Wearable Smartphone Cloud 5G Autonomous Vehicle Big Data Robot Machine Learning
HISTORY AI, 5G, IoT, Cloud, Robot First Production of Color TV Production of Electronic Tube Black and White TV Passed 34Million Mobile Phone Users Production of Semi-Electronic Switching (M10CN) Foundation of Samsung (69) Release of 4G Mobile Phone (Smart Phone) Wearable VCR 1958 1960 1965 1966 1972 1974 1979 1982 1983 1984 1986 1994 1996 1998 2000 2004 2008 2010 2013 2014 2015 2020 2025 DAEDUCK PCBs Established New factory For Flexible PCB $200M (2006) Export Award (DAEDUCK GDS) Mass Production of FCCSP (L/S 15/15) Development of Single Side PCB 02 Flexible PCB Double Side PCB Multi Layer PCB HDI PCB Rigid Flex PCB Package Substrate 03
PORTFOLIO Semiconductor Smartphone Super-thin : 2L/ 70 μm, 3L/ 80 μm, 4L/ 120 μm High Density Circuit Thickness tolerance +/- 7um Halogen-free material ETS, MSAP Impedance Control Ultra Thin CSP Controlled-warpage properties High Density FPC High layer Rigid-Flex more than 10Layer 2-4L ETS, Line/Space 10/10um Technology for Mobile Camera Module SAP available Cavity structure and process FCCSP Presolder(SOP), ENEPIG, OSP High layer-count like 3-2-3 Cavity & Flat Rigid-Flex Slim material and process Surface flatness control, Thick Rigid-Flex CSP 2L/90 μm, 3L/100 μm, 4L/140 μm Flattened Solder Resist Line/Space 25/25um, MSAP FPC for New Application Differentiated solutions for new application Ultra slim material Asymmetric and Partial plating High Reliability (for ) SiP/Module Coreless any-layer (4,5,6,7 12L) Super-thin : 8L / 200umT Layer to layer align < 20um ENEPIG, OSP HDI Various structures Halogen free Material Line/Space 30 μm /40 μm 0.65 mm thickness for 12 Layer, Impedance Control Line/Space 20 μm /20 μm Line/Space 20 μm /20 μm MSAP MSAP Various Material Various Material SLP MSAP 04 05
PORTFOLIO Network Over 20+ Layer High Density Circuit (Line/Space 50/50 μm ) Low Dk & Df Material Impedance Control High Layer MLB Si Technology (Back Drill) High Aspect Ratio (15:1) Infotainment - Telematics High Reliability - Anti-CAF(Conductive Anodic Filament) - Warpage Control Cored 10~12L Full stack-via Low Dk CCL/PPG (Dk 3.5) Technology for Camera Module - Surface flatness control, Build-Up Structure Impedance Control msap / SR1 High Reliability 5G Module OSP + SOP Camera Module - Anti-CAF(Conductive Anodic Filament) - Thermally Stable material and Structure MLB Halogen free & High-Tg, Low Loss Material Hybrid Construction Impedance Control Various Finish Radar Module High frequency - Low Dk/Df material (Teflon etc.) - Low profile material and process - Impedance control Hybrid Structure - Low Dk/Df material + FR-4 Material High Power Management Systems Semiconductor Test Over 80+ Layer BVH (Multiple Lamination) Flatness control (Max 0.300mm ) High Aspect Ratio (37:1) Power Management Module - Cu Inlay Structure (Radiant Heat) - High Voltage (Min 500V) - Heavy Cu, High Tg (170 ) Material High Reliability - Anti-CAF(Conductive Anodic Filament) - Thermally Stable material and Structure Load Board, Socket, BIB 0.35mm Pitch, 48~60Layer, 5.40 mm ±0.2 mm 0.125Ø(DHS), FR-4 High Tg BVH (Sequential Lamination) Aspect Ratio : 36:1 Smart Junction Box - Heavy Copper Heavy Copper - Inner Cu 140µm ~ 400µm - Outer Cu 210µm ~ 400µm Surface Finished - HASL / Immersion Tin / OSP High Reliability - Low CTE, CAF Free Materials 06 07
CSR(CORPORATE SOCIAL RESPONSIBILITY) EHS(ENVIRONMENT, HEALTH & SAFETY ) [ Ethical Management ] Declaration of ethics, Code of ethics, Hotline management Ethical Responsibility Vision Create values by fulfilling EHS [ Mutual Growth ] Agreement of fair trade and mutual growth, Supplier s day, Support for supplier s safety & health and recruitment Mission Secure safety-culture which everyone participates in and practices Charitable Responsibility CSR Economic Responsibility 3 Rules of EHS [ Social Contribution ] HAEDONG science & cultural foundation, DAEDUCK welfare foundation, Company volunteer service Legal Responsibility [ Environmental Management ] Certification of environmental management Greenhouse gas and waste management Strategies Zero Disaster Build field-oriented PSM Prevent from potential risk Achieve global standard of EHS Compliance With Regulation Self audit / Process change management Proactive action for fulfilling regulation Limit emission of pollutants Establish foundation for growth Develop human resources Low-carbon green growth Risk management of chemical substances ENVIRONMENT HEALTH SAFETY 08 09
GLOBAL NETWORK Semiconductor Network Smartphone Utra Thin CSP FCCSP SiP/Module SLP High-Layer MLB Semiconductor Test DDE (KOREA) GDS (KOREA) TAIWAN FPC Rigid-Flex HDI MSAP MLB USA CANADA DDPI (PHILIPPINES) Factory Sales Office DAEDUCK ELECTRONICS CO., LTD. (DDE) Headquarter 335, Somanggongwon-ro, Siheung-si, Gyeonggi-do, KOREA Tel : +82-31-599-8800 Fax : +82-31-497-0906 Web site : www.daeduck.com DAEDUCK GDS CO., LTD. (GDS) 230, Gangchon-ro, Danwon-gu, Ansan-si, Gyeonggi-do, KOREA Tel : +82-31-8040-8000 Fax : +82-31-8040-8082 Web site : www.daeduckgds.com DAEDUCK PHILIPPINES, INC. (DDPI) Philippines Economic Zone Authority(PEZA) Lot 1-13 Block 20, Phase 4, Main Ave., Rosario, Cavite, Philippines Tel : +63-46-437-0741 Fax : +63-46-437-1318 Web site : www.ddpi.com.ph Overseas Sales Office Nakor Inc. / CANADA 215 Sanders Street, Suite 202 Kemptville, Ontario, Canada K0G 1J0 Tel : +1-613-258-4775 Fax : +1-613-258-7936 E-mail : bill.ballantyne@nakor.ca Paratronics Corp. / U.S.A. 17870 Sky Park Circle, Suite 275, Irvine, CA 92614, U.S.A Tel : +1-949-752-2223 Fax : +1-949-752-2211 E-mail : tima@paratronics.com TAIWAN Office 4F-A, No.32, Chenggong 13 Street, Jhubei City, HsinChu Hsien, TAIWAN Mobile(TW) +886-922-980-549 E-mail : swimpool@daeduck.com 10
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