The No Lead manufacturing Initiative Dr. Srinivas T. Rao UCLA Workshop on Lead-free Solder for Electronic, Optical, and MEMs Packaging and Manufacturing September 5 th 2002
Address Mfg. Needs of OEMs and EMSs Monitor environmental legislation and adjust activities if necessary Recommend an industry standard lead-free alloy (reflow and wave) Develop criteria for industry to use to evaluate Pb-free processes Share information in a timely manner to promote common path to Pb-free Develop best practices experimental procedures to measure mechanical, thermal, electrical and wetting properties of Pb-free solders Develop solder databases for properties and literature references for lead-free alloys in the public domain Promote modeling for reliability through generation of best possible data and modeling methods Work with component and PCB suppliers to develop specifications to meet higher temperature reflow conditions Connect with and Strengthen Your Supply Chain
North America Electronics Goal N. American OEM s/ems need to prepare processes to be able to deliver Pb-free products in 2001 with an eye to total Pb-elimination by 2004. Japan driving Green consumer products.! Timetables seem to be holding (2001-2003) NEMI companies received serious inquiries. EU legislation banning lead in electronics in 2004, proposal pushed out to 2007.! Individual Countries can shorten timeframe. NEMI engaged the technical side of Pb-free related to compatibility with existing assembly infrastructure. Connect with and Strengthen Your Supply Chain
Connect with and Strengthen Your Supply Chain Legislation Europe: WEEE/ROHS. WEEE expected to come to a vote in 4Q 2002. Sticking point is the product takeback and company responsibility of ROHS. US: new rules regarding reporting of Pb, but no legislation on horizon for banning Pb or Pb-containing solder. Asia: No legislation, but Japanese companies are still actively engaged in eliminating Pb from electronics. Push back of WEEE date + lack of other legislation has taken immediate pressure off drive to implement. But many OEMs moving forward for marketing reasons
Major Task Group Objectives Demonstrate capability to deliver products in volume in 2001 with Pb-free interconnects. " Facilitate a common Pb-free solder alloy composition for N.American electronics assembly. " Work with component and PCB suppliers to develop specifications necessary to meet higher temperature reflow conditions. " Develop criteria that industry can use to evaluate Pb-free processes. " Monitor environmental legislation to adjust activities if necessary. " Share our information in a timely manner to promote common path to Pb-free. Commonality is an overarching goal for all NEMI activities Connect with and Strengthen Your Supply Chain
Connect with and Strengthen Your Supply Chain Worldwide Pb-free Activities NCMS recent high temperature solder alloy project report released, Pb-free solders performed well. Gintic (Singapore) Consortium working on process and reliability of Pb-free solders. JEITA Continuing work on solders and tin whiskering. Soldertec Performed reliability tests, supported SnAgCu. Now working on Tin whiskering. JEDEC 020 revision with elevated temperatures for MSL testing out for ballot. IPC Support with meetings, standards development. EPA Life Cycle project. Proposal for companies to partner on a project and split cost with EPA. GECI Promoting global cooperation and commonality.
Connect with and Strengthen Your Supply Chain Cooperation/Commonality Maximum benefit achieved through world wide agreement and cooperation. NEMI is member of GECI (Global Environmental Cooperation Initiative). HDPUG, SEMI, Soldertec, MEPTEC, SAC, ITRI Taiwan also members. + Promoted single alloy SnAgCu + Definition of Pb-free (0.2%) Update/create JEDEC standards. Working with committee on J-STD-020.
Major Project Activities Alloy Carol Handwerker, NIST Alloy Material Property development Interface w/academia, gov t agencies Components/PCBs Rich Parker, Delphi Effect of High temperature reflow Pb-free terminations Solder Reliability John Sohn, NEMI Transparent test procedure Common data to share with industry Process Development Jasbir Bath, Solectron Generic process for Reliability test boards Process characterization benchmark Tin Whisker Swami Prasad, ChipPAC Connect with and Strengthen Your Supply Chain
Connect with and Strengthen Your Supply Chain Solder Alloy Team Mission: To provide the Task Force with critical data and analyses needed for making decisions with respect to solder alloys, manufacturing, and assembly reliability. " NEMI chose Sn-Ag-Cu, rest of world moving in that direction. " Developed best practices experimental procedures to measure the mechanical, thermal, electrical and wetting properties of leadfree solders.! Developing Solder Reliability Modeling Guidelines " Critical review of reported deformation data and models
Solder Alloy Team Accomplishments " Conducted extensive literature search including Europe and Far East " Determined ternary eutectic melting temperature of SAC as 217 0 C " Investigated patent issues and selected Sn-3.9Ag-0.6Cu for reflow and Sn-0.7Cu for wave " Examined sensitivity of melting behavior of Sn-Ag-Cu to composition and temperature in response to request from team members Connect with and Strengthen Your Supply Chain
Connect with and Strengthen Your Supply Chain Component Team Mission: To collectively work on identifying and recommending the best materials for the supplier industry to use, in delivering compatible components and PWBs that will meet the Pb-free requirements sent forth in the main task group. " Previously characterized component survivability at elevated reflow temp. " Characterized the optimum operating profile of maximum time, temperature and environment exposures. " Recommendation for component temperatures " Reflow characterization, peak temp/board delta-t " JEDEC using our data for proposal for new standard, consistent with our position.! Working with IPC (ex. ITRI) PCB project for evaluation of PCB laminates.
Assembly Process Team Mission: To demonstrate capable processes for leadfree soldering of printed wiring board assemblies. " Most thorough study of lead-free assembly to date " Demonstrated high quality joints for reliability testing " Report generation and review "X-ray solder inspection of BGAs "Acoustic microscopy of packages "AOI of solder joints "Solder paste performance "Rework Connect with and Strengthen Your Supply Chain
Reliability Team Mission: To perform reliability testing for selected solders, components and board finishes using an approved test vehicle. "Thorough experiment covering various components, solder/lead combinations, failure analysis, statistical analysis. "Reliability tests " Thermal Cycling " Three-point Bend Testing " Electrochemical Migration!Failure analysis and root cause of TC failures " Red dye penetrant " Metallurgical cross-section " Very detailed and thorough FA process. "Statistical Data Analysis on TC results! Data to go into alloy group database Connect with and Strengthen Your Supply Chain
Connect with and Strengthen Your Supply Chain Universal Build Visual Inspection Results: CBGA Tin-lead paste/ tin-lead CBGA (Shiny joint) Lead-free paste/ Tin-lead CBGA (Dull joint) Lead-free paste/ lead-free CBGA (Cratered joint)
Test Vehicle (169CSP) Connect with and Strengthen Your Supply Chain
Connect with and Strengthen Your Supply Chain Board details: 169CSP 1 component side 2 internal signal 3 dummy plane 4 dummy plane 5 dummy plane 6 dummy plane 7 internal signal 8 circuit side 8 layer board, 0.062" thick, FR-4, Tg ~ 170 C, microvia technology Immersion silver finish 169CSP
Connect with and Strengthen Your Supply Chain 169CSP Weibull Analyses 0 to100 C cycling -40 to +125 C cycling Pb-Pb Pb-LF LF-LF η (N63) 3321 3688 8343 β 7.5 2.9 4.1 Pb-Pb Pb-LF LF-LF η (N63) 1944 3046 3230 β 6.6 11.3 7.7
Connect with and Strengthen Your Supply Chain Tin Whisker Committee: First DOE Experimental matrix formulated after review of available whisker data in industry included selected IC s and passive components variables # preconditioning: ambient vs temperature cycling (500 h) # temperature: ambient, 50-55 C, 85 C # humidity: ambient, 85% RH Accelerated conditions seem to promote whisker growth T/C 55/85 Platd Sample
Project Results Recommended SAC Alloy to industry Demonstrated SAC Process compatible with current tools/facilities Interim solution to MSL problem recommended Further work identified and underway Initiated solder joint reliability modeling effort Reliability evaluations find SAC alloy equal to or better than PbSn Member companies have released products with new alloy to production Connect with and Strengthen Your Supply Chain
Project Schedule Project Final Report Sept 2002 Webcast Planned for Sept. 19 from Nortel in Montreal (see www.nemi.org for details/signup) IEEE /Wiley Book: Q2, 2003 Integrated book covering major points of this project along with other published work to date. Connect with and Strengthen Your Supply Chain