Product Selector Guide
|
|
- Jodie O’Brien’
- 5 years ago
- Views:
Transcription
1 Selector Guide 1
2 Rogers Corporation was founded in 1832 and has over 60 years of experience as a global supplier of high performance RF materials. Rogers Corporation s Advanced Connectivity Solutions (ACS) is the world s leading manufacturer of high performance dielectrics, laminates and prepregs used in microwave and RF printed circuit and related applications in Aerospace & Defense, Wireless & Wireline (digital) Infrastructure, Automotive Radar Sensor, Satellite TV, Mobile Internet Device and High End Chip Scale Packaging. ACS is headquartered in Chandler, Arizona. Additional manufacturing, sales and technical service locations in North America, Europe and Asia enable Rogers to support our global customers at the local level. Beyond recently expanded manufacturing capability, an extensive and growing product portfolio supports a wide array of application needs and environments. Rogers application and technical service engineers are ready to assist in material selection, for design and PCB manufacturing phases of your product development process. 2
3 With unmatched industry expertise, Rogers Corporation continues to conceive and develop new material solutions for ever more challenging problems. For example, over the last several years Rogers Corporation introduced thermal management materials and continues to innovate to meet the needs for a range of emerging higher power applications. Our dedication to improving on electrical characterization capabilities, already best in class, enables us to anticipate questions and work collaboratively to push the material performance envelope. 3
4 LAMINATES ML Series AD Series 92ML Woven Glass Reinforced Modified Epoxy Laminates 92ML StaCool Woven Glass Reinforced Modified Epoxy IMS AD250C AD255C AD260A AD300C AD300D AD320A AD350A AD410L AD430L AD450L AD600L AD1000 CLTE-XT Dielectric Constant, 10 GHz (2.5 GHz) Process (1) Design (11) Dissipation (1) Factor TAN 10 GHz (2.5 GHz) Thermal (2) Coefficient of er -50 C to 150 C ppm/ C Volume Resistivity Mohm cm Surface Resistivity Mohm Water (4) Absorption D48/50 % 5.2 (1 MHz) (1 MHz) X X 10 8 (22) (1 MHz) (1 MHz) X X 10 8 (22) ± X X 10 7 (22) ± X X 10 7 (22) ± X X 10 7 (22) ± X X 10 8 (22) ± 0.05 TBD X X ± X X 10 7 (22) ± X X 10 7 (22) ± X X 10 7 (22) ± X X 10 7 (22) ± X X 10 7 (22) * ± (22) * ± X X 10 9 (22) * ± X X 10 8 (22) 0.02 CLTE Series CLTE CLTE-AT 2.98 ± X X 10 6 (22) ± X X 10 8 (22) 0.03 CLTE-MW ± to X X 10 6 (22) 0.03 CuCLAD Series DICLAD Series CuClad 217 Cross-Plied Woven Glass Reinforced PTFE CuClad 233 Cross-Plied Woven Glass Reinforced PTFE CuClad 250 Cross-Plied Woven Glass Reinforced PTFE DiClad 880 DiClad 870 DiClad , 2.20 ± , X X 10 6 (22) ± X X 10 6 (22) to 2.55* ± , 2.20 ± to 2.60* X X 10 8 (22) X X 10 6 (22) ± X X 10 7 (22) to 2.60* ± to 2.60* X X 10 7 (22) *Refer to Data Sheets for Dielectric Constant and Thickness Options
5 Thermal Conductivity W/(m K) 50 C ASTM D5470 Coefficient of Thermal Expansion (6) -55 to 288 C ppm/ C X Y Z Peel Strength 1 oz (35µm) ED Foil lbs/in. (N/mm) 5.0 (8.9) 5.0 (8.9) 12.0 (2.14) 12.0 (2.14) 17.0 (3.04) 13.0 (2.32) 3.20 (18.3) 12.0 (2.14) 17.0 (3.04) 12.0 (2.14) 12.0 (2.14) 12.0 (2.14) Density g/cm 3 Flammability Rating UL 94 Lead-Free (9) Process Compatible PIM (23) dbc 2.20 V-0 YES V-0 YES V-0 YES V-0 YES V-0 YES V-0 YES V-0 YES V-0 YES V-0 YES V-0 YES V-0 YES V-0 YES - 92ML Woven Glass Reinforced Modified Epoxy Laminates 92ML StaCool Woven Glass Reinforced Modified Epoxy IMS AD250C AD255C AD260A AD300C AD300D AD320A AD350A AD410L AD430L AD450L ML Series AD Series (2.14) 2.45 V-0 YES - AD600L (2.14) 3.20 V-0 YES - AD (1.29) 2.02 V-0 YES - CLTE-XT (1.25) 6.5 (1.16) 2.38 V-0 YES V-0 YES - CLTE CLTE-AT CLTE Series (6.0) 2.1 V-0 YES - CLTE-MW (2.50) 14.0 (2.50) 14.0 (2.50) 2.23 V-0 YES V-0 YES V-0 YES - CuClad 217 Cross-Plied Woven Glass Reinforced PTFE CuClad 233 Cross-Plied Woven Glass Reinforced PTFE CuClad 250 Cross-Plied Woven Glass Reinforced PTFE CuCLAD Series (2.50) 14.0 (2.50) 14.0 (2.50) 2.23 V-0 YES V-0 YES V-0 YES - DiClad 880 DiClad 870 DiClad 527 DICLAD Series 5
6 LAMINATES Dielectric Constant, 10 GHz (2.5 GHz) Process (1) Design (11) Dissipation (1) Factor TAN 10 GHz (2.5 GHz) Thermal (2) Coefficient of er -50 C to 150 C ppm/ C Volume Resistivity Mohm cm Surface Resistivity Mohm Water (4) Absorption D48/50 % ISOCLAD Series kappa RO1000 IsoClad 917 Non- IsoClad 933 Non- Kappa 438 UL 94 V-0 Laminates XtremeSpeed RO1200 Woven Glass Reinforced 2.17 ± X X 10 9 (22) ± X X 10 8 (22) (24) X X ± X X RO3003 (7) 3.00 ± X X RO3000 Series RO ± X X RO ± X X RO ± X X RO3210 Woven Glass Reinforced RO4725JXR RO4730JXR RO4730G3 UL 94 V-0 RO ± X X ± ± ± ± (0.0022) (0.0023) (0.0023) (0.0020) X X X X X X X X RO4003C 3.38 ± X X RO4000 Series RO ± (0.0022) X X RO4350B 3.48 ± X X RO ± X X RO TBD 9.6 X X (16) RO4835T TBD 1.34 X X RO4535 UL 94 V ± (0.0032) X X RO4360G ± X X
7 Thermal Conductivity W/(m K) 50 C ASTM D5470 Coefficient of Thermal Expansion (6) -55 to 288 C ppm/ C X Y Z Peel Strength 1 oz (35µm) ED Foil lbs/in. (N/mm) Density g/cm 3 Flammability Rating UL 94 Lead-Free (9) Process Compatible PIM (23) dbc (1.79) 10.0 (1.79) 2.23 V-0 YES V-0 YES - IsoClad 917 Non- IsoClad 933 Non- ISOCLAD Series V-0 YES - Kappa 438 UL 94 V-0 Laminates kappa > V-0 YES - XtremeSpeed RO1200 Woven Glass Reinforced RO (2.2) 2.1 V-0 YES - RO (1.8) 7.1 (1.2) 9.4 (1.6) 2.1 V-0 YES V-0 YES V-0 YES - RO3035 RO3006 RO3010 RO3000 Series (19) (19) (1.9) 8.5 (1.49) 8.4 (1.47) 3 V-0 YES NON FR YES NON FR YES V-0 YES (1.2) 1.8 NON FR YES -157 RO3210 Woven Glass Reinforced RO4725JXR RO4730JXR RO4730G3 UL 94 V-0 RO (1.05) 1.8 NON FR YES - RO4003C (1.1) 5.0 (0.88) 1.8 NON FR YES V-0 YES - RO4534 RO4350B RO4000 Series (0.88) 1.92 V-0 YES - RO (3.8) 1.68 V-0 YES - RO V-0 YES - (16) RO4835T (0.9) 1.9 V-0 YES -157 RO4535 UL 94 V (0.91) 2.16 V-0 YES - RO4360G2 7
8 LAMINATES Dielectric Constant, 10 GHz (2.5 GHz) Process (1) Design (11) Dissipation (1) Factor TAN 10 GHz (2.5 GHz) Thermal (2) Coefficient of er -50 C to 150 C ppm/ C Volume Resistivity Mohm cm Surface Resistivity Mohm Water (4) Absorption D48/50 % RT/Duroid 5000 RT/duroid 5880LZ Filled PTFE Composite RT/duroid 5880 PTFE RandomGlass Fiber RT/duroid 5870 PTFE Random Glass Fiber 2.00 ± X X ± X X ± X X RT/duroid ± X X RT/Duroid 6000 RT/duroid 6202PR (20) Woven Glass Reinforced RT/duroid 6202 Woven Glass Reinforced RT/duroid 6035HTC 2.90 to 3.00 ± 0.04 (8) 2.90 to to (8) 2.90 to 3.06 ± (8) +5 to X X (8) +5 to X X ± X X 10 8 (12) 0.06 RT/duroid 6006 RT/duroid LM 6.15 ± X X ± X X TC Series TC350 TC X X 10 7 (22) X X 10 9 (22) 0.03 TMM 3 Hydrocarbon Ceramic 3.27 ± X x 10 9 (10) 0.06 TMM 4 Hydrocarbon Ceramic 4.50 ± X 10 8 * 1 x 10 9 (10) 0.07 TMM Series TMM 6 Hydrocarbon Ceramic TMM 10 Hydrocarbon Ceramic 6.00 ± X 10 8 * 1 x 10 9 (10) ± X X 10 7 (10) 0.09 TMM 10i Hydrocarbon Ceramic 9.80 ± X X 10 7 (10) 0.16 TMM 13i Hydrocarbon Ceramic (14) ± TBD TBD 0.13 XT/DUROID Series XT/duroid 8000 (PEEK) (15) XT/duroid 8100 (PEEK) Woven Glass Reinforced 0.002" (0.0508mm) 0.004" (0.102mm) (18) X X 10 8 (12) 0.20 (18) 3.54 ± ± X X 10 6 (12)
9 Thermal Conductivity W/(m K) 50 C ASTM D5470 Coefficient of Thermal Expansion (6) -55 to 288 C ppm/ C X Y Z Peel Strength 1 oz (35µm) ED Foil lbs/in. (N/mm) Density g/cm 3 Flammability Rating UL 94 Lead-Free (9) Process Compatible PIM (23) dbc > V-0 YES (5.5) 27.2 (4.8) 2.2 V-0 YES V-0 YES - RT/duroid 5880LZ Filled PTFE Composite RT/duroid 5880 PTFE RandomGlass Fiber RT/duroid 5870 PTFE Random Glass Fiber RT/Duroid (1.6) 2.1 V-0 YES - RT/duroid (2.5) 2.1 V-0 YES - RT/duroid 6202PR (20) Woven Glass Reinforced (1.6) 7.9 (1.4) 2.1 V-0 YES V-0 YES - RT/duroid 6202 Woven Glass Reinforced RT/duroid 6035HTC RT/Duroid (2.5) 2.7 V-0 YES - RT/duroid (2.1) 3.1 V-0 YES - RT/duroid LM 0.72 (27) V-0 YES V-0 YES - TC350 TC600 TC Series (1.0) 1.8 NON FR YES - TMM 3 Hydrocarbon Ceramic (1.0) 2.1 NON FR YES - TMM 4 Hydrocarbon Ceramic (1.0) 5 (0.9) 2.4 NON FR YES NON FR YES - TMM 6 Hydrocarbon Ceramic TMM 10 Hydrocarbon Ceramic TMM Series (0.9) 2.8 NON FR YES - TMM 10i Hydrocarbon Ceramic (17) (0.7) 3.0 NON FR YES - TMM 13i Hydrocarbon Ceramic (0.88) VTM-0 YES VTM-0 YES - XT/duroid 8000 (PEEK) (15) XT/duroid 8100 (PEEK) Woven Glass Reinforced 0.002" (0.0508mm) 0.004" (0.102mm) XT/DUROID Series 9
10 BONDING MATERIALS Dielectric (1) Constant, er Dissipation (1) Factor TAN 10 GHz Volume Resistivity Mohm cm Water (4) Absorption D48/50 % Thermal (5) Conductivity W/(m K) 50 C ASTM D ML Prepreg 5.2 (1 MHz) (1 MHz) 1.2 X (25) 2.00 (26) 2929 Bondply 2.94 ± (21) 7.4 X CLTE-P 2.98 ± X (22) 0.50 COOLSPAN TECA Thermoset Thermally & Electrically Conductive Adhesive (TECA) Film N/A N/A 3.8 X (Conductive) N/A 6.00 CuClad 6250 Bonding Film X (22) 0.17 CuClad 6700 Bonding Film X (22) 0.17 RO3003 Ceramic PTFE Bondply RO3006 Ceramic PTFE Bondply RO3010 Ceramic PTFE Bondply 3.00 ± X ± X ± X RO4450B Hydrocarbon / Ceramic / Woven Glass / Prepreg 3.30 ± X 10 7 < ± X 10 7 < RO4460G ± X (28) RO4450T X RO4450F / Prepreg RT/duroid 6002 Ceramic PTFE Bondply 3.52 ± X ± X 10 6 < Properties Notes: (1) Measured by IPC-TM-650 method ~10 GHz, 23 C. Materials were based on testing raw substrate material. er values and tolerance reported by IPC-TM-650 method are the basis for quality acceptance, but for some products these values may be incorrect for design engineering applications, especially those in microstrip. We recommend that prototype boards of a new design be verified for electrical performance. (2) Measured by IPC-TM-650 method at ~10GHz modified. (3) Typical values are mean values derived from populations of measurements involving multiple lots of the specific foil type. (4) Measured after 48±1 hours immersion at 50±1ºC in accordance with the ASTM D570 standard. (5) Tested by ASTM C518. (6) Tested by IPC-TM Values are average over temperature range but not necessarily linear. However for RT/duroid 6002 and TMM grades the response is essentially linear. (7) The nominal dielectric constant of an 0.060" thick RO3003/RO3203 laminate as measured by IPC-TM will be 3.04 due to the elimination of biasing caused by air gaps in the test fixture. For further information refer to Rogers' T.R (8) Due to construction limitations, the dielectric constant of 0.005" laminates is 3.06 ± 0.04; 0.010" and 0.015" laminates are 3.02 ± 0.04: TCDK is +5 for the higher Dk range; and for 2.90 TCDK is -15 (9) Rogers' high frequency laminates and prepregs are lead-free process compatible and in accordance with IEC (10) TMM material test conditions D24/50 (twenty-four hours at 50 C) on 0.050" (1.27mm) thick specimens. TMM13i test condition D48/50. (11) Design Dk is determined by testing thick microstrip transmission line circuits and reporting the thickness-axis dielectric constant of the raw material without the influence of copper. For more information, refer to the article on the Rogers website titled "The Influence of Test Method, Conductor Profile, and Substrate Anisotropy on the Permittivity Values Required for Accurate Modeling of High Frequency Planar Circuits", which was featured in a publication Sept (12) Testing conditions: C, specimens etched free of copper (13) Available only with LoPro copper foil (14) Measured by IPC-TM-650 method (15) XT/duroid material thicknesses tested were 0.002" and 0.004" except for 8100 volume and surface resistivity which 0.004" material was tested (16) Values for 2.5 mil thickness. (17) Estimated 10
11 Coefficient of Thermal Expansion (6) C ppm/ C Density g/cm 3 Flammability Rating UL 94 Lead-Free (9) Process Compatible Press Temperatures X Y Z F C V-0 YES ML Prepreg NON-FR YES Bondply V-0 YES CLTE-P NON-FR YES COOLSPAN Thermoset & Electrically Conductive Adhesive (TECA) Film NO CuClad 6250 Bonding Film NO CuClad 6700 Bonding Film V-0 YES V-0 YES V-0 YES RO3003 Ceramic PTFE Bondply RO3006 Ceramic PTFE Bondply RO3010 Ceramic PTFE Bondply V-0 YES - - RO4450B Hydrocarbon / V-0 YES - - Ceramic / Woven Glass / Prepreg V-0 YES - - RO4460G V-0 YES - - (28) RO4450T V-0 YES V-0 YES RO4450F / Prepreg RT/duroid 6002 Ceramic PTFE Bondply Properties Notes Continued: (18) IPC-TM (19) Test method: ASTM 50 C (20) PR stands for Planar Resistor. Resistive foil, if required, must be specified when ordering 6202PR laminate. (21) Conditions 125ºC/24 hours. Test method IPC-TM (22) Measured after 24+1/2-0 hours immersion at 23 ± 1ºC in accordance with the ASTM D570 standard. (23) 12 microstrip transmission line test circuit on 0.060" thick laminate. (24) Dielectric Constant using stripline method IPC TM at 10 GHz is 4.10 ± 0.08 for Rogers' internal Q.A. testing (25) (D24/23) IPC TM (26) ASTM E1461 (27) 1.0 W/(m K) based on ASTM E1461 (28) Values for 3 mil thickness. Typical values are a representation of an average value for the population of the property. For specification values contact Rogers Corporation. The information contained in this Selector Guide is intended to assist you in designing with Rogers circuit materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular purpose. The user should determine the suitability of Rogers circuit materials for each application. Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The rate of change increases at higher temperatures and is highly dependent on the circuit design. Although Rogers' high frequency materials have been used successfully in innumerable applications and reports of oxidization resulting in performance problems are extremely rare, Rogers recommends the customer evaluate each material and design combination to determine fitness for use over the entire life of the end product. 11
12 Metal Claddings Foil Type Rolled Electrodeposited Electrodeposited Low Profile Reverse Treated LoPro Foil Resistive Foil Weight or Thickness Surface Roughness Sq (µm) Dielectric Side Top Side s 1 oz (35 µm) XtremeSpeed RO1200, RO3003, RO3006, RO3010, RO3035, RO3203, RO3206, RT/duroid 5870, 5880, 6002, 6202, 6006, LM, CLTE TM, CLTE-AT TM, CLTE-XT TM, CLTE- 1/2 oz. (18 µm) MW TM, CuClad 217, CuClad 233, CuClad 250, DiClad 527, DiClad 870, DiClad 880, IsoClad 917, IsoClad oz (70 µm) oz (35 µm) TC350 TM, TC600 TM, AD250 TM, AD255 TM, AD260 TM, AD300 TM, AD320 TM, AD350 TM 1/2 oz. (18 µm) oz (70 µm) oz (35 µm) CuClad 217, CuClad 233, CuClad 250, DiClad 527, DiClad 870, DiClad 880, IsoClad 917, IsoClad 933, CuClad, CLTE, CLTE-AT, CLTE-XT, CLTE-MW, AD410 TM, AD430 TM, AD450 TM, AD600 TM, AD1000 TM 1/2 oz. (18 µm) oz (35 µm) RO3003, RO3006, RO3010, RO3035, RO3203, RO3206, RO3210, RT/duroid 5870, 5880, 6002, 1/2 oz. (18 µm) HTC(not available with 1/4 oz cu), 6202, 6006, LM, TMM 3,4, 6,10, 10i, 13i ¼ oz. (9 µm) oz (140 µm) oz (105 µm) ML TM, 92ML TM StaCool 2 oz. (70 µm) oz. (35 µm) Kappa TM 438, RO4003C, RO4350B, RO4360G2 RO4533, RO4534, RO4535, RO4835 TM, 92ML, 92ML StaCool 1/2 oz. (18 µm) oz. (35 µm) XtremeSpeed RO1200, AD300D -IM, AD255C -IM, DiClad 880 -IM 1/2 oz. (18 µm) XtremeSpeed RO oz. (35 µm) /2 oz. (18 µm) RO4835T TM 1/2 oz. (18 µm) ¼ oz. (9 µm) XT/duroid 8000, XT/duriod oz. (70 µm) DiClad 527, DiClad 870, DiClad 880, IsoClad 917, IsoClad 933, CuClad 217, CuClad 233, CuClad 1 oz. (35 µm) , CLTE, CLTE-AT, CLTE-XT, CLTE-MW, AD410, AD430, AD450, AD600, AD1000, XtremeSpeed 1/2 oz. (18 µm) RO1200 (2 oz. only) 2 oz. (70 µm) AD250, AD255, AD260, AD300, AD320, AD350, RT/duroid 6002, 6006, LM, 6202, 6002PR, 6202PR, TC350, TC600 1 oz. (35 µm) RT/duroid 6035HTC, 6002, 6006, LM, 6202, 6002PR, 6202PR, AD250, AD255, AD260, 1/2 oz. (18 µm) AD300, AD320, AD350, RO3003, RO3006, RO3010, RO3210, TC350, TC600 1 oz. (35 µm) RO4003C, RO4350B, RO4533, RO4534, RO4535, RO4725JXR TM, RO4730JXR, RO4730G3, 1/2 oz. (18 µm) RO4830, RO4835 NiCr Ticer TCR 1/2 oz. (18 µm) NiCr Ticer TCR-HF 1/2 oz. (18 µm) OhmegaPly 1/2 oz (18 µm) OhmegaPly 1/2 oz. (18 µm) RO4003C CuClad 217, CuClad 233, CuClad 250, CLTE, CLTE-XT, DiClad 527, DiClad 870, DiClad 880, IsoClad 917, IsoClad 933 CuClad 217, CuClad 233, CuClad 250, CLTE, CLTE-XT, DiClad 527, DiClad 870, DiClad 880, IsoClad 917, IsoClad 933, RO4003C, RO4350B, RO4360G2, RO4835 CuClad 217, CuClad 233, CuClad 250, CLTE, CLTE-XT, DiClad 527, DiClad 870, DiClad 880, IsoClad 917, IsoClad 933, RO3003, RO3006, RO3010, RO3035, RO3203, RO3206, RO3210, RT/duroid 5870, 5880, 6002, 6202, 6006, LM Plates Alloy Machinability Density gm/cm 3 Thermal Conductivity W/(m K) Coefficient of Thermal Expansion ppm/c Aluminum 6061 Poor Brass 70/30 Cartridge Good Copper 110 Fair to Good Property Electrodeposited (ED) Rolled (RLD) ¼ oz (9 µm) 0.5 oz (18 µm) 1 oz. (35 µm) 2 oz (70 µm) 0.5 oz (18 µm) 1 oz. (35 µm) 2 oz.(70 µm) Tensile Strength, kpsi Elongation, % Vol Resistivity mohm cm Thickness: in (µm) (10.2) (17.8) (35.6) Rogers Advanced Connectivity Solutions (ACS) produces upon request a select number of copper clad laminates using commercially available, subtractively processed resistive foils. Resistive foil technology enables the use of planar resistors within the circuit boards that are made from our laminate products. The availability of these resistive foils varies depending on each particular copper clad laminate product offered by ACS. However, in general ACS uses both OhmegaPly foil from Ohmega Technologies, Inc. ( and TCR foil from Ticer Technologies ( ACS customers are encouraged to research the specific resistive foil products that are available as well as the performance and processing details from each foil supplier prior to placing orders with Rogers (71.1) (17.8) (35.6) (71.1) 12
13 Thickness, Tolerance & Panel Size inches (mm) Laminates Standard Dielectric Thickness (Without The Cladding) Available Claddings Standard Panel Sizes 92ML 0.003" (0.076mm) ± " 0.004" (0.102mm) ± " 0.006" (0.152mm) ± " 0.008" (0.203mm) ± " 92ML StaCool 0.003" (0.076mm) ± " 0.004" (0.102mm) ± " 0.006" (0.152mm) ± " 0.008" (0.203mm) ± " AD250C 0.020" (0.508mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " 0.125" (3.175mm) ± " AD255C 0.030" (0.762mm) ± " 0.040" (1.016mm) ± " 0.060" (1.524mm) ± " 0.125" (3.175mm) ± " AD260A 0.030" (0.762mm) ± " 0.040" (1.016mm) ± " 0.060" (1.524mm) ± " 0.125" (3.175mm) ± " AD300C 0.030" (0.762mm) ± " 0.040" (1.016mm) ± " 0.060" (1.524mm) ± " 0.120" (3.048mm) ± " AD300D 0.030" (0.762mm) 0.060" (1.524mm) AD320A 0.030" (0.762mm) ± " 0.041" (1.041mm) ± " 0.062" (1.575mm) ± " 0.120" (3.048mm) ± " AD350A 0.020" (0.508mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " 0.120" (3.048mm) ± " AD " (0.762mm) ± " 0.062" (1.575mm) ± " 0.125" (3.175mm) ± " AD " (0.762mm) ± " 0.050" (1.270mm) ± " 0.125" (3.175mm) ± " AD " (0.508mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " 0.120" (3.048mm) ± " AD " (0.254mm) ± " 0.020" (0.508mm) ± " 0.031" (0.787mm) ± " 0.060" (1.524mm) ± " 0.125" (3.175mm) ± " AD " (0.267mm) ± " 0.020" (0.508mm) ± " 0.030" (0.762mm) ± " 0.059" (1.499mm) ± " 0.120" (3.048mm) ± " CLTE-XT " (0.130mm) ± " " (0.239mm) ± " " (0.368mm) ± " 0.020" (0.508mm) ± " 0.030" ( 0.762mm) ± " 0.060" (1.524mm) ± " 0.120" (3.048mm) ± " 1 oz (35µm), 2 oz (70µm), 3 oz (105µm), 4 oz (140µm) ED 1 oz (35µm), 2 oz (70µm), 3 oz (105µm), 4 oz (140µm) ED 0.040", 0.059", 0.079" Thick Al and 6061 alloys 1/2 oz (18µm), 1 oz (35µm) ED Thick metal Aluminum, Copper, Brass 1/2 oz (18µm), 1 oz (35µm) rolled 1/2 oz (18µm), 1 oz (35µm) Ohmega & Ticer resistive foil Thick metal Aluminum, Copper, Brass 48" X 54" (1220mm X 1372mm) Other dielectric thicknesses and panel sizes may be available. Contact customer service. 13
14 Thickness, Tolerance & Panel Size inches (mm) Laminates Standard Dielectric Thickness (Without The Cladding) CLTE " (0.135mm) ± " 0.010" (0.0254mm) ± " 0.015" (0.381mm) ± " 0.020" (0.508mm) ± " 0.024" (0.610mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " 0.125" (3.175mm) ± " CLTE-AT 0.005" (0.127mm) ± " 0.010" (0.254mm) ± " (0.381mm) ± " 0.020" (0.508mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " 0.120" (3.048mm) ± " CuClad " (0.127mm) ± " 0.010" (0.254mm) ± " 0.020" (0.508mm) ± " 0.031" (0.787mm) ± " 0.060" (1.524mm) ± " 0.125" (3.175mm) ± " CuClad " (0.127mm) ± " 0.010" (0.254mm) ± " 0.020" (0.508mm) ± " 0.031" (0.787mm) ± " 0.062" (1.575mm) ± " 0.125" (3.175mm) ± " CuClad " (0.135mm) ± " 0.010" (0.254mm) ± " 0.020" (0.508mm) ± " 0.031" (0.787mm) ± " 0.062" (1.575mm) ± " 0.125" (3.175mm) ± " DiClad " (0.127mm) ± " 0.010" (0.254mm) ± " 0.020" (0.508mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " 0.125" (3.175mm) ± " DiClad " (0.127mm) ± " 0.010" (0.254mm) ± " 0.020" (0.508mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " 0.125" (3.175mm) ± " DiClad " (0.127mm) ± " 0.010" (0.254mm) ± " 0.020" (0.508mm) ± " 0.031" (0.787mm) ± " 0.060" (1.524mm) ± " 0.125" (3.175mm) ± " IsoClad " (0.127mm) ± " 0.010" (0.254mm) ± " 0.020" (0.508mm) ± " 0.031" (0.787mm) ± " 0.060" (1.524mm) ± " IsoClad " (0.127mm) ± " 0.010" (0.254mm) ± " 0.020" (0.508mm) ± " 0.031" (0.787mm) ± " 0.060" (1.524mm) ± " Kappa " (0.508mm) 0.030" (0.762mm) 0.040" (1.016mm) 0.060" (1.524mm) Other dielectric thicknesses and panel sizes may be available. Contact customer service. Available Claddings 1/2 oz (18µm), 1 oz (35µm) rolled 1/2 oz (18µm), 1 oz (35µm) Ohmega & Ticer resistive foil Thick metal Aluminum, Copper, Brass 1/2 oz (18µm), 1 oz (35µm) rolled 1/2 oz (18µm), 1 oz (35µm) rolled 1/2 oz (18µm), 1 oz (35µm) Ohmega & Ticer resistive foil Thick metal Aluminum, Copper, Brass 1/2 oz (18µm), 1 oz (35µm) rolled 1/2 oz (18µm), 1 oz (35µm) Ohmega & Ticer resistive foil Thick metal Aluminum, Copper, Brass 1/2 oz (18µm), 1 oz (35µm) rolled 1/2 oz (18µm), 1 oz (35µm) Ohmega & Ticer resistive foil Thick metal Aluminum, Copper, Brass 1/2 oz (18µm), 1 oz (35µm) rolled 1/2 oz (18µm), 1 oz (35µm) Ohmega & Ticer resistive foil Thick metal Aluminum, Copper, Brass 1/2 oz (18µm), 1 oz (35µm) rolled 1/2 oz (18µm), 1 oz (35µm) Ohmega & Ticer resistive foil Thick metal Aluminum, Copper, Brass 1/2 oz (18µm), 1 oz (35µm) rolled 1/2 oz (18µm), 1 oz (35µm) Ohmega & Ticer resistive foil Thick metal Aluminum, Copper, Brass 1/2 oz (18µm), 1 oz (35µm)rolled 1/2 oz (18µm), 1 oz (35µm) Ohmega & Ticer resistive foil Thick metal Aluminum, Copper, Brass 1/2 oz (18µm), 1 oz (35µm) rolled 1/2 oz (18µm), 1 oz (35µm) Ohmega & Ticer resistive foil Thick metal Aluminum, Copper, Brass 1/2 oz (18µm) ED, 1 oz (35µm) ED Standard Panel Sizes 24.25" X 18.25" (616mm X 464mm) 48" X 36" (1220mm X 914mm) 48.25" X 36.25" (1226mm X 921mm) 14
15 Thickness, Tolerance & Panel Size inches (mm) Laminates XtremeSpeed RO1200 RO3003 RO3035 RO3006 RO3010 *RO3206 *RO3210 *not available in 0.005"(0.127mm) and 0.010"(0.254mm) Standard Dielectric Thickness (Without The Cladding) 0.003" (0.076mm) 0.004" (0.102mm) 0.005" (0.127mm) 0.006" (0.152mm) 0.007" (0.178mm) 0.008" (0.203mm) 0.010" (0.254mm) 0.005" (0.127mm) ± " (RO3203 not available with 0.005" (0.127mm)) 0.010" (0.254mm) ± " 0.020" (0.508mm) ± 0.001" 0.030" (0.762mm) ± " 0.060" (1.524mm) ± 0.003" Additional non-standard thicknesses available between 0.005" and 0.250" 0.005" (0.127mm) ± " 0.010" (0.254mm) ± " 0.025" (0.635mm) ± 0.001" 0.050" (1.270mm) ± 0.002" Additional non-standard thicknesses available between 0.005" and 0.250" RO4725JXR " (0.780mm) ± 0.002" " (1.542mm) ± 0.004" RO4730JXR / RO4730G " (0.529mm) ± 0.001" " (0.780mm) ± 0.002" " (1.034mm) ± 0.003" " (1.542mm) ± 0.004" RO " (0.762mm) ± 0.002" 0.040" (1.016mm) ± 0.003" 0.060" (1.524mm) ± 0.004" *RO4003C RO4360G " (0.780mm) ± 0.002" " (1.034mm) ± 0.003" " (1.542mm) ± 0.004" 0.008" (0.203mm) ± 0.001" 0.012" (0.305mm) ± 0.001" 0.016" (0.406mm) ± " 0.020" (0.508mm) ± " 0.032" (0.813mm) ± 0.002" 0.060" (1.524mm) ± 0.004" *Non-standard thicknesses available in 4 mil increments starting from a 20 mil base RO4350B / RO " (0.101mm) ± " (RO " available with LoPro foil only) " (0.168mm) ± " 0.010" (0.254mm) ± 0.001" " (0.338mm) ± " " (0.422mm) ± " 0.020" (0.508mm) ± " 0.030" (0.762mm) ± 0.002" 0.060" (1.524mm) ± 0.004" *Non-standard thicknesses available in 3.3 mil increments starting from a 20 mil base RO " (0.127mm) " (0.239mm) RO " (0.813mm) ± 0.002" 0.040" (1.016mm) ± 0.003" 0.060" (1.524mm) ± 0.004" " (0.831mm) ± 0.002" " (1.034mm) ± 0.003" " (1.542mm) ± 0.004" Available Claddings 1/2 oz (18µm), 1 oz (35µm) RA 2 oz (70µm) ED & Reverse Treat ¼ oz (9µm) ED, 1/2 oz (18µm) ED, 1 oz (35µm) ED, 2 oz (70µm) ED 1/2 oz (18µm), 1 oz (35µm), 2 oz (70µm) Rolled Cu * Additional charges may apply for Rolled Cu 1/2 oz (18µm) and 1 oz (35µm) Ohmega Resistive Foil 1/2 oz (18µm) ED, 1 oz (35µm) ED 1/2 oz (18µm), 1 oz (35µm) LoPro reverse treated ED foil 1/2 oz (18µm), 1 oz (35µm) Ohmega Resistive Foil 1/2 oz (18µm), 1 oz (35µm) LoPro reverse treated ED foil 1/2 oz (18µm), 1 oz (35µm) LoPro reverse treated ED foil 1/2 oz (18µm) ED, 1 oz (35µm) ED 1/2 oz (18µm), 1 oz (35µm) LoPro reverse treated ED foil 1/2 oz (18µm) ED, 1 oz (35µm) ED, 2 oz (70µm) ED 1/2 oz (18µm), 1 oz (35µm) LoPro reverse treated ED foil LoPro foil will add.0007" (0.0177mm) to the board thickness LoPro foil not available with RO4360G2 laminate 1/2 oz Ticer Resistive Foil available 1/2 oz (18µm) ED, 1 oz (35µm) ED, 2 oz (70µm) ED 1/2 oz (18µm), 1 oz (35µm) LoPro reverse treated ED foil LoPro foil will add.0007" (0.0177mm) to the board thickness 1/2 oz Ticer Resistive Foil available 1/2 oz (18µm), 1 oz (35µm) LoPro reverse treated ED foil 1/2 oz (18µm) ED, 1 oz (35µm) ED 1/2 oz (18µm), 1 oz (35µm) LoPro reverse treated ED foil Standard Panel Sizes 24" X 36" (610mm X 914mm) 24" X 36" (610mm X 914mm) 48" X 36" (1220mm X 914mm) Larger sizes may be available upon request 24" X 36" (610mm X 914mm) 48" X 36" (1220mm X 914mm) Larger sizes may be available upon request 24" X 36" (610mm X 914mm) 48" X 36" (1220mm X 914mm) 48" X 36" (1220mm X 914mm) 48" X 36" (1220mm X 914mm) 48" X 36" (1220mm X 914mm) 24" X 36" (610mm X 914mm) 48" X 36" (1220mm X 914mm) Other dielectric thicknesses and panel sizes may be available. Contact customer service. 15
16 Thickness, Tolerance & Panel Size inches (mm) Laminates Standard Dielectric Thickness (Without The Cladding) RO " (0.762mm) ± 0.002" 0.040" (1.016mm) ± 0.003" 0.060" (1.524mm) ± 0.004" " (0.780mm) ± 0.002" " (1.034mm) ± 0.003" " (1.542mm) ± 0.004" RT/duroid 5880LZ 0.010" (0.254mm) ± " 0.020" (0.508mm) ± " 0.025" (0.635mm) ± " 0.030" (0.762mm) ± " 0.040" (1.016mm) ± " 0.050" (1.270mm) ± " 0.100" (2.540mm) ± " 0.170" (4.318 mm) ± " Non-standard and custom thicknesses available. Please check with Rogers' Representative to confirm availability. RT/duroid 5870 RT/duroid " (0.127mm) ± " 0.010" (0.254mm) ± " 0.015" (0.381mm) ± " 0.020" (0.508mm) ± " 0.031" (0.787mm) ± " 0.062" (1.575mm) ± " 0.125" (3.175mm) ± " Non-standard and custom thicknesses available. Please check with Rogers' Representative to confirm availability. RT/duroid " (0.127mm) ± " 0.010" (0.254mm) ± " 0.020" (0.508mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " 0.120" (3.048mm) ± " Non-standard and custom thicknesses available. Please check with Rogers' Representative to confirm availability. RT/duroid " (0.127mm) ± " 0.010" (0.254mm) ± " 0.015" (0.381mm) ± " 0.020" (0.508mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " RT/duroid 6202PR 0.005" (0.127mm) ± " 0.010" (0.254mm) ± " 0.015" (0.381mm) ± " 0.020" (0.508mm) ± " RT/duroid 6035HTC 0.010" (0.254mm) ± " 0.020" (0.508mm) ± 0.001" 0.030" (0.762mm) ± " 0.060" (1.524mm) ± 0.003" RT/duroid LM RT/duroid " (0.254mm) ± " 0.025" (0.635mm) ± " 0.050" (1.270mm) ± " 0.075" (1.905mm) ± " 0.100" (2.540mm) ± " Non-standard and custom thicknesses available. Please check with Rogers' Representative to confirm availability. TC " (0.254mm) ± " (0.508mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " TC " (0.254mm) ± " (0.508mm) ± " 0.030" (0.762mm) ± " 0.060" (1.524mm) ± " Available Claddings Other dielectric thicknesses and panel sizes may be available. Contact customer service. * Please check with Rogers' representative to confirm availability. 1/2 oz (18µm) ED, 1 oz (35µm) ED 1/2 oz (18µm), 1 oz (35µm) LoPro reverse treated ED foil 1/2 oz (18µm) ED, 1 oz (35µm) ED ¼ oz (9µm)*, 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* ED 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* Rolled Copper 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* Reverse Treated 1/2 (18µm), 1 oz (35µm) Ohmega resistive foil Aluminum, Copper, Brass thick metal claddings may be available based on dielectric thickness* ¼ oz (9µm)*, 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* ED 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* Rolled Copper 1/2 (18µm), 1 oz (35µm) Ohmega resistive foil 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* Reverse Treated Aluminum, Copper, Brass thick metal claddings may be available based on dielectric thickness* ¼ oz (9µm)*, 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* ED 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* Rolled Copper 1/2 (18µm), 1 oz (35µm) Ohmega resistive foil 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* Reverse Treated ¼ oz (9µm)*, 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* ED 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* Reverse Treated 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* Rolled Copper 1/2 (18µm), 1 oz (35µm) Ohmega-ply resistive foil 1/2 (18µm), 1 oz (35µm), 2 oz (70µm) ED 1/2 (18µm), 1 oz (35µm) Reverse Treated ¼ oz (9µm)*, 1/2 (18µm), 1 oz (35µm), 2* ED 1/2 (18µm), 1 oz (35µm), 2 oz (70µm)* Reverse Treated 1/2 (18µm), 1 oz (35µm) Ohmega resistive foil Aluminum, Copper, Brass thick metal claddings may be available based on dielectric thickness* 1/2 (18µm), 1 oz (35µm), 2 oz (70µm) ED 1/2 (18µm), 1 oz (35µm), 2 oz (70µm) RT 1/2 (18µm), 1 oz (35µm), 2 oz (70µm) ED 1/2 (18µm), 1 oz (35µm), 2 oz (70µm) RT Standard Panel Sizes 24" X 36" (610mm X 914mm) 48" X 36" (1220mm X 914mm) Non-Standard size available up to 24" X 54" (610mm X 1372mm) Non-Standard size available up to 18" X 48" (457mm X 1219mm) Non-Standard size available up to 24" X 54" (610mm X 1372mm) Non-Standard size available up to 24" X 54" (610mm X 1372mm) Non-Standard size available up to 24" X 54" (610mm X 1372mm) 10" X 10" (254mm X 254mm) 10" X 20" (254mm X 508mm) Available in 0.025" Dielectric Thickness Increments Only 18" X 24" (457 X 610mm) - Non-Standard not available in 0.010" (0.254mm) 16
17 Thickness, Tolerance & Panel Size inches (mm) Laminates TMM 3 TMM 4 TMM 6 TMM 10 TMM 10i TMM 13i XT/duroid 8000 XT/duroid 8100 Standard Dielectric Thickness (Without The Cladding) 0.015" (0.381mm) ± " 0.020" (0.508mm) ± " 0.025" (0.635mm) ± " 0.030" (0.762mm) ± " 0.050" (1.270mm) ± " 0.060" (1.524mm) ± " 0.075" (1.905mm) ± " 0.100" (2.540mm) ± " 0.125" (3.175mm) ± " 0.150" (3.810mm) ± " 0.200" (5.080mm) ± " 0.250" (6.350mm) ± " 0.275" (6.985mm) ± " 0.300" (7.620mm) ± " 0.500" (12.70mm) ± " Non-standard and custom thicknesses available. Please check with Rogers' Representative to confirm availability " (0.051mm) ± 12.5% 0.002" (0.051mm) ± 12.5% 0.004" (0.102mm) ± 12.5% Available Claddings 1/2 (18µm), 1 oz (35µm), 2 oz (70µm) ED Aluminum, Copper, Brass thick metal claddings may be available based on dielectric thickness* 1/2 (18µm) very low profile Reverse Treated ED foil Standard Panel Sizes Other dielectric thicknesses and panel sizes may be available. Contact customer service. Thickness, Tolerance & Panel Size inches (mm) Bonding Materials 2929 Thermoset Bondply 92ML Prepreg Ceramic Filled Thermoset Prepreg CLTE-P Thermoplastic COOLSPAN TECA Thermoset Thermally & Electrically Conductive Adhesive (TECA) Film CuClad 6250 Thermoplastic Bonding Film CuClad 6700 Thermoplastic Bonding Film RO3003, RO3006, RO3010 Bondply Thermoplastic - Ceramic PTFE Bondply RO4450B Thermoset - Hydrocarbon / Ceramic / Woven Glass / Prepreg RO4450F Thermoset - Hydrocarbon / Ceramic / Woven Glass / Prepreg RO4460G2 Thermoset - Hydrocarbon / Ceramic / Woven Glass / Prepreg Standard Dielectric Thickness (Without The Cladding) " (0.038mm) " (0.051mm) " (0.076mm) % " (0.081mm) % " (0.107mm) % " (0.152mm) Available Claddings N/A N/A Standard Panel Sizes " (0.061mm) N/A 0.002" (0.051mm) ± " 0.004" (0.102mm) ± " N/A 10" X 12" (254mm X 305mm) " (0.038mm) N/A 24" X 30' Roll (610mm X 9.144m) " (0.038mm) " (0.076mm) N/A 24" X 30' Roll (610mm X 9.144m).005" (0.127mm) N/A 25.5" X 18" (648mm X 457mm).0036" (0.091mm).004" (0.102mm) N/A.004" (0.102mm) N/A 48" X 36" (1220mm X 914mm) " (0.0121mm) N/A RT/duroid 6002 Thermoplastic - Ceramic PTFE Bondply " (0.064mm) N/A Other dielectric thicknesses and panel sizes may be available. Contact customer service. 17
18 Ordering Materials From Rogers Advanced Connectivity Solutions: Rogers Corporation has global customer service locations to assist with the order process. Please see the back of the guide to determine which office in the Americas, Europe or Asia is most convenient for you. The following represents a typical process for determining a material to purchase and placing an order: 1 Step 1 Determining the ACS Material Grade to Use Rogers Advanced Connectivity Solutions provides a wide range of specialty material types (PTFE, hydrocarbon ceramic, LCP, etc.) to offer unique combinations of electrical, thermal and mechanical properties. Performance requirements usually determine which ACS Grade best suits the application. For example, if requirements point to material with the lowest dissipation factor (tan d) combined with a high dielectric constant, that may lead to one of our PTFE offerings. In another example mechanical strength may be required, pointing to a thermoset product, such as RO4000 laminate. Common examples of ACS product grades include: RT/duroid 5880, CLTE-XT, RO4350B, RO3003, AD300C, and TMM. It is is critical to pick the correct material grade when you order. Our technical experts are happy to assist you in making that determination. 2Step 2 Choosing Thickness and Thickness Tolerance Following IPC guidelines, laminate thickness is specified as dielectric thickness and does not include thickness of copper foil or other metal claddings. In most cases, thickness tolerance is defined by product grade and thickness. However, custom tolerances are considered upon request for certain high reliability products (RT/duroid and CLTE Series laminates are examples). Step 3 Selecting Cladding Type Rogers offers cladding options which include ¼, ½, 1, & 2 oz. electrodeposited copper foil; ½, 1, & 2 oz. reverse treated copper foil; and ½, 1, & 2 oz. rolled copper foil. Not all laminate systems are available with all copper foil claddings. For example, TMM and RO4000 series laminates are not supplied with ¼ oz. electrodeposited foil or rolled copper foil. Thick metal claddings such as aluminum, copper and brass are available on Rogers RT/duroid, CLTE, DiClad, CuClad and IsoClad laminates and may be based on dielectric thickness. Thick aluminum, copper, and brass claddings are also available in a range of thicknesses and thickness tolerances. Thick aluminum and brass claddings are available on most TMM laminates. Please note, thick metal cladding is not available on RO4000 laminates. Some material grades may be supplied unclad. Call Rogers Customer Service Representatives to discuss options. Step 4 Picking your Panel Size* Finally, you need to select the panel size dimensions you desire. For example, a very common panel size in the printed circuit board industry is 24 (610mm) x 18 (457mm). Please note, different product grades may have different standard panel sizes due to unique manufacturing processes. Special charges typically apply for nonstandard panel sizes. Please see pages for a list of standard panel sizes and thicknesses by product grade. * Various terminology is used in the industry to represent panel dimensions. Rogers panel dimensions are always listed as: Cross machine(y) x Machine direction(x). Special charges may apply for customers requesting non-standard thicknesses or tolerances. Please see pages for a list of standard panel sizes and thicknesses by product grade. 18
19 Specification Requirements and Terms and Conditions of Sale Rogers material specifications are applicable unless otherwise agreed upon prior to order. Certificates of conformance are available for purchased goods. All other requirements must be discussed at the time the order is placed. If special testing or data generation is required, additional costs may be incurred. For Rogers Terms and Conditions of Sale, please go to: About Advanced Connectivity Solutions Advanced Connectivity Solutions manufactures high frequency laminates and prepregs for applications in wireless base station, aerospace and defense, automotive, high-speed digital and advanced chip packaging industries. All of our products are manufactured in ISO-9001:2008 certified facilities. Rogers high frequency laminates can be purchased by contacting a Rogers' Customer Service Representative. Refer to back cover for contact information. IPC Slash Sheet Definitions Legacy 4103/ 4103A/ RO4003C RO4350B RO RO4360G2 NA 270 RO RO RO RO4725JXR NA 220 RO4730JXR NA 230 RO4450B RO4450F RO4450T NA 540 RO4460G2 NA 570 RO4835T NA
20 Interpreting Rogers Part Descriptions: Copper Weight 1/4 oz 1/2 oz 1 oz 2 oz x 12 H2/H2 R DI OV Grade Panel Size Metal Cladding Revision Number (When Applicable) ROGERS Copper Foil Designation Rogers Clad Designation HQ CQ Foil Grade (1.2.4) Standard Electrodeposited (STD-E) Foil Thickness (1.2.5) Q (9 µm) Dielectric Thickness & Tolerance IPC-4562A Dielectric Thickness (When Applicable) Bond Enhancement Treatment (1.2.6) Single-sided treatment (S) May See OV Which Stands For Overall Thickness (When Applicable) Foil Profile (1.2.7) Low (L) Very low (V) 5E 5ED Standard (S) 5E S High Temperature 5ED Elongation HH Electrodeposited 5TC (HTE-E) Reverse-treated (R) LoPro SH R L AH As Rolled Wrought 5R (AR-W) 5RD H (1/2 oz, 18 µm) S V 25RFO(1)(2)-5E(D) S-25 OPS Ohmega 50RFO(1)(2)-5E(D) S-50 OPS Ohmega 100RFO(1)(2)-5E(D) S-100 OPS Ohmega HTE-E 25RFT(3)(4)-5E(D) S-25 OPS Ticer S 50RFT(3)(4)-5E(D) S-50 OPS Ticer 100RFT(3)(4)-5E(D) S-100 OPS Ticer 1E 1ED S 1E S 1ED HTE-E H1 L 1TC R-LoPro S1 R A1 1R AR-W 1 (1 oz, 35 µm) S V 1RD 25RFO(1)(2)-1E(D) S-25 OPS Ohmega 50RFO(1)(2)-1E(D) S-50 OPS Ohmega 100RFO(1)(2)-1E(D) S-100 OPS Ohmega HTE-E 25RFT(3)(4)-1E(D) S-25 OPS Ticer S 50RFT(3)(4)-1E(D) S-50 OPS Ticer 100RFT(3)(4)-1E(D) S-100 OPS Ticer 2E 2ED S S HTE-E H2 S2 2 (2 oz, 70 µm) R L A2 2R AR-W S V 2RD 20
21 Electrical Characterization Capabilities Multiple Test Methods Used: Clamped Stripline Resonator Split Post Dielectric Resonator Full Sheet Resonance Ring Resonators Waveguide Perturbation Very wideband insertion loss & phase measurements PIM Testing Capabilities 21
22 Primary Markets 22 KEY: = Recommended Material AUTOMOTIVE Active Safety Telematics/Infotainment Thermal Management 2929 Bondply 92ML 92ML StaCool AD250C AD255C AD260A AD300C AD300D AD320A AD350A AD430 AD410 AD450 AD600 CLTE-XT CLTE CLTE-AT CLTE-P CLTE-MW CuClad 217 CuClad 233 CuClad 250 CuClad 6250 Bonding Film CuClad 6700 Bonding Film COOLSPAN DiClad 880 DiClad 870 DiClad 527 IM Series IsoClad 917 IsoClad 933 Kappa 438 XtremeSpeed RO1200 RO3003 RO3035 RO3006 RO3206 RO3010 RO3210 RO4725JXR RO4730JXR RO4730G3 RO4533 RO4003C RO4534 RO4350B RO4450F RO4450T RO4460G2 RO4835 RO4835T RO4535 RO4360G2 RO4830 RT/duroid 5880LZ RT/duroid 5880 RT/duroid 5870 RT/duroid 6002 RT/duroid 6202PR RT/duroid 6202 RT/duroid 6006 RT/duroid 6035HTC RT/duroid LM TC350 TC600 TMM 3 TMM 4 TMM 6 TMM 10 TMM 10i TMM 13i XT/duroid 8000 XT/duroid 8100
23 KEY: = Recommended Material CONNECTED DEVICES Internet of Things (IoT) Mobile Internet Devices Thermal Management 2929 Bondply 92ML 92ML StaCool AD250C AD255C AD260A AD300C AD300D AD320A AD350A AD430 AD410 AD450 AD600 CLTE-XT CLTE CLTE-AT CLTE-P CLTE-MW CuClad 217 CuClad 233 CuClad 250 CuClad 6250 Bonding Film CuClad 6700 Bonding Film COOLSPAN DiClad 880 DiClad 870 DiClad 527 IM Series IsoClad 917 IsoClad 933 Kappa 438 XtremeSpeed RO1200 RO3003 RO3035 RO3006 RO3206 RO3010 RO3210 RO4725JXR RO4730JXR RO4730G3 RO4533 RO4003C RO4534 RO4350B RO4450F RO4450T RO4460G2 RO4835 RO4835T RO4535 RO4360G2 RO4830 RT/duroid 5880LZ RT/duroid 5880 RT/duroid 5870 RT/duroid 6002 RT/duroid 6202PR RT/duroid 6202 RT/duroid 6006 RT/duroid 6035HTC RT/duroid LM TC350 TC600 TMM 3 TMM 4 TMM 6 TMM 10 TMM 10i TMM 13i XT/duroid 8000 XT/duroid
24 Primary Markets 24 KEY: = Recommended Material HIGH RELIABILITY Antenna Systems Communications Systems Radar Systems Space Based Systems 2929 Bondply 92ML 92ML StaCool AD250C AD255C AD260A AD300C AD300D AD320A AD350A AD430 AD410 AD450 AD600 CLTE-XT CLTE CLTE-AT CLTE-P CLTE-MW CuClad 217 CuClad 233 CuClad 250 CuClad 6250 Bonding Film CuClad 6700 Bonding Film COOLSPAN DiClad 880 DiClad 870 DiClad 527 IM Series IsoClad 917 IsoClad 933 Kappa 438 XtremeSpeed RO1200 RO3003 RO3035 RO3006 RO3206 RO3010 RO3210 RO4725JXR RO4730JXR RO4730G3 RO4533 RO4003C RO4534 RO4350B RO4450F RO4450T RO4460G2 RO4835 RO4835T RO4535 RO4360G2 RO4830 RT/duroid 5880LZ RT/duroid 5880 RT/duroid 5870 RT/duroid 6002 RT/duroid 6202PR RT/duroid 6202 RT/duroid 6006 RT/duroid 6035HTC RT/duroid LM TC350 TC600 TMM 3 TMM 4 TMM 6 TMM 10 TMM 10i TMM 13i XT/duroid 8000 XT/duroid 8100
25 KEY: = Recommended Material WIRED INFRASTRUCTURE Computing IP Infrastructure Test & Measurement 2929 Bondply 92ML 92ML StaCool AD250C AD255C AD260A AD300C AD300D AD320A AD350A AD430 AD410 AD450 AD600 CLTE-XT CLTE CLTE-AT CLTE-P CLTE-MW CuClad 217 CuClad 233 CuClad 250 CuClad 6250 Bonding Film CuClad 6700 Bonding Film COOLSPAN DiClad 880 DiClad 870 DiClad 527 IM Series IsoClad 917 IsoClad 933 Kappa 438 XtremeSpeed RO1200 RO3003 RO3035 RO3006 RO3206 RO3010 RO3210 RO4725JXR RO4730JXR RO4730G3 RO4533 RO4003C RO4534 RO4350B RO4450F RO4450T RO4460G2 RO4835 RO4835T RO4535 RO4360G2 RO4830 RT/duroid 5880LZ RT/duroid 5880 RT/duroid 5870 RT/duroid 6002 RT/duroid 6202PR RT/duroid 6202 RT/duroid 6006 RT/duroid 6035HTC RT/duroid LM TC350 TC600 TMM 3 TMM 4 TMM 6 TMM 10 TMM 10i TMM 13i XT/duroid 8000 XT/duroid
26 Primary Markets 26 KEY: = Recommended Material WIRELESS INFRASTRUCTURE Antennas Backhaul Radios Power Amplifiers Small Cells/DAS 2929 Bondply 92ML 92ML StaCool AD250C AD255C AD260A AD300C AD300D AD320A AD350A AD430 AD410 AD450 AD600 CLTE-XT CLTE CLTE-AT CLTE-P CLTE-MW CuClad 217 CuClad 233 CuClad 250 CuClad 6250 Bonding Film CuClad 6700 Bonding Film COOLSPAN DiClad 880 DiClad 870 DiClad 527 IM Series IsoClad 917 IsoClad 933 Kappa 438 XtremeSpeed RO1200 RO3003 RO3035 RO3006 RO3206 RO3010 RO3210 RO4725JXR RO4730JXR RO4730G3 RO4533 RO4003C RO4534 RO4350B RO4450F RO4450T RO4460G2 RO4835 RO4835T RO4535 RO4360G2 RO4830 RT/duroid 5880LZ RT/duroid 5880 RT/duroid 5870 RT/duroid 6002 RT/duroid 6202PR RT/duroid 6202 RT/duroid 6006 RT/duroid 6035HTC RT/duroid LM TC350 TC600 TMM 3 TMM 4 TMM 6 TMM 10 TMM 10i TMM 13i XT/duroid 8000 XT/duroid 8100
27 Notes 27
28 Join Our Technology Support Hub Today & Access Online Tools: Calculators Video Library Literature Material Sample Requests Technical Papers Ask an Engineer... Much More! As part of our ROGERS Cares initiative, we aim to show you how Rogers is making a difference in our world. Here at Rogers, we are powering, protecting, and connecting our world. This is how. Environmental Protection: We are committed to compliance with regulations. We are consistently looking for ways to make the work we do safer and better for the environment. Employee Safety: Workplace safety and employee health is a priority. ion is shut down immediately if something is unsafe. The priority always is for employees to go home in the same condition they arrived to work. Contact Information: The Americas: Rogers Advanced Connectivity Solutions Tel: Fax: Europe/Africa: Rogers BVBA Tel: Fax: Asia: Rogers Suzhou Tel: Fax: Social Consciousness & Community Participation: We know that a company can have an impact not only on the environment, but in the community in which it operates as well. Being a socially responsible company is important, and our collaborative culture encourages employee involvement. Being involved in the community is an integral part of life at Rogers. There are numerous ways employees can get involved. The information contained in this product selector guide is intended to assist you in designing with Rogers circuit materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular purpose. The user should determine the suitability of Rogers circuit materials for each application. These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited. 92ML StaCool, ML Series, CuClad, DiClad, DiClad 880-IM, IsoClad, AD250, AD250C, AD255, AD255-IM, AD255C, AD260, AD260A, AD300, AD300C, AD300D-IM, AD320, AD350, AD350A, AD410, AD430, AD450, AD600, AD1000, AD Series, CLTE, CLTE-AT, CLTE-MW, CLTE-P, CLTE-XT, CLTE Series, COOLSPAN, Kappa, XtremeSpeed RO1200, RO3000, RO3003, RO3006, RO3010, RO3035, RO3203, RO3206, RO3210, RO4000, RO4003C, RO4350B, RO4360G2, RO4450B, RO4450F, RO4460G2, RO4533, RO4534, RO4535, RO4725JXR, RO4730JXR, RO4730G3, RO4830, RO4835, RO4835T, RT/duroid, TC350, TC600, TC Series, TMM, XT/duroid, the Rogers logo and Helping power, protect, connect our world. are trademarks of Rogers Corporation or one of its subsidiaries All Rights Reserved. Printed in USA. Revised 05/ Publication #
PRODUCT SELECTOR GUIDE
PRODUCT SELECTOR GUIDE 1 Rogers Corporation was founded in 1832 and has over 60 years of experience as a global supplier of high performance RF materials. Rogers Corporation s Advanced Connectivity Solutions
More informationCopper Foils for High Frequency Materials
Properties Copper Foils for High Frequency Materials Copper foils, for the wide range of Rogers high frequency circuit substrates, are designed to provide optimum performance in high reliability applications.
More informationMICROWAVE & RF MATERIALS GUIDE
MICROWAVE & RF MATERIALS GUIDE RF & Microwave Materials Guide Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon
More informationMicrowave & RF Materials Guide
Microwave & RF Materials Guide Advanced Materia l s f or the Designs of Tomorrow RF & Microwave Materials Guide Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic
More informationNiP Resistor Manufacturing Overview
0 NiP Resistor Manufacturing Overview Thin film NiP resistive alloy material is made by electrodepositing of the NiP alloy onto copper foil (RESISTOR-CONDUCTOR MATERIAL) which is then laminated to a dielectric
More informationArlon. Our Suppliers. 4B Delta Drive Tewkesbury Gloucestershire GL20 8HB United Kingdom
4B Delta Drive Tewkesbury Gloucestershire GL20 8HB United Kingdom T +44 (0)1684 299930 F +44 (0)1684 290551 enquiries@trackwise.co.uk www.trackwise.co.uk RF and Microwave Substrates Directory Please note
More informationThermal image of 0603 capacitor at the center of a microstrip (47pF/250V/C0G) assembled on RF-35TC under 200 watts applied power.
offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10 th of a db is critical and the PWB substrate is
More informationALTIUMLIVE 2018: NAVIGATING THE COMPLEXITIES OF PCB MATERIAL SELECTION
ALTIUMLIVE 2018: NAVIGATING THE COMPLEXITIES OF PCB MATERIAL SELECTION Chris Hunrath Insulectro, VP of Technology San Diego October 4 Outline 1 PCB Material Overview 2 What is the Dielectric Constant of
More informationRO4000 Series High Frequency Circuit Materials
Advanced Circuit Materials Division 100 S. Roosevelt Avenue Chandler, AZ 85226 Tel: 480-961-1382, Fax: 480-961-4533 www.rogerscorporation.com Advanced Circuit Materials Data Sheet RO4000 Series High Frequency
More informationB-IS620i/3. IS620i. Base material. for high-frequency. applications CAF. Enhanced
J B-/3 Base material for high-frequency applications CAF Enhanced Low loss base material with a stable dielectric behaviour over frequency is a base material for high frequency applications, especially
More informationRO4000 Series High Frequency Circuit Materials
Advanced Circuit Materials Division 100 S. Roosevelt Avenue Chandler, AZ 85226 Tel: 480-961-1382, Fax: 480-961-4533 www.rogerscorporation.com Advanced Circuit Materials Data Sheet RO4000 Series High Frequency
More informationNP-180R NAN YA PLASTICS CORPORATION ELECTRONIC MATERIALS DIVISION. COPPER CLAD LAMINATE DEPARTMENT NO TUNG HWA N. ROAD, TAIPEI, TAIWAN.
New: 2014/04/30 flame retardant copper clad laminate NP-180R High Tg 175 (DSC) Excellent dimensional stability through-hole reliability Excellent electrical, chemical and heat resistance properties IPC-4101C
More informationHow to select PCB materials for highfrequency
How to select PCB materials for highfrequency apps Find out how to simplify that choice when striving for the best tradeoff between ease of fabrication and best electrical performance. By John Coonrod
More informationPRELIMINARY. RO4533, RO4534, AND RO4535 Laminates. Preliminary Data Sheet Antenna Grade Laminates
Advanced Circuit Materials Rogers Antenna Grade Materials RO4500 Series Cost Performance Antenna Grade Laminates A new line of cost/performance materials from Rogers Corporation. These laminates are specifi
More informationLow CTE / High Tg FR-4 with High Heat Resistance
Low CTE / High Tg FR-4 with High Heat Resistance Laminate: EM-827 Prepreg: EM-827B 1 Features Tg(DSC) > 170 Z direction CTE < 3.0% (50~260 ) High thermal degradation temperature: Td > 340 Excellent thermal
More informationDevice Attachment Methods and Wirebonding Notes for RT/duroid and RO4000 Series High Frequency Laminates
Device Attachment Methods and Wirebonding Notes for RT/duroid and RO4000 Series High Frequency Laminates Volume production of microwave circuit assemblies requires fast, reliable and efficient methods
More informationHigh Frequency Circuit Materials Attributes John Coonrod, Rogers Corporation
High Frequency Circuit Materials Attributes John Coonrod, Rogers Corporation Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There
More informationB-IS400 IS420/3 IS400 IS420 PCL370HR. Temperature resistant mid and high T g - base materials with low z-axis expansion CAF ENHANCED
J B-IS4 IS42/3 IS4 IS42 PCL37HR Temperature resistant mid and high T g - base materials with low z-axis expansion CAF ENHANCED Temperature-resistant base materials with low z-axis expansion IS4, IS42 and
More informationTEST REPORT (Self-Tested Data)
TEST REPORT (Self-Tested Data) CLIENT: IPC Validation Services 3000 Lakeside Drive Suite 105N Bannockburn, IL 60015 USA Attention: Mr. Randy Cherry +1-847-597-5606 TEST ITEMS: Peel Strength, Volume Resistivity,
More informationRO4835T Core/RO4450T Bonding Layers Multi-Layer Board Processing Guidelines
Fabrication Technical Articles Notes RO4835T Core/RO4450T Bonding Layers Multi-Layer Board Processing Guidelines These guidelines were developed to provide fabricators basic information on processing core
More informationc/bach, 2-B Pol. Ind Foinvasa Montcada i Reixac (Barcelona) SPAIN Tel FAX
1- What is 2- How does it work? 3- How do we make it? 4- Applications 5- Processing? WHAT IS? Thick aluminium based substrate, cladded in ED copper foil. Designed for an effective thermal dissipation and
More informationSpecification for Base Materials for Rigid and Multilayer Printed Boards
ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Specification for Base Materials for Rigid and Multilayer Printed Boards Developed by the Laminate/Prepreg Materials Subcommittee (3-11) of the Printed Board
More informationInnovative PCB Solutions. Win time and flexibility benefit from Swiss quality. THE PCB CHALLENGE Doing it together
Innovative PCB Solutions Win time and flexibility benefit from Swiss quality THE PCB CHALLENGE Doing it together INDIVIDUAL CUSTOMER SOLUTIONS from a reliable partner 2 Optiprint offers consulting, development
More informationDURAVER -E-Cu quality 104 ML
J B-DE 104 ML DURAVER -E-Cu quality 104 ML Base materials for multilayers 2 Quality and security to give you the edge The demands imposed with regard to the performance of circuit boards are rising constantly,
More informationDuPont Kapton FPC POLYIMIDE FILM
DuPont FPC POLYIMIDE FILM Technical Data Sheet DuPont FPC polyimide film is treated on both sides and has the same excellent balance of physical, chemical and electrical properties over a wide temperature
More informationLiquid Crystal Polymer Substrates to Enable Advanced RF and Medical Applications
Liquid Crystal Polymer Substrates to Enable Advanced RF and Medical Applications Susan Bagen & Brian Sinclair MST Inc. Eckardt Bihler, Marc Hauer & Daniel Schulze DYCONEX AG New England 42nd Symposium
More informationTaconic Advanced Dielectric Division. Thomas McCarthy. Sean Reynolds. Jon Skelly
Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures Taconic Advanced Dielectric Division Thomas McCarthy Sean Reynolds Jon Skelly Multilayer/Stripline Design
More informationModeling Printed Circuit Boards with Sherlock 3.2
Modeling Printed Circuit Boards with Sherlock 3.2 DfR Solutions September 23, 2014 Presented by: Dr. Nathan Blattau Senior Vice President 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 301-474-0607
More informationB-DE104. DURAVER -E-Cu quality 104 quality 104 KF quality 104 TS
J B-DE104 DURAVER -E-Cu quality 104 quality 104 KF quality 104 TS Epoxy fibre glass laminate (FR-4) Circuit boards for computers, communications systems, industrial electronics and electronic devices in
More informationESPANEX L Series. Technical data sheet Nishigotanda Shinagawa Tokyo, , Japan TEL FAX
ESPANEX L Series Technical data sheet This sheet will be changed without any information in advance. The data on this sheet are solely for your reference and are not to be constructed as constituting a
More informationQuestion: Are RO4000 materials compatible with lead-free processes? Answer:
Question: Are RO4 materials compatible with lead-free processes? Answer: RO4 cores and prepregs are among the most temperature stable products available. They easily meet or exceed all expectations for
More informationN9000 PTFE Processing Guidelines
N9000 PTFE Substrates The Park/Nelco (previously known as Metclad) NY, NX, and NH families of RF and Microwave materials are woven fiberglass/ptfe composites for use as printed-circuit substrates. The
More informationCX Thin Fil s. Resistors Attenuators Thin-Film Products Thin-Film Services. ISO 9001:2008 RoHS/REACH Compliant ITAR Compliant
CX Thin Fil s Resistors Attenuators Thin-Film Products Thin-Film Services www.cxthinfilms.com ISO 9001:2008 RoHS/REACH Compliant ITAR Compliant www.cxthinfilms.com sales@cxthinfilms.com +1 (401) 461-5500
More informationDuPont Kapton HPP-ST
DuPont HPP-ST POLYIMIDE FILM Technical Data Sheet DuPont HPP-ST is a two-sided, treated film that offers the same excellent balance of physical, chemical, and electrical properties over a wide temperature
More informationLow Dielectric Constant 3.9. RoHS/WEEE compliant. SMT Board Designs using LCCC s or other low expansion chip carriers (See Figure 1)
WOVEN KEVLAR REINFORCED LAMINATE AND PREPREG is a woven Kevlar aramid fiber reinforced multifunctional epoxy laminate and prepreg system engineered to provide in-plane CTE values as low as 6 ppm/ C for
More informationDuPont. Pyralux AP-PLUS ALL-POLYIMIDE THICK COPPER-CLAD LAMINATES
DuPont Pyralux AP-PLUS ALL-POLYIMIDE THICK COPPER-CLAD LAMINATES An Expanded Family of High-Performance Laminates for Advanced Flexible and Rigid-Flex Printed Circuit Applications Product Description DuPont
More informationTrends and Developments
Trends and Developments Monique Mayr Monique.Mayr@eu.panasonic.com European R&M Group Panasonic Corporation Electronic Material Business Division Weitere Informationen finden Sie auch auf: http://www3.panasonic.biz/em/pcbm/en/index.html
More informationTaconic Advanced Dielectric Division. Thomas McCarthy. Sean Reynolds. Jon Skelly
Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures Taconic Advanced Dielectric Division Thomas McCarthy Sean Reynolds Jon Skelly Multilayer/Stripline Design
More informationPyralux LF Flexible Circuit Materials Excellent Automotive Fluids Reliability Tom R. Fisher; Product Manager Adhesiveless Products, 4/03
Pyralux LF Flexible Circuit Materials Excellent Automotive Fluids Reliability Tom R. Fisher; Product Manager Adhesiveless Products, 4/03 Evaluation Testing Thermal Cycling Peel Strength Performance Thermal
More informationNew Developments in PCB Laminates. Dean Hattula, John Coonrod Rogers Corporation Advanced Circuit Materials Division
New Developments in PCB Laminates Dean Hattula, John Coonrod Rogers Corporation Advanced Circuit Materials Division Overview PCB laminate properties Thermal stability Electrical performance Summary PCB
More informationCLAD MATERIAL ~ FINE CLAD is a solution for high density, low cost PWB.
~ CLAD MATERIAL ~ FINE CLAD is a solution for high density, low cost PWB. Principle of bonding technique Principle of bonding technique Step 1 Material A, B In vacuum Step 2 Surface activated treatment
More informationMultek s lead free compatible and compliant material selection February 01, 2006
Multek s lead free compatible and compliant material selection Helmut.Kroener@de.multek.com +49 7 463 543 February 0, 2006 Overview I. Introduction II. Project setup III. Tested materials IV. Test vehicle
More informationUL PCB Recognition what is it & why do you need to know about it
UL PCB Recognition what is it & why do you need to know about it Presented by Emma Hudson NCAB Customer Event March 2015 UL and the UL logo are trademarks of UL LLC 2015 Agenda What is UL and what are
More informationDeepen your knowledge
FLEX & RIGID-FLEX PRINTED CIRCUIT BOARDS Deepen your knowledge What are Flex & Rigid-flex Printed Circuit Boards? What are their similarities and differences? Their capabilities? And the design rules.
More information3 Adhesive Transfer Tapes with Adhesive PC
3 Adhesive Transfer Tapes with Adhesive 300 9458 9471 9471PC 9472 9653 9671 9672 9673 9674 Technical Data January, 2006 Product Description 3M Adhesive Transfer Tapes with 3M Adhesive 300 offer excellent
More informationUBE Polyimide Film Exhibits Industry Leading Heat Resistance
UBE Polyimide Film Exhibits Industry Leading Heat Resistance Super-heat resistant polyimide film produced from UBE s exclusive BPDA (Biphenyl tetracarboxylic dianhydride) monomers. This formulation is
More informationEngineered Honeycomb Solutions and Services. Honeycomb Panels
Engineered Honeycomb Solutions and Services Honeycomb Panels Plascore Honeycomb Panels Light, Strong, Tough, Cost-Effective Plascore Honeycomb Panels are a high-strength, lightweight material that provide
More informationWIRE BOND CAPACITORS, RESISTORS & INTEGRATED PASSIVE COMPONENTS FOR CHIP & WIRE ASSEMBLY
WIRE BOND CAPACITORS, RESISTORS & INTEGRATED PASSIVE COMPONENTS FOR CHIP & WIRE ASSEMBLY ABOUT AVX COMPANY INFORMATION AVX is a leading international manufacturer and supplier of a vast portfolio of advanced
More informationCOFAN USA. Meeting your Project needs.
COFAN USA Meeting your Project needs www.cofangroup.com PCB Substrate Pre-preg Category SEKISUI Laird T-Clad Denka PCB Substrate Pre-preg Category In the PCB industry, there are a couple major Pre-preg
More informationAPPLICATION NOTES COMBINING DIELECTRICS IN MULTILAYER MICROWAVE BOARDS.
TECHNOLOGY ENABLING INNOVATION APPLICATION NOTES COMBINING DIELECTRICS IN MULTILAYER MICROWAVE BOARDS by Vince Weis, Applications Engineer Arlon Materials for Electronics1100 Governor Lea Road, Bear, DE
More informationIsotape Adhesive Tapes for Electrical Insulation
Isotape Adhesive Tapes for Electrical Insulation 2 Isotape Adhesive Tapes for Electrical Insulation We Enable Energy As one of the oldest industrial companies of Switzerland, founded in 1803, we focus
More informationULTRA LOW PROFILE COPPER FOIL FOR VERY LOW LOSS MATERIAL
As originally published in the SMTA Proceedings ULTRA LOW PROFILE COPPER FOIL FOR VERY LOW LOSS MATERIAL Thomas Devahif Circuit Foil Wiltz, Luxembourg thomas.devahif@circuitfoil.com ABSTRACT Copper foil
More informationMeasuring Copper Surface Roughness for High Speed Applications
Measuring Copper Surface Roughness for High Speed Applications John A. Marshall MacDermid Inc. 245 Freight Street Waterbury CT, USA Abstract This paper examines the use of Light Interferometry and the
More informationFlexible Substrates for Smart Sensor Applications
Flexible Substrates for Smart Sensor Applications A novel approach that delivers miniaturized, hermetic, biostable and highly reliable smart sensor modules. AUTHORS Dr. Eckardt Bihler, Dr. Marc Hauer,
More informationPORON Urethanes. Material Selection Guide For Portable Electronics
PORON Urethanes Material Selection Guide For Portable Electronics PORON Urethane foams ensure reliability where cushioning, sealing, impact protection or energy management are critical to product performance.
More information3 Epoxy and Hot Melt Adhesives for Electronics. Products and Specifications
3 Epoxy and Hot Melt Adhesives for Electronics Products and Specifications 3M Epoxy and Hot Melt Adhesives have the characteristics an 3M Epoxy and Hot Melt Specifications ➀ Typical Physical Properties
More informationVT-45PP VT-47PP VT-447PP
& Prepreg General Information Ventec provides a series of and Prepregs with different glass style and resin content. These products have good bonding and thermal performance in applications of heat sink
More information2W, 2512, 4-Terminal, Low Resistance Chip Resistor (Lead / Halogen Free)
2W, 2512, 4-Terminal, Low Resistance Chip Resistor (Lead / Halogen Free) 1. Scope This specification applies to 3.2mm x 6.4mm size 2W, fixed metal foil with ceramic carrier current sensing resistors used
More information3M Electromagnetic Compatible Products
3M Electromagnetic Compatible Products Selection Guide Revision E 3 Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant
More informationPhoto. Materials Testing for Manufacturers and Retailers
Photo Materials Testing for Manufacturers and Retailers UL helps you bring safe, high performance materials to the market while protecting your brand When end-product manufacturers are searching for materials
More informationProduct-Info 3D-MID. 1. Introduction. 2. Material and manufacturing process. 1/5
Product-Info 3D-MID 1. Introduction The term 3D-MID (3D moulded interconnect devices) stands for injectionmoulded, three-dimensional circuit carriers that have been in use for many years in various fields
More informationHEAT SPREADERS. Heat Spreaders. and C-Wing
T-Wing TM and C-Wing Chomerics family of thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks aren t appropriate. T-Wing spreaders
More informationDuPont Kapton HN POLYIMIDE FILM
DuPont Kapton HN POLYIMIDE FILM Technical Data Sheet DuPont Kapton HN general-purpose film has been used successfully in applications at temperatures as low as -269 C (-452 F) and as high as 400 C (752
More informationOne-part Epoxy, General Purpose Adhesive, High Tg
Technical Data Sheet One-part Epoxy, General Purpose Adhesive, High Tg Description a is general purpose, one-part epoxy adhesive. It is smooth, thixotropic, self-leveling, and bonds well to a wide variety
More informationThunderClad 2. TU-883 HF Very Low Loss Material. Laminates & Prepregs Mass Lamination Service Insulated Metal Substrate Materials
ThunderClad 2 TU-883 HF Very Low Loss Material Laminates & Prepregs Mass Lamination Service Insulated Metal Substrate Materials TUC Product Roadmap 2 ULVP VLP HCF Ultra Low Void Prepreg Very Low Profile
More informationcuramik CERAMIC SUBSTRATES AMB technology Design Rules Version #04 (09/2015)
curamik CERAMIC SUBSTRATES AMB technology Design Rules Version #04 (09/2015) Content 1. Geometric properties 1.01. Available ceramic types / thicknesses... 03 1.02. thicknesses (standard)... 03 3. Quality
More information3M Electromagnetic Compatible Products
3M Electromagnetic Compatible Products 3Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant new problems. These solutions
More informationEPOXY POTTING & ENCAPSULATING COMPOUNDS
ONE COMPANY MANY SOLUTIONS EPOXY POTTING & ENCAPSULATING COMPOUNDS AUTOMOTIVE AEROSPACE TRANSPORT MARINE MEDICAL TELECOMMUNICATIONS CONSUMER ELECTRONICS UTILITIES ISO 9001:2008 Registered Quality System
More informationARLON Silicones Technology
ARLON Silicones Technology ARLON Silicones Technology For over 60 years, Arlon has been the industry leader in innovation for calendered and extruded silicone, creating over 6,000 products for a variety
More informationThe Optimal Passive Thermal Management Soldering and Electrically-Isolating Power Semiconductors to Within 33-micron (1.3 mil) of The Heat Sink
The Optimal Passive Thermal Management ing and Electrically-Isolating Power Semiconductors to Within 33-micron (1.3 mil) of The Heat Sink Jim Fraivillig Fraivillig Technologies 3315 Toro Canyon Road Austin,
More informationAraldite EP 300 A/B High Temperature Adhesive
Araldite EP 300 A/B High Temperature Adhesive Product Description Araldite EP 300 A/B Adhesive is an extrudable, two-component, room temperature curing epoxy adhesive designed for service temperatures
More information3 Thermally Conductive Tapes
3 Thermally Conductive Tapes Technical Data July, 21 Product Description 3M Thermally Conductive Tapes 885, 881, and 8815 are designed to provide a preferential heat-transfer path between heat-generating
More informationBuilding HDI Structures using Thin Films and Low Temperature Sintering Paste
Building HDI Structures using Thin Films and Low Temperature Sintering Paste Catherine Shearer, James Haley and Chris Hunrath Ormet Circuits Inc. - Integral Technology California, USA chunrath@integral-hdi.com
More informationEMERGING APPLICATIONS
COVER FEATURE INVITED PAPER New PCB Material Emerging for mmwave Applications Tarun Amla Isola Group, Chandler, Ariz. Requirements for stability of dielectric properties, manufacturability and suitability
More informationSilicone Material Selection Guide
Silicone Material Selection Guide MARKETS Aircraft Rail Automotive Telecommunications & Electrical Enclosures Portable Communications Exterior Lighting Medical Devices Wire, Cable & Fiberoptics Manufacturing
More informationOne-part Epoxy, Electrically Conductive Adhesive, Low Tg
Technical Data Sheet One-part Epoxy, Electrically Conductive Adhesive, Low Tg Description 9400 is an electrically conductive, silver-filled, one-part epoxy adhesive with a low cure temperature. It is smooth,
More information==========qéåüåáå~ä=ç~í~=^h^cibu h`i=eq = =
qéåüåáå~äç~í~^h^cibu h`ieq ^h^cibu h`ieqw `çéééêä~ãáå~íéëçå~éçäóáãáçéjñáäãä~åâáåö ÑçêÑäÉñáÄäÉéêáåíÉÇÅáêÅìáíë qüé^h^cibu h`ieqéêçöê~ããé AKAFLEX KCL HT is available from KREMPEL as two-layer laminates and
More informationFABRICATING HIGH CURRENT, HEAVY COPPER PCBS
Royal Circuit Solutions 21 Hamilton Ct, Hollister, CA 95023 (831) 636-7728 www.royalcircuits.com FABRICATING HIGH CURRENT, HEAVY COPPER PCBS INTRODUCTION All printed circuit boards (PCBs) carry current
More informationRadomes & Antennas. Low Dielectric Composites. Product Selection Guide
Tencate Advanced Composites Radomes & Antennas Low Composites Product Selection Guide Tencate Radomes & Antennas Radome & Antenna Composites TenCate Advanced Composites is a leading supplier of advanced
More informationStackup Planning, Part 1
by Barry Olney coulmn BEYOND DESIGN Stackup Planning, Part 1 The PCB substrate that physically supports the components, links them together via highspeed interconnects and also distributes highcurrent
More informationARALDITE 2027 A/B (XD 4712/HARDENER XD 4713)
Advanced Materials ARALDITE 2027 A/B (XD 472/HARDENER XD 473) TWO-COMPONENT POLYURETHANE ADHESIVE Description ARALDITE 2027 A/B polyurethane adhesive is a two-component, room-temperature curing, beige-colored
More informationAll-Polyimide Thermal Interface Products
All-Polyimide Thermal Interface Products SMTA Harsh Environment Electronics Workshop Dearborn, MI 6/24/03 Jim Fraivillig Fraivillig Technologies Boston, MA Why polyimide? HARSH ENVIRONMENT ELECTRONICS.
More informationinemi BFR-Free Free PCB Material Evaluation Project Chair : Stephen Tisdale Intel Corporation SMTAi Presentation August 21, 2008
inemi BFR-Free Free PCB Material Evaluation Project Chair : Stephen Tisdale Intel Corporation SMTAi Presentation August 21, 2008 0 Co-Authors Gary B. Long Intel Corporation Hillsboro, OR Gary.B.Long@Intel.com
More information3M XYZ / Isotropic Electrically Conductive Adhesive Transfer Tape 9709
Technical Data October, 2009 3M XYZ / Isotropic Electrically Conductive Adhesive Transfer Tape 9709 Product Description 3M XYZ/Isotropic Electrically Conductive Adhesive Transfer Tape 9709 is a pressure
More informationEconomical aluminum substrates make light work of visible LED circuits
Economical aluminum substrates make light work of visible LED circuits Advances in solid state light emitting diodes (LEDs) over the last several years have opened new applications for these devices. Traditionally
More informationROLINX Laminated Busbar. Design Rules Version 01 (12/2015)
ROLINX Laminated Busbar Design Rules Version 01 (12/2015) Content 1. Introduction... 03 7. Features... 13 2. Configuration...03 8. Thermal parameters... 14 3. Products... 04 9. General parameters... 14
More informationCompany Overview Markets Products- Capabilities
Company Overview Markets Products- Capabilities A Simpler way for PCB production. www.purepcb.co.uk What can Pure do for you? From 1 off Circuit upward, No MOQ/MOV High Mix Production Focus. Fast Turn
More informationDispersion Analysis of Finite Dielectric Coplanar Waveguide (FCPW) on Alumina and FR4 Substrate
Dispersion Analysis of Finite Dielectric Coplanar Waveguide (FCPW) on Alumina and FR4 Substrate Shanu Sharma #1, Alok Kumar Rastogi (FIETE) # 1, Gazala Parvin #1 #1 Institute for Excellence in Higher Education,
More informationCONTINUOUS EFFICIENCY FOR CORRUGATED BOARD PRODUCTION
CONTINUOUS EFFICIENCY FOR CORRUGATED BOARD PRODUCTION Our Specialty Tapes for All Process and Design Requirements Full-range solutions provider Our decades of experience as one of the world s leading manufacturers
More informationThermal Management of High Frequency Circuits by Blind Hole Technology
Thermal Management of High Frequency Circuits by Blind Hole Technology Dr Sundaram N Kumar American Standard Circuits, Inc. 475 Industrial Drive West Chicago, IL 60185 www.asc-i.com Email: skumar@asc-i.com
More informationPORON Urethanes. Material Selection Guide For Industrial Applications
PORON Urethanes Material Selection Guide For Industrial Applications Seal & Design Inc. 401 Casilio Pkwy Clarence, NY 14031 info@sealanddesign.com PORON Urethane foams ensure reliability where cushioning,
More information3M Thermally Conductive Adhesive Transfer Tapes
Technical Data April, 2008 M Thermally Conductive Adhesive Transfer Tapes Product Description M Thermally Conductive Adhesive Transfer Tapes 9882, 9885, and 9890 are designed to provide a preferential
More informationFine Pitch P4 Probe Cards
Fine Pitch P4 Probe Cards Photolithographic Pattern Plating Process June 1998 By Toshi Ishii, Hide Yoshida Contents What is a P4 probe card? Specification Some test results Tip cleaning RF performance
More information3 Adhesive Transfer Tapes with 300 Adhesive PC
3 Adhesive Transfer Tapes with 300 Adhesive 9458 9471 9471PC 9472 9653 9671 9672 9673 9674 Technical Data February, 2002 Product Description 3M Adhesive Transfer Tapes with 300 Adhesive offer excellent
More informationYOUR PARTNER FOR. fluoropolymer products
YOUR PARTNER FOR fluoropolymer products ScanTube has been manufacturing tubes and profiles from fluoropolymers such as PTFE, FEP, PFA, PVdF, ETFE and E-CTFE for more than 30 years. In 2015 ScanTube became
More informationManufacturing Capacity
Capability List Manufacturing Capacity QTA & Prototype Layer : 1L ~32 L Impedance Board Ball Grid Array ( BGA ) Blind/ Buried Via Micro Via ( Laser Drilling) Flex /Rigid Flexible PCB Series Orders Layer
More informationAdhesive Transfer Tapes with Adhesive EK
Adhesive Transfer Tapes with Adhesive 300 927 950 950EK 9458 9471 9472 9671 9672 9674 Technical Data December 2017 Product Description Transfer Tapes with 300 offer excellent adhesion to a wide variety
More information3M Electrically Conductive Adhesive Transfer Tape 9707
Technical Data May 2014 3M Electrically Conductive Adhesive Transfer Tape 9707 Product Description 3M Electrically Conductive Adhesive Transfer Tape (ECATT) 9707 is a pressure sensitive adhesive (PSA)
More informationThis product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies.
Technical Data Sheet Thermally Conductive Epoxy Adhesive Description 8329TCS is a thermally conductive two-part epoxy adhesive with a long working life. It is dark grey, smooth, viscous, thixotropic, and
More informationHigh Tg Bromine-free Laminates for PWB Applications
Presented at IPC Printed Circuits EXPO www.ipcprintedcircuitexpo.org High Tg Bromine-free Laminates for PWB Applications Marty Choate Isola Abstract The development of halogen free materials has been a
More information