How can MOCVD enable production of cost efficient HB LED's
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1 How can MOCVD enable production of cost efficient HB LED's Dr. Frank Schulte AIXTRON SE
2 Company and Market Market requests and challenges Answer from the technology Conclusion P 2 Confidential Proprietary
3 AIXTRON Global Presence Key figures: Est as spin-off from RWTH Aachen, Germany Legal form: Public Company Employees: ~ 800 Turnover: 780 Mio. (2010) ; 302 Mio. (2009) Product: Gas Deposition Equipment P 3 Confidential Proprietary
4 24 - Month Business Development ( million) Equipment (only) Order Intake * Equipment (only) Order Backlog Total Revenues (incl. equipment, service, spare parts) *) revalued on January 1, 2011 to 302.3m at $1.35/ Order Intake and Order Backlog are recorded at the prevailing budget rate (2011: $ 1.35/ ) P 4 Confidential Proprietary
5 LED Growth Opportunities: Lighting and BLU CAGR : Signs/Displays: Illumination: 60% 45% CAGR 30% Strategies Unlimited October 2010 Illumination currently 12% of total market MOCVD is one of the key/enabling technology P 5 Confidential Proprietary
6 Advances in LED Performance and Application LEDs 1975 LEDs 2010 The LED Industry has changed P 6 Confidential Proprietary
7 Advances in MOCVD MOCVD 1983 MOCVD 2010 MOCVD Technology has Advanced P 7 Confidential Proprietary
8 Gas Phase Deposition Technology Evolution for Compound Semiconductor Research -led, driven by Science (Compound ) Technology -led, driven by Research (Compound ) Application -led, driven by Technology (Compound ) Market -led, driven by Applications (Compound ) Cost of Ownership -driven, led by the Market ( Now) Semiconductor Market CoO-driven, led by the Market (10 Yrs +) Display Market CoO-driven, led by the Market (10 Yrs +) More and more Si-like technology directions mainly driving by LED production P 8 Confidential Proprietary
9 Company and Market Market requests and challenges Answer from the technology Conclusion P 9 Confidential Proprietary
10
11 Cost reduction Roadmap DoE 2010 Cost Reduction 20% per year P 11 Confidential Proprietary
12 MOCVD Performance Roadmap DoE 2010.but wavelength is only one LED parameter P 12 Confidential Proprietary
13 Company and Market Market requests and challenges Answer from the technology Conclusion P 13 Confidential Proprietary
14 LED Industry s Requirements LEDs Chip volumes Cost per chip Brightness & efficacy New device Layouts Silicon style fabs MOCVD P 14 Confidential Proprietary
15 Typical LED InGaN/GaN MQW + cap 3.5 µm GaN Buffer with thin nucleation onto sapphire 150 mm sapphire p tot = mbar T D = C TMGa, TEGa, TMIn, NH 3 Carrier gas N 2 during MQW Carrier gas H 2 during GaN P 15 Confidential Proprietary
16 Cost reducing factors Advances in MOCVD Throughput Wafer size and Capacity Cycle time Uptime Time to Production: True Scaling Yield Design to Uniformity Repeatability r2r, s2s Reliability, Stability MOCVD Solutions for Best Performance and Highest Productivity P 16 Confidential Proprietary AIX G5 HT and CRIUS II
17 Compound Common Platform Systems One common platform for CCS and Planetary Reactors One common platform for different application Planetary Reactor AIX G5 HT, 56x2 (14x4, 8x6, 5x8 ) Integrated Concept (IC) System Close Coupled Showerhead CRIUS II, 55x2 (13x4, 7x6, 3x8 ) P 17 Confidential Proprietary
18 Compound Technology is moving to Silicon rules Up to now Sapphire is dominating the market going from 2 to 4 to 6 Larger wafers allow to increase the number of devices per wafer whilst keeping processing costs low. If the same edge exclusion can be maintained then the yield is improved. High degree of automation is available for large wafers convergence with Si-industry Si-substrates are widely available possible road for further cost reduction P 18 Confidential Proprietary
19 Improved Yield and Reproducibility by In Situ Control for all wafer Wafer 1 Wafer 2 Wafer 3 Wafer 4 Wafer 5 Wafer 6 Monitoring and control of surface temperature, film thickness, bowing and uniformity during growth P 19 Confidential Proprietary
20 Manufacturing Execution System Control System / Database Centralized Remote Fab-wide Linked Analyze Manage Control in real-time for the whole factory Efficiency Productivity P 20 Confidential Proprietary
21 Company and Market Market requests and challenges Answer from the technology Conclusion P 21 Confidential Proprietary
22 Conclusion LED Industry is changing Proven technology reducing CoO implemented for LED production Fab integration: AIXTRON MES interface installed & running on already > 200 tools P 22 Confidential Proprietary
23 SSL will turn into reality MOCVD is one of the key/enabling technology for SSL P 23 Confidential Proprietary
24 Thank you for your attention P 24 Confidential Proprietary
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