MCPCB Material (Heat sync) NIPPON RIKA KOGYOSHO CO.,LTD Feb
Metal Base CCL (Heat sync) Metal Base CCL (Heat sync) Copper Foil FR-4 High Performance Epoxy Metal Base Glass Cloth + Epoxy Etching Etching Metal Base PCB Lamination Metal base PCB (FR-4) Bonding Sheet Metal Base
High Performance Epoxy Resin High Performance Epoxy Epoxy Resin We kept the performance by the original technology. Inorganic Filler Peel strength and the insulating property deteriorate if a lot of inorganic fillers are filled to epoxy resin.
Microsection of Metal Base CCL Copper Foil Epoxy Resin + Inorganic Filler Metal Base
Thermal Conductivity of Every Materials
General Properties Of Filler
Thermal Conductivity VS Filler Content
Feature of NRK Metal Base CCL (Heat sync) Excellent Radiation Heat is greatly radiated from the mounting parts. Excellent Heat Resistance Superior heat resistance insulating material is adaptable to direct bonding and reflow soldering High Voltage Insulation performance that endures energizing high voltage. Many Line Up The material corresponding to the usage can be selected.
Market Trend of Metal Base PCB Metal Base PCB Audio Power Supply Intelligent Power Module Inverter DC/DC Converter Trend Lead Free Approaching New Market New Application Car Electronics (In Engine Room) LED (Lighting) (LCD Back Light) Others More excellent heat radiation Long-term reliability
NRK Line Up per Requirement Item Power Module Car Electronics LED Requirements Lead Free High Voltage Radiation High density mounting Noise reduction Lead Free Long-term reliability Radiation High density mounting Heat Resistance Lead Free Excellent Radiation Cost Performance NRK Line Up RCCPrepreg
NRK Metal Base CCL Line up
General Properties of Metal Base CCL
NRK LINE UP & Other Company USINGAlN NRA-X 4.2W/mK,6.5W/mK NRA-E6.5W/mK,12.0W/mK
Lead Free Reliability The solder crack is generated in lead free solder in the Thermal shock test Thermal Shock Test Condition (or 125)
Solder Resistance
Thermal Shock Test Graph
Measurement Method of Thermal Resistance
Thermal Conductivity & Thermal Resistance
Name,Classification,Specifiction
Specification when shipping Copper Fiol Insulation Metal Base Musking Film A Musking Film B Musking Film A (Copper Foil Side) Musking Film B (Alminium Side)
CCL Side Masking Solder Resist Type Film Tape Type
MCPCB Munufucturing Process (1Layer) Copper Fiol Insulation Metal Base Masking Film Metal Base CCL Etching Coating Solder Resist Contour Processing Peeling Protection Film
MCPCB Munufucturing Process - 1 (2Layers) Copper Fiol Insulation Metal Base Masking Film Metal Base CCL Etching 1)Black Oxide or CZ Treatment 2)RCC Layup
MCPCB Munufucturing Process - 2 (2Layers) Lamination Lazer Drilling Copper Plating
MCPCB Munufucturing Process - 3 (2Layers) Etching Coating Solder Resist Contour Processing Peeling Protection Film
Press Condition (NRP-8)
Press Condition (NRP-E)
Contour Processing (1) Clearance of Die Core Plate Fixed Platen Clearance = BaseMetal Thickness 1012%
Contour Processing (2) Routers Condition of Reference drill bit /2.0 Revolution / 40,000rpm More Fast feeding / 300mm/min More Slow