WF637 A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering Low viscosity and high tacking power stabilize ball holding force and ensures excellent solder wettability Easy to wash out water-soluble flux which can be used for Pb-free reflow soldering at 25 C Prevents and inhibits contamination of reflow ovens with low-volatile flux Mounts solder balls with good squeezing property and ball holding force Solder ball Suction head Suction head Suction head Suction head Suction head Suction head Flux Flux printing Flux transfer Ball mounting Ball fusion and bonding Package Package Washing with water within 8 hours after mounting can remove flux residue Residue Washed after h Washed after 4h Washed after 8h Washed after 2h No flux residue after washing with warm water at 4 C Excellent wettability even on Cu-OSP PBC Washing with water No flux residue WF-637 Conventional flux Low-volatile flux inhibits contamination of reflow ovens Residue (%) 5 Low-volatile flux WF-637 Low-residue flux Reflow temperature ( C) 25 Residue-free flux TaiSemi4-E
Joint Protect Flux JPK8 Flux residue reinforces solder joints Flux residue improves joint strength by approx. 5% Even without cleaning, volatile components do not suppress a good underfill injection property Flux residue prevents cracks during long-term temperature cycle tests Process example JPK8 JPK8 JPK8 Flux film formation Dipping Transfer JPK8 residue Solder Ball JPK8 Mount Reflow Underfill injection Join by transfer and reflow and inject underfill without cleaning Maintains good adhesion with acid anhydride-based underfill agents Results of a temperature cycle test Ball diameter:.3 mm Temperature cycle: -4. C /3 min. 25 C/3 min. Flux residue reinforces joints, and a low amount of volatile components does not contaminate joints Result of a JEDEC Level 3 moisture sensitivity test Before After Initial stage After 25 cycles After 5 cycles Flux residue reinforces joints and increases joint strength by approx. 5% 6 Flux residue JEDEC Level 3; 3 /6%RH 96h Maintains a good underfill injection property regardless of the transfer amount Comparison of joint strength after high temperature exposure Strenbth (N) 5 4 3 2 JPK8 Normal flux Ball diameter Test speed Test height :.3mm : 3um/s 2 Storage time at 5 C (h) Flux residue reinforces joints and prevents cracks : 5um Transfer time : 5msec Transfer time : 25msec Small Result of a temperature cycle test JPK8 JPK8 Flux residue Transfer time : msec Large Normal flux Cracks Temperature cycle -4 C 25 C/after cycles TaiSemi4-2E
NRF SERIES Realization of Highly Reliable Mounting with No-Residue / No-Cleaning Halogen-free and no-residue flux keeps residue level at % or lower Maintains excellent solder wettability under a rapid-heating profile Highly compatible with under-filling materials; leaves no void Successful development of halogen-free flux with no-residue TGA evaluation result TG[%] 8 6 4 2 2 4 6 8 2-2 Time[sec] Post reflow solder ball with no flux 3 25 2 NRF-S3 NRF-S4 5 temp(degc) 5 Temp[degC] Delivers excellent solder wettability under a rapid-heating profile Evaluation method SAC35 Copper plate 6µm NRF 99% or more flux Rapid-heating Copper plate µm The improved product offers even better wetting extendability than conventional product It s measured 4 times per each bump, and they are averaged. Evaluation results 2 Solder spread [um] 8 6 4 Conventional product NRF-S3 NRF-S4 NRF-S3 Flux NRF-S4 Highly compatible even with under-filling materials; no formation of delamination or voids Cross section picture Solder Under -filling X-ray void check Heating profile (TCB process) 3 25 Temp[degC] 2 5 5 There is no delamination and void. Compatibility is good. There is no void after flow UFalso after cure. 2 4 6 8 2 Time[sec] JPCA4-3E
LAS-/OZ63-BPS ser. Form 2µm-pitch bumps with Φ4μm alloy powder Excellent sticking characteristic forms fine bumps in each process Realizes excellent melting characteristic even when Type 7 or finer powder Good solder wettability enables bump formation with fewer voids Trend towards fine pitch Forms 2 µm pitch bumps with φ4µm alloy powder Metal mask Type 7 (φ to μm) Type 7 or finer (φ to 6 μm) Opening size Solder Mask opening size Narrower and thinner Pitch sizes and bump formation in various supplying methods 2 µm pitch printing Forms good bumps even when using paste with fine powder because of excellent melting property Open squeegee method Cartridge method Dry film method Rolling Movement Movement Rolling Movement Stencil Pressurization Dry film Type6 6 mm pitch or more Type7 to 8 mm pitch Type 7 or finer 9 to 5 mm pitch Excellent flux prevents heat sags and forms good bumps After printing Bump formation after reflow Uniquely developed flux prevents oxidation Conventional product Preheating 8 C-3min Even though fine powder, still has good wettability and forms bumps with fewer voids Conventional product BPS series Preheating 8 C-3min BPS series TaiSemi4-4E
-NRB7 Void-free soldering with residue-free paste Vacuum reflow oven SVR-625GT realizes void-free and residue-free soldering Achieves highly reliable soldering with residue-free and no-clean solder paste No cleaning liquid reduces environmental burden and realizes lower price Achieves void-free soldering of power devices with the vacuum reflow oven SVR-625GT Void area ratio % 2 5 5 Paste: -NRB7 The void area ratio is decreased to % by controlling the degree of vacuum Residue-free and excellent wettability even with N 2 reflow oven General-purpose paste Residue-free = Residue ratio is 5% or less (defined by SMIC) No vacuum 3 2 5 Degree of vacuum (Pa) Residue-free paste Changing heat-evaporating materials decreases the flux residue ratio to 5% or less and realizes no-clean solder paste Low-volatile flux Oxygen density: 5 ppm or less Residue (%) 5 Reflow temperature ( ) Residue-free mounting of fine pitch microscopic components made possible with Type 5 powder and NRB7H 25 Low-residue flux Residue-free flux NRB7 φ2 µm dot printing part 5 -type chip component No interference with repletion of underfill in BGA mounting ø2 µm dot printing part.4 mm pitch part 63 -type component TaiSemi4-5E
LS72V Series Low-Ag/Ag-free solder pastes with lower void Reduces voids by improving fluidity of flux during solder melting Reduces voids even in bottom surface electrode type components by improving solder wettability LS72V flux which can be used for low-ag/ag-free alloys Development of Ag-free/M773 alloy Price Lower prices M4 M47 M773 Main reason of void formation and the measure Bottom surface electrode 3.% Ag Appearance of QFN Although voids are tend to occur when bottom surface electrode type components such as QFN frequently, it can be reduced by LS72V Conventional product Achieves Ag-free while confrming reliability QFN Improvement M4.% Ag Sn-3.Ag-.5Cu Sn-.Ag-.7Cu-.6Bi-In Sn-.3Ag-.7Cu-.5Bi-Ni Sn-.Ag-.7Cu-.5Bi-Ni Void PWB Solder M47.3% Ag 2 2 23 LS72V product % Ag The effect of LS72V is observed in suppressing void formation Solder paste M773 Voids are caused by reducing gas from residual flux and poor solder wettability Comparison of crack progression between Sn-Cu-Ni-Ge and M773 % Crack progression Approximately only 3% crack progression Joint strength improved with the addition of Bi and Ni (compared to % Ag material) Strength(N) 8 7 6 5 4 3 Effect of Ni addition Cycle conditions: -4 to +25, after cycles Sn-Cu-Ni-Ge Evaluation using chip resistors -4 /3min +85 /3min M773 M773;Sn-Cu-Bi-Ni Sn-Cu-Ni-Ge ;SAC35 2 2 4 6 8,,2,4,6 Number of temperature cycle (Cycle) M773 Replacing Cu with Ni makes the construction of the bonding surface finer and thus increases strength Without Ni With Ni 5 Void area ratio (%) 4 3 2 Conventional product LS72V Conventional product LS72V 4mm QFN 8mm QFN Reflow: time Reflow: 4times Surface treatment: Cu-OSP TaiSemi4-6E
PPS Achieves μm bump and 3μm pitch packaging No need for masking or positioning, thanks to transfer process Automatic ongoing production enabled by rolling Unlike plated coating, solder alloy structure can form bumps PPS structural diagram TaiSemi4-7E
Cu Core Ball Cu core ball facilitate 3D packaging and narrow-pitch mounting Ensures space to easily realize a highly-reliable component-built structure Enables narrow-pitch mounting that can be performed through Cu pillar mounting using existing equipment Promises high heat dissipation and electromigration countermeasures Ensures space through its multilayer structure with a Cu core Cu ball Ni plating Characteristics Inclination Electromigration Ensures space Heat dissipation PKG PKG PKG Solder ball Solder plating PCB PCB PCB Short Solder plating PKG PKG PKG Cu core ball Cu ball PCB PCB PCB Superior electromigration resistance Ensures appropriate space Cu has good thermal conductivity Cu core ball facilitate 3D packaging Cu core ball (spacer) Enables narrow-pitch mounting without short circuit risk with existing equipment Solder plating Cu plating Cu core ball Cu pillar mounting Cu core ball mounting Eliminates the plating processes required in Cu pillar mounting Drop test and temperature cycle test Drop test C-Cu M9 (conventional product) Temperature cycle test C-Cu M9 (conventional product) The Cu core ball ensure space to easily realize a highly-reliable component-built structure Cumulative Frequency Drop Number Realizes good drop resistance Cumulative Frequency Cycle Number Exhibits a temperature cycle equivalent to that of a conventional product TaiSemi4-9E
M758 A high-reliability WLCSP solder ball Forms bumps with high joint strength on wafer electrodes Good wettability on copper plating such wafer electrodes Packaged M758 has excellent thermal fatigue resistance M758 forms bumps having high joint strength on wafer electrodes Failure mode Failure Mode Shear tool Shear height Shear Good wettability on copper plating such wafer electrodes Testing method Flux Mode Mode2 Mode3 Mode4 Pad Solder Solder & Interface Interface The failure mode in every test is Mode 4: Interface failure Cu Plating Strength (N) 5 4.5 4 3.5 3 2.5 2.5.5 Shear Strength SAC35 SAC45 M758 M758 forms bumps having high strength on the package level by the surface reforming effect of added Ni.3 Spreadability test result.2 Reflow oven (245 ) O₂;<2ppm Cu plating Length(mm)..9 Measured location Measured location Packaged M758 shows good results in temperature cycle test.8 SAC35 SAC45 M758 M758 has good wettability for Cu plated package 99.9 TCT 99.9 Drop WLCSP : Size 7 x 7mm Product Name Composition Melting Point (%) S/F : Cu Note SAC35 27-22 Pb-free Standard M7 SAC45 27-229 M758 25-25 Suitable material for WLP Accumulation rate.% Accumulation rate.%,,,, Cycle number Drop number M758 has excellent thermal fatigue resistance due to solid solution strengthening with Bi added compared to conventional products, such as SAC35 and SAC45. Also, M758 has drop impact resistance equivalent to or more than that of conventional products TaiSemi4-E
M77 Simultaneously realizes high thermal fatigue resistance and drop impact reliability Solves problems with contrary demands by means of technology controlling the separation strengthening and interface response Excellent affinity with all kinds of surface treatment materials (Cu, Ni, Au) Optimized for mobile devices such as smart phones and in-vehicle ball packaging Cumulative failure rate (%) Evaluation on Cu-OSP PCB 99.9 Drop impact reliability (Cu-OSP PCB) M6 M77 M6 Number of drops (times) Evaluation on electrolytic Ni/Au plated PCB Cumulative failure rate (%) 99.9 Thermal fatigue resistance (Cu-OSP PCB) M6 M6 M77 Number of cycles (cycles) Material structures M6 Interface Surface Ni M6 Ni Drop impact reliability (electrolytic Ni/Au plated PCB) 99.9 Thermal fatigue resistance (electrolytic Ni/Au plated PCB) 99.9 Cumulative failure rate (%) M6 M77 M6.. Number of drops (times) Cumulative failure rate (%) M6 M6 M77 Number of cycles (cycles) M77 Ni Material selection according to purpose and application Drop impact reliability Thermal fatigue resistance M6 M6 M77 Results from relative evaluation with as basis. Focus on thermal fatigue resistance: M6 Focus on drop impact reliability : M6 Satisfies both characteristics in a reliable manner: M77 TaiSemi4-E
M6 M6 solder ball with high drop impact resistance For products with high risk of being dropped, such as mobile devices Solder balls with excellent drop impact resistance Accommodates fine pitch connections, high density connections, and high-quality packaging Accommodates every type of surface treatment material Composition µ Product name Alloy composition Melting temperature( ) Solid phase Liquid phase Aims to achieve the stress absorption effect of bulk solder through material softening 2 Vickers hardness (.49 N/3 sec) Eutectic phase (Ag 3 Sn Cu 6 Sn 5 compound) Sn phase 7.5 5 2.5 Hard Strength µ The year 23 The year 23 2.3% Concentration of stress is avoided through property modification of the joint interface by adding elements and optimizing the amount to be added. Schematic diagram of the joint process PKG Side(Cu,Ni/Au etc..) Sn PKG Side(Cu,Ni/Au etc..) 7.5 5 Soft 2 3 4 5 PKG Side(Cu,Ni/Au etc..) Ag content : % Sn-.Ag Low Ag concentration High Sn-3.Ag Fracture surface observation Electrolytic Ni/Au After drops Cu-OSP After 2 drops Electroless Ni/Pd/Au After 5 drops Cu Ni Diffusion velocity (vector) Cu(PCB Side) Cu(PCB Side) Cu(PCB Side) (Sn-3.Ag-.5Cu) Large diffusion layer Reflow Thick diffusion layer Cooling M6(Sn-.Ag-.75Cu-.7Ni) M6 M6 Electrolytic Ni/Au After 7 drops Cu-OSP After 2 drops Electroless Ni/Pd/Au After 33 drops Drop test result Thick diffusion layer M6 Thin and smooth diffusion layer The diffusion layer has been made thin, fine and smooth by adding Ni. fractures at the joint interface, and M6 fractures within the bulk solder Surface treatment: electrolytic Ni/Au PKG surface treatment: Cu-OSP PKG surface treatment: electroless Ni/Pd/Au Cumulative failure (t)(%) Cumulative failure InIn (/[-F(t)]) Cumulative failure (t)(%) Cumulative failure InIn (/[-F(t)]) Cumulative failure (t)(%) Cumulative failure InIn (/[-F(t)]) Drop Number Drop Number Drop Number TaiSemi4-2E
Micro Solder Ball Realizes fine-pitch packaging with high reliability Balls with high sphericity and tight tolerance achieved by means of unique technique Materials can be selected according to purpose, thanks to line-up of all kinds of alloys Promise of high-quality connection, with balls that have few impurities and only a small dose of α Regions where processes are possible Bump height (μm) 75 5 25 φ2 φ5 φ5 φ75 Solder ball Paste printing PPS (Precoated by Powder Sheets) 5 5 Pitch (μm) Various sizes from φ 3μm and structures are available Line-up Line-up of various sizes ranging from φ 3μm to φ μm Standard lead-free material Sn-3.Ag-.5Cu 27 Liquid Melting point ( ) Solid 22 φ 2μm solder ball has been achieved (reference exhibition) Excellent TCT reliability M6 Sn-2.3Ag-Ni-Co 22 Melting point ( ) Solid Liquid 222 Simultaneously realizes high thermal fatigue resistance and drop impact reliability M77 Sn-2.Ag-Cu-Ni 27 Melting point ( ) Solid Liquid 265 Silver/Lead-free soft solder M2 Sn-.7Cu 227 Melting point ( ) Solid Liquid 227 φ2μm The year 23 The year 23 Low melting point lead-free solder L2 Sn-58Bi 39 Melting point ( ) Solid Liquid 4 TaiSemi4-3E