*1) min to Topr max Humidity Relative humidity Within the range that condensation does not occur Other The board should be coated in cases with potential condensation. Voltage Breakdown voltage Follow the recommended operating conditions Excessive voltage Take measures to prevent excessive voltage application and electrostatic destruction. Current Input / output pins Consider fan out and load impedance. (*1) Topr: Operating temperature Notes on Absolute Maximum Ratings According to JIS C 7032, the absolute maximum rating is defined as Limits which should not be exceeded, even for an instant, and limits which should not be reached for any 2 items simultaneously. If the absolute maximum rating value is exceeded, even temporarily, then there is a possibility that this will cause deterioration or destruction and a risk that the life of the device will be shortened. It is therefore important in the design of electronic circuits using semiconductor devices to ensure that the absolute maximum rating specified for a device is never exceeded, no matter what fluctuations may occur in the external conditions during use. 5-11

85 Chapter 5 Notes on the Use of AKM Products AKM datasheets for products specify the absolute maximum ratings. When actually using an AKM product, the system design must be within the limits specified on the datasheet Noise and Surge Voltage Countermeasures Problems such as surge voltages, static electricity and noise are common to all semiconductor devices. Take care to eliminate the factors causing their occurrence and to reduce their effects. (1) Countermeasures for the source of noise Reduction of noise from external sources is very important. Methods for this include, but are not limited to: [1] Reducing surge voltages by placing a diode, resistor or capacitor in parallel with the input resistance; and [2] Placing a filter on the power supply line at the noise source side as a measure against the noise coupling through the AC power supply line. If measures are taken at the source of the noise, such as, placing shielding on equipment generating strong electric fields, then it is not necessary to take measures for the entire system on the side receiving the interference. Other measures such as moving the source away are also recommended. (2) Countermeasures using Grounding Lines By providing a dedicated grounding line for the circuit system and isolating it completely from the grounding systems for other power supply lines, any interference in the circuit system from the power supplies may be eliminated in the ground. Also, there should be only one point of contact between the circuit system and the chassis, so that no closed loop is formed between the circuit system and the chassis. (3) Countermeasures using Shielding The shielding of the signal line or the entire system, is a recommended method for reducing the effects of external noise Latch-Up Countermeasures (For LSI / CMOS products) Latch-up is a phenomenon peculiar to CMOS (Complementary Metal Oxide Semiconductor) LSI devices. It occurs when excessive current flows because of the operation of a thyristor formed by parasitic bipolar transistors, which inevitably result from the CMOS structure. The following precautions should be taken to prevent latch-up. 5-12

86 Chapter 5 Notes on the Use of AKM Products (1) Design the system so that the absolute maximum rating is not exceeded during the operation of the CMOS LSI device. For the input pins in particular, if a voltage above the absolute maximum rating is applied, then a forward current will flow in the diode in the input protection circuits and this may become a trigger current for the parasitic thyristor and cause latch-up and destruction of the device. (2) Do not insert the CMOS LSI device in reversed orientation. If the power supply voltage is applied to a CMOS LSI device inserted in reversed orientation, then the pn junctions inside the device are biased in the forward direction and are destroyed. (3) If any pins are unused, output pins should be left open and input pins should be connected to the power supply pin or grounding pin, depending upon the system logic. Latch-up will not occur in ordinary operation within the absolute maximum ratings. Refer to the following methods to ensure that the absolute maximum ratings are not exceeded: [1] Insert protective resistors in series with input and output pins. It is desirable that resistors are connected that can limit the input current to 200 ma or less. [2] Insert a current limiting resistor in series with the power supply. [3] Insert a noise absorbing capacitor between the power supply pin and the grounding pin. [4] Ensure that input signals are not applied before the power supply voltage when the power is turned on. If the input signal is present before power-up, insert a current limiting resistor in series with the input. [5] Insert switching diodes at the input and output pins in the same direction as the input protection circuit diodes and the output parasitic diodes in the chip. 5-13

87 Chapter 5 Notes on the Use of AKM Products 5.3 Notes on Handling AKM s semiconductor devices are high quality and highly reliable, but there are many factors that can lead to the destruction of the device (such as electrostatic discharge destruction, mechanical destruction, moisture absorption, etc.), depending upon handling techniques, mounting, and conditions of use. Pay careful attention to the points listed in this section when handling devices. Also refer to JEITA EDR-4701C Handling guidance for semiconductor devices Static Electricity and Electrostatic Discharge Destruction ESD (Electro Static Discharge) destruction is different from EOS (Electrical Overstress) destruction that occurs during normal operation in that it can also occur before the device is mounted. For this reason, take care during the packing, storage and transportation of semiconductor devices. (1) The Cause of Static Electricity When two insulators touch, electrons are exchanged between them. At this time, the side receiving the electrons becomes negatively charged and the side giving the electrons becomes positively charged, so they are charged with static electricity. Also, when a charged object is close to a conductor, electrostatic induction occurs and positive and negative charges appear on the surface of the conductor. This is also a charged state with static electricity. Figure shows the mechanisms for the occurrence of static electricity Charge moves when The charging remains when there is contact the objects are separated (a) The case of two insulators A charged object approaches a conductor Conductor (b) The case when a charged object approaches a conductor Conductor The conductor is charged due to electrostatic induction Figure The Occurrence of Static Electricity 5-14

88 Chapter 5 Notes on the Use of AKM Products (2) The Cause of Electrostatic Discharge Destruction Electrostatic discharge destruction of semiconductor devices occurs when the discharge current from static electricity flows inside the device. Electrical discharge occurs when conductors at different electrical potentials come into contact. There are several models (forms) for electrostatic discharge destruction. Figure is an explanation of one example of electrostatic discharge destruction with the CDM (Charged Device Model). + V dd IN + OUT All terminals are in a floating state and the device is charged GND V dd Any terminal touches a conductor and discharge occurs + + (Example: The output side touches a conductor) IN OUT Contact with conductor and discharge GND The charge this side is easily discharged from the wiring towards the conductor that was touched Voltage Even if the charge on this side gathers in the wiring, it is blocked by the gate and the discharge takes time. A difference in electrical potential is created between the IN side and the OUT side. If this exceeds the gate withstand voltage then gate oxide destruction occurs. VIN The potential difference can be reduced by slowing down the discharge = The electrostatic discharge destruction can be prevented VOUT Time Figure Example of Electrostatic Discharge Destruction in CDM 5-15

89 Chapter 5 Notes on the Use of AKM Products (3) Reducing Static Electricity The key factors in dealing with static electricity are: - To stop the generation of static electricity - To allow any charge generated to escape slowly To make this possible, take care with regard to the work environment, storage environment, workers, equipment (including jigs and tools) and the methods of transportation. Table shows examples of static electricity countermeasures. Table Countermeasures to Static Electricity (examples) Subject Details Work environment Humidity Use a humidifier to keep the humidity at %RH Electricity removal Use appropriate neutralization apparatus to keep at 100 V or below Floor Install a conductive floor (conductive sheet) Seating Fit a conductive cover Insulating material, dielectric material There is a risk that charged insulating and dielectric materials may cause static electrostatic induction, so do not bring them close to devices Storage environment Printed circuit boards after mounting Containers and racks Storage cases Storage racks Short circuit the connectors with a short-circuiting bar, etc. Use conductive items Use items specified by AKM Stick on conductive sheets, etc., and do not expose metal parts Workers Wrist straps Insert a resistor of about 1 MΩ on the human body side (To prevent electric shock and to suppress the discharge rate) Shoes, work clothes Wear conductive shoes and anti-static clothing Equipment, jigs and Equipment Implement grounding tools Conveying sections Attach conductive materials to parts which may come into contact with the device terminals Soldering irons Ground the iron tip with a resistance of around 1 MΩ Transportation methods Containers Carts Use conductive containers Lay a conductive sheet on the surface and ground the entire cart with conductive rubber, etc Packing (1) Storage Cases (Trays, Reels, Tubes) The storage cases used by AKM use materials and structures that maintain the initial device quality, regardless of the transportation situation and surrounding environment. Do not take the devices out of the storage cases specified by AKM until the device is used. 5-16

90 Chapter 5 Notes on the Use of AKM Products If taking the devices out is unavoidable, always return them to the storage cases specified by AKM. If storage cases that have not been recommended are used, mounting failure may occur due to damage or contamination of the terminals (leads, lands, bumps and balls). In this case, contact our sales staff. When removing a device from its storage case, take care to prevent static electricity and lead bending. The storage cases specified by AKM use materials and structures designed to maintain the initial device quality in even the worst environmental conditions, so use the AKM specified storage cases for storage of the devices. We do not recommend the use of any products other than the AKM specified ones, so contact a member of our sales staff if the use of non-specified material is necessary. (2) Packaging (Cable ties, Packing bags, Packing boxes, Corrugated cardboard, etc.) Use the packing materials specified by AKM for packing of the storage cases. We do not recommend the use of any products other than the AKM specified ones, so contact a member of our sales staff if the use of non-specified material is necessary. In particular, when moisture-proof packing is used, do not open the packing until the device will be used. AKM selects packing materials and packing methods so that the reliability of the products can be maintained regardless of the method of transportation. Also, external markings are displayed on the corrugated cardboard boxes, so comply with these during handling. Figure shows the external markings: a) Handle with care b) Beware of static electricity c) Up direction for box d) Fragile e) Hand hooks forbidden f) Do not wet Figure External Markings 5-17

91 Chapter 5 Notes on the Use of AKM Products Storage Methods (1) Environment at Storage Locations a) We recommend the following temperature and humidity conditions for the storage locations of the semiconductor devices. - For LSI products Temperature: 5-30 C Humidity: 70% RH or less - For sensor products Temperature: 5-35 C Humidity: 40-85% RH In cases where the use of a humidifier is necessary, use purified water or boiled water. If tap water is used, then the chlorine in it may cause corrosion of the device terminals. b) Avoid dusty locations and locations with corrosive gases. c) Rapid changes in temperature may cause condensation on the device. Avoid these environments, and store devices in locations with as little temperature variation as possible. Also avoid environments exposed to direct sunlight or strong light. (2) Storage Conditions a) When stacking storage cases, packing boxes or corrugated cardboard boxes, ensure that no load is placed on the devices stored. Avoid placing heavy products on top. b) Store semiconductor devices with their external leads unprocessed. If devices are stored after lead bending processing, then corrosion may occur on the bent parts and cause soldering failure. c) Do not place products using organic rubber materials close to semiconductor devices. Sulfur released from the organic rubber materials may corrode the terminals. (Silver in particular is known to react with sulfur.) Be particularly careful about the materials used in binding, non-slip surfaces and mats, etc. (3) Long-term Storage When semiconductor devices are stored for long periods, the solderability of the terminals may deteriorate because of corrosion, and the electrical characteristics may fail. This can occur if the packaging is opened, but it also can occur without opening the package. If AKM products have been in storage for a prolonged period, verify the safety of storage conditions sufficiently before use Transportation Methods Packages have become thinner and smaller and impacts during transportation may cause the leads to bend or lift. Observe the following points for transportation: 5-18

92 Chapter 5 Notes on the Use of AKM Products a) Keep the boxes in the correct orientation during transportation in accordance with the external markings. If the boxes are inverted or placed upright then this will exert unnatural forces and may cause damage. b) Even in the packing, the device may be damaged if it is thrown or dropped. c) Ensure that the boxes do not get wet and keep them dry during transportation in rain or snow. d) Keep mechanical vibrations and shocks to a minimum Cautions during Evaluations When electrical characteristics evaluations or inspections, including mounting on the printed circuit board are performed, sufficient care should be taken about static electricity, noise and surge voltages. Putting terminals at the same electrical potential during transportation and storage helps to avoid destruction. However, when measuring or incorporating the device, all the terminals are opened and each terminal may independently come into contact with the surroundings. For this reason, the device may be destroyed due to static electricity or electric leakage from electrical facilities. Manage equipment appropriately to ensure that there is no electric leakage from the AC power supply, etc., on the chassis or the terminals of measurement apparatus (curve tracers, synchroscopes, pulse generators, stabilized DC power supplies). Observe these points during evaluations: [1] Ensure that no surge voltage is applied from the tester. [2] Put a clamp circuit in the tester. [3] Ensure that no abnormal voltage is applied due to contact failure during the current source supply start-up. Also ensure that the test that terminals are not incorrectly connected, that the device is inserted in the correct orientation, and that no shorting between terminals occurs. When checking the operation of a printed circuit board, check carefully that there are no solder bridges or particle bridges before turning the power supply on. The points to pay attention to depend on the different types of device, so contact our sales staff if anything is unclear Notes on the Disposal of the Product Various materials are used in semiconductor devices and their packing materials, take care when disposing of them. (1) Disposal Method for Semiconductor Devices Semiconductor devices contain various different substances, so they must be processed correctly as industrial waste. (2) Disposal Method for Packing Materials The packing of semiconductor devices includes trays, tubes and taping and also corrugated cardboard, plastic and binding materials, etc. These materials should be separated into papers and plastics, and then either incinerated, buried or recycled in accordance with the local laws, regulations and ordinances. 5-19

93 Chapter 6 Appendices and Attached Figures Chapter 6 Appendices and Attached Figures 6.1 Reference Information Conflict Minerals It is natural that we must avoid the use of materials that have an impact on the environment in products and packing materials. However, it is also required in the social responsibility of a company (CSR) that consideration is given to various matters during the procurement of the raw materials for those products and packing materials, for example, consideration of conflict minerals. Conflict minerals is the name given to the four minerals of tin, gold, tantalum and tungsten, when mined from the Democratic Republic of the Congo and nine other countries in that area (Angola, Uganda, Republic of the Congo, Zambia, South Sudan, United Republic of Tanzania, Burundi, Rwanda and the Central African Republic). They are considered to be a source of funding for the anti-government forces in the Democratic Republic of the Congo. These mines are a blight that fosters human rights violations such as forced labor, including of women and children, and sanctions have been imposed on them by the United Nations. The use of raw materials that are produced and distributed under these kinds of conditions is seen as an acceptance of those human rights violations. In Europe and America, some companies have been the target of fierce protests because of their use of these conflict minerals. Under such circumstances, there is a strong effort to avoid the use of conflict minerals. For example, in the financial regulatory reform that was established in the United States on July 21, 2010, any company that uses conflict minerals in products has an obligation to report this to the US Securities and Exchange Commission. Also, based on the EICC (Electronics Industry Code of Conduct), the electronic devices industry in Europe and America has decided that in principle no conflict minerals will be purchased within the United States from January There are increasing examples of investigations using a template issued by the EICC. In particular, many powerful global corporations are members of the EICC, so there will be an increasing number of repeat investigations using that template in connection with the supply chain for those companies. In coordination with these trends in the industry, AKM implements distribution channel investigations for the affected materials we use in products and we confirm that they are not conflict minerals. We issue certificates of the non-use of conflict minerals for individual products when required by our customers, so contact our sales staff to process such documentation. 6-1

94 Chapter 6 Appendices and Attached Figures Together with Society By carrying out a variety of activities in harmony with the community, AKM strives for social welfare and raises environmental awareness among its employees. (1) Tree-planting Activities To promote environmental conservation, AKM actively participates in the tree-planting projects being carried out in various regions. (2) Neighborhood Clean-up Activities Employees at our main production sites periodically clean up the areas nearby the plant to get rid of litter, rubbish, and weeds as part of our interaction with the surrounding communities. On June 7, 2010, the Clean-up Operation which has been implemented at FAB2 since 2001 was presented with an award for achievement in local environmental beautification by the Ministry of the Environment in Japan. (The award certificate is shown in Figure ) Figure Award Certificate for Achievement in Local Environmental Beautification This certificate, presented to Asahi Kasei Microsystems Co., Ltd. (Nobeoka Office) by the Ministry of the Environment of Japan, is proof of their contribution to local environmental beautification. 6-2

95 Chapter 6 Appendices and Attached Figures 6.2 Compliance with International Standards at Each Plant Table illustrates the compliance with international standards at each AKM plant. Table Compliance with International Standards at Each Plant FAB1 FAB2 FAB3 FAB5 FABFP ISO 9001 Registration certificate number JQA-0899 Expiry date July 14, 2017 ISO/TS Registration certificate JQA-AU JQA-AU number (IATF: ) (IATF: ) Expiry date July 10, 2017 JQA-AU (IATF: ) ISO Registration certificate number JQA-EM0561 JQA-EM0302 JQA-EM6851 JQA-EM0561 Expiry date October 21, 2017 December 24, 2016 November 1, 2016 October 21,

96 Chapter 6 Appendices and Attached Figures 6.3 Documents Provided by AKM AKM provides documents related to product quality and/or the environment in response to customer requests. This section provides details for a variety of requests QC Process Chart The QC Process Flow chart is a summary table of the controlled items and their methods at each stage of the manufacturing process. Figure shows the explanatory notes for QC Process Flow charts. The raw materials used in process Item managed at each process Process flow chart (Symbols conform to JIS Z 8206) Product name Process name The method for the management Frequency of the management The process are divided into wafer processes, package (assembly) processes and inspection processes. The plants responsible for each process Figure QC Process Flow Chart (example) 6-4

97 Chapter 6 Appendices and Attached Figures Reliability Testing Results Figure shows the explanatory notes for the results of reliability testing on products. The listed items include High-temperature / low-temperature operating tests, High-temperature/ low-temperature storage tests, Reflow thermal resistance tests, etc. Figure shows just one example. Items other than these are tested and included on the list when necessary, depending upon the details of the contract with our customer. Product name Wafer process and package type Test conditions Number of samples Test item Test results: Elapsed time (cycles) / Number of failed items Figure Reliability Data (example) 6-5

98 Chapter 6 Appendices and Attached Figures Estimated Field Failure Rate The Arrhenius model is used to estimate the failure rate. (See Chapter 2, Item 2.1.3) Documents on the estimated failure rate of products include the basis for its calculation and its calculation results with a confidence level of 60%. Figure shows a document related to the estimated failure rate. Product name The basis for the failure rate calculation Conditions for the failure rate calculation Estimated failure rate Figure Estimated Post-shipping Failure Rate (example) 6-6

99 Chapter 6 Appendices and Attached Figures Packaging Specifications The packaging specifications for finished products delivered to customers specify and explain the method for storing in containers such as embossed tape, trays or tubes, and the method of packing those containers in the packing bags and outer boxes. Refer to these specifications for information on the handling of packaging. Figure shows a document related to packaging specifications. (This is an example of a product model using embossed tape.) Package name Packing specifications (ex. use embossed tape: format conform to JIS C ) Figure Taping Specifications (example; partial excerpt) 6-7

100 Chapter 6 Appendices and Attached Figures Package Thermal Resistance of Product When the temperature at the junctions of bipolar transistors or at the channels of MOS transistors exceeds the specified temperature, they stop operating. Figure shows a document related to thermal resistance, which is one of the parameters which affect the junction (channel) temperature. Product name Conditions for simulation Thermal resistance at simulation Figure Document related to Thermal Resistance Value (example) Flame Resistance The documents related to the flame resistance of products show the material of the package, whether or not the material will ignite, and the flame resistance grade based on the UL Standards. Figure shows a document related to flame resistance. Product materials and Flame resistance grade Product name Figure Flame Resistance of the Package (example) 6-8

101 Chapter 6 Appendices and Attached Figures FMEA (Failure Mode and Effects Analysis) Figure shows an example of FMEA (Failure Mode and Effects Analysis) done at AKM for the product manufacturing processes. Product name Function Analysis for functions Figure FMEA (example; partial excerpt) ESD (Electrostatic Discharge) Information on the resistance to ESD (Electrostatic Discharge) is provided in the reliability data as in Item 6.3.2, but we also provide a separate document if it is requested. Figure shows the format for this document. Product Wafer process Package type Test Test Figure ESD Data (example) 6-9

102 Chapter 6 Appendices and Attached Figures Recommended Land Pattern The land pattern diagram is a document related to the positioning of lands for the mounting of the product on a printed circuit board. Figure shows an example of a document related to the land pattern recommended by AKM. Product name Recommended land pattern diagram Figure Recommended Land Pattern (example) 6-10

103 Chapter 6 Appendices and Attached Figures Package Cross Section Diagrams Package cross section diagrams are used to expose the schematic structure of the inside of the product. Figure shows an example. As it is only a schematic representation of the internal structure, it does not match the actual dimensions. Product name Wafer process Package type Cross section diagram of the package (schematic diagram) Package materials and specification Figure Package Cross Section Diagram (example) 6-11

104 Chapter 6 Appendices and Attached Figures Package Diagrams and Marking Diagrams The package diagrams and marking diagrams show the package and markings for the product. Figure shows a package diagram and a marking diagram. Product name Package diagram Marking diagram Figure Package Diagram and Marking Diagram (example) 6-12

105 Chapter 6 Appendices and Attached Figures Analysis Report of Environmental Hazardous Substances The table of analysis data shows the results of component analysis done at an analysis agency to check whether any environmentally hazardous substances are included in the substances making up the product. Figure shows the analysis data. Customer name Date of submission Product name Parts of the reporting 2nd page onwards: Report of analysis result at inspection agency (ex.: SGS) Figure Analysis Data (example) 6-13

106 Chapter 6 Appendices and Attached Figures Material Component Datasheet The component table provides a list of the substances the product is composed of. Figure shows the component table. This component table example is for the entire package. We can also provide component tables for separate parts, for example, for the mold resin or for the lead frame. Customer name Product name Weight Parts and intended use Containing substances and CAS No. Content rate for each parts Figure Component Table (example) 6-14

107 Chapter 6 Appendices and Attached Figures Certificate of Non-Use A document to certify that a particular environmentally hazardous substance is not used in AKM products can be issued at the request of customers. Figure shows a certificate of non-use. (Example of certificate of non-use for PBBs and PBDEs.) Date of submission Customer name Target substance (substance groups) Product name Figure Certificate of Non-use (example) 6-15

108 Chapter 6 Appendices and Attached Figures Certificate of Compliance with the RoHS Directive Figure shows an example of a certificate to prove that none of the substances specified in the RoHS directive are included in the product. Customer name Date of submission Product name RoHS regulation substances and threshold valure About the report of the analysis results Figure Certificate of Compliance with the RoHS Directive (example) 6-16

109 Chapter 6 Appendices and Attached Figures Certificate of Non-Use of Substances Subject to the REACH Regulations Figure shows an example of a certificate to prove compliance with the REACH regulations, showing that SVHC (substances of very high concern) are not included in the product. Customer name Date of submission Product name List of SVHC 2nd page onwards: List of SVHC Figure Certificate of Non-use of SVHC (example) 6-17

110 Chapter 6 Appendices and Attached Figures Certificate of Non-Use of Halogens Figure shows an example of a certificate to prove that halogens (chlorine and bromine) are not used in the product. Customer name Date of submission Product name Standard value for halogen-free About the report of the analysis results Figure Certificate of Non-use of Halogens (example) 6-18

111 Chapter 6 Appendices and Attached Figures 6.4 Reference Standards AKM products are manufactured with concern for quality and for the environment based on the requests from customers and our knowledge. The ideas of international standards and of the specifications and standards issued by industry organizations have been incorporated into this handbook, such as those shown in Table (although complete compliance with them is not guaranteed.) Table The Standards that have been Referenced in this Handbook Standard number Standard name Note International Organization for Standardization (ISO) ISO 9001: 2008 Quality management system -- Requirements - ISO/TS 16949: 2009 ISO 14001: 2004 ISO/IEC 17025: 2005 ISO 9004: 2009 Quality management systems -- Particular requirements for application of ISO 9001: 2008 for automotive production and relevant service part organizations Environmental management systems -- Requirements with guidance for use General requirements for the competence of testing and calibration laboratories Managing for the sustained success of an organization A quality management approach ISO : 1999 Cleanroom and associated controlled environments -- Part 1: Classification of air cleanliness Japanese Industrial Standards Committee (JISC) JIS C General rules for transistors - JIS Z 8115: 2000 Glossary of terms used in dependability - JIS Z Graphical Symbols for Process Chart - JIS C : 2010 Packing of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes JEDEC Solid State Technology Association (JEDEC) JESD46D JESD51-2A J-STD-020D.1 J-STD-033C Customer Notification of Product/Process Changes by Solid-State Suppliers Integrated Circuits Thermal Test Method Environmental Conditions Natural Convection (Still Air) Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mounted Devices Japan Electronics and Information Technology Industries Association (JEITA) EIAJ ED-4701/100 EIAJ ED-4701/200 EIAJ ED-4701/300 Environmental and endurance test methods for semiconductor devices (Life test I) Environmental and endurance test methods for semiconductor devices (Life test II) Environmental and endurance test methods for semiconductor devices (Stress test I)

112 Chapter 6 Appendices and Attached Figures EIAJ ED-4701/300-1 EIAJ ED-4701/300-2 EIAJ ED-4701/300-3 EIAJ ED-4701/300-4 JEITA ED-4701/303 JEITA ED-4702B Environmental and endurance test methods for semiconductor devices (Stress test I) (Amendment 1) Environmental and endurance test methods for semiconductor devices (Stress test I) (Amendment 2) Environmental and endurance test methods for semiconductor devices (Stress test I) (Amendment 3) Environmental and endurance test methods for semiconductor devices (Stress test I) (Amendment 4) Environmental and endurance test methods for semiconductor devices Mechanical stress test methods for semiconductor surface mounting devices JEITA EDR-4701C Handling Guidance for Semiconductor Devices - JEITA EDR-4704A Application guide of the accelerated life test for semiconductor devices JEITA EDR-4707 Report on Failure Mechanism of LSI and reliability test method - JEITA EDR-4708 Guideline for LSI Reliability Qualification Plan - JEITA EDR-7336 Package thermal characteristic guideline in semiconductor product - JEITA ET-7407A Automotive Electronics Council (AEC) Endurance test methods of solder joint for CSP and BGA package on mounting condition AEC-Q100-Rev-G STRESS TEST QUALIFICATION FOR INTEGRATED CIRCUITS - AEC-Q101-REV-C STRESS TEST QUALIFICATION FOR AUTOMOTIVE GRADE DISCRETE SEMICONDUCTORS AEC-Q001 Rev-D GUIDELINES FOR PART AVERAGE TESTING - AEC-Q002 Rev B GUIDELINES FOR STATISTICAL YIELD ANALYSIS - Japan Electronics Packaging and Circuits Association (JPCA) JPCA-ES Test Method for Halogen-Free Materials - International Electrotechnical Commission (IEC) IEC Reinforced base materials, clad and unclad-non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad) Association Connecting Electronics Industries (IPC) IPC-4101C European Union (EU) Directive 2011/65/EU Specification for Base Materials for Rigid and Multilayer Printed Boards Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (recast) (Text with EEA relevance) RoHS 6-20

113 Chapter 6 Appendices and Attached Figures REGULATION (EC) No 1907/2006 Directive 2000/53/EC Directive 2002/96/EC Directive 2005/32/EC Directive 2009/125/EC REGULATION (EC) No 1907/2006 OF THE EUROPEN PARLIAMENT AND OF THE COUNCIL of 18 December 2006 concerning the Registration, Evaluation, Authorisation and Restriction of Chemicals (REACH), establishing a European Chemical Agency, amending Directive 1999/45/EC and repealing Council Regulation (EEC) No 793/93 and Commission Regulation (EC) No 1488/94 as well as Council Directive 76/769/EEC and Commision Directives 91/155/EEC, 93/67/EEC, 93/105/EC and 2000/21/EC Directive 2000/53/EC of the European Parliament and of the Council of 18 September 2000 on end-of life vehicles Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE) Directive 2005/32/EC of the European Parliament and of the Council of 6 July 2005 establishing a framework for the setting of ecodesign requirements for energy-using products and amending Council Directive 92/42/EEC and Directive 96/57/EC and 2000/55/EC of the European Parliament and the Council Directive 2009/125/EC of the European Parliament and of the Council of 21 October 2009 establishing a framework for the setting of ecodesign requirements for energy-related products (recast) (Text with EEA relevance) Electronic Industry Citizenship Coalition (EICC) Version 4.0 EICC CODE OF CONDUCT - Federal Standard (FS) FED-STD-209D CLEAN ROOM AND WORK STATION REQUIREMENTS, CONTROLLED ENVIRONMENT REACH ELV WEEE EuP ErP repeal 6-21

114 Chapter 6 Appendices and Attached Figures 6.5 List of Tables and Figures Table gives a list of the tables and figures in this handbook. About Us Table List of Tables and Figures 0.1 Introduction to AKM Figure Company Organization Chart P.0-2 Chapter 1 Quality Management System 1.1 Compliance with International Standards 1.2 Quality Management System Figure Company Sites in Japan Figure Company Sites Overseas Figure Business Fields and Group Philosophy of the Asahi Kasei Group Figure ISO Registration Certificates Figure AKM's Management Cycle Figure AKM s Product Realization System Figure Quality Assurance System from Design to Mass Production (outline) Figure Product Development and APQP Activities Figure Procedure for Change Control (outline) Figure Subcontractor Registration through Evaluation Figure Integrated Production Control System Figure Basic Outline of Planned Maintenance Figure In-process Inspections and the Action when Abnormalities are Detected Figure Example Inspection Processes at AKM Figure Traceability System Diagram for Measurement Tools Figure Flow of Evaluations of Customer Satisfaction Figure System at AKM for Dealing with Customer Quality Problems Figure Flow of Corrective Action (example: for a case of quality problems received from the customer or company-internal failures) Figure Flow Chart for Internal Audits (outline) Figure Small Group Activities Presentation Figure Clean Room (left: central aisle, right: working area) P.0-3 P.0-3 P.0-4 P.1-1 P.1-3 P.1-4 P.1-5 P.1-6 P.1-8 P.1-10 P.1-11 P.1-12 P.1-13 P.1-14 P.1-15 P.1-16 P.1-18 P.1-19 P.1-21 P.1-22 P

115 Chapter 6 Appendices and Attached Figures Chapter 2 Reliability Assurance 2.1 Reliability Assurance Philosophy Figure The Flow of Particle Measurements Figure The Flow of Education and Training (outline) Table Examples of Changes Subject to Change Control Table Basic Storage Periods for Records Table Emergency Situations that are Assumed Figure Failure Rate Curve (bathtub curve) Expressing the Distribution of Failures Figure Reaction and Activation Energy in the Arrhenius Model (model diagram) Figure Arrhenius Model P.1-23 P.1-24 P.1-7 P.1-23 P.1-25 P.2-3 P.2-5 P Reliability Testing and Qualification 2.3 Technology for the Elimination of Latent Defects Figure Eyring Model Figure Method for Checking Durable Period Table AKM s Standard Test Methods Table Standard Test Items and Numbers of Samples for the Reliability Testing of LSI Products ( : Necessary, : Implemented as appropriate, depending on details) Figure Concept of PAT Figure Static PAT Figure Dynamic PAT P.2-7 P.2-12 P.2-11 P.2-14 P.2-15 P.2-16 P.2-16 Figure Representation of IDDQ Chapter 3 Failure Analysis and Analysis Technology P Failure Analysis Flow Figure Failure Analysis Flow P Analysis Equipment and Analysis Examples Figure X-ray Transmission Systems Figure Example Observations Using X-ray Transmission Systems Figure Scanning Acoustic Tomography Equipment (SAT) Figure Example of Observation Made on Scanning Acoustic Tomography Equipment Figure Emission Microscope Figure Example of Observation Using an Emission Microscope Figure EB Tester Figure Example of Difference Image Analysis (analysis using voltage contrast images) Figure Example of Waveform Analysis P.3-4 P.3-4 P.3-5 P.3-5 P.3-6 P.3-6 P.3-7 P.3-7 P

116 Chapter 6 Appendices and Attached Figures 3.3 Root Cause Identification and Problem Solving Tools Figure OBIRCH Analysis Equipment Figure Examples of Analysis on OBIRCH Analysis Equipment (left: surface analysis, right: backside analysis) Figure Example of SDL Analysis Figure FIB for Circuit Edit Figure Nano-probing System Figure Example of Analysis of MOS Static Characteristics Measurement (left: the probing, right: the measurement results) Figure Example of EBAC Analysis Figure Example Observation Using an Optical Microscope Figure SEM Equipment Figure Example of Analysis Using a SEM Figure Dual FIB/SEM Equipment Figure Cross-section Analysis Using FIB/SEM Figure Example of Cross-section Observation on a STEM System (observation of cross-section of Poly-Si gate) Figure Example of Elemental Analysis Using STEM + EDX Table Failure Analysis Equipment at AKM Figure Actions for Problem Solving P.3-9 P.3-9 P.3-10 P.3-10 P.3-11 P.3-11 P.3-12 P.3-12 P.3-13 P.3-13 P.3-14 P.3-14 P.3-15 P.3-15 P.3-3 P

117 Chapter 6 Appendices and Attached Figures Chapter 4 The Management of Environment-Related Substances 4.1 The Management of Chemical Substances Chapter 5 Notes on the Use of AKM's Products Table Substances Subject to the RoHS Directive and Regulation Values Table Comparison of RoHS Directive and REACH Regulation Table Substances Subject to the ELV Directive and Regulation Values Table Standards Applied to Halogen-free Products 5.1 Notes on Mounting Figure Recommended Dip Conditions for Through-hole Mount Packages 5.2 Notes on Circuit Design Figure Schematic Diagram of Thermal Resistance Table Printed Circuit Board Cleanliness after Component Mounting (from JEITA EDR-4701C) Table Items to be Considered in Derating the Design P.4-3 P.4-4 P.4-5 P.4-6 P.5-3 P.5-8 P.5-4 P Notes on Handling Figure The Occurrence of Static Electricity P.5-14 Chapter 6 Appendices and Attached Figures Figure Example of Electrostatic Discharge Destruction in CDM Figure External Markings Table Countermeasures to Static Electricity (examples) 6.1 Reference Information Figure Award Certificate for Achievement in Local Environmental Beautification 6.2 Compliance with International Standards at Each Plant 6.3 Documents Provided by AKM Table Compliance with International Standards at Each Plant Figure QC Process Floe Chart (example) Figure Reliability Data (example) Figure Estimated Post-shipping Failure Rate (example) Figure Taping Specifications (example; partial excerpt) Figure Document Related to Thermal Resistance Value (example) Figure Flame Resistance of the Package (example) Figure FMEA (example; partial excerpt) Figure ESD Data (example) Figure Recommended Land Pattern (example) Figure Package Cross Section Diagram (example) P.5-15 P.5-17 P.5-16 P.6-2 P.6-3 P.6-4 P.6-5 P.6-6 P.6-7 P.6-8 P.6-8 P.6-9 P.6-9 P.6-10 P

118 Chapter 6 Appendices and Attached Figures 6.4 Reference Standards 6.5 List of Tables and Figures Figure Packing Diagram and Marking Diagram (example) Figure Analysis Data (example) Figure Component Table (example) Figure Certificate of Non-use (example) Figure Certificate of Compliance with the RoHS Directive (example) Figure Certificate of Non-use of SVHC (example) Figure Certificate of Non-use of Halogens (example) Table The Standards that have been Reference in this Handbook Table List of Tables and Figures P.6-12 P.6-13 P.6-14 P.6-15 P.6-16 P.6-17 P.6-18 P.6-19 P

119 Notes for using this document 1. The information provided in this document is subject to change without notice. Please contact the AKM Sales Department for orders. 2. AKM has made every effort to ensure the accuracy of the information provided in this document at the time of its preparation. Please note that AKM is not responsible for any damages suffered by customers resulting from any errors in this document. 3. Do not reprint, copy, or distribute this document to third parties without permission from AKM. 4. If you have any inquiries or notice any errors regarding this document, please contact the AKM Sales Department. Asahi Kasei Microdevices Corporation Qualuty & Environment Handbook 2015/ 09 / 01 Published by: Quality Assurance Center

120 URL: Home Office: Kanda Jinbocho, Chiyoda-ku, Tokyo Japan TEL: +81-(0) TEL: +81-(0)