DEPOSITION SYSTEMS FOR ORGANIC ELECTRONICS. OVPD-200 Organic Vapor Phase Deposition

Similar documents
AIXTRON SE. Kaiserstrasse 98, Herzogenrath, Germany

AMOLED DISPLAY PROTOTYPING SYSTEM CLUSTER TYPE FMM TECHNOLOGY

How can MOCVD enable production of cost efficient HB LED's

2005 ANNUAL REPORT 2005 ANNUAL REPORT

TFS PRODUCTION SOLUTIONS. TFS Production Solutions. For thin-film solar modules

TFS PRODUCTION SOLUTIONS. TFS Production Solutions. For thin-film solar modules

Atomic Layer Deposition. ALD process solutions using FlexAL and OpAL

Glass Bonding Solutions

Activities in Plasma Process Technology at SENTECH Instruments GmbH, Berlin. Dr. Frank Schmidt

SUSS MICROTEC - SEMI MEMS TECH SEMINAR Mailand, 23. September Margarete Zoberbier, Product Manager Bonder

EQUIPMENT EQUIPMENT FOR HIGH-EFFICIENCY SOLAR CONCEPTS CRYSTALLINE SILICON PV. SCALA XEA nova XENIA

Atomic Layer Deposition (ALD)

Boost Your Yield Get more out of Inspection Inspection-Systems for Plastic Film and Sheets 100% Optical Web Inspection.

Solar Film Introduction. Company Presentation 1

State of the art quality of a GeOx interfacial passivation layer formed on Ge(001)

Evaporation MATERIALS I 01

TA Instruments THERMOPHYSICAL PROPERTIES

III Fabrication of the samples

Development of Conductive Polymer Film and R2R Coating Process

Customer Satisfaction

MODULAR PROCESS SYSTEMS ADVANCED COATING EQUIPMENT ADVANCED COATING EQUIPMENT

The Effect of Interfacial Roughness on the Electrical Properties of Organic Thin Film Transistors with Anisotropic Dielectric Layer

Inline Sputtering System for Heterojunction Cells

Platypus Gold Coated Substrates. Bringing Science to the Surface

MOCVD Technology for LED

125nXT Series. EMD PeRFoRmaNce MaTeRIaLs. technical datasheet. Photopolymer Negative Tone Photoresists APPLICATION TYPICAL PROCESS THICKNESS GRADES

PEAK EFFICIENCIES WITH FALLING MANUFACTURING COSTS

Atomic Layer Deposition

Czochralski Crystal Growth

Pulsed Laser Deposition of Epitaxial Titanium Nitride on Magnesium Oxide substrate

csi PRODUCTION SOLUTIONS csi PRODUCTION SOLUTIONS FOR CRYSTALLINE SILICON SOLAR CELLS

Power Vision Ltd. PV Research. Power Vision Ltd. Unit R2, Herald Park, Crewe, Cheshire, CW1 6EA, UK Tel:

Aluminum oxide barrier layers on polymer web

SCU450 and SCU650. ALD Vacuum Technologies High Tech is our Business. Mono 2 TM

ALD systems and SENTECH Instruments GmbH

M. Hasumi, J. Takenezawa, Y. Kanda, T. Nagao and T. Sameshima

Low temperature deposition of thin passivation layers by plasma ALD

EV Group 300mm Wafer Bonding Technology July 16, 2008

Innovative Laser Processing Technologies

1500 Series. EMD PeRFoRmaNce MaTeRIaLs. technical datasheet. Positive Tone Photoresists APPLICATION TYPICAL PROCESS. SPIN CURVES (150mm wafers)

SPUTTERING TECHNOLOGY. for Multiple Applications such as Solar, Display, Semiconductor & 3D-Substrates

Etching Mask Properties of Diamond-Like Carbon Films

Smart Lighting Amazing Life

Magnetic pinning in hybrid YBa 2 Cu 3 O 7-x /ferromagnetic nano-dot structures obtained by di-block copolymer self-assembly method

2015 IEEE. REPRINTED, WITH PERMISSION, FROM Next Generation Metallization Technique for IC Package Application

GENERIS PVD. Inline Sputtering System for Heterojunction Solar Cells

IMRE/ETPL Flagship Project

3SUN: Innovative Advanced Technology Factory for PV Module R(e)volution

200mm Next Generation MEMS Technology update. Florent Ducrot

Automation & Metrology Key technologies for high-tech production

AC : PROCEDURE DEVELOPMENT OF THERMAL EVAPO- RATION PROCESS FOR INCORPORATION INTO UNDERGRADUATE CURRICULUM

Supplementary Information

Productivity versus Profitability in Vacuum Web Coating

BAK EVAPORATOR FAMILY

Enabling Solid State Lighting through Advancements in MOCVD Technology

Ecologix Immersed Flat Sheet MBR module

DIFFERENT SPUTTERING CONFIGURATIONS FOR COATING 1,5 GHz COPPER CAVITIES

Safety & Security - Intelligent access control for healthcare equipment

BAK. Evaporator Family

ENCAPSULATION OF ORGANIC LIGHT EMITTING DIODES

Aluminum oxide barrier coatings on polymeric substrates

Roll-to-roll Technology for Transparent High Barrier Films

Improvement of gas barrier properties by combination of polymer film and gas barrier layer

Developing Enhanced Substrates for OLED SSL

Global Vacuum (Pumps & Valves) Market: Industry Analysis & Outlook ( )

High Definition Selective Metallization for Printed Electronics

Capital / MRKT CAP \6.14B / \280.6B (as of May 12 th ) Chugeri, Yangji myun, Cheoin gu, Yongin, Kyunggi do, Korea

Company Overview JDA. JDA with Hynix. JDA with SAMSUNG. Engineering Manpower over 80% R&D Key Member Name Position Major Career

BAK EVAPORATOR FAMILY

DESCRIPTION STANDARD RANGES

Dow Corning Solutions for Office Equipment and Home Electronics

More on VLSI Fabrication Technologies. Emanuele Baravelli

HYPRES. Hypres MCM Process Design Rules 04/12/2016

Photovoltaics & Solar Thermals. Thin-film equipment. Customized. FHR Anlagenbau GmbH I

High Performance Optical Coatings Deposited Using Closed Field Magnetron Sputtering

Corial PS200 4-sided multi-module platform

ACS300 Gen2. The coat develop solution from pilot to high volume production

Comparison of OSRAM OSTAR Headlamp Pro and OSLON Black Flat Application Note

Productivity versus Profitability in Vacuum Web Coating

Si DRIE APPLICATION In Corial 210IL

YXLON Cheetah EVO SMT

Magnetron Sputter Cathodes planar & rotatable. Linear ion sources. Reactive gas controller & endpoint detector

Lecture 12. Physical Vapor Deposition: Evaporation and Sputtering Reading: Chapter 12. ECE Dr. Alan Doolittle

VLSI Design and Simulation

Typical Powder Morphology

Mechanical Characterization of Sol-Gel Coatings Using a Nano Indenter G200

WŝŽŶĞĞƌŝŶŐ > ĞdžƉĞƌŝĞŶĐĞ ƐŝŶĐĞ ϭϵϳϰ WŝĐŽƐƵŶ ^he > Ρ WͲƐĞƌŝĞƐ > ƐLJƐƚĞŵƐ ƌŝěőŝŷő ƚśğ ŐĂƉ ďğƚǁğğŷ ƌğɛğăƌđś ĂŶĚ ƉƌŽĚƵĐƟŽŶ d, &hdhz K& d,/e &/>D /^, Z

EROWA Robot System Linear

New Applications of Old Materials From Paint to Solar Cells

Laboratory-Platen-Presses Types P/M

Barix Multilayers: a Water and Oxygen Barrier for Flexible Organic Electronics. Robert Jan Visser

Adam R. Boyd, Arthur Beckers, Martin Eickelkamp, Assad Alam, Michael Heuken

Interconnected tools for PCB insertion loss

The Impact of Capping on the Mobility and Thermal Stability of Organic Thin Film Transistors

Corrosion of metals in the atmosphere

Oxide Growth. 1. Introduction

EQUIPMENT AND SYSTEM FOR VACUUM COATING METALLIZING, SPUTTERING, PLASMA and PECVD. Hybrid system KOLZER DGK 36

Surface Activated Dynabeads

K. Shimakawa a, K. Hayashi a, T. Kameyama a, T. Watanabe a & K. Morigaki b a Department of Electronics and Computer Engineering, Gifu

DESCRIPTION STANDARD RANGES. Disposable Blood Pressure Sensor AAMI Specifications Low Cost Disposable Dielectric Gel Barrier Fully Tested & Calibrated

Transcription:

DEPOSITION SYSTEMS FOR ORGANIC ELECTRONICS OVPD-200 Organic Vapor Phase Deposition

ORGANIC VAPOR PHASE DEPOSITION OVPD-200 OVPD-200 Process Module Overview Most innovative method to deposit small molecule organic materials For applications in the field of organic electronics Displays, Lighting, Solar Cells, Transistors etc. Unique Advantages Enabling highest deposition rates (1 100 Å/s, material dependent) Minimizes risk of degradation of organic material through STExS (Short Thermal Exposure Source) Technology Best organic material utilization efficiency > 30 % Highest thickness uniformity and reproducibility: Range 2 % Control of morphology through substrate temperature: Film roughness typ. 2 nm RMS Variable interface control: Sharp and graded layer with multi component mixing possible Flexible configuration and integration in cluster environment based on modular building blocks OVPD technology has been exclusively licensed to AIXTRON from Universal Display Corporation (UDC), Ewing, NJ, USA for equipment manufacture. OVPD technology is based on an invention by Professor Stephan R. Forrest et al. at Princeton University, USA, which is exclusively licensed to UDC. AIXTRON and UDC have jointly developed and qualified OVPD pre-production equipment.

OVPD-200 Process Module Configuration Substrate Size: 200 x 200 mm 2 Connects with up to 5 Source Modules HCS (Horizontal Container Source) Module with 4 Organic Material Sources STExS (Short Thermal Exposure Source) Module with 2 Organic Material Sources Substrate/Mask alignment accuracy: ± 250 µm; Optional: FMM-alignment accuracy: ± 3 µm Indexer for segment deposition and combinatorial optimization of process parameters Fully computer-controlled OVPD-200 with 3x STExS and 1x HCS modules OEC-200 Organic Electronics Cluster OEC-200 Demo Cluster in AIXTRON s organic electronics laboratory AIXTRON offers a wide range of equipment building blocks for manufacturing needs in the field of organic electronics. Highest flexibility is given by individually custom-tailored configurations. The product range consists of process modules (PMs), utility modules (UMs) and transfer modules (TMs) that can be clustered to enable applications on basis of OLED display, lighting, solar cells (OPV), transistors or functional polymer layers (e. g. dielectric, conductive, hydro- or oleophobic). AIXTRON offers the full range from single process modules for integration to third party clusters towards full pilot-production clusters with up to eight transfer modules.

OEC-200 Cluster Integration Options TRANSFER MODULE (TM) TM-200 Automated transfer of substrates and masks LP (low pressure ~ 1 hpa) section for OVPD HV (high vacuum~ 10-6 hpa) section for vacuum thermal evaporation (VTE) processes 4, 5 or 6 facets/ports for flexible configurationwith nwith process modules (PM) and utility modules (UM) PA-200 Pre-Alignment (PA) Module Pre-alignes substrates for frame-less handling Rotates substrate 180 in passage configuration between adjacent TMs TM-200 / 6 facets TM-200 / 5 facets TM-200 / 4 facets

OEC-200 Utility Modules MASK MAGAZINE MM-200 Holds up to 10 masks LP or HV option Sliding door interface to fab space or GB LOAD LOCK LL-200 LP or HV option Sliding door interface to fab space or GB Cassette for up to 10 substrates FLIP CHAMBER FC-200 Flips substrate from facing up (OVPD) to facing down (VTE) and vice versa

A I X T RON Lund, Sweden Cambridge, UK Sunnyvale, USA Aachen, Germany AIXTRON SE Headquarters Seoul, South Korea Tokyo, Japan Shanghai, China Hsinchu, Taiwan AIXTRON Group C H I NA KOR E A U N I T E D K I NGDOM AIXTRON China Ltd. +86 (21) 6445 3226 +86 (21) 6445 3742 chinainfo@aixtron.com AIXTRON Korea Co., Ltd. +82 (31) 783 2220 +82 (31) 783 4497 koreainfo@aixtron.com AIXTRON Ltd. +44 (1223) 519 444 +44 (1223) 519 888 info@aixtron.com GER M A N Y S W E DEN USA AIXTRON SE +49 (2407) 9030-0 +49 (2407) 9030-40 info@aixtron.com AIXTRON AB +46 (46) 286 8980 +46 (46) 286 8989 info@aixtron.com AIXTRON Inc. +1 (408) 747 7140 +1 (408) 752 0173 usinfo@aixtron.com JA PA N TA I WA N AIXTRON K.K. +81 (3) 5781 0931 +81 (3) 5781 0940 japaninfo@aixtron.com AIXTRON Taiwan Co., Ltd. +886 (3) 571 2678 +886 (3) 571 2738 taiwaninfo@aixtron.com www.aixtron.com Copyright AIXTRON SE 1014 Information subject to change without notice Global Presence