Board Assembly TWG Champion: Assembly Materials: Keith Howell, Nihon Superior Repair & Rework: Jasbir Bath, Bath Consultancy Press-fit: Dennis Willie, Flextronics SMT Placement: Girish Wable, Jabil NPI: Michael Gerner, Plexus Chair & Co-chair: Dr. Paul Wang, Mitac Frank Grano, GE Participant: 51 from 33 companies Rev.03 Dec. 5 th, 2013 SMTA Silicon Valley Chapter Meeting At Cisco Systems, Bldg D, Pacific Pacific Room
International Electronics Manufacturing Initiative (inemi) Not for profit, highly efficient R&D consortia since 1994 Funded by Corporate memberships - Staffed globally in US, China, Japan & Ireland Membership includes 107 leading industry companies & organizations, representing a cross section of our electronics manufacturing industry & supply chain inemi Mission: Forecast and accelerate improvements in the Electronics Manufacturing Industry for a sustainable future. We Accomplish This By: Being the recognized leader at projecting future technology needs for the global supply chain (inemi Technology Roadmap). Guiding and leveraging the strength of the consortium s industry leading international membership. Driving high impact collaborative R&D Results through constantly improving methodologies. Defining and implementing science based sustainable solutions in high impact areas including the environment and health care. Influencing and leveraging key government agencies and labs (inemi Research Priorities Document). inemi has currently 25 collaborative R&D projects and initiatives that address key technology gaps Projects typically have 10-20 member companies/institutions www.inemi.org 1
Some Definitions TWG - Technical Working Group Develops the roadmap technology chapters Presently 20 groups and chapters PEG Product Emulator Group Virtual Product : future product attributes plus key cost and density drivers Portable / Consumer Office Systems High-End Systems Medical Products Automotive Aerospace/Defense 2
Methodology Available to Market Place Competitive Solutions Technology Evolution Government Roadmap Research Product Needs Disruptive Technology Academia Global Industry Participation GAP Analysis No Work Required inemi Members Collaborate Projects Industry Solution Needed 3
Statistics for the 2013 Roadmap > 650 participants -- Big Thanks to All Contributors!! > 350 companies/organizations 18 countries from 4 continents 20 Technology Working Groups (TWGs) 6 Product Emulator Groups (PEGs) > 1900 pages of information Roadmaps the needs for 2013-2023 Workshops held in Europe (Berlin, Germany), Asia (Hong Kong, China) and North America (ECTC, San Diego) in June 2012 A Full Global Perspective Available to inemi members on 12/22/12 at: www.inemi.org Shipping/Downloading to industry beginning April 4 at www.inemi.org 4
2013 Technology Working Groups (TWGs) Modeling, Simulation, and Design Solid State Illumination Large Area, Flexible Electronics Semiconductor Technology Photovoltaics Ceramic Substrates Connectors MEMS/ Sensors Packaging & Component Substrates Passive Components Optoelectronics Mass Storage (Magnetic & Optical) Energy Storage & Conversion Systems Test, Inspection & Measurement Thermal Management Organic PCB Board Assembly Final Assembly Customer Information Management Systems Environmentally Conscious Electronics Red=Business Green=Engineering Aqua=Manufacturing Blue=Component & Subsystem 5
Portable / Consumer Office Systems Defense and Aerospace Medical Products Automotive High-End Systems Roadmap Development Product Sector Needs Vs. Technology Evolution TWGs (20) Product Emulator Groups Semiconductor Technology Business Processes Prod Lifecycle Information Mgmt. Design Technologies Modeling, Thermal, etc. Manufacturing Technologies Board Assy, Test, etc. Comp./Subsyst. Technologies Packaging, Substrates, Displays, etc. 6
Fourteen Contributing Organizations Semiconductors Organic Printed Circuit Boards inemi / ITRS / MIG/PSMA Packaging TWG inemi / MIG / ITRS MEMS TWG inemi / IPC / EIPC / TPCA Organic PWB TWG Interconnect Substrates Ceramic inemi Passives TWG inemi Roadmap inemi Information Management TWG Supply Chain Management inemi Board Assembly TWG inemi Optoelectronics TWG inemi Mass Data Storage TWG Magnetic and Optical Storage Optoelectronics and Optical Storage 7
Key Trends (2013 Roadmap) 8 8
Key Trends (2013 Roadmap) 9 9
Key Trends (2013 Roadmap) 10 10
Board Assembly of 3D IC Integration System-in-Package (SiP) Challenges/Opportunities 11
Miniaturization: Passive components size reduction Sources: Murata, Rohm From 2012 onwards the M0201 package will be introduced Dimensions: 0.2 x 0.1 mm This is half the size of a 01005 package! 12
Maturity 3D 3D Integration Technology 3D IC Packaging 3D IC Integration 3D Si Integration Mass Production Full swing production for memories. Every 18 months one layer increase Testing and yield challenges give way for Package stacking Commercialization Applied R&D Basic R&D Die Stacking with wire bonds Package on Package Stacking (PoP) C2C, C2W, W2W Stacking Active applied R&D is undertaken by Research Institutes. System level challenges are key. In the phase of industrialization. Still in Upstream research, technological challenges such as yield & device architecture are key issues. W2W Stacking Technology John H. Lau 13
Press-Fit TWG Scope Technologies for second level Board Assembly process Compliance press-fit Design Smaller Compliance Pins Placement & insertion Inspection Testing Challenges Repair Finish Hole size Environment Requirement Contact Relibaility 14
Press-Fit TWG Scope Technologies for second level Board Assembly process 15
Inspection 3D Automated Press-Fit Pin Profiling Inspection Backplanes and PCBA assemblies up to size 127x76cm (50 x30 ), 200K~500K pts/cm 2 in 18 seconds Non-contact Confocal line sensor scan then create 3D profile to detect bent pin, pin crushed and missing pin in quantitative value Press-Fit TWG Scope 16
Press-Fit TWG Scope Technologies for second level Board Assembly process Compliance press-fit Design Smaller Compliance Pins Placement & insertion Inspection Testing Challenges Repair Finish Hole size Environment Requirement Contact Reliability Related press-fit reliability correlation with design and transportation stress (case study) 17
Repair and Rework TWG Scope Technologies for second level Board Assembly process Rework and Repair Technology forecast Hand Solder and PTH Rework Rework of New/Non-Standard Components Site Dressing Rework Process Re-Attach Rework Process 18
Repair and Rework TWG Scope Technologies for second level Board Assembly process Rework of Temperature Sensitive Devices 19
Repair and Rework TWG Scope Technologies for second level Board Assembly process Rework and Repair Technology forecast Area Array and Non-Standard Package Rework Soldering Process Parameter Units 2011 2013 2015 2017 2023 Maximum package size Minimum package size Smallest type of discretes being reworked Minimum reworkable pitch Target delta T across solder joints Typical rework profile length (time) mm 50 50 55 60 75 mm 5 2 1.5 1.5 1-0201 (Imperial) 0201 (Imperial) 01005 (Imperial) 0201 metric 0201 metric mm 0.4 0.4 0.4 0.3 0.3 C <10 <10 <10 <10 <10 min 8 6 to 8 6 to 8 6 to 8 6 to 8 SnPb Time Above Liquidus (TAL) Number of allowable area array reworks at a specific location Type of rework (Conv./IR/Other) (Other is Laser and Vapor Phase Rework) sec 45-90 45-90 45-90 45-90 45-90 # 3 3 3 3 3 % 85/15 85/15 85/15 80/20 70/20/10 Type redress approach (Non Contact/SolderWick) % 20/80 20/80 20/80 30/70 40/60 Type of medium deposit for BGA component rework (Paste on PCB/Paste on Part/Flux only) (See Note) % 40/40/20 40/40/20 40/40/20 40/40/20 40/40/20 20
Expanded Rework Section (Pb-Free) Maximum package size mm 50 50 55 60 75 Minimum package size mm 5 2 1.5 1.5 1 Smallest type of discretes being reworked - 0201 (Imperial) 0201 (Imperial) 01005 (Imperial) 0201 metric 0201 metric Pb-free Minimum reworkable pitch Target delta T across solder joints Typical rework profile length (time) Time Above Liquidus (TAL) Number of allowable area array reworks at a specific location Type of rework (Conv./IR/Other) (Other is Laser and Vapor Phase Rework) Type redress approach (Non Contact/Solder Wick) mm 0.4 0.4 0.4 0.3 0.3 C <10 <10 <10 <10 <10 min 8 8 8 8 8 sec 60-90 60-90 60-90 60-90 60-90 # 3 3 3 3 3 % 85/15 85/15 85/15 80/20 70/20/10 % 20/80 20/80 20/80 30/70 40/60 Type of medium deposit for BGA component rework (Paste on PCB/Paste on Part/Flux only) (See Note) % 40/40/20 40/40/20 40/40/20 40/40/20 40/40/20 Note: The use of solder paste or tacky flux will depend on the type of component being reworked. Paste is typically used to reduce the affect of component warpage causing Head-in-Pillow component soldering defects during BGA and PoP part rework. In terms of ease of use and speed of rework, tacky flux is used more even though it may have an affect first pass yield. The percentages mentioned for Paste versus Flux medium are for BGA rework and will vary dependent on the type of part being reworked. 21
Repair and Rework TWG Scope Technologies for second level Board Assembly process Hand soldering and PTH Rework 22
Assembly Materials TWG Chair: Keith Howell, Nihon Superior
Assembly Materials TWG Scope Technologies for second level Board Assembly process SMT solder pastes BGA rework pastes Wave bar solder Wave solder fluxes Repair / manual soldering materials Underfills Die attach materials Encapsulants Conformal coatings 24
Assembly Materials Drivers Increasing Component Complexity Increasing package density Smaller components with lower stand-off Rework and cleaning challenges Low component stand-off height will challenge underfill chemistries Fill time and voiding requirements Lower joint heights affect solder joint reliability Opportunities for new interconnect technologies and materials BGA components become thinner resulting in component warpage Head-in-pillow (HiP) defects are expected to become more prevalent Introduction of smaller chip components 01005 (0402 metric) Solder pastes to be more thermal resistant to prevent oxidation and graping defects 25
Energy Costs Assembly Materials Drivers Lower energy consuming processes may become more prevalent Low temperature alloy technologies to meet the market drive for lower energy consumption in SMT manufacturing Desire to lower process temperatures for higher reliability of the PCB substrates and components 26
Assembly Materials Drivers Environmental Concerns RoHS exemptions Telecommunications expiration in 2014 which will drive the conversion to lead-free in 2013-2015 time-frame. VOC-free fluxes Lack of RoHS regulation in US Conversion from SnPb to lead-free soldering material has been slower than previously predicted Most consumer electronics are now lead-free worldwide but industrial products for the US, aerospace, and military remain SnPb 27
Assembly Materials R&D Needs Higher fluxing power or activity to compensate for the poorer wetting as a result of the higher surface tension of lead-free solders while mitigating tin whiskers (due to possible corrosion) and electrical reliability concerns of the flux on the board Higher fluxing capacity and lower corrosion to support the use of a finer solder powder printing Greater oxidation resistance and improved wetting for the reduction of head-in-pillow component soldering defects, mainly due to component or board warpage Greater oxidation resistance to support 260 C reflow and further miniaturized solder paste deposits, with minimal use of halogen containing compounds in the flux 28
Assembly Materials R&D Needs Alloy development which promotes the formation of finer microstructures hence a more smooth and higher reliability solder joint Water soluble chemistries to support cleaning requirements with 260 C reflow No clean chemistries to support 260 C reflow with increased ability for ICT probing No clean chemistries which are compatible with conformal coating systems Flux residue compatible with vapor phase fluids to reduce contamination of the fluids Low viscosity dipping paste for Package-on-Package as finer pitch components are introduced Low voiding paste formulations for thermally conductive components 29
Assembly Materials Gaps Parameter Definition 2011 2013 2015 2017 2023 SAC/ SAC/ SAC/ SAC/ SAC/ Alloy Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Solder Paste Alloy (Low Temp) Low Temp Low Temp Alloy (Lead-free) High Temp>260C High Temp High Temp High Temp High Temp High Temp Halogen-free Bar Solder Wave Solder Flux Alloy VOC Free Halogen free SAC/ SAC/ SAC/ SAC/ SAC/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Flux-cored Solder Wire Repair Gel/Pasty Fluxes Repair Liquid Fluxes Alloy Flux-cored Solder Wire Repair Gel/Tacky Fluxes SAC/ SAC/ SAC/ SAC/ SAC/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC M ore Benign Left on Board Left on Board M ore Benign Left on Board Left on Board Repair Liquid Fluxes More Benign Left on Board Left on Board 30
Assembly Materials Gaps Parameter Definition 2011 2013 2015 2017 2023 Die Attach Preforms Thermal conductivity critical Matched CTE capability Lead-free compatibility JEDEC L1 @260 JEDEC L1 @260 JEDEC +260 reflow, small die, paste JEDEC L1 @260 JEDEC L1 @260 JEDEC L1 @260 Die Attach Adhesives Lead-free compatibility JEDEC +260 reflow, large die, paste High thermal (polymer based) paste JEDEC L1 @260 JEDEC L1 @260 JEDEC L1 @260 JEDEC L1 @260 JEDEC L1 @260 >30 W/m-K >50 W/m-K >100 W/m-K >100 W/m-K >100 W/m-K Compatibility with Low-k ILD, paste JEDEC L2 @260 JEDEC L1 @260 JEDEC L1 @260 JEDEC L1 @260 JEDEC L1 @260 65 nm tech 65 nm tech 45 nm tech 45 nm tech 32 and below nm tech Pre-applied polymer DA to silicon JEDEC L3 @260 JEDEC L2 @260 JEDEC L2A @260 JEDEC L2A @260 JEDEC L1 @260 Repair Adhesives Polymer Based 31
Assembly Materials Gaps Parameter Definition 2011 2013 2015 2017 2023 Underfills Lead-free FC in package (Laminate) BGA balls only Lead-free FC in package (ceramic), BGA balls only JEDEC L3 @ 260, BGA balls only JEDEC L1 @260, BGA balls only JEDEC L2 @ 260, BGA balls only JEDEC L1 @260, BGA balls only JEDEC L1 @260, FC bump and BGA balls JEDEC L1 @260, FC bump and BGA balls JEDEC L1 @260, FC bump and BGA balls JEDEC L1 @260, FC bump and BGA balls JEDEC L1 @260, FC bump and BGA balls JEDEC L1 @260, FC bump and BGA balls Low K ILD JEDEC L3 @260 JEDEC L2 @260 JEDEC L2 @260 JEDEC L2 @260 JEDEC L2 @260 90 nm tech 65 nm tech 45 nm tech 45 nm tech 45 nm tech Pre-applied FC JEDEC L3 @260 JEDEC L2 @260 JEDEC L2A @260 JEDEC L2A @260 JEDEC L2A @260 Large Die 25 mm Low K 25 mm low K 30 mm low K 30 mm low K 30 mm low K CSP Pre-applied Leadfree Reworkable Reworkable Reworkablle Reworkable Conformal Coatings Lead-free Compatible with Lead-free residues Compatible with Lead-free residues VOC-free 5-10% Compatible with Lead-free residues Increasing Volume Compatible with Lead-free residues Compatible with Lead-free residues Halogen-free 5-10% Increasing Volume Fillers Small Quantiites Small Quantiites Large Quantities Large Quantities Large Quantities Nano-materials Printed Electronics Available Imprint Technologies Available 32
Solder Paste Assembly Materials R&D Priorities Next generation of solder materials for lower cost and processing temperatures Replacement of SAC, modified SnCu, and low silver SAC alloys Better characterization of the reliability trade-offs with lower silver SAC alloys and SAC (Sn3-4Ag0.5Cu) and modified SnCu alloys. Silver content increases resistance to thermal cycling, while reducing silver improves drop shock resistance New interconnect technologies deploying nano-materials to support decreased pitch and increased interconnect frequencies. Improvement in printing technology and material development 0.3mm pitch CSP, 01005[0402 metric] chip, LGA/QFN/MLF, and Package-on-Package (PoP) components Effect of the percentage of voiding on the thermal and electrical reliability on QFN/MLF components. Process optimization of paste-in-hole or pin-in-paste with or without solder performs on thick boards as alternatives to wave soldering Improved reflow wetting performance with halogen-free fluxes 33
Assembly Materials R&D Priorities Wave Flux Halogen-free material which provides good hole-fill on thick boards Reduced residue fluxes for thick boards with improved pin testability for ICT Development of fluxes with benign residues without heat activation in the solder VOC-free (water based) no-clean wave fluxes with good hole-fill on thicker boards for lead-free wave soldering and low solder balling Improved flux formulations which exceed the electro-migration requirements in J-STD-004 Repair Flux Improvements in tacky fluxes for CSPs Development of fluxes with benign residues without heat activation in the solder 34
Assembly Materials R&D Priorities Die Attach Materials Thermal and moisture resistant polymers Formulation adjustments for new lead-free solder masks Low thermal resistance materials Alternative fillers and fiber technology to improve thermal performance Non silver fillers to reduce cost Lower temperature cure to reduce assembly cost and reduce warpage for stress sensitive applications 35
Assembly Materials R&D Priorities Conformal Coatings Conformal coating materials / processes which are compatible with leadfree solder materials / processes, to help mitigate lead-free issues such as tin whisker formation Need for investigating the compatibility and wetting of conformal coatings with various lead-free materials (mold compounds, solders, solder mask ) Development of a halogen-free parylene that can help mitigate tin whisker issues and be compatible with the lead-free, no clean flux systems. Conformal coatings for high temperature electronics and components Evaluation of vapor phase thin conformal coatings for various MEMS applications Development of composite conformal coatings materials for better barrier properties and mitigation of tin whiskers 36
Assembly Materials R&D Priorities Nanotechnology As the electronics industry moves forward with miniaturization and increasing functionality, there is an escalating demand on materials performance used in the manufacture of materials used in electronics assembly One such method of improving the performance of some materials is the use of nanomaterials and nano-structured materials The US National Nanotechnology Initiative is now 11 years old; initiatives in Europe and Asia started at about the same time when the benefits of nanotechnology for a wide range of applications was recognized Bearing in mind the fact that it takes 7-10 years from invention for a nondisruptive new product to gain market, we are just starting to see the first applications of non-semiconductor nanotechnology reaching the market and can expect considerable growth in this sector in the next few years 37
Nanotechnology - Size At least one dimension in the range 1-100nm (US National Nanotechnology Initiative, www.nano.gov) A nanometre is - a billionth of meter - a thousandth of a micron - 4 hundred thousandths of a mil 1 nanometre = 10-9 m = 0.000,000,001m = 0.001µm 0.00004 mil 38
Nanotechnology - Size Nano Particle 1m Solder Sphere 12mm x 12mm 39
Assembly Materials R&D Priorities Nanotechnology Small nm fillers being introduced for specific performance improvements Mechanical strength / toughness improvements, optical clarity in filled systems, etc One of the most rapid areas of nanoparticle adoption is printed electronics Paste with nano-sized silver particles is used for solar panel interconnects, RFID and antennas as well as a range of other applications Next evolution beyond fillers is in commercial nano and near nano coatings High-release stencil coatings High-performance waterproofing of consumer electronics 40
Assembly Materials Concerns The unpredictability of the effect of potential regulations regarding conflict minerals from the Democratic Republic of the Congo (DRC) to meet Section 1502 of the Dodd-Frank Act The burden and cost of compliance as well as its impact on the supply and pricing of tin, the major constituent in lead-free solders Possible regulations affecting soldering materials, the European Commission s REACH (Registration, Evaluation, Authorization, and Restriction of Chemical substances) law Technology need for higher fluxing power or activity to address the need for lead-free wetting improvement The possibility of additional substances being included in the REACH restriction may limit formulators Further understanding of lead-free solder material metallurgy, processability, and long term reliability Impact on the long term reliability Alloys with Increased reliability 41
Summary/Next Steps
Strategic Concerns Restructuring from vertically integrated OEMs to multi-firm supply chains Resulted in a disparity in R&D Needs vs. available resources Critical needs for R&D Middle part of the Supply Chain is least capable of providing resources Industry collaboration Gain traction at University R&D centers, Industry consortia, ad-hoc cross-company R&D teams The mechanisms for cooperation throughout the supply chain must be strengthened. Cooperation among OEMs, ODMs, EMS firms and component suppliers is needed to focus on the right technology and to find a way to deploy it in a timely manner Collaboration is inemi s Strength; We play an important role 43
Paradigm Shifts Need for continuous introduction of complex multifunctional products to address converging markets favors modular components or SiP (2-D & 3-D): Increases flexibility Shortens design cycle Cloud connected digital devices have the potential to enable major disruptions across the industry: Major transition in business models New Power Distribution Systems for Data Centers Huge data centers operating more like utilities (selling data services) Local compute and storage growth may slow (as data moves to the cloud) Rent vs. buy for software (monthly usage fee model) Rapid evolution and new challenges in energy consuming products such as SSL, Automotive and more Sensors everywhere MEMS and wireless traffic! More Moore (scaling of pitch) has reached its forecast limit and must transition to heterogeneous integration - More Than Moore. 44
The Next inemi Deliverables Are Key: Addressing the Gaps Technology continues to move at a faster rate of change Driven in many cases by short life cycle low cost yet high volume product Many of these cool new things don t port well or quickly to high reliability markets such as automotive, medical, or high end networking The next key deliverables from inemi are the 2013 Technical Plan (available only to members) and the 2013 Research Priorities Effective usage and coordination behind both these documents will be key to continued industry progress and growth Look for them in late 2013 The inemi TIG s, Technical and Research Committees are actively working them NOW! 45
Questions
www.inemi.org Email contacts: Chuck Richardson Chuck.richardson@inemi.org Grace O Malley gomalley@inemi.org Bill Bader Bill.bader@inemi.org