Aligned Carbon Nanofibre-Polymer Composite Membranes. CNT Growth and Manipulation. Eleanor Campbell Dept. of Physics, Göteborg University

Similar documents
Vertically aligned Ni magnetic nanowires fabricated by diblock-copolymer-directed Al thin film anodization

ENS 06 Paris, France, December 2006

Visit

Process steps for Field Emitter devices built on Silicon wafers And 3D Photovoltaics on Silicon wafers

Journal of Chemical and Pharmaceutical Research, 2017, 9(1): Research Article

CREOL, The College of Optics & Photonics, University of Central Florida

350 C for 8 hours in argon atmosphere. Supplementary Figures. Supplementary Figure 1 High-temperature annealing of BP flakes on SiO 2.

Boron doped diamond deposited by microwave plasma-assisted CVD at low and high pressures

Oligomer-Coated Carbon Nanotube Chemiresistive Sensors for Selective Detection of Nitroaromatic Explosives

Surface Preparation and Cleaning Conference April 19-20, 2016, Santa Clara, CA, USA. Nano-Bio Electronic Materials and Processing Lab.

Multiphoton lithography based 3D micro/nano printing Dr Qin Hu

Metallization deposition and etching. Material mainly taken from Campbell, UCCS

Morphology of Thin Aluminum Film Grown by DC Magnetron Sputtering onto SiO 2 on Si(100) Substrate

Growth and Doping of SiC-Thin Films on Low-Stress, Amorphous Si 3 N 4 /Si Substrates for Robust Microelectromechanical Systems Applications

Toward Controllable Growth of Carbon Nanotubes

MEMS prototyping using RF sputtered films

TSV Processing and Wafer Stacking. Kathy Cook and Maggie Zoberbier, 3D Business Development

EE40 Lec 22. IC Fabrication Technology. Prof. Nathan Cheung 11/19/2009

Free standing Multilayer Thin Film of Cellulose Nanocrystals

EEC 118 Lecture #5: MOS Fabrication. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation

Electron field emission from transparent multiwalled carbon nanotube sheets for inverted field emission displays

Supplementary Figure S1 Crystal structure of the conducting filaments in sputtered SiO 2

Solar Cells and Photosensors.

HOMEWORK 4 and 5. March 15, Homework is due on Monday March 30, 2009 in Class. Answer the following questions from the Course Textbook:

Efficient organic distributed feedback lasers with active films imprinted by thermal nanoimprint lithography

Lecture 5. SOI Micromachining. SOI MUMPs. SOI Micromachining. Silicon-on-Insulator Microstructures. Agenda:

CMOS FABRICATION. n WELL PROCESS

Dr. Priyabrat Dash Office: BM-406, Mob: Webpage: MB: 205

Lateral epitaxial growth of two-dimensional layered semiconductor heterojunctions

ADOPT Winter School Merging silicon photonics and plasmonics

Effect of high annealing temperature on giant tunnel magnetoresistance ratio of. CoFeB/MgO/CoFeB magnetic tunnel junctions

NanoSystemsEngineering: NanoNose Final Status, March 2011

Combinatorial RF Magnetron Sputtering for Rapid Materials Discovery: Methodology and Applications

An Improved Process for Fabricating High-Mobility Organic Molecular Crystal Field-Effect Transistors

Lecture 19 Microfabrication 4/1/03 Prof. Andy Neureuther

EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES

3D technologies for integration of MEMS

Synthesis and Evaluation of Electrocatalysts for Fuel Cells

Annealing Nano-to-Micro Contacts for Improved Contact Resistance

2Dlayer Product Catalog

Choi, Jun-Hyuk Korea Institute of Machinery & Materials

Supporting Information

Biopolymers for Fibers, Textiles, and beyond

Conductivity switching of labyrinth metal films at the percolation threshold

Oxide Growth. 1. Introduction

Cellulose Nanofiber Composite Substrates for Flexible Electronics

VLSI INTRODUCTION P.VIDYA SAGAR ( ASSOCIATE PROFESSOR) Department of Electronics and Communication Engineering, VBIT

Materials Characterization

Ajay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University

Magnetic Force Microscopy: nanoscale magnetic imaging and lithography

Towards scalable fabrication of high efficiency polymer solar cells

Lab #2 Wafer Cleaning (RCA cleaning)

Development of Piezoelectric Nanocomposites for Energy Harvesting and Self-Sensing

Supplementary Information

Nanosilicon single-electron transistors and memory

Thermal Annealing Effects on the Thermoelectric and Optical Properties of SiO 2 /SiO 2 +Au Multilayer Thin Films

VLSI Systems and Computer Architecture Lab

Basics of Plasmonics

EFFECTS OF MICROWAVE ABSORPTION ON LONG AND SHORT SINGLE-WALLED CARBON NANOTUBES AT 10-6 TORR

From microelectronics down to nanotechnology.

Vertical Group IV Nanowires: Potential Enablers for 3D Integration and BioFET Sensor Arrays

Selective metallization for antenna manufacturing

ULTRA-LOW POWER PHASE CHANGE MEMORY WITH CARBON NANOTUBE INTERCONNECTS FENG XIONG THESIS

Procese de depunere in sistemul Plasma Enhanced Chemical Vapor Deposition (PECVD)

Low contact resistance a-igzo TFT based on. Copper-Molybdenum Source/Drain electrode

Preparation and Characterization of Micro-Crystalline Hydrogenated Silicon Carbide p-layers

Synthesis of Multi Wall Carbon Nanotube (WCNT) over thin films of SiO 2 -Fe 2 O 3 deposited by Combustion Chemical Vapor Deposition

Effect of aging on the reinforcement efficiency of carbon nanotubes in epoxy matrix

Electronic Supplementary Information (ESI) for

This journal is The Royal Society of Chemistry S 1

High-Resolution, Electrohydrodynamic Inkjet Printing of Stretchable, Metal Oxide Semiconductor Transistors with High Performances

Process Flow in Cross Sections

3.155J / 6.152J Micro/Nano Processing Technology TAKE-HOME QUIZ FALL TERM 2005

Universität Hamburg, Hamburg, Germany. Universität Hamburg, Hamburg, Germany

Project III. 4: THIN FILM DEVICES FOR LARGE AREA ELECTRONICS

Chang Gung University, Tao-Yuan, 333, Taiwan. Industrial Technology Research Institute, Hsinchu 310, Taiwan. Fax:

High aspect ratio nanostructures: nanotubes, wires, plates, and ribbons. Outline

Inkjet printing of oxide thin films and nanoparticles with potential use for anti-counterfeiting films and patterns

Lecture Day 2 Deposition

Using a standard Penning Gauge as a powerful means of monitoring and feedback control

Lecture 030 Integrated Circuit Technology - I (5/8/03) Page 030-1

Water Vapor and Carbon Nanotubes

Figure 2.3 (cont., p. 60) (e) Block diagram of Pentium 4 processor with 42 million transistors (2000). [Courtesy Intel Corporation.

Visualization and Control of Particulate Contamination Phenomena in a Plasma Enhanced CVD Reactor

Nanosensors. Rachel Heil 12/7/07 Wentworth Institute of Technology Department of Electronics and Mechanical Professor Khabari Ph.D.

ALD and CVD of Copper-Based Metallization for. Microelectronic Fabrication. Department of Chemistry and Chemical Biology

Carbon Nanotube Solutions for Packaging and Wireless Sensors

FABRICATION ENGINEERING MICRO- NANOSCALE ATTHE AND. Fourth Edition STEPHEN A. CAMPBELL. of Minnesota. University OXFORD UNIVERSITY PRESS

High Performance Lithium Battery Anodes Using Silicon Nanowires

Fs- Using Ultrafast Lasers to Add New Functionality to Glass

SEPARATING PLASMA AND BLOOD CELLS BY DIELECTROPHORESIS IN MICROFLUIDIC CHIPS

Specimen Preparation Technique for a Microstructure Analysis Using the Focused Ion Beam Process

Carbon Fibers and Carbon Nanotube based Materials

High-efficiency GaN-based light-emitting diodes fabricated with identical Ag contact formed on both n- and p-layers

Light enhancement by the formation of an Al-oxide honeycomb nano-structure on the n-gan surface of thin-gan light-emitting diodes

Galvanic Porous Silicon for High Velocity Nanoenergetics

Improvement of Laser Fuse Processing of Fine Pitch Link Structures for Advanced Memory Designs

Photoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller

Novel concept of rechargeable battery using iron oxide nanorods. anode and nickel hydroxide cathode in aqueous electrolyte

Transcription:

Aligned Carbon Nanofibre-Polymer Composite Membranes CNT Growth and Manipulation Eleanor Campbell Dept. of Physics, Göteborg University

Plasma CVD Growth Polymer/Nanofibre Composite Low ambient temperature growth Dielectrophoretic separation of metallic and semiconducting SWNT & its use in device fabrication (if time)

Plasma CVD Growth of Nanotubes /fibres T = 700 C Ni catalyst C 2 H 2 :NH 3 = 1:5, 4 Torr tip-grown fibres Fe catalyst C 2 H 2 :H 2 = 1:3 7 Torr base-grown MWNT Ni Fe

Growth Quality depends critically on Plasma Current Density 1.5 ma/cm 2 Array growth on Mo substrate C 2 H 2 :NH 3 = 1:5 Kabir et al., Nanotech. 16 (2005) 458 Kabir et al., Nanotech. 17 (2006) 790 10 ma/cm 2

M. Jönsson Optical spectroscopy shows the relative decrease in molecular/atomic precursors and also a clear increase in CN intensity beyond 30 ma (4.5 ma/cm 2 ) - Onset of non-catalytic deposition and increased sputtering

B. Gindre 7 6 3 ma/cm(b) 2 Length of CNFs (um) 5 4 3 2 4.5 ma/cm 2 (c) 1.5 (a) ma/cm 2 1 (d) 10 ma/cm 2 0 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 Time (min) Can these vertically aligned CNF be used to make an anistropically conducting polymer membrane? Diameter ca. 50 nm

Polymer CNT Composite Materials Array of individual nanotubes grown on a Mo substrate Arrays after spin-coating showing photonic-crystal effects Morjan, Gromov, Gindre

Electrical Characterisation Two probe measurements (-5;+5)V Deposition of gold electrodes by metal evaporation with a mask (0.5mm in diameter and 2mm apart) Mo &Mo layer Au PS+VACNF Substrate Au PS &Mo layer PS Au Substrate Au PS+VACNF & Mo layer Au PS+VACNF Substrate Au PS+VACNF & PS+VACNF layer Au PS+VACNF Substrate Au

Measured resistance through film without fibre i.e. Polystyrene alone (3 µm thick): 10 4 Ω With CNF: 50 Ω There are approximately 45000 nanofibres contacted for each measurement -The average resistance per fibre is ca. 200-300 kω (compares with ca. 100 kω for individual fibres with 0.5 ma current carrying capacity)

Removing the polymer from the substrate alkali base alkali base Leave for a couple of days Few GΩ along the membrane (2mm distance) Ag PS+VACNFs Ag

How to reduce the chip temperature to make good quality CNT at temperatures lower than 450 o C (CMOS compatibility)? Use very local resistive heating only where you want the nanotube(s) to grow. Mo Electrodes with narrow resistive bridge. Catalyst deposited on bridge (5nm Al 2 O 3, 1 nm Fe) 14 ma, 2V for heating Dittmer et al., Appl. Phys. A in press

Temperature simulation corresponding to conditions in the experiment

Dittmer et al., Appl. Phys. A, in press Room Temperature Growth: MWNT Atmospheric pressure 7 Torr With aligning electric field No electric field applied during growth MWNT (Fe catalyst, acetylene precursor) C 2 H 2 :H 2 :Ar = 10 sccm: 300 sccm: 500 sccm

0.7-1.8 nm diameter Raman AFM Replace acetylene with ethylene SWNT Chip at 60 o C

Growth stops when temperature falls below ca. 500 o C

Thanks to: Array Growth and Membranes: Oleg Nerushev Raluca Morjan Martin Jönsson Baptiste Gindre Andrei Gromov Shafiq Kabir Nanorelay: SangWook Lee Anders Eriksson Jari Kinaret et al (theory) Dielectrophoretic Separation: Andrei Gromov Low Temperature Growth: Staffan Dittmer Oleg Nerushev

AC Dielectrophoresis for separating metallic and semiconducting nanotubes r ε ε r 2 F ε E 2 1 1 Re( ) ε2 + 2ε1 2: nanotube 1: solvent For semiconducting SWNT F is negative, for metallic SWNT the force is positive, attracting the CNT to the electrodes. (Krupke et al) In this way metallic nanotubes can be preferentially attracted to electrodes leaving proportionately more semiconducting SWNT in dispersion. D.S. Lee, et al., Appl. Phys. A 80 (2005), 5

Nanotubes left in dispersion after deposition cycles Proportion of CNTs (%) 100 80 60 40 20 0 ref. Semiconducting Metallic 1 2 3 final (7) Raman analysis Number of Deposition Cycles D.S. Lee, et al., Appl. Phys. A 80 (2005), 5

Laminar flow no mixing of liquids Electrodes Although the interaction time is very short we get a significant increase in metallic content of lower channel on a single pass

reference sample suspension in Na-DOC, λ ex. 785nm > 50% metallic metallic fraction 6mg/L in 1% Na-DOC Raman intensity, a.u m s m s 140 160 180 200 220 240 260 280 300 320 wavenumbers, cm -1 140 160 180 200 220 240 260 280 300 320 Still problem with bundle formation

Carbon Nanotube Nanorelay Carbon nanotube Source electrode Drain electrode Gate electrode high Q oscillator, logical switch, bistable memory element, Mechanical resonance frequency in GHz range, switching speed could be faster. J. Kinaret et al. (S. Viefers), Appl. Phys. Lett. 82, 1287 (2003) L.M. Jonsson et al., J. Appl. Phys. 96, 629 (2004)

Nanorelay Fabrication (a) S SiO2 G D (e) (b) PMMA (d) (c) 10μm AC Acid free method to make suspended structure: S. W. Lee et. al Appl. Phys. A 78, 283 (2004)

S.W: Lee et al., Nano Lett. 4 (2004) 2027 3.5 3.0 Introduction of critical point drying led to 75% suspension length (nm) 2.5 2.0 1.5 1.0 0.5 0.0 0 20 40 60 80 100 thickness (nm) Axelsson et al., New J. Phys 7 (2005) 245

I source-drain vs Gate Voltage, V SD = 0.5 V 1.2 0.025 Current (μa) 1.0 0.8 0.6 0.4 0.2 0.0 Current (μa) 0.020 0.015 0.010 0.005 0.000 0.12 0 2 4 6 8 10 12 Voltage (V) 25-10 -8-6 -4-2 0 2 4 6 8 10 Voltage (V) 0.10 20 Current (μa) 0.08 0.06 0.04 0.02 Current(μA) 15 10 5 to (1) 0.00 0 0 1 2 3 4 5 6 Voltage (V) 0 5 10 15 20 25 V gate (V)