Henkel Advanced Thermal Materials for Higher Performance 2016 TW Power Seminar Oct 6th, 2016
Agenda 1. Henkel Overview 2. Roadmaps / TIM portfolios 3. Applications per Market Segment 4. BOND-PLY LMS-HD Discussion 5. Conclusion 2
Who we are 140 Years of History Founded 1876 Headquarters: Düsseldorf, Germany 3
Adhesive Technologies Total Henkel Sales 2015 Sales by business sector 28% 1% 49% 49% of Henkel Sales Adhesive Technologies 22% Adhesive Technologies Beauty Care Laundry & Home Care Corporate Corporate = sales and services not assignable to the individual business sectors. 4
Adhesive Technologies Five Business Segments Packaging And Consumer Goods Transport and Metal General Industry Electronics Consumer, Craftsmen and Building 5
Serving Our Customers Worldwide Global End-to-End Business Electronics Headquarters: Irvine, CA USA Estimated Adhesive Electronics Employees: 3,086 R&D, Technical Service, Sales R&D, Technical Service, Sales, Manufacturing Technical Service, Sales, Manufacturing Manufacturing Henkel has a global presence with a footprint in every geography Globally aligned infrastructure to serve our customers locally 6
Henkel Electronics Product Lines Die Attach Adhesives Molding Compounds Assembly Adhesives Liquids Inks & Coatings Solder Materials Thermal Solutions Die Attach Paste Die Attach Film Dicing Die Attach Film Conductive Die Attach Film WBC Mold Compound Powders ECA NCA SMA ABA Assembly Films Underfills Sealants CBP Encapsulants Light Cure Adhesives LPM TECHNOMELT LCM NCP Conductive Inks Non-Conductive Inks Blendable Resistors Shielding Coatings Solder Paste Liquid Flux Solder Wire Solder Wire Solder Bar Assembly Film Thermal Interface Thermally Conductive Adhesives Thermally Conductive Grease Liquid Gap Filler GAP PADS SIL PADS Insulated Metal Substrate (IMS) Abbreviations: ABA = Assembly Bench Adhesives LCM = Liquid Compression Molding NCP = Non Conductive Paste ECA = Electrically Conductive Adhesive NCA = Non Conductive Adhesive CBP = Circuit Board Protection LPM = Low Pressure Molding SMA = Surface Mount Adhesives WBC = Wafer Backside Coating 7
Market Needs Technology Platforms & Market Drivers Market-Tailored Product Solutions Henkel Solutions Assembly Liquids Assembly Adhesives Circuit Board Protection Solder Materials Thermal Materials Customer Mfg. Efficiency Low Pressure Molding Potting Compound Non-Conductive Pastes Liquid Gap Filler Conformal Coatings Electrically Conductive Pastes Gasketing Sustainability Electrically Insulating Film High Reliability CSP Underfills (Cornerbond) Solder Materials Surface Mount Adhesives Miniaturization Encapsulants (Glob Top) Printed Inks Insulated Metal Substrate (IMS) Gap Pads Assembly Film Adhesives 8
Agenda 1. Henkel Overview 2. Roadmaps / TIM Portfolios 3. Applications per Market Segment 4. BOND-PLY LMS-HD Discussion 5. Conclusion LIQUID GAP FILLER ADHESIVES THERMALLY CONDUCTIVE MATERIALS THIN BONDLINE GAP PAD SIL-PAD THERMAL CLAD 9
Power Market Drivers Power Densities Cost Automation Legislation Increasing Watts/In3 Driving Higher Reliability Requirements Low Cost Chinese Entrants Process Improvement Manual to Semi or Fully Automatic Reduced Manufacturing Footprint Improved Efficiencies Sustainable Environmental Si SiC/GaN 10
Global Power Supply Trends Henkel Solutions The Power Supply industry is advancing innovation through investment in lean manufacturing and total cost solutions. Henkel s Innovative Thermal Interface Materials (TIMs): +Eliminate Mechanical Fasteners +Save Space (2D & 3D) +Ensure Highest Dielectric Strength +Ensure Highest Thermal Performance +Improve L/T Reliability & Durability +Increase Production Though-put / Yields = Lowest Total Solution Cost 11
Gap Pad TIMs Expanding Pad-Form Innovation RELEASED Silicone ULTRA LOW MOD SOFT VALUE HIGH DURABILITY Silicone-Free HC1000 GPV0-S/US, 1500S, 2000S40 GPV0-US-C GPV0, 1450, 1500 GP1000HD Putty-like GP3500 ULM GP HC 3.0 * * 2500S20,3000S30 Lowest Modulus GP HC 5.0 5000S35 POLYURETHANE GP1000SF GP2202SF GP2200SF GP3004SF * Specialty EMI Absorbing GP EMI 1.0 NEW LINE 1 2 3 4 5 Thermal Performance (W/m-K) 6 7 12
Gap Filler Liquid TIMs Market Leading Solutions RELEASED 2K Cure-In-Place GAP FILLER 2K LOW VOLATILE 2K POTTING 2K LOW MODULUS 2K SILICONE FREE 2K GF1000/1000SR, GF1000, 1500, GF1000SR, 2000 GF1500, GF2000 GF3500S35 * GF1500LV GF1400SL GF1100SF * GF3500LV GF4000 1K Pre-Cured Gel LIQUI-FORM LF2000 LF3500 1 2 3 4 5 6 Thermal Performance (W/m-K) 13
Liquid Adhesives Flexible Cure Coming Soon RELEASED Silicone LIQUI-BOND SA HEAT-CURE LIQUI-BOND Adaptive CURE Epoxy LIQUI-BOND EA LBSA1000, 1800, 2000 LBEA1805 One-part refrigerated-storage, heat-cure LBSA3505 2K RT-storage, heat-cure 2K RT storage / RT - Flexible cure Silicone LOCTITE: Silicone Acrylic RT Fast Fixture LOCTITE: Activator-based Adhesives LOCTITE: 2K Bead-on-Bead 5404 One-part refrigerator-store, heat cure 383 high bond strength, no glass beads 384 repairable, no glass beads 315 with glass beads 3874 no glass beads 3873 with glass beads 3875 Two-part, no glass beads 3876 Two-part, with glass beads 1 2 3 4 5 Thermal Performance (W/m-K) 14
Adhesives (Pad form) Pressure Sensitive Adhesives & Laminates RELEASED Tapes BOND-PLY Pressure Sensitive Adhesive Laminates BOND-PLY HEAT-CURE BP100 BP800 Fiberglass reinforced BP400 Un-reinforced BP660P Polyimide film reinforced * BP LMS500P BP LMS-HD Fiberglass reinforced Polyimide film reinforced SEALANTS (NEW) TLB 400 SLT 1 2 3 4 5 Thermal Performance (W/m-K) 15
Thin Bond-Line Thermal Interface Material Pad-Form RELEASED Phase Change Material Hi-FLOW: Electrical Isolating Non-Isolating HF625 PEN film reinforced HF650P HF300P Polyimide film reinforced HF300G Fiberglass reinforced HF105, 225F-AC Aluminum Foil Unreinforced HF225U/T HF565U/T LOCTITE: Electrical Isolating EIF1000 KB(1), KA(2), K3 Polyimide film reinforced Non-Isolating TCF1000 (AL, ALH) Aluminum reinforced, Zinc Oxide Filler TCF2000 (AF) Aluminum reinforced, Graphite Filler Un-reinforced, Aluminum Filler TCF4000 PXF 2.0 1.0 0.5 0.25 TO220 Thermal Performance ( o C/W @ 50PSI) 16
Thin Bond-Line Thermal Interface Material Dispensable RELEASED Non-Curing Compounds TIC TIC1000A TIC4000 LOCTITE Grease TCP8010 TC8M LOCTITE PHASE CHANGE PASTES TCP4000 (D, Pm, Pe, DLV) TCP7000 1000hr@125C Open Bake Stable TCP7800NC 2.0 1.0 0.5 0.25 TO220 Thermal Performance ( o C/W @ 50PSI) 17
Sil-Pad Thermal Interface Material RELEASED Silicone SP-K4, K6, K10 Polyimide film SIL-PAD SP400-9mil, 7mil SP1200-12mil SP900S, SPA1500/2000, SP2000 Highest Electrical Isolation SP980-9mil (High pressure applications) SP800-5mil SOFT-TACK Rubber-based Mica & Grease Replacement Q-PAD SP1100ST Fiberglass reinforced Q-PAD 3 Aluminum Foil SP1500ST Q-PAD II Silicone-Free POLY-PAD PP-400 PP-K4 PP-1000 PP-K10 Polyimide film Highest Electrical Isolation 1.5 0.8 0.4 0.2 Thermal Performance ( o C-in 2 /W @ 50PSI) 18
Agenda 1. Introduction 2. Roadmap 3. Applications per Market Segment 4. BOND-PLY LMS-HD Discussion 5. Conclusion 19
Network / Server / Workstation / Computer Power Supplies Henkel Solutions Application: Discrete to heat plate Material Feature Benefits No Mechanical Fasteners BOND-PLY LMS-HD Cured core Guaranteed min. VBD No fixture in oven LIQUI-BOND SA 2000 1k, 2 W/m-k Excellent thermals, 1 part # vs pads LIQUI-BOND EA 1805 Epoxy Optional cure from 25ºC up to 150ºC LIQUI-BOND SA 2005 (Jefferson) 2k, Flexible cure 25ºC cure or very fast cure at elevated temps AC-DC Power Supply GAP PAD VO Ultra Soft Soft/Compliant Low stress on components 20
Network / Server / Workstation / Computer Power Supplies Henkel Solutions Application: Discrete to heat plate Material Feature Benefits Mechanical Fasteners SIL-PAD K-10, TCP 1700 Multiple SP options SP line: Wide variety of thickness, W/m-k, hardness, substrates HI-FLOW 650P PCM Wets out interface like a liquid, film isolation AC-DC Power Supply DC-DC Converter Q-PAD 2 Nonisolating For use on Insulated packages 21
Power Management Henkel Solutions Application: PCBA to heat sink Material Feature Benefits No Mechanical Fasteners LIQUI-BOND SA 1000 Low viscosity Screenable, 1 part # vs. pads LIQUI-BOND SA 2000 2 W/m-k Excellent thermals BOND-PLY LMS-HD Cured core Guaranteed min. VBD No fixture in oven DC-DC Converter BOND-PLY 800 PSA Press and stick 22
Power Management Henkel Solutions Application: PCBA to heat plate Material Feature Benefits Gap Filler 1500 1.8 W/m-k Low assembly force, 1 part # vs pads LIQUI-FORM 2000 Low CVE Minimal expansion during reflow temps LIQUI-FORM 3500 Low CVE, 3.5 W/m-k Minimal expansion during reflow temps DC-DC ¼ Brick Gap Filler 4000 4.0 W/m-k Excellent Thermals 23
Automotive Henkel Solutions Application: Power control unit, Cool, Seal, Isolate Material Feature Benefits Gap Filler 1500 1.8 W/m-k Low assembly force, 1 part # vs pads New 2k LIQUI- BOND materials, Adhesive TLB 400 SLT Sealant Flexible cure temps Flexible cure temps Ability to cure at 25ºC up to 180ºC Ability to cure at 25ºC up to 180ºC 24
Energy Management / Photovoltaic Henkel Solutions Application: Cooling PCBA to heat sink Material Feature Benefits Gap Filler 1500 1.8 W/m-k Low assembly force, 1 part # vs pads LIQUI-BOND 2000 2 W/m-k Excellent adhesion and thermals LIQUI-FORM 3500 Low CVE, 3.5 W/m-k Minimal expansion during reflow temps Gap Filler 4000 4 W/m-k Excellent Thermals GAP PAD HC 3.0 3 W/m-k Cost effective pad, excellent thermals 25
Power Supply Trends Henkel Solutions Components and Low Cost Heat Sinks with increased outof-flatness tolerance Thicker and more Compliant Bond-Ply LMS-HD, up to 16 mil Liqui-Bond SA 2000, dispensable solution with elevated temperature cure Liqui-Bond SA 2005 (Project Jefferson), 2k flexible cure profile, can be cured at room temperature up to 180 C. Room temperature storage Smaller footprint, Compact designs, Higher power density High thermal conductivity adhesives, now up to 3 W/mk Wide variety of adhesive options to eliminate mechanical fasteners 26
Agenda 1. Henkel Overview 2. Roadmap 3. Applications per Market Segment 4. BOND-PLY LMS-HD Discussion 5. Conclusion 27
BOND-PLY LMS-HD This Innovative Construction combines: Cured Inner Layer: A high performance inner core coated over fiber glass (e.g. a High Performance Sil- Pad ) Delivers: High dielectric breakdown voltage (DBV) High thermal performance (T c ) High durability Ease / Handling Uncured Outer Layers: Two thermally enhanced, B- staged layers symmetrically coated over the cured inner layer. Delivers: Soft interface for enhanced wet-out (Pre-Cure). Low stress laminate for L/T Reliability (Post Cure). Now available in 16 mil thickness. 28
BOND-PLY LMS-HD Processing (Typical) Oven cured after initial pressure only (IPO) Not required to run the assembly fixture through the pass-thru oven. Reduces oven time and post-processing time due to reduced thermal mass. Target Applications High Performance discrete Semi-Conductor / Heatsink assemblies where traditional attachment methods include clips, screws, rivets, or PSA tapes. High Density Power Designs with limited space and High Reliability requirements. 29
BOND-PLY LMS-HD Power Supply Trends Heat Sink Flatness Discrete Device and Heatsink Flatness is becoming more variable: Standard Thicknesses are available to Optimize your Design: 10 mil: ~3mil 12 mil: ~4 mil Now available in16 mil Die-cut parts or Kiss-cut Rolls 30
BOND-PLY LMS-HD Wet-out How LMS HD works Interfacial wet-out initiates via displacement. Increased dwell time = Greater wet-out = Greater lap shear performance. TO-220 Primary process variables include pressure, pressure distribution, and dwell time. No Force Moderate Force Excessive Force and/or dwell time Note: Not to scale 31
BOND-PLY LMS-HD Cost Savings Over Traditional Assemblies LMS-HD vs Traditional A (3) component example Reduced heatsink costs: No drilling or tapping. Improved Quality DPPM on heatsinks due to poor deburring or upsets. More compact designs: Potential use of D 2 Pak vs. TO-220 Assembly Costs Traditional vs. LMS-HD 100 75 50 25 0 Application Example Screw Ferrell Tap Labor Energy Total Assembly Cost Pad LMS-HD <$$ 32
BOND-PLY LMS and LMS-HD Processing Cure Profiles With Fixture, LMS BLN Simulation No Fixture, LMS-HD BLN Simulation <22 minutes! 33
Value Stream Mapping Improved Processing with BOND-PLY LMS-HD Value Add Inventory: 1. Standardization heat sink profile 2. LMS-HD roll, standard width Automatic cut-to-length LMS-HD Place LMS- HD on heat sink Inventory: 1. Discrete Components Place components on LMS-HD Jig Tooling: Single minute exchange of die Press components on LMS-HD Custom Press Insert Cure in Oven LMS assembly, No Fixture Est. 1 min Est. 1 min Est. 1 min Est. 8 min Wait Est. 0 min Est. 0 min Est. 0 min Change Over Time: Est. 1 min Place in bin: Bin size = to the Kanban order size Total Cycle Time Est. 11 min LEAN Opportunities: Smaller batch sizes: 1. Single minute tooling change over 2. Eliminate raw material inventory change by using standardized heat sink profiles and rolls of LMS-HD that are cut to length on the assembly line 3. Placing oven in-line with assembly table 4. Finished good inventory level drops to Kanban order size 34
Agenda 1. Henkel Overview 2. Roadmap 3. Applications per Market Segment 4. BOND-PLY LMS-HD Discussion 5. Conclusion 35
Conclusions Henkel solutions Offers a wide range of innovative and high performance materials to solve your most challenging thermal needs. New materials have been developed that save space, assembly costs and energy, yet provide great thermal and adhesion performance. Henkel maintains its industry leadership position by partnering with industry leaders to develop the next generation of thermal products. Please feel free to contact us with your challenging thermal needs! 36
Thank you!