FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Components

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1 FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Components Presentation based on Per Ohlckers' slides

2 Topics Introduce descriptions of geometrical, thermal and some electrical properties of main types of components. No description of electrical properties of monolithic circuits. Related reading: Halbo&Ohlckers Chapter 4

3 Hole Mounted Resistors Mature design, fig. 4.1: Carbon composite (a) Metal film (b) Wire wound (c)

4 Surface Mounted Resistors Fig.4.2.a: Thick film layers on ceramic substrate, rectangular shape Slide 4

5 Surface Mounted Resistors Fig. 4.2 b): Metal system for termination on SMD resistors. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 5

6 Surface Mounted Resistors Table 4.1. Properties of SMD resistors (Philips). ohm to 1 Mohm (E24* series) ± 2% Resistance range and tolerance Table 4.1: Properties of10 SMD 1 ohm to 10resistors Mohm (E24 series) ± 5% 1 ohm to 10 Mohm (E12 series) ±10% 3,2 x 1,6 x 0,6 mm Dimensions Operating temperature range -55 C to C Temperature coefficient (-40 C to 125 C) <+200 x 10-6/K Absolute max. dissipation at Tamb= 70 C 0,25 W Maximum permissible voltage 200 V (r.m.s.) Climatic category (IEC68) 55/155/56 Jumper resistance = 50 mohm Maximum current 2A *See Table 4.2 Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 6

7 Surface Mounted Resistors Table. 4.2: The resistance series E24, E12 and E6. The numbers mean that for example in series E6 there are 6 resistance values for each decade: 10, Table 15, 4.2: 22, 33, The 47 and resistance 68 x10 n ohms. series E24, 12 and 6 E E E Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 7

8 Surface Mounted Components Coding of component sizes Still very common to define sizes in fractions of inches, e.g. For example: 0603 = 0.06inch x 0.03 inch = 60mils x 30 mils = (1.6 mm 0.8 mm) mils 30 mils A word of warning: Some locations use a similar, metric system FYS4260/FYS9260 Frode Strisland 8

Hole Mounted Resistors Coding: Color Value Multiplier Tolerance (%) Black 0 0 - Brown 1 1 ±1 Red 2 2 ±2 Orange 3 3 ±0.05 Yellow 4 4 - Green 5 5 ±0.

9 Hole Mounted Resistors Coding: Color Value Multiplier Tolerance (%) Black Brown 1 1 ±1 Red 2 2 ±2 Orange 3 3 ±0.05 Yellow Green 5 5 ±0.5 Blue 6 6 ±0.25 Violet 7 7 ±0.1 Gray White Gold - -1 ±5 Silver - -2 ±10 None - - ±20 Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 9

10 Capacitors In addition the capacitance, the following properties are important: Maximum voltage rating Temperature dependence of the capacitance (temperature coefficient) Loss tangent (tan δ), see below Equivalent series resistance Long term stability and ageing phenomena High frequency properties Leakage current Ability to withstand various production processes (high temperature, etc.) Price, physical size, etc. Web: Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 10

11 Capacitors, continued Main types: Ceramic multilayer Electrolytic dry, polarized Electrolytic, wet, polarized Metallized plastic film Mica Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 11

12 Capacitors, continued Electrical model: C = (ε o ε r A) /d Z = [ R s 2 + (ωl - 1/ωC) 2 ] 1/2 C A = electrode area d= electrode distance R s = series resistance (R p neglected), L = inductance, fig. 4.5 Resonance frequency will be when: ωl = 1/ωC L R s C Rp Loss tangent: tan δ = R / Im Z = { R p + R s [1+ (ωcr p ) 2 ]} / [ ωcr p 2 - ω L (1+ (ωcr p ) 2 ] Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 12

13 Fig. 4.3: Electrical equivalent model for capacitor. If R p can be neglected the impedance is given by: Capacitors, continued Rp L R s C Z = [R s 2 + (ωl - 1/ωC) 2 ] 1/2 Fig. 4.4: The frequency dependence of impedance for multilayer ceramic capacitors (below) and tantalum electrolytic capacitors (top), all having 100 nf capacitance value. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 13

14 Capacitors, continued Fig. 4.5: Frequency dependence of the loss tangent tan δ schematically. tan δ = R / Im Z = [R p + R s ( 1+ ( ωcr p ) 2 ) ] / ( ωcr p 2 - ω L (1+ ( ωcr p ) 2 ) ] Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 14

15 Multilayer Ceramic Capacitors Capacitors, continued Fig. 4.7.a: SMD Multilayer Ceramic Capacitor Fig. 4.7.b: Metal system for the end termination of multilayer ceramic capacitors. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 15

Multilayer Ceramic Capacitor Buildup Detailed construction of a multilayer ceramic chip capacitor (MLCC). 1. Ceramic dielectric, 2. Ceramic or lacquered coating, 3. Metallized electrode, 4.

16 Multilayer Ceramic Capacitor Buildup Detailed construction of a multilayer ceramic chip capacitor (MLCC). 1. Ceramic dielectric, 2. Ceramic or lacquered coating, 3. Metallized electrode, 4. Connecting terminals "MLCC-Structure-Details" by Elcap, Jens Both, SVG-Version: Hk kng - based on de:bild:mlcc-aufbau-detailliert.png. Licensed under CC BY-SA 3.0 via Wikimedia Commons - FYS4260/FYS9260 Frode Strisland 16

17 Multilayer Ceramic Capacitor, continued Class 1: Low capacitance, good electrical properties, types NP0, N220, N750, COG, etc. Class 2: High capacitance, poorer electrical behaviour, types X7R, Z5U Fig. 4.8: Relative dielectric constant for ferroelectric ceramic compositions (class 2), as a function of temperature, near the Curie point Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 17

18 Multilayer Ceramic Capacitors, continued Fig. 4.9: Properties of dielectrics of the types NP0, X7R and Z5U in SMD ceramic multilayer capacitors. Top: The voltage dependence of capacitance. Middle: Loss tangent as function of temperature. Bottom: The temperature coefficient of the capacitance (Philips). Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 18

19 Take home message: A capacitor is not always the capacitor you think it is: Check ratings and intended usage before selecting component. FYS4260/FYS9260 Frode Strisland 19

20 Multilayer Ceramic Capacitors, continued Fig. 4.10: Crack formation because of thermal stress in ceramic capacitors Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 20

Tantalum dry electrolytic capacitor A tantalum electrolytic capacitor is an electrolytic capacitor, a passive component of electronic circuits.

The tantalum capacitor distinguishes itself from other capacitors in having high capacitance per volume and weight.

capacitors are even better in these regards.

21 Tantalum dry electrolytic capacitor A tantalum electrolytic capacitor is an electrolytic capacitor, a passive component of electronic circuits. It consists of a pellet of tantalum metal as anode, covered by an insulating oxide layer that forms the dielectric, surrounded by liquid or solid electrolyte as a cathode. The tantalum capacitor distinguishes itself from other capacitors in having high capacitance per volume and weight. Tantalum capacitors have lower equivalent series resistance (ESR), lower leakage, and higher operating temperature than other electrolytic capacitors, although other types of capacitors are even better in these regards. Tantalum capacitors are more expensive than other commonly used type of capacitor, so they are used only in applications where the small size or better performance are important. "Tantalum-SMD-Chip-Molded" by Elcap - Own work. Licensed under CC0 via Wikimedia Commons - Molded.jpg#mediaviewer/File:Tantalum-SMD-Chip-Molded.jpg FYS4260/FYS9260 Frode Strisland 21

22 Capacitors, continued Tantalum, Dry Electrolytic Very high capacitance, low voltages, low leakage current Fig a): Tantalum SMD electrolytic capacitor (Philips), and hole mounted tantalum capacitors (Siemens) Tantalum oxide is Ta2O5. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 22

23 Capacitors, continued Electrolytic Capacitors why they are polarised: The capacitance is the oxidised surface of the anode Reversed polarity will remove the oxide by reduction reaction at the anode and loss of dielectric isolation leading to short-circuiting Fig a): Tantalum SMD electrolytic capacitor (Philips), and hole mounted tantalum capacitors (Siemens) Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 23

24 Tantalum, Dry Electrolytic Capacitors, continued Dissipation factors vary with temperature: Maximum values which are not exceeded by any capacitor are as follows. Temperature -55 C 25 C 85 C 125 C Rated Voltage 4 to 10 V d.c. 10% 12% 12% 12% Rated Voltage 15 to 50 V d.c. 8% 6% 6% 6% The d.c. leakage current (at rated voltage) is within the limit set below 25 C < 0,01 µa/µf V or < 1 µa whichever is greater 85 C < 0,10 µa/µf V or < 10 µa whichever is greater 125 C < 0,125 µa/µf V or < 12,5 µa whichever is greater Fig b): Electrical properties of dry tantalum electrolytic capacitors. (Data from Philips) Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 24

Aluminum wet electrolytic capacitor An aluminum electrolytic capacitor with a non-solid electrolyte always consists of two aluminum foils separated

One of the aluminum foils, the anode, is etched (roughened) to increase the surface and oxidized (formed).

A paper spacer mechanically separates the foils to avoid direct metallic contact.

25 Aluminum wet electrolytic capacitor An aluminum electrolytic capacitor with a non-solid electrolyte always consists of two aluminum foils separated mechanically by a spacer, mostly paper, which is saturated with a liquid or gel-like electrolyte. One of the aluminum foils, the anode, is etched (roughened) to increase the surface and oxidized (formed). The second aluminum foil, called the "cathode foil", serves to make electrical contact with the electrolyte. A paper spacer mechanically separates the foils to avoid direct metallic contact. Both foils and the spacer are wound and the winding is impregnated with liquid electrolyte. Multiple electrolytes are used. Further reading: Wikipedia "Al-e-cap-construction" by Elcap - Own work. Licensed under CC0 via Wikimedia Commons - FYS4260/FYS9260 Frode Strisland 25

Wet Electrolytic Aluminium Capacitors Fig. 4.

26 Wet Electrolytic Aluminium Capacitors Fig a): Aluminium electrolytic capacitor for SMD mounting. (From Philips) Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 26

27 Wet Electrolytic Aluminium Capacitors Fig b): Aluminium electrolytic capacitor properties (Philips). Top: Temperature dependence of the capacitance, relative to the value at 20 C. Middle: Temperature dependence of tan δ. Bottom: Temperature dependence of impedance at a frequency of 10 khz. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 27

28 Diodes and Transistors Fig. 4.13: Axial, plastic encapsulated, hole mounted diodes to the left. Right: A plastic can with metal base for power diodes. It can be hole mounted or surface mounted, depending on how the leads are bent. The base is screwed to the substrate. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 28

29 Diodes and Transistors, continued Fig. 4.14: Various types of hole mounted transistor packages: a) Left: Plastic packages, b) Centre: Low power metal packages c) Right: Metal package for high power transistors. For the high power package, the collector is connected to the metal body. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 29

30 Diodes and Transistors, continued Fig. 4.16: SOT-packages for SMD diodes and transistors: The most common, SOT-23 top left, SOT-89 for power transistors in the middle, and SOT-143 with four terminals to the right. The dimensions for SOT-23 are shown bottom left, and a cut-through SOT-89 in the middle. Ceramic SMD transistor packages with terminal placement like for SOT-23 are shown bottom right. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 30

31 IC Packages Plastic or Ceramic IC Packages? Plastic: Not hermetic Low price in large quantities High initial cost Low thermal conductivity Limited time at high temperature Thermal mismatch to Si chip and metals Not suitable for high frequency circuits Ceramic: Hermetic, good reliability Costly, but OK for prototyping Good thermal conductivity Low thermal coefficient of expansion, matches well with Si, mismatch to organic substrates Gold metallization must be removed Well defined high frequency properties Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 31

32 Packages for Hole Mounted ICs Fig. 4.17:a) DIP (Dual-in-line) IC package. b) Partly cross-sectioned DIP package which shows the silicon chip, bonding wires, lead frame and plastic body. c) The terminal organisation for 4 two-input NOR gates in a 14 pins package. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 32

33 Packages for Hole Mounted ICs, continued Fig. 4.18: Pin grid packages: To the left a cavity up ceramic package, and to the right a plastic moulded package. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 33

34 SMD IC Packages Small Outline (SO) Plastic Leaded Chip Carrier (PLCC) Leadless Chip Carrier (LLCC) Leaded Ceramic Chip Carrier (LDCC) Flatpack, mini-flatpack TapePak Chip Scale Packages Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 34

35 Surface Mound Plastic Package types Malestrom: Printed Circuits Handbook 6ed FYS4260/FYS9260 Frode Strisland 35

36 SMD IC Packages, continued Fig. 4.19: Surface mounted SO (Small Outline) IC package. (From Philips) Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 36

37 Outline Encapsulation Maximum width SMD IC Packages, continued SO Maximum width Maximum length Lead end to lead end [mm] [mm] [mm] SO-8 4,0 5,00 6,2 SO-8 7,6 7,6 12,4 SO-14 4,0 8,75 6,2 SO-16 4,0 10,00 6,2 SO-16L 7,6 10,5 10,65 SO-20 7,6 13,0 10,65 SO-24 7,6 15,6 10,65 SO-28 7,6 18,1 10,65 VLO-40 7,6 15,5 12,8 VSO-56 11,1 21,6 15,8 Table 4.3: Dimensions for SO- and VSO packages. Centre-to-centre lead distance is normally 50 mils, except for VSO-40 with 30 mils and VSO-56 with 0.75 mm. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 37

SMD IC Packages: Plastic Leaded Chip Carrier (PLCC) Fig. 4.20: Plastic leaded chip carrier with (PLCC). They are normally square with an equal number of terminals on all four sides (top).

38 SMD IC Packages: Plastic Leaded Chip Carrier (PLCC) Fig. 4.20: Plastic leaded chip carrier with (PLCC). They are normally square with an equal number of terminals on all four sides (top). For large DRAMs, the package has terminals on only two sides, also being called SOJ. The bottom figure shows a 1 or 4 Mbit DRAM package. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 38

39 SMD IC Packages: Plastic Leaded Chip Carrier (PLCC) Leads Format Lead pitch Maximum body dimensions [AxB] [mm] Maximum Device Dimensions (LxW) [mm] Typical Height (C) [mm] [mm] 20 5x5 1,27 9,1x9,1 10,1x10,1 3,5-4,7 28 7x7 1,27 11,6x11,6 12,6x12,6 3,5-4, x11 1,27 16,8x16,8 17,8x17,8 3,5-4, x13 1,27 19,3x19,3 20,3x20,3 3,5-4, x17 1,27 24,4x24,4 25,4x25,4 3,5-4,7 18 5x4 1,27 10,9x7,5 11,9x8,5 3,5-4,7 28 9x5 1,27 14,1x9,0 15,1x10,0 3,5-4,7 32 9x7 1,27 14,1x11,6 15,1x12,6 3,5-4,7 Table 4.4: Dimensions for PLCC packages. Format means the number of terminals on two neighbouring sides. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 39

40 Leadless Chip Carrier (LLCC) Leaded Ceramic Chip Carrier (LDCC) Fig a): The various types of ceramic chip carriers [4.15]. Types A -D to the left are leadless (LLCC), whereas types A and B to the right are meant for mounting leads (LDCC). Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 40

Leadless Chip Carrier (LLCC) Fig. 4.21 b): LLCC packages, additional details.

41 Leadless Chip Carrier (LLCC) Fig b): LLCC packages, additional details. The longest terminal is to designate electrical terminal number 1 in the circuit. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 41

42 Leadless Chip Carrier (LLCC), continued Leads Format Pad Pitch (p) [mm] Maximum Dimension (AxB) [mm] 20 5x5 1,27 9,1x9,1 28 7x7 1,27 11,6x11, x11 1,27 16,8x16, x13 1,27 19,3x19, x17 1,27 24,4x24, x21 1,27 29,6x29,6 18 5x4 1,27 10,9x7,5 28 9x5 1,27 14,1x9,0 32 9x7 1,27 14,1x11,6 Table 4.5. LLCCs, dimensions. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 42

43 Leaded Ceramic Chip Carrier (LDCC) Fig. 4.22: Leaded ceramic chip carriers. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 43

44 Leaded Ceramic Chip Carrier (LDCC), continued Fig. 4.23: Various shapes of the leads, and leadless termination for comparison. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 44

45 Flatpacks Fig. 4.24: Quad flatpack with leads on all four sides. Flatpacks are usually made of plastic or ceramic. They have leads on four or two sides. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 45

46 Mini-flatpacks Fig. 4.25: Mini-flatpacks is a name for higher density flatpacks: Typically terminals and a pitch of 25 mils. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 46

47 TapePak Fig. 4.26: National Semiconductor s TapePak component packages are specified with terminal numbers between 40 and close to 600. To the left we see a 40 leads TapePak in the form it is received by the user with a protective ring around it, and test points outside the ring. To the right is TapePak 40 after excising and lead bending, seen from above and from the side. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 47

48 High Performance Packages Multilayer ceramic, Al 2 O 3 or AlN Ground planes Controlled characteristic impedance Thermal vias Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 48

49 High Performance Packages Fig. 4.27: Thermal via-holes in the printed circuit board, for better heat conduction. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 49

50 High Performance Packages Fig. 4.28: Multilayer package for high frequency GaAs circuits with 3 ground planes, 2 voltage planes, 1 signal layer and a top conductor layer for contacts and sealing (Triquint). Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 50

51 High Performance Packages, continued Fig. 4.29: Multichip package for memory module in a Hitachi high-performance computer [4.18]. The module contains 6 ECL chips, mounted by flip chip. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 51

52 Packages: Future Trends (1995) Fig. 4.30: Comparison between the size of various package forms for an integrated circuit with approximately 64 terminals. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 52

53 Packages: Future Trends, continued Fig. 4.31: History and prognosis for the use of various sizes of passive SMD components, in percentage of the total number. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 53

54 Metallization of Terminals Passives Ag in alloy with Pd, Ni barrier, Sn/Pb Ag in solder alloy With adhesive mounting: ICs No Sn/Pb on terminal Au removed Sn/Pb coating Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 54

55 Terminal Metallization, Solderability and Reliability Fig. 4.32: Strain at fracture of solder fillet as function of gold concentration in the solder metal, relative to value without gold. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 55

56 Electrostatic Discharges (ESD) Unprotected MOS: Max 5-80 V on input before destroyed Triboelectricity: >>1000 V discharge Billions of $ damage annually Protected circuits tolerate V Extensive precautions in industry, handling and packing Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 56

57 Electrostatic Discharges Component Damages and Precautions Fig. 4.33: MOS transistor schematically. The gate oxide is very vulnerable for damage by electrostatic discharge. Gate oxides down below 200 Å (20 nm) are now used. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 57

58 Electrostatic Discharges - Component Damages and Precautions, continued Fig. 4.34: CMOS circuit exposed to electrostatic damage: Silicon has molten in a small area. Picture size 5µm x 5µm. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 58

59 Electrostatic Discharges - Component Damages and Precautions, continued Fig. 4.35: ESD protection circuit at in- and outputs for MOS and for bipolar circuits. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 59

60 Component Packaging Paper tape (hole mounted passives) Blister tape (SMD passives, discretes, small ICs) Sticks (DIPs, SMD ICs) Waffle trays (Flatpacks) Stack magazine Bulk: Not suited for automatic mounting Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 60

61 Component Packaging for Automatic Placement Fig. 4.36: Blister tape for surface mounted components. Standard dimensions for 8 mm wide tape. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 61

62 Component Packaging for Automatic Placement Fig. 4.37: Plastic sticks as packaging for SMD integrated circuits. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 62

63 Component Packaging for Automatic Placement Fig. 4.38: Waffle trays packaging for flatpacks to the left, frame for stacking of single component to the right. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 63

64 End of Chapter 4 Components for Electronic Systems Important issues: Components: Distinguish between the different components Packages for electronic devices : Distinguish between the different packages Electrostatic discharges Component packaging: Used for automatic assembly machines Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 64

65 Some perspectives on home task on requirements extraction FYS4260/FYS9260 Frode Strisland 65

66 Generally about requirements Requirements must be verifiable (it has to be possible to decide whether a requirements is met). Examples of ways to test a requirement: Demonstration: The requirement is verified through real-time demonstration Inspection: The requirement is verified by visual examination of documentation, service components and/or technical design/device design. Testing: The requirement is verified by experimental testing that a predefined acceptance level have been reached (testing is typically carried out for physical and performance type requirements). FYS4260/FYS9260 Frode Strisland 66

67 Requirements priority: Unless stated otherwise, requirements are "MUST" When working with requirements, one will have conflicting interestes between requirements. Priorities are therefore recommended, for example: HIGH: The requirement MUST be implemented and is seen as a central element in the project/product MEDIUM: The requirement SHOULD PREFERABLY be implemented within the project/product, but alternative solutions can be found. A requirement set to MEDIUM will, in the project development process, be handled as follows: If cost, timescales and resources allow it, it will be implemented. If the requirement is not implemented, resources will be put into ensuring that the development is adapted and adjusted so the requirement can be implemented at a later stage after the present project. LOW: The requirement WOULD have been nice to have but is not seen as central. FYS4260/FYS9260 Frode Strisland 67

marking which allows free movement and sale of the product throughout the European Economic Area Implications: Compliance includes

68 The weather station case The weather station can be categorized as consumer electronics CE marking: By affixing the CE marking on a product, a manufacturer is declaring, at its sole responsibility, conformity with all of the legal requirements to achieve CE marking which allows free movement and sale of the product throughout the European Economic Area Implications: Compliance includes WEEE and RoHS on electronics waste and manufacturing Electromagnetic Compliance ISM radio + several other FYS4260/FYS9260 Frode Strisland 68

69 Environmental effects What does outdoor environment mean with respect to offices climate Larger temperature variations Frost, sunshine 100 relative humidity (CONDENSING) Rain What happens if the device is mounted up-sidedown? Storage and transport: Airline transport can be -55C and at atm FYS4260/FYS9260 Frode Strisland 69

70 Consider what is the environment Malestrom Printed Circuits Handbook 6th ed FYS4260/FYS9260 Frode Strisland 70

71 Handling What happens if the unit falls to the ground? Or if a user uses a hammer to mount the unit? Is it possible to change battery without breaking the seal towards the outside? FYS4260/FYS9260 Frode Strisland 71

72 Packaging of temperature sensor Very fast temperature response not needed can therefore for example place the temperature sensor on a corner of the PCB that is expected to be thermally in good contact with the environments Temperature technologies Thermistors Surface resistors (e.g. Pt100-type elements) FYS4260/FYS9260 Frode Strisland 72

Barometric pressure sensor Pressure sensor challenge: there must be a hole into the pressure sensitive MEMS membrane What happens if water enters into this hole? And freezes?

73 Barometric pressure sensor Pressure sensor challenge: there must be a hole into the pressure sensitive MEMS membrane What happens if water enters into this hole? And freezes? Approach: Seal the hole with e.g. a Teflon membrane for outdoor use. For more extreme situations, e.g. a divers watch, a separation membrane must be used In the current case suggest placing the barometric sensor in the indoor station part? Example device: LPS25HB from ST Microelectronics FYS4260/FYS9260 Frode Strisland 73

74 Humidity sensor Same problem as the pressure sensor: Humidity and water can enter into the sensor. Solution: Add a protective membrane of e.g. Teflon (GoreTex) Idea: Consider using the humidity temperature calibration sensor as temperature sensor. FYS4260/FYS9260 Frode Strisland 74

75 Overall packaging Humidity absorption is a general problem for outdoor electronics. It is probably acceptable to apply FR4 circuit board technology, but it may be a good idea to coat the finished circuit board with a water resistant/repellent film/paint. FYS4260/FYS9260 Frode Strisland 75

Chapter 11: Passives: Discrete, Integrated, and Embedded. Johan Liu

Chapter 11: Passives: Discrete, Integrated, and Embedded Johan Liu jliu@chalmers.se 1 Types of Passive Components 2 Embedded passive devices: advantages Reduced system mass, volume and footprint. Individual